Chip-level sensor packaging structure
阅读说明:本技术 芯片级传感器封装结构 (Chip-level sensor packaging structure ) 是由 洪立群 李建成 杜修文 于 2019-02-27 设计创作,主要内容包括:本发明公开一种芯片级传感器封装结构,包含感测芯片、设置于感测芯片顶面的环形支撑体、设置于环形支撑体上的透光件、封装体、及重置线路层。所述透光件、环形支撑体、及感测芯片共同包围形成有封闭空间。封装体包围感测芯片外侧缘、环形支撑体外侧缘、及透光件外侧缘,并且感测芯片的底面与透光件的一表面裸露于封装体之外。重置线路层直接成形于感测芯片的底面与封装体的底缘。重置线路层的底面形成有电性耦接于感测芯片的多个外接点。多个外接点中的部分位于感测芯片朝向重置线路层底面正投影所形成的投影区域的外侧。据此,通过结构上的改良,以使透光件的外侧缘被封装体所包覆,而提升结合强度,以避免在温度循环可靠度测试中引起脱层现象。(The invention discloses a chip-level sensor packaging structure which comprises a sensing chip, an annular supporting body arranged on the top surface of the sensing chip, a light-transmitting piece arranged on the annular supporting body, a packaging body and a reset circuit layer. The light-transmitting piece, the annular supporting body and the sensing chip are jointly surrounded to form a closed space. The package body surrounds the outer edge of the sensing chip, the outer edge of the annular support body and the outer edge of the light-transmitting piece, and the bottom surface of the sensing chip and one surface of the light-transmitting piece are exposed out of the package body. The reset circuit layer is directly formed on the bottom surface of the sensing chip and the bottom edge of the packaging body. The bottom surface of the reset circuit layer is provided with a plurality of external contacts electrically coupled with the sensing chip. The parts of the external contacts are positioned outside a projection area formed by orthographic projection of the sensing chip towards the bottom surface of the reset circuit layer. Therefore, through the structural improvement, the outer edge of the light-transmitting piece is wrapped by the packaging body, so that the bonding strength is improved, and the delamination phenomenon caused in a temperature cycle reliability test is avoided.)
1. A chip-scale sensor package structure, the chip-scale sensor package structure comprising:
a sensing chip, including a sensing region located on a top surface of the sensing chip, a plurality of inner contacts located on a bottom surface of the sensing chip, and a plurality of wires passing from the top surface of the sensing chip to the bottom surface of the sensing chip, the plurality of wires being respectively connected to the plurality of inner contacts and electrically coupled to the sensing region;
the annular supporting body is arranged on the top surface of the sensing chip and positioned outside the sensing region;
the light-transmitting piece comprises a first surface and a second surface which are positioned on two opposite sides, and the second surface of the light-transmitting piece is arranged on the annular supporting body, so that the light-transmitting piece, the annular supporting body and the sensing chip are jointly surrounded to form a closed space;
the packaging body surrounds the outer edge of the sensing chip, the outer edge of the annular supporting body and the outer edge of the light-transmitting piece; wherein the bottom surface of the sensing chip and the first surface of the light-transmitting member are exposed outside the package body; and
a reset circuit layer formed directly on the bottom surface of the sensing chip and the bottom edge of the package body, wherein a plurality of external contacts electrically coupled to the plurality of internal contacts are formed on the bottom surface of the reset circuit layer; wherein, some of the outer contacts are located outside a projection area formed by orthographic projection of the inner contacts towards the bottom surface of the reset line layer.
2. The chip scale sensor package structure of claim 1, wherein the bottom surface of the sensing chip is coplanar with the bottom edge of the package body.
3. The chip scale sensor package structure of claim 1, wherein the first surface of the optically transparent member is coplanar with a top edge of the package body.
4. The chip scale sensor package structure of claim 1, wherein the package body comprises a liquid package body and a molded package body, the liquid package body surrounds the outer edge of the sensing chip, the outer edge of the ring support, and the outer edge of the light-transmissive member, and the bottom surface of the sensing chip is coplanar with a bottom edge of the liquid package body; the molded package body is formed on the top edge of the liquid package body.
5. The chip scale sensor package structure of claim 1, wherein the top surface of the sensing chip, the outer edge of the ring support, and the second surface of the light-transmissive member together surround a ring-shaped recess, and the package body is filled in the ring-shaped recess.
6. The chip scale sensor package structure of claim 5, wherein a projection area formed by orthographically projecting the light-transmitting member toward the top surface of the sensing chip is located inside the outer edge of the sensing chip.
7. The chip scale sensor package structure of claim 1, wherein the outer edge of the sensing chip, the outer edge of the ring support, and the outer edge of the optically transparent member are disposed in a coplanar manner.
8. The chip scale sensor package structure of claim 1, wherein an outer edge of the package body is coplanar with an outer edge of the reset wiring layer.
9. The chip scale sensor package structure of claim 1, wherein the light-transmissive member comprises a plate-shaped portion, a supporting portion having a ring shape, and a bonding layer for bonding the plate-shaped portion and the supporting portion; wherein a surface of the plate-shaped portion remote from the support portion is defined as the first surface, and a surface of the support portion remote from the plate-shaped portion is defined as the second surface.
10. The chip scale sensor package structure of claim 9, wherein the bonding layer is a glass glue layer, an epoxy layer, or a solder layer.
Technical Field
The present disclosure relates to packaging structures, and particularly to a chip-scale sensor packaging structure.
Background
In the conventional chip scale sensor package structure, the light-transmitting member (such as optical glass) is only adhered and fixed by a glue layer at the bottom edge thereof, and the size of the light-transmitting member is substantially equal to that of the conventional chip scale sensor package structure, so that when the conventional chip scale sensor package structure is subjected to a temperature cycle reliability test (TCT), a delamination phenomenon is easily generated between the light-transmitting member and the glue layer, and the test cannot be passed.
The present inventors have considered that the above-mentioned drawbacks can be improved, and have made intensive studies and use of scientific principles, and finally have proposed the present invention which is designed reasonably and effectively to improve the above-mentioned drawbacks.
Disclosure of Invention
The embodiment of the invention provides a chip-scale sensor packaging structure, which can effectively avoid possible defects in the conventional chip-scale sensor packaging structure.
The embodiment of the invention discloses a chip-level sensor packaging structure, which comprises: a sensing chip, including a sensing region located on a top surface of the sensing chip, a plurality of inner contacts located on a bottom surface of the sensing chip, and a plurality of wires passing from the top surface of the sensing chip to the bottom surface of the sensing chip, the plurality of wires being respectively connected to the plurality of inner contacts and electrically coupled to the sensing region; the annular supporting body is arranged on the top surface of the sensing chip and positioned outside the sensing region; the light-transmitting piece comprises a first surface and a second surface which are positioned on two opposite sides, and the second surface of the light-transmitting piece is arranged on the annular supporting body, so that the light-transmitting piece, the annular supporting body and the sensing chip are jointly surrounded to form a closed space; the packaging body surrounds the outer edge of the sensing chip, the outer edge of the annular supporting body and the outer edge of the light-transmitting piece; wherein the bottom surface of the sensing chip and the first surface of the light-transmitting member are exposed outside the package body; a reset circuit layer formed directly on the bottom surface of the sensing chip and the bottom edge of the package body, wherein a plurality of external contacts electrically coupled to the plurality of internal contacts are formed on the bottom surface of the reset circuit layer; wherein, some of the outer contacts are located outside a projection area formed by orthographic projection of the inner contacts towards the bottom surface of the reset line layer.
Preferably, the bottom surface of the sensing chip is coplanar with the bottom edge of the package.
Preferably, the first surface of the light-transmissive member is coplanar with a top edge of the package body.
Preferably, the package includes a liquid package and a molded package, the liquid package surrounds the outer edge of the sensor chip, the outer edge of the ring support, and the outer edge of the light-transmissive member, and the bottom surface of the sensor chip is coplanar with the bottom edge of the liquid package; the molded package body is formed on the top edge of the liquid package body.
Preferably, an annular groove is formed by the top surface of the sensing chip, the outer edge of the annular supporting body, and the second surface of the light-transmitting member, and the package is filled in the annular groove.
Preferably, the light-transmitting member is located inside the outer edge of the sensing chip, and a projection area formed by orthographically projecting the light-transmitting member toward the top surface of the sensing chip is located inside the outer edge of the sensing chip.
Preferably, the outer edge of the sensing chip, the outer edge of the ring-shaped support, and the outer edge of the light-transmitting member are disposed in a coplanar manner.
Preferably, an outer edge of the package is coplanar with an outer edge of the reset wire layer.
Preferably, the light-transmitting member includes a plate-shaped portion, an annular supporting portion, and a bonding layer for bonding the plate-shaped portion and the supporting portion; wherein the plate-like portion surface remote from the support portion is defined as the first surface, and the support portion surface remote from the plate-like portion is defined as the second surface.
Preferably, the bonding layer is a glass glue layer, an epoxy resin layer, or a welding layer.
In summary, the chip-scale sensor package structure disclosed in the embodiments of the invention is structurally improved (for example, the reset circuit layer is directly formed on the bottom surface of the sensing chip and the bottom edge of the package body), so that the outer edge of the light-transmitting element can be covered by the package body, and the bonding strength of the light-transmitting element in the chip-scale sensor package structure is further improved, thereby preventing the chip-scale sensor package structure from delaminating during the temperature cycling reliability test.
For a better understanding of the nature and technical content of the present invention, reference should be made to the following detailed description of the invention and the accompanying drawings, which are provided for illustration purposes only and are not intended to limit the scope of the invention in any way.
Drawings
Fig. 1 is a schematic cross-sectional view of a chip-scale sensor package structure according to a first embodiment of the invention.
Fig. 2 is a schematic view of step S110 of a method for manufacturing a chip-scale sensor package structure according to a first embodiment of the invention.
Fig. 3 is a schematic diagram of step S130 of a method for manufacturing a chip-scale sensor package structure according to a first embodiment of the invention.
Fig. 4 is a schematic diagram of step S150 of a method for manufacturing a chip-scale sensor package structure according to a first embodiment of the invention.
Fig. 5 is a schematic diagram of step S170 of a method for manufacturing a chip-scale sensor package structure according to a first embodiment of the invention.
Fig. 6 is a schematic cross-sectional view of a chip-scale sensor package structure according to a second embodiment of the invention.
Detailed Description
Please refer to fig. 1 to 6, which are exemplary embodiments of the present invention, and it should be noted that, in the exemplary embodiments, related numbers and shapes mentioned in the accompanying drawings are only used for describing the embodiments of the present invention in detail, so as to facilitate the understanding of the contents of the present invention, and not for limiting the scope of the present invention.
[ example one ]
As shown in fig. 1 to 5, it is a first embodiment of the present invention. The present embodiment discloses a chip-scale
The chip scale
It should be noted that, for convenience of describing the chip-scale
As shown in fig. 1, the
The ring-shaped supporting
The light-transmitting
In this embodiment, the light-transmitting
However, in other embodiments not shown in the present disclosure, the outer diameter of the light-transmitting
The
In more detail, the
However, in other embodiments not shown in the present disclosure, the
The reset circuit layer 5 is formed directly on the
The
Furthermore, a plurality of
The above is a description of the structure of the chip-scale
The pre-step S110: as shown in fig. 2, a semi-finished product M is provided, which includes the
The packaging step S130: as shown in fig. 3, the
The inverted wiring step S150: as shown in fig. 4, the semi-finished product M and the
The ball mounting step S170: as shown in fig. 5, a plurality of
[ example two ]
As shown in FIG. 6, which is a second embodiment of the present invention, the present embodiment is similar to the first embodiment, so the same points (e.g., the
in this embodiment, the
More specifically, the light-transmitting
In addition, in other embodiments not shown in the present disclosure, the bonding layer 3c may be omitted from the light-transmitting
[ technical effects of embodiments of the present invention ]
In summary, the chip-scale sensor package structure disclosed in the embodiments of the invention is structurally improved (for example, the reset circuit layer is directly formed on the bottom surface of the sensing chip and the bottom edge of the package body), so that the outer edge of the light-transmitting element can be covered by the package body, and the bonding strength of the light-transmitting element in the chip-scale sensor package structure is further improved, thereby preventing the chip-scale sensor package structure from delaminating during the temperature cycling reliability test.
Furthermore, in the chip scale sensor package structure disclosed in the embodiment of the present invention, the bottom surface of the sensing chip is coplanar with the bottom edge of the package body, so as to facilitate the formation of the reset circuit layer; the packaging body is filled in the annular groove formed by the sensing chip, the annular supporting body and the light-transmitting piece in a surrounding mode, and therefore the bonding strength of the light-transmitting piece in the chip-scale sensor packaging structure is further improved.
In addition, in the chip scale sensor package structure disclosed in the embodiment of the invention, the light-transmitting member may be composed of a plate-shaped portion and a supporting portion, so that the enclosed space is enlarged, and the vertical distance between the sensing region of the sensing chip and the light-transmitting member is increased, thereby reducing the influence of stains (bleish) attached to the plate-shaped portion on the sensing result of the sensing chip.
The disclosure is only a preferred embodiment of the invention and is not intended to limit the scope of the invention, so that all equivalent technical changes made by using the contents of the specification and drawings are included in the scope of the invention.
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