阅读说明：本技术 电子部件封装及其制造方法
(Electronic component package and method for manufacturing the same
) 是由 松川喜孝
高木阳一
胜部彰夫
越川祥高 于 2019-01-10 设计创作，主要内容包括：电子部件封装(100)具备：树脂层(40)、电子部件(10)、接地部件(30)、导体膜(50)。接地部件(30)包含层叠体(31)和设置于层叠体(31)的层叠方向的端部的外部导体(32)。在层叠体(31)中,层叠有至少一个树脂膜(31a)与至少一个图案导体(31b),并且设置有沿上述层叠方向延伸而与外部导体(32)连接的至少一个通路导体(31c)。在层叠体(31)中,图案导体(31b)中至少一个图案导体(31b)的周缘的至少局部与导体膜(50)连接,并且与通路导体(31c)电连接。外部端子以及外部导体(32)的各自的局部在树脂层(40)的同一个面暴露。(An electronic component package (100) is provided with: a resin layer (40), an electronic component (10), a grounding component (30), and a conductor film (50). The grounding member (30) comprises a laminate (31) and an external conductor (32) provided at an end of the laminate (31) in the laminating direction. In the laminated body (31), at least one resin film (31a) and at least one pattern conductor (31b) are laminated, and at least one via conductor (31c) extending in the laminating direction and connected to an external conductor (32) is provided. In the laminated body (31), at least a part of the peripheral edge of at least one pattern conductor (31b) of the pattern conductors (31b) is connected to the conductor film (50), and is electrically connected to the via conductor (31 c). The external terminal and the external conductor (32) are partially exposed on the same surface of the resin layer (40).)
1. An electronic component package, comprising:
a resin layer;
an electronic component partially covered with the resin layer and having an external terminal;
a ground member partially covered with the resin layer; and
a conductor film provided on a surface of the resin layer,
the grounding member includes a laminate and an external conductor provided at an end of the laminate in a lamination direction,
in the laminated body, at least one resin film and at least one pattern conductor are laminated, and at least one via conductor extending in the laminating direction and connected to the external conductor is provided,
the laminate has a 1 st surface, a 2 nd surface located on the opposite side of the 1 st surface in the laminating direction, and a 3 rd surface connecting the 1 st surface and the 2 nd surface,
in the laminated body, at least a part of a peripheral edge of at least one of the pattern conductors is connected to the conductor film at the 3 rd surface and is electrically connected to the via conductor,
the external terminal and the external conductor are partially exposed on the same surface of the resin layer.
2. The electronic component package of claim 1,
the external terminal includes an external electrode and a 1 st connection member connected to the external electrode.
3. A method of manufacturing an electronic component package, the electronic component package comprising:
a resin layer;
an electronic component partially covered with the resin layer and having an external terminal;
a grounding member partially covered with the resin layer, the grounding member including a laminate in which at least one resin film and at least one pattern conductor are laminated, and an external conductor provided at an end of the laminate in a laminating direction; and
a conductor film provided on a surface of the resin layer,
the method for manufacturing an electronic component package is characterized by comprising:
a holding step of manufacturing or preparing a base including a base and an adhesive layer provided on one main surface of the base, the electronic component, and a ground-engaging member including a bonded laminate in which a plurality of the laminates are bonded, and disposing the external terminal of the electronic component and the external conductor of the ground-engaging member on the adhesive layer, thereby holding the electronic component and the ground-engaging member on the base;
a resin layer applying step of applying the resin layer on the adhesive layer so as to cover a surface of the electronic component other than a region where the external terminal is in contact with the adhesive layer and a surface of the ground-bonding member other than a region where the external conductor is in contact with the adhesive layer;
a removing step of removing the base table so that at least a part of the external terminal of the electronic component and at least a part of the external conductor of the ground member are exposed on the same surface of the resin layer;
a cutting step of cutting the bonded ground member together with the resin layer to separate the plurality of ground members and expose a part of a peripheral edge of the pattern conductor; and
and a conductive film applying step of applying the conductive film to the surface of the resin layer so as to be connected to a part of the peripheral edge of the exposed pattern conductor.
Technical Field
The invention relates to an electronic component package and a method of manufacturing the same.
Background
An example of an electronic component package that includes an electronic component, a resin layer, and a conductor film and does not include a support substrate is an electronic component package described in international publication No. 2016/092633 (patent document 1). Fig. 14 is a cross-sectional view for explaining the electronic component package described in patent document 1.
The electronic component package 200 includes: the electronic component 210, the resin layer 240, the conductor film 250, the lead frame 280, and the wire 290 do not include a support substrate. The electronic component 210, the lead frame 280, and the wire 290 are embedded in the resin layer 240.
The lead frame 280 has: a 1 st portion 281, a 2 nd portion 282, a 3 rd portion 283 configured to surround the 2 nd portion 282. The 2 nd part 282 is an internal wiring, and the 3 rd part 283 is a ground terminal. Electronic component 210 is fixed on portion 1 281 and connected to portion 2 282 by wire 290. The conductor film 250 is provided on the outer surface of the resin layer 240, and is connected to a portion of the 3 rd portion 283 exposed from the resin layer 240.
Fig. 15 is a cross-sectional view for explaining a part of the manufacturing process of the electronic component package 200. In the manufacturing process of the electronic component package 200, first, as shown in fig. 15 (a), a package aggregate is manufactured in which an aggregate of lead frames 280 to which electronic components 210 are connected is embedded in a bonding resin layer 240A. In the packaged aggregate, the 3 rd portion 283 serves as a bond 283W including two 3 rd portions 283 adjacent to each other.
Next, as shown in fig. 15 (B), the packaged aggregate is cut off using, for example, a dicing saw or the like. At this time, the joined body 283W is cut into two 3 rd portions 283. Then, as shown in fig. 15 (C), a conductor film 250 is applied to the cut-off semi-finished product, thereby completing the electronic component package 200. Further, the conductor film 250 is connected to a portion of the 3 rd portion 283 exposed from the resin layer 240.
Patent document 1: international publication No. 2016/092633
One of the features of the electronic component package 200 is that it is manufactured using an aggregate of the lead frames 280 including a combination 283W of the 1 st part 281, the 2 nd part 282, and the 3 rd part 283. Therefore, in this manufacturing step, the bonded body 283W composed of the bonding resin layer 240A and the metal is cut off at the same time by a dicing saw or the like.
Normally, cutting is started from the bonding resin layer 240A side. When the blade of the dicing saw reaches the bonded body 283W made of metal from the bonding resin layer 240A, the hardness of the object to be cut changes rapidly. Therefore, the blade of the dicing saw, which is intended to cut into the object, may be worn or deformed and damaged, and the blade of the dicing saw may need to be replaced. In this case, the blade may be replaced in a troublesome manner, and the manufacturing may not be performed smoothly.
Further, when the bonded body 283W is pressed by the blade of the dicing saw, the bonded body 283W may be peeled off from the bonding resin layer 240A. In addition, the peeled portion may become a structural defect that adversely affects moisture resistance and the like in the electronic component package 200.
Disclosure of Invention
That is, an object of the present invention is to provide an electronic component package capable of suppressing the occurrence of structural defects, and a method for manufacturing the same.
An electronic component package according to claim 1 of the present invention includes: resin layer, electronic component, grounding component, conductor film. The electronic component is partially covered with the resin layer, and the electronic component has an external terminal. A part of the grounding member is covered with the resin layer. The conductor film is provided on the surface of the resin layer. The grounding member includes a laminate and an external conductor provided at an end of the laminate in the laminating direction. In the laminate, at least one resin film and at least one pattern conductor are laminated, and at least one via conductor extending in the laminating direction and connected to an external conductor is provided. The laminate has a 1 st surface, a 2 nd surface located on the opposite side of the 1 st surface in the laminating direction, and a 3 rd surface connecting the 1 st surface and the 2 nd surface. In the laminated body, at least a part of a peripheral edge of at least one of the pattern conductors is connected to the conductor film at the 3 rd surface and is electrically connected to the via conductor. The external terminal and the external conductor are partially exposed on the same surface of the resin layer.
The method for manufacturing an electronic component package according to claim 2 of the present invention is a method for manufacturing an electronic component package including a resin layer, an electronic component, a grounding member, and a conductor film. The electronic component is partially covered with the resin layer, and the electronic component has an external terminal. A part of the grounding member is covered with the resin layer. The grounding member includes a laminate in which at least one resin film and at least one pattern conductor are laminated, and an external conductor provided at an end of the laminate in the laminating direction. The conductor film is provided on the surface of the resin layer. The method for manufacturing the electronic component package comprises: a holding step, a resin layer applying step, a removing step, a cutting step, and a conductor film applying step. In the holding step, a base including a base material and an adhesive layer provided on one main surface of the base material, an electronic component, and a ground-connecting member including a bonded laminate in which a plurality of laminates are bonded are manufactured or prepared, and an external terminal of the electronic component and an external conductor of the ground-connecting member are arranged on the adhesive layer, whereby the electronic component and the ground-connecting member are held on the base. In the resin layer applying step, the resin layer is applied on the adhesive layer so as to cover the surface of the electronic component other than the region where the external terminal is in contact with the adhesive layer and the surface of the bonding ground member other than the region where the external conductor is in contact with the adhesive layer. In the removing step, the base is removed so that at least a part of the external terminal of the electronic component and at least a part of the external conductor of the grounding member are exposed on the same surface of the resin layer. In the conductor film application step, the bonded ground member is cut together with the resin layer, thereby separating the plurality of ground members and partially exposing the peripheral edge of the pattern conductor. In the conductive film applying step, the conductive film is applied to the surface of the resin layer and is connected to a part of the periphery of the exposed pattern conductor.
According to the present invention, the occurrence of structural defects in the electronic component package can be suppressed.
Drawings
Fig. 1 is a sectional view of an electronic component package 100 as an embodiment of the electronic component package of the present invention.
Fig. 2 is a perspective view of the ground member 30 and a perspective cut-out view of the bonded ground member 30W used in the manufacturing process of the electronic component package 100.
Fig. 3 is a cross-sectional view for explaining an example of a manufacturing process of the electronic component package 100.
Fig. 4 is a plan view showing a state where the electronic component 10, the electronic component 20, and the ground member 30W are held on the base B in an example of a manufacturing process of the electronic component package 100.
Fig. 5 is a bottom view showing the 1 st to 3 rd modifications of the coupling ground member 30W.
Fig. 6 is a bottom view and a sectional view showing a 4 th modification of the coupling grounding member 30W, and a front view showing a modification of the grounding member 30 obtained by cutting the 4 th modification of the coupling grounding member 30W.
Fig. 7 is a bottom view and a sectional view showing a 5 th modification of the coupling grounding member 30W, and a front view showing a modification of the grounding member 30 obtained by cutting the 5 th modification of the coupling grounding member 30W.
Fig. 8 is a plan view (top view) showing a state of modification 6 in which the electronic component 10, the electronic component 20, and the bonding ground member 30W are held on the base B in another example of the manufacturing process of the electronic component package 100.
Fig. 9 is a plan view showing a state of modification 7 in which the electronic component 10, the electronic component 20, and the bonding ground member 30W are held on the base B in another example of the manufacturing process of the electronic component package 100.
Fig. 10 is a cross-sectional view of an electronic component package 100A as a 1 st modification of the embodiment of the electronic component package of the present invention.
Fig. 11 is a cross-sectional view of an electronic component package 100B as a 2 nd modification of the embodiment of the electronic component package of the present invention.
Fig. 12 is a diagram for explaining an example of a manufacturing process of the electronic component package 100B, and is a cross-sectional view for explaining a part of the process.
Fig. 13 is a diagram for explaining an example of a manufacturing process of the electronic component package 100B, and is a cross-sectional view for explaining a process to be followed by fig. 12.
Fig. 14 is a sectional view of an electronic component package 200 of the background art.
Fig. 15 is a cross-sectional view for explaining a part of the manufacturing process of the electronic component package 200.
Detailed Description
Hereinafter, embodiments of the present invention will be described, and features of the present invention will be described in further detail. The present invention is applied to, for example, an electronic component package constituting a circuit module, which is required to have a low back, but is not limited thereto.
Embodiment 1 of electronic component packaging
< Structure of electronic parts Package >
The structure and characteristics of an electronic component package 100 according to embodiment 1 of the electronic component package according to the present invention will be described with reference to fig. 1 and 2.
In addition, each drawing is a schematic diagram. In addition, differences in the shapes of the respective constituent elements and the like generated in the manufacturing process are not necessarily reflected in the respective drawings. That is, in the following, the drawings used for the description in this specification may be said to essentially represent actual products even if there are portions different from the actual products.
Fig. 1 is a sectional view of an electronic component package 100. Fig. 2 (a) is a perspective view of the ground member 30 included in the electronic component package 100. Fig. 2 (B) is a perspective cut-out view of the ground connection member 30W used in a manufacturing process of the electronic component package 100 described later.
As shown in fig. 1, the electronic component package 100 includes: an electronic component 10 having an external terminal, a grounding component 30, a resin layer 40, and a conductor film 50. The electronic component 10 includes an electronic component body 11 and external terminals exposed to a surface of the electronic component body 11. The electronic component 10 is, for example, various ics (integrated circuits), or an electronic component such as a circuit module smaller than the electronic component package 100.
In embodiment 1, the external terminal includes the external electrode 12 and the solder bump S1 constituting the 1 st connection member connected to the external electrode 12. The solder bump S1 is made of Sn — Ag — Cu based lead-free solder material. The material used for the solder bump S1 is not limited to this. As described later, the external terminal may not include the solder bump S1.
As shown in fig. 1, the electronic component package 100 may further include an electronic component 20 having an electronic component body 21 and external electrodes 22. The electronic component 20 is, for example, a multilayer capacitor, a multilayer inductor, various filters, various ICs, or other electronic components.
When the electronic component package 100 is connected to a circuit board (not shown) of an electronic device, the ground member 30 is connected to a ground electrode of the circuit board. As shown in fig. 2 (a), the ground member 30 includes a laminate 31 and an outer conductor 32 provided at one end of the laminate 31 in the laminating direction. The grounding member 30 may include an outer conductor 33 provided at the other end of the laminate 31 in the laminating direction.
The laminate 31 has a 1 st plane P1, a 2 nd plane P2 located on the opposite side of the 1 st plane P1, and a 3 rd plane P3 connecting the 1 st plane P1 and the 2 nd plane P2. In embodiment 1, the laminate 31 has a rectangular parallelepiped shape, and in fig. 2, the lower surface is a 1 st plane P1, the upper surface is a 2 nd plane P2, and the four side surfaces are 3 rd planes P3. The shape of the laminate 31 is not limited to this.
The outer conductor 32 is disposed on the 1 st plane P1. In the case where the ground member 30 has the outer conductor 33, the outer conductor 33 is provided on the 2 nd plane P2. When the external conductor 33 is provided on the 2 nd plane P2, it is not necessary to separate the upper and lower parts of the ground member 30, and the electronic component package 100 can be manufactured more efficiently.
In embodiment 1, the laminate 31 includes three resin films 31a, two pattern conductors 31b, and three via conductors 31 c. The laminate 31 is formed by alternately laminating the resin film 31a and the pattern conductor 31b such that the principal surface of the resin film 31a is the 1 st surface P1. As described below, the via conductor 31c is disposed inside the laminated body 31. However, the structure of the laminate 31 is not limited to the above embodiment. For example, the laminated body 31 may be configured by one resin film 31a, one via conductor 31c provided on the resin film 31a, and one pattern conductor 31b laminated on the resin film 31 a. The laminate 31 may include components other than the resin film 31a, the pattern conductor 31b, and the via conductor 31 c.
In the laminated body 31, the peripheral edge of each pattern conductor 31b is exposed at the 3 rd plane P3, which is four side surfaces of the laminated body 31. Each pattern conductor 31b is electrically connected directly to a via conductor 31c having one end exposed on the 1 st surface P1, which is the lower surface of the laminate 31, or is electrically connected indirectly to the via conductor 31c via another via conductor 31 c. However, the present invention is not limited to the above, and at least one pattern conductor 31b of the pattern conductors 31b may be at least partially exposed at the 3 rd surface P3 of the laminated body 31 and electrically connected to the via conductor 31c having one end exposed at the 1 st surface P1 of the laminated body 31 (see fig. 5 described later).
The external conductor 32 is provided on the 1 st surface P1 of the laminate 31, and the peripheral edge thereof is electrically connected to one end of the via conductor 31c, and the via conductor 31c is electrically connected to the pattern conductor 31b exposed on the 3 rd surface P3 of the laminate 31. As described above, at least one via conductor 31c extending in the stacking direction of the stacked body 31 and connected to the external conductor 32 is provided.
The grounding member 30 is, for example, a resin multilayer substrate or the like manufactured by a known manufacturing method. The resin film 31a is made of an insulating resin material such as epoxy resin. The pattern conductor 31b uses Cu foil. The via conductor 31c is obtained by curing a Cu paste. As the external conductor 32, a Cu foil to which a metal plating film selected from a Sn plating film, a Ni plating film, an Au plating film, and the like is applied is used.
However, the material used for each constituent element is not limited to the above embodiment. For example, a composite material including a woven fabric such as glass, a nonwoven fabric, and an insulating resin such as epoxy resin, or a resin material such as a liquid crystal polymer may be used as the resin film 31 a. The via conductor 31c may be formed by Cu plating.
The resin layer 40 covers a part of the electronic component 10 and a part of the ground component 30. A part of the periphery of the pattern conductor 31b of the laminate 31 exposed on the 3 rd plane P3 is exposed from the resin layer 40. In addition, portions of the external terminals of the electronic component 10, that is, portions of the solder bumps S1 constituting the 1 st connecting member and portions of the external conductors 32 of the ground member 30 are exposed from the resin layer 40. That is, a part of the solder bump S1 as the external terminal of the electronic component 10 and a part of the external conductor 32 of the ground member 30 are exposed from the same surface of the resin layer 40.
The resin layer 40 uses a resin material in which a glass material, silica, or the like is dispersed as a filler. However, the resin layer 40 may be formed of a single resin material.
The conductor film 50 covers the surface of the resin layer 40, and is connected to a part of the periphery of the pattern conductor 31b of the laminate 31 exposed from the resin layer 40. As the conductor film 50, a Cu film formed by depositing metal fine particles on the resin layer 40 by sputtering is used. However, the present invention is not limited to this, and a Cu paste may be solidified in a film form.
As described later, the electronic component package 100 is efficiently manufactured by first manufacturing a semi-finished product in an aggregated state and then singulating the semi-finished product through a cutting process using a dicing saw or the like. In the production of the semi-finished product, the bonding ground member 30W including the bonding laminate 31W including the via conductor 31c and in which the bonding resin films 31Wa and the bonding pattern conductors 31Wb are alternately laminated as shown in fig. 2 (B) is used.
The coupling ground member 30W in fig. 2 (B) includes two ground members 30. As described above, the resin multilayer substrate or the like manufactured by a known manufacturing method is used in combination with the ground member 30W. Then, in the cutting step, the portions indicated by the broken lines are cut away to separate the two grounding members 30.
As described above, since the bonding ground member 30W includes the bonding resin film 31Wa, the bonding ground member 30W is more flexible than the bonded body 283W of the 3 rd portion 283 of the lead frame made of a metal single body as described in the background art. That is, the difference between the hardness of the coupling ground member 30W and the hardness of the coupling resin layer 40A (see fig. 3C) described later is smaller than the difference between the hardness of the above-described coupled body 283W and the hardness of the coupling resin layer 40A. Therefore, the blade of the dicing saw enters from the bonding resin layer 40A, and even when reaching the bonding ground member 30W, an increase in resistance when cutting into the object to be cut can be suppressed.
That is, the force of the blade of the dicing saw acting on the bonded ground member 30W pressing in the traveling direction is small. Therefore, the occurrence of peeling at the interface between the bonded laminate and the bonded resin layer can be suppressed. Therefore, the occurrence of structural defects in the completed electronic component package 100 can be suppressed.
< method for manufacturing electronic component Package >
A method for manufacturing the electronic component package 100 will be described with reference to fig. 3 and 4.
Fig. 3 is a diagram illustrating an example of a manufacturing process of the electronic component package 100. Fig. 3 (a) to (F) are cross-sectional views schematically showing respective steps sequentially performed in one example of the manufacturing process of the electronic component package 100. Each of fig. 3 corresponds to a cross-sectional view of the electronic component package 100 of fig. 1.
Fig. 3 (a) and 3 (B) are cross-sectional views showing the holding step. In the holding step, as shown in fig. 3 (a), first, a base B including a base B1 and an adhesive layer B2 provided on one main surface B11 of the base B1, the electronic component 10, the electronic component 20, and a ground member 30W to which a plurality of ground members 30 are bonded are manufactured or prepared. The electronic component 10, the electronic component 20, and the bonding ground component 30W have the above-described configuration. Therefore, detailed description is omitted. The base B uses a known adhesive layer-attached thin plate or the like.
Then, as shown in fig. 3 (B), a solder bump S1 as a part of the external terminal of the electronic component 10, the external electrode 22 of the electronic component 20, and the external conductor 32 to which the ground member 30W is bonded are disposed on the adhesive layer B2. Thus, the electronic component 10, the electronic component 20, and the ground member 30W are held on the base B. Fig. 4 (a) is a plan view showing a state in which the electronic component 10, the electronic component 20, and the ground member 30W are arranged on the adhesive layer B2. The outer conductor 33 is not shown. The cross-sectional view shown in fig. 3 (B) corresponds to a downward cross-sectional view obtained by cutting the semi-finished product of the electronic component package in the assembled state shown in fig. 4 (a) by a plane including the line X1-X1.
The plurality of bonded ground members 30W are arranged so that the 3 rd plane P3, which is a cut plane, is exposed to the 6 th plane P6, which is four side surfaces of the resin layer 40 after being cut in a cutting step described later. With this arrangement, after the cutting, part of the peripheral edge of the pattern conductor 31b is exposed to the 3 rd surface P3 and the 6 th surface P6. That is, the pattern conductor 31b exposed on each of the four side surfaces of the resin layer 40 and the conductor film 50 can be grounded.
As shown in fig. 4 (B), the bonding ground member 30W may be disposed so that the ground member 30 obtained after cutting is present in a region where the electronic component 10 and the electronic component 20 are small in the electronic component package 100. The external conductor 33 is not shown in the drawing, similarly to fig. 4 (a). That is, when each electronic component is disposed near a side surface at a certain position in the electronic component package 100, the ground member 30W can be disposed near the side surface where each electronic component is not disposed, while avoiding the position. In this case, the electronic component package 100 can be miniaturized.
Fig. 3 (C) is a cross-sectional view showing the resin layer applying step. In the resin layer applying step, the bonding resin layer 40A having the 4 th surface P4 in contact with the adhesive layer B2 and the 5 th surface P5 located on the opposite side of the 4 th surface P4 is applied to the adhesive layer B2. At this time, the surface of the electronic component 10 except for the region where the solder bump S1 contacts the adhesive layer B2, the surface of the electronic component 20 except for the region where the external electrode 22 contacts the adhesive layer B2, and the surface of the bonding ground member 30W except for the region where the external conductor 32 contacts the adhesive layer B2 are covered with the bonding resin layer 40A.
Fig. 3 (D) is a cross-sectional view showing the removal step. In the removing step, the base B is removed to expose the 4 th surface P4, and a part of the solder bump S1 of the electronic component 10, a part of the external electrode 22 of the electronic component 20, and a part of the external conductor 32 of the bonding ground member 30W are exposed to the 4 th surface P4 of the bonding resin layer 40A. This removal step is performed by, for example, peeling the base B from the bonding resin layer 40A.
Fig. 3 (E) is a cross-sectional view showing the cutting step. In the cutting step, the bonding resin layer 40A is cut by the blade D of the dicing saw into the resin layer 40 having the 4 th surface P4, the 5 th surface P5, and the 6 th surface P6 connecting the 4 th surface P4 and the 5 th surface P5. In this embodiment, the resin layer 40 has a rectangular parallelepiped shape, and when the lower surface of the rectangular parallelepiped is the 4 th plane P4 and the upper surface is the 5 th plane P5, the four side surfaces thereof are the 6 th plane P6.
Through this process, the bonding ground member 30W is cut together with the bonding resin layer 40A, thereby being separated into two ground members 30, and the peripheral edge of the pattern conductor 31b is partially exposed on the 3 rd surface P3 and the 6 th surface P6.
Fig. 3 (F) is a cross-sectional view showing the conductive film applying step. In the conductive film application step, conductive films are applied to the 5 th plane P5 and the 6 th plane P6, which are the surfaces of the resin layer 40, and these are connected to the part of the peripheral edge of the pattern conductor 31b exposed at the 6 th plane P6.
In the above-described method for manufacturing the electronic component package 100, the load applied to the blade D of the dicing saw when cutting the connection ground member 30W is smaller than that in the case of cutting the connection ground member composed entirely of metal as in the background art. Further, the hardness of the object to be cut during cutting is less changed. Therefore, the replacement work of the blade D required for the blade D of the dicing saw to cut into the object to be cut to be worn out and damaged by further deformation can be reduced, and the electronic component package 100 can be smoothly manufactured.
< modification of bonded laminate >
The structures and features of modifications 1 to 7, which are the ground connection members 30W used for manufacturing the electronic component package 100 according to embodiment 1, will be described with reference to fig. 5 to 9.
Fig. 5 is a bottom view showing the 1 st to 3 rd modifications of the coupling ground member 30W. The 1 st modification to the 3 rd modification of the ground coupling member 30W basically have the same configuration as the ground coupling member 30W shown in the 1 st embodiment.
Fig. 5 (a) is a plan view for explaining a 1 st modification of the grounding member 30W. In modification 1 shown in fig. 5 (a), the bonding laminated body 31W has a rectangular bonding pattern conductor 31Wb, similar to the bonding ground member 30W shown in embodiment 1. However, the bonding pattern conductor 31Wb is not exposed to the side surface of the bonding laminated body 31W. That is, the pattern conductor 31b of the laminated body 31 obtained by cutting the bonded laminated body 31W of the 1 st modification is exposed only to the cut surface of the 3 rd surface P3, and does not contact the side surface adjacent to the cut surface.
In modification 1, the side surface of the bonded laminate 31W is a bonded resin film 31 Wa. Therefore, the adhesion between the resin material and the bonding resin layer 40A, which is a resin material, is further improved. Therefore, the occurrence of peeling at the interface between the bonding ground member 30W and the bonding resin layer 40A can be effectively suppressed. As a result, the occurrence of structural defects in the completed electronic component package 100 can be effectively suppressed.
Fig. 5 (B) is a plan view for explaining a 2 nd modification of the grounding member 30W. In modification 2 shown in fig. 5 (B), the bonded laminate 31W has a dumbbell-shaped bonding pattern conductor 31Wb in a plan view. Further, as in modification 1, the bonding pattern conductor 31Wb is not exposed to the side surface of the bonding laminated body 31W.
In this case, the same effect as in modification 1 can be obtained. In addition, in modification 2, the interface between the resin film 31a and the exposed pattern conductor 31b in the cross-section of the laminate 31 is smaller than that in modification 1. Therefore, it is possible to effectively suppress the occurrence of defects such as peeling of the interface between the resin film 31a and the exposed pattern conductor 31b during the cutting step, or the intrusion of moisture into the interface.
Fig. 5 (C) is a plan view for explaining a 3 rd modification of the grounding member 30W. In the 3 rd modification shown in fig. 5 (C), the bonded laminate 31W has the bonding pattern conductor 31Wb in a shape which is continuous with the cut surface and a part of the side surface adjacent to the cut surface and is not exposed to the other side surfaces after cutting.
In this case, the same effect as in modification 1 can be obtained. In modification 3, the area of the exposed pattern conductor 31b in the cross-section of the laminate 31 is the same as that in embodiment 1. That is, the area to be bonded to the conductive film 50 is not reduced as compared with the bonding area in embodiment 1. Therefore, the conductive film 50 can be effectively grounded.
Fig. 6 is an explanatory view of a 4 th modification of the coupling ground member 30W. Fig. 6 (a) is a bottom view of the ground member 30W. Fig. 6 (B) is a downward sectional view of the ground engaging member 30W shown in fig. 6 (a) cut by a plane including the line X2-X2. Fig. 6 (C) is a front view of a modification of the grounding member 30 obtained by cutting off the 4 th modification of the coupling grounding member 30W.
In the 4 th modification shown in fig. 6, the bonded laminate 31W includes two via conductors 31c1And a via conductor 31c2As a plurality of via conductors 31 c. Via conductor 31c1Is disposed at the same position as the bonding laminated body 31W shown in embodiment 1. On the other hand, as shown in FIG. 2, via conductor 31c2The cutting device is arranged to overlap with the portion cut and removed in the cutting step. Further, via conductor 31c2The number of (2) is not limited to one.
That is, inIn the laminated body 31 obtained by cutting the bonded laminated body 31W of the 4 th modification, as shown in fig. 6 (C), in the 3 rd plane P3 which is a cut surface, the via conductor 31C is cut in addition to the pattern conductor 31b2Is also exposed. Therefore, the electrical connection area between the ground member 30 and the conductive film 50 is increased. As a result, the conductive film 50 can be further effectively grounded.
Fig. 7 is an explanatory view of a 5 th modification of the coupling ground member 30W. Fig. 7 (a) is a bottom view of the ground member 30W. FIG. 7 (B) is a cross-sectional view taken along a plane containing the line X3-X3
Fig. 7 (a) is a downward sectional view of the ground member 30W. Fig. 7 (C) is a front view of a modification of the grounding member 30 obtained by cutting off the 5 th modification of the coupling grounding member 30W.
The coupling ground member 30W of the 5 th modification shown in fig. 7 basically has the same configuration as the coupling ground member 30W of the 1 st embodiment. However, modification 5 is a square in plan view. The outer conductor 32 is provided at a position symmetrical to the 1 st plane P1 on the diagonal line. That is, the portion cut off in the cutting step is a region including a diagonal line orthogonal to the diagonal line on which the external conductor 32 is provided in a plan view, which is indicated by a broken line in fig. 7 (a). Therefore, the ground member 30 after being cut is an isosceles right triangle in plan view.
In this case, the area of the pattern conductor 31b exposed to the cut surface of the laminate 31 can be increased. As a result, the electrical connection area between the ground member 30 and the conductive film 50 increases. As a result, the conductive film 50 can be further effectively grounded.
Fig. 8 is a plan view showing another example of the manufacturing process of the electronic component package 100, in which the solder bumps S1 of the electronic component 10, the external electrodes 22 of the electronic component 20, and the external conductors 32 of the 6 th modification to which the ground member 30W is bonded are arranged on the adhesive layer B2. In modification 6 of the coupling ground member 30W, the plurality of coupling ground members 30W shown in embodiment 1 are connected to each other such that the cut portions when the ground members 30 are cut are on the same plane. The outer conductor 33 is not shown.
In this case, the 3 rd plane P3 as a cut plane of one bonding ground member 30W is divided into a plurality of regions, and the pattern conductor 31b is exposed. The number of the connection-ground members 30W is not particularly limited.
Fig. 9 is a plan view showing a state in which the solder bumps S1 of the electronic component 10, the external electrodes 22 of the electronic component 20, and the external conductors 32 of the 7 th modification bonded to the ground member 30W are arranged on the adhesive layer B2, respectively, in another example of the manufacturing process of the electronic component package 100. In the 7 th modification of the ground-connecting member 30W, the ground-connecting members 30W are connected to each other in a mesh shape in the 6 th modification. The external conductor 33 is not shown in the figure, as in fig. 8.
In this case, the ground member 30 after cutting has a window frame shape, and each side is divided into a plurality of regions to expose the pattern conductor 31 b. As in modification 6, the number of the ground connection members 30W to be connected is not particularly limited.
In the manufacturing process of the electronic component package 100, the 6 th modification and the 7 th modification of the bonding ground member 30W are used, whereby the time required for the work of disposing the bonding ground member 30W on the adhesive layer B2 can be reduced.
Modification of embodiment 1 of electronic component Package
The structure and characteristics of an electronic component package 100A, which is a modification of the electronic component package 100 according to embodiment 1, will be described with reference to fig. 10.
Fig. 10 is a sectional view of the electronic component package 100A. The electronic component package 100A basically has the same structure as the electronic component package 100, and includes an electronic component 10A having an external terminal, a ground member 30, a resin layer 40, and a conductor film 50. However, the external terminal of the electronic component 10A does not include the solder bump S1.
Even in the electronic component package 100A, the same effects as those of the electronic component package 100 can be obtained. In addition, the electronic component package 100A can achieve a lower back than the electronic component package 100 by the solder bumps S1. As a result, the electronic component package 100A can be mounted on the electronic device with a small size.
Embodiment 2 of electronic component packaging
< Structure of electronic parts Package >
The structure and characteristics of an electronic component package 100B according to embodiment 2 of the electronic component package of the present invention will be described with reference to fig. 11.
Fig. 11 is a sectional view of the electronic component package 100B. The electronic component package 100B includes: the electronic component 10 having the external terminal, the ground member 30, the soldering member S2 constituting the 2 nd connecting member, the resin layer 40, and the conductor film 50. The electronic component 10, the grounding component 30, the resin layer 40, and the conductive film 50 are the same as those of embodiment 1, and therefore, descriptions thereof are omitted. As shown in fig. 11, the case where the electronic component package 100B includes the electronic component 20 is also the same as that of embodiment 1.
In the electronic component package 100B, the external terminals of the electronic component 10 include the external electrodes 12 and the solder bumps S1 constituting the 1 st connecting member. The welding member S2 is connected to the outer conductor 32 of the ground member 30. In addition, as shown in fig. 11, even in the case where the electronic component package 100B includes the electronic component 20, the solder member S2 is connected to the external electrodes 22 of the electronic component 20.
The resin layer 40 covers the electronic component 10, the ground component 30, and the soldering component S2. At this time, a part of the peripheral edge of the pattern conductor 31b exposed to the 3 rd surface P3 of the laminate 31 is exposed from the resin layer 40. In addition, a part of the soldering bump S1 and a part of the soldering member S2 are exposed from the resin layer 40.
Even in the electronic component package 100B, the same effects as those of the electronic component package 100 can be obtained. In addition, the following effects can be further obtained.
When the conductive film 50 is formed on the resin layer 40 by sputtering, there is a possibility that the metal fine particles are not sufficiently attached to the surface on the mounting side in the vicinity of the side surface. In addition, when the conductor film 50 is formed using a Cu paste and a device such as spin coating, there is a possibility that the Cu paste does not sufficiently enter. That is, when the pattern conductor 31b in the laminate 31 is located on the mounting-side surface near the side surface, there is a possibility that sufficient connection with the conductive film 50 is not obtained.
On the other hand, the laminated body 31 of the ground member 30 of the electronic component package 100B is separated from the lower surface of the resin layer 40 by an amount corresponding to the connection of the solder member S2 to the external conductor 32. That is, the pattern conductor 31b in the laminated body 31 is located at a position separated from the lower surface by an amount corresponding to the soldering member S2. Therefore, the occurrence of the above-described problem can be suppressed, and the patterned conductor 31b and the conductive film 50 in the laminate 31 can be sufficiently connected.
< method for manufacturing electronic component Package >
A method for manufacturing the electronic component package 100B will be described with reference to fig. 12 and 13.
Fig. 12 and 13 are diagrams illustrating an example of a manufacturing process of the electronic component package 100B. Fig. 12 (a) to (F) are cross-sectional views schematically showing respective steps sequentially performed in one example of the manufacturing process of the electronic component package 100B. Fig. 13 (a) to (C) are cross-sectional views schematically showing the respective steps following fig. 12. Each of fig. 12 and 13 corresponds to a cross-sectional view of the electronic component package 100B of fig. 11.
Fig. 12 (a) to (E) are cross-sectional views showing the holding step. In the holding step, first, as shown in fig. 12 a, a solder paste (not shown) including a metal base MB1 and a protective layer MB2 provided on one main surface MB11 of the metal base MB1, the electronic component 10, the electronic component 20, a ground-bonding member 30W to which a plurality of ground-bonding members 30 are bonded, and a solder member S2 is manufactured or prepared. The electronic component 10, the electronic component 20, and the bonding ground component 30W have the above-described configuration. Therefore, detailed description is omitted.
For the metal base MB1, for example, a metal foil containing a material that is easily wettable by a lead-free solder material containing Sn and has a contact angle of 10 ° or less, such as a Cu foil having a thickness of 40 μm to 100 μm is used. For the protective layer MB2, for example, a film containing a material that easily repels the solder material and has a contact angle of 90 ° or more, such as an Al film having a thickness of 0.1 μm to 10 μm, is used. The protective layer MB2 is provided on one main surface of the metal base MB1 by sputtering, for example. However, the metal base material MB1 and the protective layer MB2 are not limited to the above embodiment.
Next, as shown in fig. 12 (B), a plurality of through holes H are formed in the protective layer MB 2. The plurality of through holes H are formed by irradiating the protective layer MB2 with the laser beam LB and removing the protective layer MB2 in the region irradiated with the laser beam LB. The laser LB is, for example, YAG laser or CO2Laser, etc. By adjusting the irradiation spot diameter, the laser output, and the like of the laser beam LB, the flatness of the one main surface MB11 of the metal base MB1 in the region where the through-hole H is formed is maintained.
Next, as shown in fig. 12 (C), the solder paste SP2 serving as the solder member S2 constituting the 2 nd connection member is filled into the through hole H at the position where the electronic component 20 and the bonding ground member 30W are connected to the metal base MB 1. The through-hole H is filled with the solder paste SP2 by, for example, screen printing. In the example shown in fig. 12 (C), the solder paste SP2 is not filled at the position where the electronic component 10 and the metal base material MB1 are connected.
As shown in fig. 12 (D), the external terminals of the electronic component 10 are connected to the metal base material MB1 exposed from the through-hole H by, for example, ultrasonic bonding using the solder bump S1 constituting the 1 st connecting member.
Then, the electronic component 20 and the bonding ground component 30W are placed on the solder paste SP2, and in this state, a reflow process is performed. As a result, as shown in fig. 12 (E), the external electrode 22 of the electronic component 20 and the external conductor 32 of the ground member 30W are connected to the metal base material MB1 exposed by the through-hole H via the solder member S2. Accordingly, the electronic component 10, the electronic component 20, and the coupling ground member 30W are held on the metal base MB.
The solder bump S1 is made of the same solder material as that used in embodiment 1. The welding member S2 uses the same welding material as the welding bump S1. However, different solder materials may be used for the solder bump S1 and the solder member S2.
The order of connecting the electronic component 10 to the metal base MB1, and connecting the electronic component 20 and the ground member 30W to the metal base MB1 may be reversed from the above. The solder paste SP2 may be filled in all the through holes H, and the electronic component 10 may be connected to the metal base MB1 via the solder bump S1 and the solder member S2. In this case, the 1 st connecting member includes the welding bump S1 and the welding member S2.
Fig. 12 (F) is a cross-sectional view showing the resin layer providing step. In the resin layer applying step, the bonding resin layer 40A having the 4 th surface P4 in contact with the protective layer MB2 and the 5 th surface P5 located on the opposite side of the 4 th surface P4 is applied on the protective layer MB 2. At this time, the surface of the electronic component 10 except for the region where the solder bump S1 is connected to the metal base material MB1 and the region in contact with the resist MB2, the surface of the electronic component 20 except for the region where the external electrode 22 is connected to the solder part S2, the surface of the bonding ground part 30W except for the region where the external conductor 32 is connected to the solder part S2, and the surface of the exposed solder part S2 are covered with the bonding resin layer 40A.
Fig. 13 (a) is a cross-sectional view showing the removal step. In the removing step, the metal base MB is removed so that the 4 th surface P4 is exposed, and a part of the solder bump S1 of the electronic component 10, a part of the solder member S2 connected to the external electrode 22 of the electronic component 20, and a part of the solder member S2 connected to the external conductor 32 of the ground member 30W are exposed on the 4 th surface P4. The removal step is performed by dissolving the metal base MB by etching.
The etching solution for dissolving and removing the Cu foil as the metal substrate MB1 is, for example, CuCl2An aqueous solution. The etching solution for dissolving and removing the Al film as the protective layer MB2 is, for example, FeCl3An aqueous solution. In short, an etching solution that does not dissolve the property of the bonding resin layer 40A is used.
Fig. 13 (B) is a cross-sectional view showing the cutting step. In the cutting step, the bonding resin layer 40A is cut by the blade D of the dicing saw into the resin layer 40 having the 4 th surface P4, the 5 th surface P5, and the 6 th surface P6 connecting the 4 th surface P4 and the 5 th surface P5. That is, the resin layer 40 has a rectangular parallelepiped shape, and when the lower surface of the rectangular parallelepiped is the 4 th plane P4 and the upper surface is the 5 th plane P5, the four side surfaces thereof are the 6 th plane P6.
Through this process, the coupled ground member 30W is separated into two ground members 30, and the peripheral edge of the pattern conductor 31b is partially exposed on the 3 rd plane P3 and the 6 th plane P6.
Fig. 13 (C) is a cross-sectional view showing the conductive film applying step. In the conductive film applying step, a conductive film is applied to the 5 th surface P5 and the 6 th surface P6 of the resin layer 40, and is connected to a part of the periphery of the pattern conductor 31b exposed on the 6 th surface P6.
In the above-described method for manufacturing the electronic component package 100B, the same effects as those of the above-described method for manufacturing the electronic component package 100 can be obtained.
The embodiments described in this specification are examples, and the present invention is not limited to the above-described embodiments and modifications, and various applications and modifications can be made within the scope of the present invention.
Description of reference numerals
100 … electronic component packaging; 10 … electronic components; 11 … electronic component body; 12 … an outer electrode; 30 … a ground member; a 31 … laminate; 31a … resin film; 31b … pattern conductor; 31c … via conductors; 32. 33 … an outer conductor; 40 … resin layer; 50 … a conductor film; s1 … bumps (1 st connecting part) are soldered.
