阅读说明：本技术 电路装置以及电力变换装置 (Circuit device and power conversion device ) 是由 矢原宽之 藤井健太 白形雄二 福田智仁 熊谷隆 中岛浩二 于 2019-01-18 设计创作，主要内容包括：无需大型化而能够大幅提高印刷基板的散热性的电路装置(1A1)具备印刷基板(2)、安装零件(3)、非实心金属间隔体(5)、冷却器(6)以及树脂层(8)。安装零件(3)在印刷基板(2)的至少一方的主表面(2A、2B)上配置至少一部分。非实心金属间隔体(5)配置于印刷基板(2)的至少一方的主表面(2A)上。冷却器(6)配置于非实心金属间隔体(5)的与印刷基板(2)相反的一侧。树脂层(8)配置于非实心金属间隔体(5)与冷却器(6)之间。非实心金属间隔体(5)具有能够在印刷基板(2)与冷却器(6)之间形成至少1个中空部分(5C)的形状。(A circuit device (1A1) capable of greatly improving the heat dissipation of a printed circuit board without increasing the size thereof is provided with a printed circuit board (2), a mounted component (3), a non-solid metallic spacer (5), a cooler (6), and a resin layer (8). The mounting component (3) is disposed at least partially on at least one of the main surfaces (2A, 2B) of the printed board (2). The non-solid metal spacer (5) is disposed on at least one main surface (2A) of the printed substrate (2). The cooler (6) is disposed on the side of the non-solid metal spacer (5) opposite to the printed substrate (2). The resin layer (8) is disposed between the non-solid metal spacer (5) and the cooler (6). The non-solid metal spacer (5) has a shape capable of forming at least 1 hollow portion (5C) between the printed substrate (2) and the cooler (6).)

1. A circuit arrangement having:

a printed substrate;

a mounting component, at least a part of which is disposed on at least one main surface of the printed circuit board;

a non-solid metal spacer disposed on at least one main surface of the printed circuit board;

a cooler disposed on an opposite side of the non-solid metallic spacer from the printed substrate; and

a resin layer disposed between the non-solid metallic spacer and the cooler,

the non-solid metal spacer has a shape capable of forming at least 1 hollow portion between the printed substrate and the cooler.

2. The circuit arrangement of claim 1,

the non-solid metal spacer has a thickness equal to or greater than the mounting component with respect to a direction intersecting the one main surface.

3. The circuit arrangement of claim 1 or 2,

the printed board includes a conductor layer along the one main surface,

the non-solid metallic spacers are bonded to the conductor layer by a No. 1 bonding material,

the melting point of the 1 st bonding material is less than the melting point of the metal material constituting the non-solid metal spacer.

4. The circuit arrangement of claim 3,

the mounting part and the non-solid metal spacer are connected by the 1 st bonding material.

5. The circuit arrangement of claim 3,

the non-solid metal spacer includes a1 st region having a comb shape and a2 nd region extending from a region overlapping the 1 st region in a plane to a region overlapping the mount part in a plane,

the mounting part and the 2 nd region of the non-solid metallic spacer are connected by a2 nd bonding material.

6. The circuit arrangement of claim 5,

the 2 nd bonding material is a material different from the 1 st bonding material.

7. A circuit arrangement according to any one of claims 1 to 6,

the non-solid metal spacer includes:

a pair of 1 st portions extending in a direction along the one main surface and facing each other with a longitudinal interval therebetween; and

a plurality of 2 nd portions extending from each 1 st portion of the pair of 1 st portions in a direction intersecting the one main surface in a region between the pair of 1 st portions, the 2 nd portions being arranged at intervals in a width direction with respect to a direction along the one main surface,

the non-solid metal spacer forms the hollow portion by the widthwise interval,

any 1 st part of the pair of 1 st parts is joined to the printed substrate.

8. A circuit arrangement according to any one of claims 1 to 6,

the non-solid metal spacer includes:

a1 st portion extending in a direction along the one main surface; and

a plurality of 2 nd portions extending from the 1 st portion in a direction intersecting the one main surface and arranged at intervals in a width direction with respect to a direction along the one main surface,

the non-solid metal spacer forms the hollow portion by the widthwise interval,

the plurality of 2 nd portions are bonded to the printed substrate.

9. The circuit arrangement of claim 8,

the mounting component is disposed in the hollow portion.

10. The circuit arrangement of claim 8 or 9,

a cutting portion formed by cutting the non-solid metal spacer is formed on a part of the non-solid metal spacer,

at the cut portion, a portion of the non-solid metal spacer is bent and bonded to the printed substrate.

11. The circuit arrangement according to any one of claims 1 to 10,

the hollow portion extends from a region adjacent to the component to a region adjacent to an end surface of the printed board along the one main surface.

12. The circuit arrangement according to any one of claims 1 to 11,

the non-solid metal spacers include a1 st non-solid metal spacer on the one main surface and a2 nd non-solid metal spacer on the other main surface on a side opposite to the one main surface,

the cooler includes a1 st cooler on the one main surface and a2 nd cooler on the other main surface.

13. The circuit arrangement of claim 12,

the cooler further includes a cooler connection portion extending in a direction intersecting the one main surface so as to connect an end portion of the 1 st cooler and an end portion of the 2 nd cooler,

the hollow portion extends from a region adjacent to the mounting component to a region adjacent to the cooler connection portion along the one main surface.

14. A circuit arrangement according to any one of claims 1 to 3,

the mounting part is a magnetic part and,

the magnetic component extends from the upper surface of the one main surface so as to penetrate through the printed circuit board.

15. A power conversion device including the circuit device according to any one of claims 1 to 14, the power conversion device comprising:

a main conversion circuit having a semiconductor module included in the circuit device, the main conversion circuit converting an input power and outputting the converted power; and

and the control circuit outputs a control signal for controlling the main conversion circuit to the main conversion circuit.

Technical Field

The present invention relates to a circuit device and a power conversion device, and more particularly to a technique for mounting a power electronic device with a small size and high heat dissipation.

Background

As a conventional circuit device, for example, japanese patent laying-open No. 2006-253205 (patent document 1) discloses an example in which an aluminum pipe having a flow passage for a cooling liquid is integrally laminated on a non-component mounting surface of a printed circuit board with an insulating layer interposed therebetween.

However, in general, in a reflow method which is an inexpensive soldering means, cream-like solder paste obtained by adding flux to solder powder is first screen-printed on a printed circuit board with a uniform thickness. Next, a surface mount component is placed on the printed circuit board by a chip mounter or the like. Then, the substrate is put into a furnace and the solder is melted to bond the printed board and the surface mounting component.

Most of the surface mount components used in the reflow method described above have a base plate having a heat diffusion function on the mounting surface side contacting the printed circuit board. On the other hand, the non-mounting surface side of the surface mount component is sealed by a resin package having electrical insulation and low thermal conductivity. Therefore, it is difficult to efficiently cool the surface mounting component from the non-mounting surface side. Therefore, in the above-mentioned japanese patent application laid-open No. 2006-253205, a method is employed in which heat generated in a mounted component is conducted to a printed circuit board, and a cooler connected to a non-component mounting surface of the printed circuit board is used for cooling.

Disclosure of Invention

In a power conversion device or the like as a power circuit using a large current, a demand for downsizing and high efficiency has been increasing year by year. Therefore, it is very important to reduce the size and increase the capacity of the circuit device included in the power conversion device.

In order to meet the demand for a smaller size and a larger capacity, it is necessary to connect the printed circuit board and the cooler with an insulating resin layer as in japanese patent application laid-open No. 2006-253205. However, the insulating resin layer has poor thermal conductivity. Therefore, when an insulating resin layer is used, it is important to reduce the thermal resistance between the printed circuit board and the cooler. Therefore, a technique for diffusing heat generated in the printed circuit board and transferring the heat to the cooler side with a heat transfer cross-sectional area as wide as possible is required. However, if the printed circuit board is increased in size in order to increase the heat transfer cross-sectional area, the entire circuit device is increased in size in accordance with the increase in size. It is necessary to improve the cooling efficiency from the printed circuit board to the cooler side while avoiding the increase in size of the circuit device.

The present invention has been made in view of the above problems. The purpose of the present invention is to provide a circuit device capable of greatly improving the heat dissipation of a printed circuit board without increasing the size, and a power conversion device including the circuit device.

The circuit device of the present embodiment includes a printed circuit board, a mounted component, a non-solid metallic spacer, a cooler, and a resin layer. The mounted component is disposed at least partially on at least one main surface of the printed board. The non-solid metal spacer is disposed on at least one main surface of the printed circuit board. The cooler is disposed on the opposite side of the non-solid metal spacer from the printed substrate. The resin layer is disposed between the non-solid metal spacer and the cooler. The non-solid metal spacer has a shape capable of forming at least 1 hollow portion between the printed substrate and the cooler.

According to the present invention, the non-solid metallic spacer disposed between the printed circuit board and the cooler functions as a heat sink for the printed circuit board and a thermal bridge between the printed circuit board and the cooler. The non-solid metal spacer greatly improves the heat dissipation of the printed circuit board without enlarging the circuit device. Thus, a circuit device in which a large current flows to a component mounted on a printed circuit board or the like or a component is mounted on a printed circuit board at a high density, and a power conversion device including the circuit device can be provided.

Drawings

Fig. 1 is a schematic cross-sectional view showing a configuration of a circuit device according to example 1 of embodiment 1.

Fig. 2 is a schematic perspective view showing the configuration of the circuit device according to embodiment 1, centering on a part where a component and a non-solid metallic spacer are mounted.

Fig. 3 is a schematic perspective view showing an example 1 of the structure of the non-solid metallic spacer according to embodiment 1.

Fig. 4 is a schematic perspective view showing a2 nd example of the structure of the non-solid metallic spacer according to embodiment 1.

Fig. 5 is a schematic perspective view showing a3 rd example of the structure of the non-solid metallic spacer according to embodiment 1.

Fig. 6 is a schematic perspective view showing a4 th example of the structure of the non-solid metallic spacer according to embodiment 1.

Fig. 7 is a schematic cross-sectional view showing the configuration of a circuit device according to example 2 of embodiment 1.

Fig. 8 is a schematic cross-sectional view showing the configuration of a circuit device according to example 3 of embodiment 1.

Fig. 9 is a schematic cross-sectional view showing the configuration of a circuit device according to example 4 of embodiment 1.

Fig. 10 is a schematic perspective view showing a5 th example of the structure of the non-solid metallic spacer according to embodiment 1.

Fig. 11 is a schematic cross-sectional view showing the configuration of a circuit device according to example 5 of embodiment 1.

Fig. 12 is a schematic perspective view showing the configuration of the circuit device according to example 5 of embodiment 1, centering on a part where a component and a non-solid metallic spacer are mounted.

Fig. 13 is a schematic cross-sectional view showing the configuration of a circuit device according to example 1 of embodiment 2.

Fig. 14 is a schematic perspective view showing example 1 of the configuration of the circuit device according to embodiment 2, centering on a part where a component and a non-solid metallic spacer are mounted.

Fig. 15 is a schematic perspective view of example 2 showing the configuration of the circuit device according to embodiment 2, centering on a portion where a component and a non-solid metallic spacer are mounted.

Fig. 16 is a schematic perspective view of example 3 showing the configuration of the circuit device according to embodiment 2, centering on a part where a component and a non-solid metallic spacer are mounted.

Fig. 17 is a schematic cross-sectional view of the circuit device according to example 4 of embodiment 2, in particular, in which the non-solid metallic spacers and a partial region of the printed substrate are cut out.

Fig. 18 is a schematic cross-sectional view showing a configuration of a circuit device according to embodiment 3.

Fig. 19 is a schematic cross-sectional view showing the configuration of the circuit device according to embodiment 4.

Fig. 20 is a schematic perspective view showing the configuration of the circuit device according to embodiment 4, centering on a portion other than the cooler.

Fig. 21 is a schematic cross-sectional view showing a configuration of a circuit device according to embodiment 5.

Fig. 22 is a schematic perspective view showing the configuration of the circuit device according to embodiment 5, centering on a part where a component and a non-solid metallic spacer are mounted.

Fig. 23 is a schematic perspective view showing the configuration of the circuit device according to embodiment 6, centering on a part where a component and a non-solid metallic spacer are mounted.

Fig. 24 is a schematic cross-sectional view showing the configuration of a circuit device according to embodiment 6.

Fig. 25 is a schematic cross-sectional view showing a configuration of a circuit device according to embodiment 7.

Fig. 26 is a schematic perspective view showing the configuration of the circuit device according to embodiment 7, centering on a part where a component and a non-solid metallic spacer are mounted.

Fig. 27 is a block diagram showing a configuration of a power conversion system to which the power conversion device according to embodiment 8 is applied.

(symbol description)

1a1, 1a2, 1A3, 1a4, 1a5, 1B1, 1B2, 1B3, 1B4, 1C, 1D, 1E, 1F, 1G: a circuit arrangement; 2: a printed substrate; 2A: one main surface; 2B: the other main surface; 2E: an end face; 3: a semiconductor component; 4: an electronic component; 5. 5A, 5B: a metal spacer; 5A 1: a flat tube; 5a2, 5A3, 5a4, 5a5, 5a 6: a square tube; 5A7, 5A 8: a metal flat plate; 5A 9: a corrugated metal plate; 5A 10: a comb-shaped portion; 5A 11: a branched portion; 5C: a hollow portion; 5D: a spacer through hole; 6. 6A, 6B: a cooler; 6C: a protrusion portion; 6D: a cooler connection portion; 7: a solder layer; 8: a resin layer; 9: a magnetic part; 10: a cutting section; 20: a photoresist layer; 21. 21A, 21B, 21C, 21D, 21E: a conductor layer; 22. 22A, 22B, 22C: an insulating layer; 23: a through hole; 24: a coil pattern; 25. 35: an area; 31: a semiconductor element; 32: a base plate; 33: resin packaging; 34: a lead frame; 1000: a power source; 2000: a power conversion device; 2010: a main conversion circuit; 2020: a semiconductor module; 2030: a control circuit; 3000: and (4) loading.

Detailed Description

Hereinafter, embodiments of the present invention will be described with reference to the drawings.