Electronic heat dissipation equipment for heat dissipation of electronic chip at different temperatures
阅读说明:本技术 一种用于电子芯片散热不同温度下散热的电子散热设备 (Electronic heat dissipation equipment for heat dissipation of electronic chip at different temperatures ) 是由 徐锐 于 2020-06-30 设计创作,主要内容包括:本发明公开了一种用于电子芯片散热不同温度下散热的电子散热设备,包括机身,所述机身内设有散热腔,所述散热腔上侧固设有用于散热的集热板,所述散热腔下侧固设有电子芯片,所述电子芯片外侧设有保护板,本发明设有第一散热装置,能够通过对流散热,从而使散热腔内的电子芯片进行高效散热;本发明设有风冷散热装置,能够通过风冷风扇转动与风冷风扇喷出冷却液配合,从而对电子芯片表面迅速降温,使设备能够短时间内恢复正常运作;本发明设有水冷散热装置,能够通过电子芯片外侧设有的液体管六内的冷却液对热量进行吸收,从而对电子芯片进行有效的散热。(The invention discloses electronic heat dissipation equipment for dissipating heat of an electronic chip at different temperatures, which comprises a machine body, wherein a heat dissipation cavity is arranged in the machine body, a heat collection plate for dissipating heat is fixedly arranged on the upper side of the heat dissipation cavity, the electronic chip is fixedly arranged on the lower side of the heat dissipation cavity, and a protection plate is arranged on the outer side of the electronic chip; the electronic chip cooling device is provided with the air-cooled heat dissipation device, and can be matched with cooling liquid sprayed by the air-cooled fan through rotation of the air-cooled fan, so that the surface of the electronic chip is rapidly cooled, and the equipment can be recovered to normally operate in a short time; the electronic chip cooling device is provided with the water-cooling heat dissipation device, and heat can be absorbed by the cooling liquid in the liquid pipe six arranged on the outer side of the electronic chip, so that the electronic chip can be effectively cooled.)
1. The utility model provides a be used for radiating electron heat dissipation equipment under different temperatures of electron chip heat dissipation, includes the fuselage, its characterized in that: the heat radiation device is characterized in that a heat radiation cavity is arranged in the machine body, a heat collection plate for heat radiation is fixedly arranged on the upper side of the heat radiation cavity, an electronic chip is fixedly arranged on the lower side of the heat radiation cavity, a protection plate is arranged on the outer side of the electronic chip, a first heat radiation device for convection heat radiation is arranged on the upper side of the heat collection plate, the first heat radiation device comprises an air inlet cavity which is arranged in the left side wall body of the heat radiation cavity and used for air inlet, a fan cavity is arranged on the left side of the air inlet cavity, an air inlet fan used for extracting cold air from the outside is rotatably arranged in the fan cavity, a hot air cavity for heat radiation is fixedly arranged on the upper side of the heat collection plate, a sliding cavity is arranged in the wall body on the upper side of the hot air cavity, an air inlet pipe is communicated between the sliding cavity and the hot air, and then the hot air cavity enters the sliding cavity, equipment is removed from the air outlet pipe, and cold air enters the air inlet cavity for supplement, so that convection heat dissipation is realized, the electronic chip is effectively dissipated, an air-cooled heat dissipation device for starting the electronic chip when the temperature of the electronic chip is too high is arranged on the upper side of the heat dissipation cavity, a water-cooled heat dissipation device for starting the electronic chip when the temperature of the electronic chip reaches a certain critical value is arranged on the right side of the heat dissipation cavity, and the water-cooled heat dissipation device and the air-cooled heat dissipation device are matched for starting to rapidly dissipate heat of the electronic chip.
2. The electronic heat sink device of claim 1, wherein the heat sink device further comprises: the first heat dissipation device comprises the air inlet fan, a belt wheel I is fixedly arranged on the right side of the air inlet fan, a belt wheel cavity I is arranged in the wall body on the upper side of the air inlet cavity, a motor I is fixedly arranged in the wall body on the left side of the belt wheel cavity I, a gear cavity I is arranged on the right side of the belt wheel cavity I, a rotating rod cavity is arranged on the upper side of the gear cavity I, a rotating shaft I is rotatably arranged between the rotating rod cavity and the gear cavity I, a rotating shaft II fixedly installed with a power output shaft of the motor I is rotatably arranged between the belt wheel cavity I and the gear cavity I, a bevel gear II in meshed connection with the bevel gear I fixedly arranged on the rotating shaft I is fixedly arranged on the rotating shaft II in the gear cavity I, a belt wheel II is fixedly arranged on the rotating shaft II in the belt wheel cavity I, a synchronous belt I is rotatably arranged between the belt wheel I and the belt wheel II, and a rotating, rotate on the dwang and be equipped with the connecting rod, the sliding chamber right side slide be equipped with connecting rod hinged joint has a sliding block, the sliding block with sliding chamber seal installation.
3. The electronic heat sink device of claim 1, wherein the heat sink device further comprises: the air-cooled heat dissipation device comprises a cooling liquid tank arranged on the lower right side in the machine body, a first liquid pump used for extracting cold liquid is arranged on the upper side of the cooling liquid tank, a first liquid pipe is communicated between the first liquid pump and the cooling liquid tank, a temperature control valve is arranged on the upper side of the first liquid pump, a second liquid pipe communicated between the rear side of the temperature control valve and the first liquid pump is connected, a communicating cavity is arranged in the temperature control valve, a rotary shaft capable of rotating and resetting is arranged on the upper side and the lower side of the communicating cavity in a rotating manner, a valve is fixedly arranged on the resetting rotary shaft, a driving block is fixedly arranged on the resetting rotary shaft on the lower side of the valve, the driving block is connected with a first capillary pipe, a filter screen is fixedly arranged on the lower side of the heat dissipation cavity, a temperature sensor is fixedly arranged on the wall body on the lower side of the electronic chip, the lower side of the filter screen is fixedly provided with a confluence plate, the confluence plate is provided with a confluence opening which can lead cooling liquid on the filter screen to be converged and flow in, the confluence opening is communicated with a liquid pipe III arranged on the lower side of the confluence plate, an intelligent one-way outflow check valve is arranged in the liquid pipe III, the lower side of the liquid pipe III is communicated with a liquid pipe IV, the right side of a liquid pump I is fixedly provided with a motor II, the left side of the liquid pump I is provided with a gear cavity II, the left side of the gear cavity II is provided with a gear cavity III, the lower side of the gear cavity III is provided with a liquid pump II which is used for collecting used cooling liquid to recycle the cooling liquid, a rotating shaft III fixedly arranged on a power output shaft of the motor II is rotatably arranged between the gear cavity III and the liquid pump I, a belt wheel cavity II is arranged in the wall body on the right side of the hot, a bevel gear IV which is engaged and connected with a bevel gear III fixedly arranged on the rotating shaft III is arranged in the gear cavity II, a rotating shaft five is rotatably arranged on the heat collecting plate on the left side of the belt wheel cavity two, a liquid pipe five communicated with the temperature control valve is arranged on the upper side of the rotating shaft five, a spray head for spraying atomized cooling liquid is arranged in the lower side wall body of the rotating shaft five, an air cooling fan is fixedly arranged on the rotating shaft five, a third belt wheel is fixedly arranged on the rotating shaft five, a fourth belt wheel is fixedly arranged on the rotating shaft four in the second belt wheel cavity, a second synchronous belt is arranged between the third belt wheel and the fourth belt wheel, when the temperature sensor detects that the electronic chip is overloaded and operates, the liquid in the capillary tube II flows towards the capillary tube I, thereby driving the driving block to rotate anticlockwise, and driving the valve to rotate anticlockwise so as to enable the liquid pipe five to be communicated with the liquid pipe two.
4. The electronic heat sink device of claim 1, wherein the heat sink device further comprises: the water-cooling heat dissipation device comprises a liquid pipe six arranged on the left side of a liquid pipe five on the temperature control valve, the liquid pipe six extends into the heat dissipation cavity and is wound with the electronic chip, so that the contact area is increased, the heat dissipation is quicker, the liquid pipe six is communicated with a liquid pipe four which is wound from the left lower corner of the electronic chip and is arranged in the left side wall body of the heat dissipation cavity, the liquid pipe four is communicated with a liquid pump two, a rotating shaft six is rotatably arranged between a gear cavity three and the liquid pump two, a bevel gear six which is in meshed connection with the bevel gear five fixedly arranged on the rotating shaft three is fixedly arranged on the rotating shaft six in the gear cavity three, a liquid pipe seven is arranged between the liquid pump two and the cooling liquid tank, and when the temperature value exceeds the normal operation temperature value of the electronic chip and is lower than the starting critical value of the air-cooling heat dissipation device, the electronic chip performs, and starting the water-cooling heat dissipation device.
Technical Field
The invention relates to the technical field related to electronic heat dissipation, in particular to electronic heat dissipation equipment for dissipating heat of an electronic chip at different temperatures.
Background
Electronic chips, also known as microcircuits, microchips, integrated circuits; the silicon chip containing an integrated circuit is small in size and is often a part of a computer or other electronic equipment; in the existing traditional electronic chip heat dissipation device, the general heat dissipation function is single, and the high-efficiency heat dissipation can not be performed according to the electronic chip operated in different states of the electronic chip, so that the safety performance and the load capacity of the electronic chip after operation are general, and therefore an electronic heat dissipation device capable of being used at different temperatures needs to be designed.
Disclosure of Invention
The present invention is directed to an electronic heat dissipation device for dissipating heat of an electronic chip at different temperatures, which overcomes the above-mentioned drawbacks of the prior art.
The electronic heat dissipation device comprises a machine body, wherein a heat dissipation cavity is arranged in the machine body, a heat collection plate for dissipating heat is fixedly arranged on the upper side of the heat dissipation cavity, an electronic chip is fixedly arranged on the lower side of the heat dissipation cavity, a protection plate is arranged on the outer side of the electronic chip, a first heat dissipation device for dissipating heat by convection is arranged on the upper side of the heat collection plate, the first heat dissipation device comprises an air inlet cavity which is arranged in the left side wall body of the heat dissipation cavity and used for inlet air, a fan cavity is arranged on the left side of the air inlet cavity, an air inlet fan used for extracting cold air from the outside is rotatably arranged in the fan cavity, a hot air cavity for dissipating heat is fixedly arranged on the upper side of the heat collection plate, a sliding cavity is arranged in the wall body on the upper side of the hot air cavity, an air inlet pipe is communicated between the sliding cavity and the hot, when the electronic chip works and generates heat, hot air passes through the heat collecting plate enters the hot air cavity, then enters the sliding cavity in the hot air cavity, then gets rid of equipment from the outlet duct, and air conditioning is followed the air inlet intracavity gets into the replenishment to realized the convection heat dissipation, thereby made the electronic chip realizes effectively dispelling the heat, heat dissipation chamber upside is equipped with the air-cooled heat abstractor that is used for electronic chip high temperature time to start, heat dissipation chamber right side is equipped with the water-cooled heat abstractor that is used for electronic chip temperature to start when reaching certain critical value, the water-cooled heat abstractor with the cooperation of air-cooled heat abstractor is started can be right the electronic chip dispels the heat rapidly.
On the basis of the technical scheme, the first heat dissipation device comprises the air inlet fan, a belt wheel I is fixedly arranged on the right side of the air inlet fan, a belt wheel cavity I is arranged in the wall body on the upper side of the air inlet cavity, a motor I is fixedly arranged in the wall body on the left side of the belt wheel cavity I, a gear cavity I is arranged on the right side of the belt wheel cavity I, a rotating rod cavity is arranged on the upper side of the gear cavity I, a rotating shaft I is rotatably arranged between the rotating rod cavity and the gear cavity I, a rotating shaft II fixedly installed with a power output shaft of the motor I is rotatably arranged between the belt wheel cavity I and the gear cavity I, a bevel gear II meshed and connected with the bevel gear I fixedly arranged on the rotating shaft I is fixedly arranged on the rotating shaft II in the gear cavity I, a belt wheel II is fixedly arranged on the rotating shaft II in the belt wheel cavity I, a synchronous belt I is rotatably arranged between the belt wheel I and the belt wheel II, a rotating, rotate on the dwang and be equipped with the connecting rod, the sliding chamber right side slide be equipped with connecting rod hinged joint has a sliding block, the sliding block with sliding chamber seal installation.
On the basis of the technical scheme, the air-cooled heat dissipation device comprises a cooling liquid tank arranged at the lower right side in the machine body, a first liquid pump used for extracting cold liquid is arranged at the upper side of the cooling liquid tank, a first liquid pipe is communicated between the first liquid pump and the cooling liquid tank, a temperature control valve is arranged at the upper side of the first liquid pump, a second liquid pipe communicated with the rear side of the temperature control valve and the first liquid pump is connected between the rear side of the temperature control valve and the first liquid pump, a communicating cavity is arranged in the temperature control valve, a rotary shaft capable of rotating and resetting is arranged on the upper side and the lower side of the communicating cavity in a rotating manner, a valve is fixedly arranged on the resetting rotary shaft, a driving block is fixedly arranged on the resetting rotary shaft at the lower side of the valve, the driving block is connected with a first capillary tube, a filter screen is fixedly arranged at the lower, the lower side of the temperature sensor is provided with a capillary tube II communicated with the capillary tube I, the lower side of the filter screen is fixedly provided with a confluence plate, the confluence plate is provided with a confluence port capable of enabling cooling liquid on the filter screen to be converged and flow in, the confluence port is communicated with a liquid tube III arranged on the lower side of the confluence plate, an intelligent one-way outflow check valve is arranged in the liquid tube III, the lower side of the liquid tube III is communicated with a liquid tube IV, the right side of the liquid pump I is fixedly provided with a motor II, the left side of the liquid pump I is provided with a gear cavity II, the left side of the gear cavity II is provided with a gear cavity III, the lower side of the gear cavity III is provided with a liquid pump II used for collecting used cooling liquid to enable the cooling liquid to be recycled, a rotating shaft III fixedly installed with a power output shaft of the motor II is rotatably arranged between the gear cavity III, a rotating shaft IV is rotatably arranged between the belt wheel cavity II and the gear cavity II, a bevel gear IV which is meshed with a bevel gear III fixedly arranged on the rotating shaft IV is arranged in the gear cavity II, a rotating shaft V is rotatably arranged on the heat collecting plate on the left side of the belt wheel cavity II, a liquid pipe V communicated with the temperature control valve is arranged on the upper side of the rotating shaft V, a spray head for spraying atomized cooling liquid is arranged in the lower side wall body of the rotating shaft V, a cooling fan is fixedly arranged on the rotating shaft V, a belt wheel III is fixedly arranged on the rotating shaft V, a belt wheel IV is fixedly arranged on the rotating shaft IV in the belt wheel cavity II, a synchronous belt II is arranged between the belt wheel III and the belt wheel IV, and when an electronic chip detected by a temperature sensor runs in an overload state, the liquid in the capillary tube II flows towards one direction of the capillary tube, so that a driving block is driven to rotate anticlockwise, thereby driving the valve to rotate anticlockwise to enable the liquid pipe five to be communicated with the liquid pipe two.
On the basis of the technical scheme, the water-cooling heat dissipation device comprises a liquid pipe six arranged on the left side of a liquid pipe five on the temperature control valve, the liquid pipe six extends into the heat dissipation cavity to be wound with the electronic chip, so that the contact area is increased, the heat dissipation is quicker, the liquid pipe six is communicated with a liquid pipe four which is wound from the left lower corner of the electronic chip and is arranged in the wall body on the left side of the heat dissipation cavity, the liquid pipe four is communicated with a liquid pump two, a rotating shaft six is rotatably arranged between a gear cavity three and the liquid pump two, a bevel gear six which is in meshed connection with the bevel gear five fixedly arranged on the rotating shaft three is fixedly arranged on the rotating shaft six in the gear cavity three, a liquid pipe seven is arranged between the liquid pump two and the cooling liquid tank, and when the temperature value exceeds the normal operation temperature value of the electronic chip and is lower than the starting critical value of the air-, and the electronic chip performs load operation and starts the water-cooling heat dissipation device.
The invention has the beneficial effects that: the heat dissipation device is provided with the first heat dissipation device, the hot air in the heat dissipation cavity can be accelerated to be discharged under the action of the sliding block in the sliding cavity, and then the cold air is supplemented to the heat dissipation cavity through the air inlet fan, so that the convection heat dissipation is realized, and the electronic chip in the heat dissipation cavity can be efficiently dissipated; the electronic chip cooling device is provided with the air-cooled heat dissipation device, and can be matched with cooling liquid sprayed by the air-cooled fan through rotation of the air-cooled fan, so that the surface of the electronic chip is rapidly cooled, and the equipment can be recovered to normally operate in a short time; the electronic chip cooling device is provided with the water-cooling heat dissipation device, heat can be absorbed through cooling liquid in the liquid pipe six arranged on the outer side of the electronic chip, and therefore the electronic chip is effectively cooled.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic view of an overall structure of an electronic heat dissipation device for dissipating heat of an electronic chip at different temperatures;
FIG. 2 is an enlarged view of a portion of the invention at A in FIG. 1;
FIG. 3 is a cross-sectional view taken at "B-B" of FIG. 1 in accordance with the present invention;
FIG. 4 is an enlarged view of a portion of the invention at C in FIG. 1;
FIG. 5 is an enlarged view of a portion of the invention at D in FIG. 1;
fig. 6 is a partial enlarged view at E in fig. 1 of the present invention.
Detailed Description
The invention will now be described in detail with reference to fig. 1-6, for convenience of description, the following orientations will now be defined: the up, down, left, right, and front-back directions described below correspond to the up, down, left, right, and front-back directions in the projection relationship of fig. 1 itself.
Referring to fig. 1 to 6, an electronic heat dissipating apparatus for dissipating heat from an electronic chip at different temperatures according to an embodiment of the present invention includes a
In addition, in one embodiment, the first
In addition, in one embodiment, the air-cooled
In addition, in one embodiment, the water-cooled heat sink 903 includes a liquid pipe six 33 disposed on the left side of a liquid pipe five 52 on the temperature control valve 73, the liquid pipe six 33 extends into the
In the initial state, the second
When the
When the
When the
The invention has the beneficial effects that: the heat dissipation device is provided with the first heat dissipation device, the hot air in the heat dissipation cavity can be accelerated to be discharged under the action of the sliding block in the sliding cavity, and then the cold air is supplemented to the heat dissipation cavity through the air inlet fan, so that the convection heat dissipation is realized, and the electronic chip in the heat dissipation cavity can be efficiently dissipated; the electronic chip cooling device is provided with the air-cooled heat dissipation device, and can be matched with cooling liquid sprayed by the air-cooled fan through rotation of the air-cooled fan, so that the surface of the electronic chip is rapidly cooled, and the equipment can be recovered to normally operate in a short time; the electronic chip cooling device is provided with the water-cooling heat dissipation device, heat can be absorbed through cooling liquid in the liquid pipe six arranged on the outer side of the electronic chip, and therefore the electronic chip is effectively cooled.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
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