Power conversion device and method for manufacturing power conversion device
阅读说明：本技术 电力变换装置以及电力变换装置的制造方法 (Power conversion device and method for manufacturing power conversion device ) 是由 清永浩之 藤井健太 福田智仁 若生周治 熊谷隆 五十岚弘 于 2019-01-09 设计创作，主要内容包括：提供得到高的散热性且易于组装的电力变换装置及电力变换装置的制造方法。电力变换装置(100)具备：第1散热体(50)；第2散热体(51),与第1散热体(50)对置；印刷基板(1),形成有第1电路图案(2a)；第1绝缘构件(40),设置于第1散热体(50)与印刷基板(1)之间；开关元件(10),具有隔着第1接合构件(30)电接合于第1电路图案(2a)的电极部(10b)；第1固定构件(32),接合于电极部(10b)的露出面；散热构件(20),一端接合于第1固定构件(32),另一端设置于开关元件(10)的与第2散热体(51)对置的部位与第2散热体(51)之间；第2绝缘构件(41),夹持于第2散热体(51)与开关元件(10)之间；以及安装部(52),固定第1散热体(50)和第2散热体(51)。(Provided are a power conversion device which has high heat dissipation and is easy to assemble, and a method for manufacturing the power conversion device. A power conversion device (100) is provided with: a 1 st heat radiator (50); a 2 nd radiator (51) that faces the 1 st radiator (50); a printed substrate (1) on which a 1 st circuit pattern (2a) is formed; a 1 st insulating member (40) provided between the 1 st radiator (50) and the printed substrate (1); a switching element (10) having an electrode portion (10b) electrically joined to the 1 st circuit pattern (2a) via a 1 st joining member (30); a 1 st fixing member (32) bonded to an exposed surface of the electrode portion (10 b); a heat radiation member (20) having one end joined to the 1 st fixing member (32) and the other end disposed between the switching element (10) and the 2 nd radiator (51) at a position facing the 2 nd radiator (51); a 2 nd insulating member (41) sandwiched between the 2 nd radiator (51) and the switching element (10); and a mounting portion (52) that fixes the 1 st radiator (50) and the 2 nd radiator (51).)
1. A power conversion device is provided with:
1, a first heat radiator;
a 2 nd radiator opposed to the 1 st radiator;
a printed substrate having a 1 st circuit pattern formed on a front surface thereof and a rear surface facing the 1 st radiator;
a 1 st insulating member provided between the 1 st heat radiator and the printed substrate;
a switching element having an electrode portion, a semiconductor chip, and a resin portion, a back surface of the electrode portion being electrically bonded to the 1 st circuit pattern via a 1 st bonding member, the electrode portion including a metal plate, the semiconductor chip being electrically bonded to the electrode portion, the resin portion sealing a part of a front surface side of the electrode portion and the semiconductor chip,
a 1 st fixing member having a back surface bonded to an exposed surface on the front surface side of the electrode portion;
a heat radiation member having one end joined to the front surface of the electrode portion with a 1 st fixing member interposed therebetween and the other end disposed between the surface of the resin portion of the switching element facing the 2 nd radiator and the 2 nd radiator;
a 2 nd insulating member sandwiched between the 2 nd radiator and the heat radiation member; and
and the mounting part is used for fixing the 1 st heat radiator and the 2 nd heat radiator.
2. The power conversion device according to claim 1,
the power conversion device further includes a sealing member that is filled between the 1 st radiator and the 2 nd radiator and seals the 1 st insulating member, the printed circuit board, the switching element, the 1 st fixing member, the heat radiation member, and the 2 nd insulating member.
3. A power conversion device is provided with:
1, a first heat radiator;
a 2 nd radiator opposed to the 1 st radiator;
a printed substrate having a 1 st circuit pattern formed on a front surface thereof and a rear surface facing the 1 st radiator;
a switching element having an electrode portion, a semiconductor chip, and a resin portion, a back surface of the electrode portion being electrically bonded to the 1 st circuit pattern via a 1 st bonding member, the electrode portion including a metal plate, the semiconductor chip being electrically bonded to the electrode portion, the resin portion sealing a part of a front surface side of the electrode portion and the semiconductor chip,
a 1 st fixing member having a back surface bonded to an exposed surface on the front surface side of the electrode portion;
a heat radiation member having one end joined to the front surface of the electrode portion with a 1 st fixing member interposed therebetween and the other end disposed between a surface of the resin portion of the switching element facing the 2 nd radiator and the 2 nd radiator;
a sealing member filled between the 1 st radiator and the 2 nd radiator to seal the printed substrate, the switching element, the 1 st fixing member, and the heat radiating member; and
and the mounting part is used for fixing the 1 st heat radiator and the 2 nd heat radiator.
4. The power conversion device according to claim 3,
a1 st insulating member is provided between the 1 st heat radiator and the printed substrate.
5. The power conversion device according to claim 3,
a 2 nd insulating member is provided between the 2 nd radiator and the heat dissipation member.
6. The power conversion device according to any one of claims 1 to 5,
the power conversion device further includes a harness electrically connected to the 1 st circuit pattern and configured to supply power to the switching element from outside.
7. The power conversion device according to any one of claims 1 to 6,
a heat conductive member is provided between a surface of the resin portion of the switching element facing the 2 nd radiator and the heat radiating member.
8. The power conversion device according to any one of claims 1 to 7,
the electrode portion has a through-hole,
one end of the heat dissipation member has a protrusion,
the protrusion is fitted in the through hole.
9. The power conversion device according to any one of claims 1 to 8,
the heat dissipation member further includes a 2 nd fixing portion, and the 2 nd fixing portion is joined to the 1 st circuit pattern via a 2 nd fixing member.
10. The power conversion device according to any one of claims 1 to 9,
the printed circuit board includes:
a 2 nd circuit pattern disposed on the back surface; and
and a via hole provided in the printed circuit board, one end of the via hole being bonded to the 1 st circuit pattern, and the other end of the via hole being bonded to the 2 nd circuit pattern.
11. The power conversion device according to claim 10,
a heat diffusion plate is bonded to the 2 nd circuit pattern.
12. A method for manufacturing a power conversion device includes:
a bonding member forming step of forming a 1 st bonding member and a 2 nd bonding member on a 1 st circuit pattern formed on a front surface of a printed circuit board, respectively;
a placement step of placing a switching element having an electrode portion, a semiconductor chip, a lead terminal, and a resin portion such that the electrode portion is positioned on the 1 st bonding member and the lead terminal is positioned on the 2 nd bonding member, a first fixing member 1 is disposed on an exposed surface of the switching element on a front surface side of the electrode portion, and the heat dissipating member is disposed such that one end thereof is positioned on a front surface of the first fixing member 1 and the other end thereof is positioned on a front surface of the switching element, the electrode portion includes a metal plate, the semiconductor chip is electrically bonded to the electrode portion, one end of the lead terminal is electrically bonded to the semiconductor chip by a wire, the resin section seals a part of the front surface side of the electrode section, the other end of the lead terminal, and the semiconductor chip;
a bonding step of simultaneously electrically bonding the electrode portion to the 1 st circuit pattern, electrically bonding the lead terminal to the 1 st circuit pattern, and bonding one end of the heat dissipation member to the electrode portion by reflow soldering heated at a temperature higher than a melting point of any of the 1 st bonding member and the 2 nd bonding member; and
and a fixing step of disposing a 1 st insulating member on a front surface of a 1 st radiator, disposing the printed circuit board on the front surface of the 1 st insulating member, disposing a 2 nd insulating member on a front surface of the other end of the radiator member, disposing a 2 nd radiator on the 2 nd insulating member, and fixing the 1 st radiator and the 2 nd radiator with a mounting portion.
13. A method for manufacturing a power conversion device includes:
a placement step of placing a 1 st fixing member on an exposed surface of a front surface side of an electrode portion of a switching element having the electrode portion, a semiconductor chip, a lead terminal, and a resin portion, the heat dissipating member being placed such that one end of the heat dissipating member is positioned on the front surface of the 1 st fixing member and the other end of the heat dissipating member is positioned on the front surface of the switching element, the electrode portion including a metal plate, the semiconductor chip being electrically bonded to the electrode portion, one end of the lead terminal being electrically bonded to the semiconductor chip by a wire, the resin portion sealing a part of the front surface side of the electrode portion, the other end of the lead terminal, and the semiconductor chip;
a heat radiation member bonding step of bonding one end of the heat radiation member to the electrode portion by the 1 st fixing member;
a bonding member forming step of forming a 1 st bonding member and a 2 nd bonding member on a 1 st circuit pattern formed on a front surface of the printed circuit board, respectively;
a bonding step of disposing the switching element such that the electrode portion is positioned on the 1 st bonding member and the lead terminal is positioned on the 2 nd bonding member, and performing electrical bonding of the electrode portion to the 1 st circuit pattern and electrical bonding of the lead terminal to the 1 st circuit pattern at the same time by reflow soldering by heating at a temperature lower than a melting point of the 1 st fixing member; and
and a fixing step of arranging a 1 st insulating member on a front surface of a 1 st radiator, arranging the printed board so that a rear surface of the printed board is positioned on the front surface of the 1 st insulating member, arranging a 2 nd insulating member on a front surface of the other end of the radiator member, arranging a 2 nd radiator on the 2 nd insulating member, and fixing the 1 st radiator and the 2 nd radiator by using a mounting portion.
14. A power conversion device is provided with:
1, a first heat radiator;
a 2 nd radiator opposed to the 1 st radiator;
a printed substrate having a 1 st circuit pattern formed on a front surface thereof and a rear surface facing the 1 st radiator;
a 1 st insulating member provided between the 1 st heat radiator and the printed substrate;
a switching element including an electrode portion, a semiconductor chip, a lead terminal, a resin portion, and a wire, wherein a back surface of the electrode portion is electrically bonded to the 1 st circuit pattern via a 1 st bonding member, the semiconductor chip is electrically bonded to a front surface of the electrode portion, one end of the lead terminal is electrically bonded to the 1 st circuit pattern via a 2 nd bonding member, the resin portion seals a part of a front surface side of the electrode portion, the other end of the lead terminal, and the semiconductor chip, and the wire electrically connects the other end of the lead terminal to the semiconductor chip;
a 1 st fixing member having a back surface bonded to an exposed surface on the front surface side of the electrode portion;
a heat radiation member having a joint portion at one end and a heat radiation portion at the other end, the joint portion being joined to a front surface of the 1 st fixing member, the heat radiation portion being provided between the resin portion of the switching element and the 2 nd heat radiator;
a 2 nd insulating member sandwiched between the 2 nd radiator and the switching element; and
an installation part, one end of which is combined with the 1 st heat radiation body and the other end of which is combined with the 2 nd heat radiation body, wherein the installation part fixes the 1 st heat radiation body and the 2 nd heat radiation body,
the heat dissipation part is a flat plate,
the joint portion and the heat radiating portion are connected by an inclined portion, and the joint portion, the heat radiating portion, and the inclined portion are integrally formed, and the inclined portion is a flat plate inclined with respect to the joint portion.
Technical Field
The present invention relates to a power converter and a method for manufacturing the power converter, and more particularly to a power converter having high heat dissipation performance and a method for manufacturing the power converter.
Background
Generally, a power conversion device includes a switching element that generates heat in association with an operation of the power conversion device. In recent years, the amount of heat generated per unit volume of a switching element mounted on a power conversion device has increased due to an increase in demand for downsizing and increasing output of the power conversion device. Since the temperature of the switching element rises due to heat generation associated with the operation of the power conversion device, the temperature of the switching element needs to be kept lower than the allowable temperature of surrounding electronic components.
Patent document 2 describes a structure of a power conversion device including: in the power conversion device, a heat dissipation member including elastic and adhesive silicone rubber is arranged between an electrode portion of a switching element mounted on a printed circuit board and a cooling body in a pressed manner. Since the heat dissipating member is made of elastic and adhesive silicone rubber, the heat dissipating member can be deformed to enter the fine irregularities on the surface of the electrode portion, thereby reducing the thermal contact resistance between the electrode portion and the heat dissipating member. Further, since the heat dissipating member has adhesiveness, when the printed circuit board on which the switching element is mounted, the heat dissipating member, and the cooling body are combined, the possibility that the heat dissipating member is detached from the electrode of the switching element can be reduced.
Disclosure of Invention
However, in the cooling structure of the power converter described in
In addition, in the case of manufacturing the cooling structure described in
Patent document 2 describes a heat dissipation structure of a power conversion device using silicone rubber as a heat dissipation member, but the thermal conductivity of silicone rubber is only about 1/100 or less of that of metal, and if only a heat dissipation member including silicone rubber is disposed as a heat dissipation path between an electrode portion of a switching element and a cooling body, there is a problem that high heat dissipation cannot be obtained.
The present invention has been made to solve the above problems. The main object of the present invention is to provide a power converter which has high heat dissipation and is easy to assemble, and a method for manufacturing the power converter.
The invention provides a power conversion device, comprising: 1, a first heat radiator; a 2 nd radiator opposed to the 1 st radiator; a printed substrate having a 1 st circuit pattern formed on a front surface thereof and a rear surface facing the 1 st radiator; the 1 st insulating component is arranged between the 1 st heat radiator and the printed substrate; a switching element having an electrode portion, a semiconductor chip, and a resin portion, a back surface of the electrode portion being electrically bonded to the 1 st circuit pattern via a 1 st bonding member, the electrode portion including a metal plate, the semiconductor chip being electrically bonded to the electrode portion, the resin portion sealing a part of a front surface side of the electrode portion and the semiconductor chip; a 1 st fixing member, the back surface of which is joined to the exposed surface on the front surface side of the electrode portion; a heat radiation member having one end joined to the front surface of the electrode portion via the 1 st fixing member and the other end disposed between the surface of the resin portion of the switching element facing the 2 nd radiator and the 2 nd radiator; the 2 nd insulating component, grasp between 2 nd radiator and heat-dissipating component; and one end of the mounting part is combined with the 1 st heat radiation body, the other end of the mounting part is combined with the 2 nd heat radiation body, and the 1 st heat radiation body and the 2 nd heat radiation body are fixed on the mounting part.
The present invention provides a method for manufacturing a power conversion device, including: a bonding member forming step of forming a 1 st bonding member and a 2 nd bonding member on a 1 st circuit pattern formed on a front surface of the printed circuit board, respectively; a placement step of placing a switching element having an electrode portion, a semiconductor chip, a lead terminal, and a resin portion, the electrode portion including a metal plate, the semiconductor chip being electrically connected to the electrode portion, the lead terminal being electrically connected to the semiconductor chip by a wire, the resin portion sealing a part of the front surface side of the electrode portion, the other end of the lead terminal, and the semiconductor chip, such that the electrode portion is placed on a 1 st bonding member, and the lead terminal is placed on a 2 nd bonding member, wherein a 1 st fixing member is placed on an exposed surface of the switching element on the front surface side of the electrode portion, and one end of a heat dissipation member is placed on the front surface of the 1 st fixing member, and the other end of the heat dissipation member is placed on the front surface of the resin; a bonding step of simultaneously electrically bonding the electrode portion to the 1 st circuit pattern, electrically bonding the lead terminal to the 1 st circuit pattern, and bonding one end of the heat dissipation member to the electrode portion by reflow soldering heated at a temperature higher than a melting point of any of the 1 st bonding member and the 2 nd bonding member; and a fixing step of disposing a 1 st insulating member on a front surface of the 1 st radiator, disposing a printed circuit board on the front surface of the 1 st insulating member, disposing a 2 nd insulating member on a front surface of the other end of the radiator member, disposing a 2 nd radiator on the 2 nd insulating member, and fixing the 1 st radiator and the 2 nd radiator by the mounting portion.
According to the power conversion device of the present invention, since heat generated by the semiconductor chip is radiated to the radiator using the plurality of heat radiation paths, high heat radiation performance can be obtained.
According to the method of manufacturing the power converter of the present invention, the electrical connection of the electrode portion to the 1 st circuit pattern, the electrical connection of the lead terminal to the 1 st circuit pattern, and the connection of the 1 st fixing portion to the electrode portion are simultaneously performed by performing reflow soldering by heating at a temperature higher than the melting point of any of the 1 st bonding member, the 2 nd bonding member, and the 3 rd bonding member, so that the assembly of the power converter can be simplified.
Drawings
Fig. 1 is a perspective view of a power conversion device according to
Fig. 2 is a perspective view of a power conversion device according to
Fig. 3 is a perspective view of a power conversion device according to
Fig. 4 is a sectional view of a power conversion device according to
Fig. 5 is a perspective view of a switching element and a heat radiation member of a power conversion device according to
Fig. 6 is a perspective view of a switching element and a heat radiation member of a power conversion device according to
Fig. 7 is a perspective view of a switching element and a heat radiation member of a power conversion device according to embodiment 2 of the present invention.
Fig. 8 is a sectional view of a power conversion device according to embodiment 3 of the present invention.
Fig. 9 is a sectional view of a power conversion device according to
Fig. 10 is a perspective view of a switching element and a heat radiation member of a power conversion device according to
Fig. 11 is a sectional view of a power conversion device according to embodiment 5 of the present invention.
Fig. 12 is a perspective view of a switching element and a heat radiation member of a power conversion device according to embodiment 5 of the present invention.
Fig. 13 is a perspective view of a switching element and a heat radiation member of a power conversion device according to embodiment 5 of the present invention.
Fig. 14 is a sectional view of a power conversion device according to embodiment 6 of the present invention.
Fig. 15 is a sectional view of a power converter according to embodiment 6 of the present invention.
Fig. 16 is a sectional view of a power conversion device according to embodiment 7 of the present invention.
Fig. 17 is a sectional view of a power conversion device according to embodiment 7 of the present invention.
Fig. 18 is a sectional view of a power conversion device according to embodiment 7 of the present invention.
Fig. 19 is a sectional view of a power conversion device according to embodiment 7 of the present invention.
(description of reference numerals)
100. 200, 300, 400, 500, 600, 700: a power conversion device; 1: a printed substrate; 1 a: a 1 st main surface; 1 b: a 2 nd main surface; 2a, 2b, 2c, 2 d: 1 st circuit pattern; 3: a 2 nd circuit pattern; 4: a wire harness; 10: a switching element; 10 a: a semiconductor chip; 10 b: an electrode section; 10 c:
Detailed Description
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