阅读说明：本技术 散热器和用于散热器的组装方法 (Heat sink and assembly method for a heat sink ) 是由 榊原直树 于 2019-02-04 设计创作，主要内容包括：公开了一种散热器,包括：散热器本体,该散热器本体具有吸收从发热本体传递的热量的吸热表面和向外辐射热量的散热表面；保持构件,该保持构件被保持为抵靠吸热表面；以及固定部,该固定部设置在散热器本体上,固定保持构件以使其不能从散热器本体上松脱,并且抑制在吸热表面延伸的平面方向上的移位。(Disclosed is a heat sink, including: a heat sink body having a heat absorbing surface that absorbs heat transferred from the heat generating body and a heat radiating surface that radiates the heat outward; a holding member held against the heat absorbing surface; and a fixing portion provided on the heat sink body, fixing the holding member so as not to be released from the heat sink body, and suppressing displacement in a plane direction in which the heat absorbing surface extends.)

1. A heat sink, comprising:

a heat sink body having a heat absorbing surface that absorbs heat transferred from the heat generating body and a heat radiating surface that radiates the heat outward;

a retaining member retained against the heat absorbing surface; and

a fixing portion provided on the heat sink body, fixing the holding member so as not to be loosened from the heat sink body, and suppressing displacement in a plane direction in which the heat absorbing surface extends.

2. The heat sink as claimed in claim 1, wherein the fixing portion has a first fixing portion having: an insertion portion that protrudes from the heat absorbing surface toward the holding member and is inserted through a through hole formed in the holding member; and an engaging portion provided on a tip end of the insertion portion and engaged with the through hole.

3. The heat sink as claimed in claim 2, wherein the plurality of first fixing portions are arranged to be spaced apart from each other.

4. The heat sink according to any one of claims 1 to 3, wherein the fixing portion has a second fixing portion having: a contact portion that is provided on at least a part of an edge of the heat absorbing surface on the heat sink body and that contacts a heat transfer surface on the holding member, the heat transfer surface facing an opposite side of the heat absorbing surface; and a connection portion connecting the contact portion and the heat sink body.

5. The heat sink as claimed in claim 4, wherein a plurality of the second fixing portions are arranged to be spaced apart from each other along an edge of the heat absorbing surface.

6. An assembly method for a heat sink according to any one of claims 1 to 5, the heat sink assembly method comprising:

preparing the holding member; and

the heat sink body and the fixing portion are integrally molded with the holding member.

Technical Field

The present invention relates to a heat sink for radiating heat generated in an electronic component to the outside, and an assembling method for the heat sink.

Background

In recent years, in semiconductor integrated circuits such as an IC (integrated circuit) and an LSI (large-scale IC) used in electronic devices, higher-density integration has been achieved. With the high integration of internal circuits, power consumption is also increased compared to the past. In addition, the amount of heat generated by internal resistance and the like in the semiconductor integrated circuit also increases in proportion to an increase in power consumption.

As heat generation increases, not only does the circuit become less efficient to operate, but it may also cause thermal runaway of the electronic circuit and result in damage to circuit components. Therefore, it is important to provide a heat sink in the integrated circuit as a heat source. As such a heat sink, a heat sink formed of a metal member made of aluminum or the like having a heat capacity larger than that of an electronic component as a heat generating body is known. The heat sink adheres to the outer surface of the electronic component by means of a thermally conductive material, such as thermal grease, thereby causing heat dissipation from the electronic component.

As such a heat sink, for example, those described in patent documents 1 and 2 below are known. Patent document 1 describes a heat dissipation structure having a metal member that is a heat absorbing member for absorbing heat from a heat source and a heat dissipation member integrally molded with the metal member. Patent document 2 describes an LED heat sink having a heat sink body that is a heat radiation member for radiating heat, and a heat transfer plate that is a heat absorption member molded to the heat sink body for absorbing heat generated by high-brightness LEDs.

Reference list

Patent document

[ patent document 1]

Japanese unexamined patent application, first publication No. 2014-229714

[ patent document 2]

Japanese unexamined patent application, first publication No. 2011-

Disclosure of Invention

Problems to be solved by the invention

In the devices according to patent document 1 and patent document 2, there is a difference between the linear thermal expansion coefficients of the heat absorbing member and the heat dissipating member. In addition, in the devices according to patent document 1 and patent document 2, the heat radiating member is fixed to the heat receiving member only by a holding force at the time of molding. For this reason, if the heat is continuously heated in the case of long-term use, there is a possibility that misalignment or a gap occurs between the heat-absorbing member and the heat-dissipating member due to a difference in the linear thermal expansion coefficient. If such misalignment or gap occurs, the desired heat dissipation performance cannot be obtained.

The present invention has been made to solve the above-mentioned problems, and has an object to provide a heat sink capable of providing good heat dissipation performance over a long period of time, and an assembling method for the heat sink.

Means for solving the problems

An object of the present invention is to provide a heat sink that solves the above-mentioned problems and an assembling method for the heat sink.

A heat sink according to an embodiment of the present invention includes: a heat sink body having a heat absorbing surface that absorbs heat transferred from the heat generating body and a heat radiating surface that radiates the heat outward; a holding member held against the heat absorbing surface; and a fixing portion provided on the heat sink body, fixing the holding member so as not to be loosened from the heat sink body, and suppressing displacement in a plane direction in which the heat absorbing surface extends.

Advantageous effects of the invention

According to the above-mentioned embodiments, good heat dissipation performance can be obtained over a long period of time.

Drawings

Fig. 1 is an exploded perspective view illustrating a structure of a heat sink according to an embodiment of the present invention.

Fig. 2 is a plan view of a retaining member according to an embodiment of the present invention.

Fig. 3 is a sectional view taken along line II-II in fig. 1.

Fig. 4 is a sectional view taken along line III-III in fig. 1.

Fig. 5 is a sequence diagram indicating a heat sink assembling method according to an embodiment of the present invention.

Fig. 6 is a sectional view showing a state after a holding member preparation step is performed in the heat sink assembly method according to the embodiment of the invention.

Fig. 7 is a sectional view showing a state after an integral molding step is performed in a heat sink assembling method according to an embodiment of the present invention.

Fig. 8 is a sectional view showing a minimum structure of a heat sink according to an embodiment of the present invention.

Detailed Description

Embodiments of the present invention will be explained with reference to the drawings.

The heat sink 100 according to the present embodiment is used by: it is arranged in close contact with an electronic component including an integrated circuit element (such as an LSI or an IC) to thereby radiate heat from the electronic component as a heat generating body.

As shown in fig. 1 to 4, the heat sink 100 is provided with a heat sink body 1, a holding member 3, and a fixing portion 4.

The heat sink body 1 has a base 11 of a rectangular plate shape and a plurality of fins 12 integrally provided on the base 11. The fins 12 are plate-shaped so as to extend in a direction orthogonal to the plane in which the base 11 extends. The plurality of fins 12 are arranged to be spaced apart from each other on one surface of the base 11. The fins 12 are not limited to being plate-shaped, and they may also be columnar.

In the present embodiment, the heat sink body 1 is formed of a heat conductive resin. The heat sink body 1 is formed by insert molding together with the fixing portion 4 using a heat conductive resin as a material.

Of the surfaces of the base 11, the surface opposite to the surface on which the fins 12 are provided is the heat absorbing surface 1A. The holding member 3 contacts the heat absorbing surface 1A.

Among the surfaces of the base 11, the surface on which the fins 12 are provided is the heat dissipation surface 1B. A plurality of fins 12 extend from the heat dissipation surface 1B.

As shown in fig. 2, the holding member 3 is in the shape of a substantially rectangular plate.

The holding member 3 is held by the radiator body 1 against the heat absorbing surface 1A.

In the present embodiment, the holding member 3 is formed of metal (e.g., aluminum).

The cutout portions 31 are formed at four corners of the holding member 3. Each cutout portion 31 is formed in an L shape by being recessed inward from the edge of the holding member 3. The fixing portions 4 (second fixing portions 42) to be described later are engaged with these cutout portions 31. A plurality of (two) through holes 32 are formed in the center region of the holding member 3. Each through-hole 32 is a circular opening penetrating the holding member 3 in the thickness direction. The fixing portion 4 (first fixing portion 41) to be described later is engaged with these through holes 32.

As shown in fig. 3 or fig. 4, of the surfaces of the holding member 3, the surface facing the heat absorbing surface 1A is a contact surface 3A, and the surface facing the direction opposite to the heat absorbing surface 1A is a heat transfer surface 3B. As shown in fig. 3, by insert-molding the heat sink body 1 to the holding member 3, the heat absorbing surface 1A of the heat sink body 1 is fixed in close contact with the contact surface 3A of the holding member 3.

The holding member 3 is fixed to the heat sink body 1 by means of the fixing portion 4 so as not to be released. The structure of the fixing portion 4 will be explained. The fixing portion 4 has a first fixing portion 41 and a second fixing portion 42.

As shown in fig. 3, the first fixing portions 41 each have an insertion portion 41A protruding from the base portion 11 (heat absorbing surface 1A) of the radiator body 1 toward the contact surface 3A of the holding member 3, and an engagement portion 41B, the engagement portion 41B being integrally provided on a tip end of the insertion portion 41A. The insertion portion 41A is inserted through the through hole 32 formed in the holding member 3. The engaging portion 41B is formed in the shape of a flange extending in a planar direction orthogonal to the direction in which the insertion portion 41A extends (i.e., a planar direction in which the heat transfer surface 3B of the holding member 3 extends).

As shown in fig. 3, in the present embodiment, the engaging portion 41B of the first fixing portion 41 extends from the through hole 32 along the heat transfer surface 3B of the holding member 3, and contacts the heat transfer surface 3B at the periphery of the through hole 32.

As shown in fig. 4, the second fixing portions 42 each have a contact portion 42A and a connection portion 42B, the contact portion 42A being provided on at least a part of the edge of the heat absorbing surface 1A (four corner portions of the heat absorbing surface 1A in the present embodiment), the connection portion 42B connecting the contact portion 42A with the radiator body 1 (base 11). The contact portion 42A extends along the heat transfer surface 3B of the holding member 3. The contact portion 42A contacts a portion of the heat transfer surface 3B at the corner including the edge. The connecting portion 42B is provided integrally with the contact portion 42A. As a result, the second fixing portion 42 is formed substantially in an L shape in cross section.

Due to these first fixing portions 41 and second fixing portions 42, the holding member 3 is fixed to the radiator body 1. More specifically, displacement of the holding member 3 in the plane direction in which the heat absorbing surface 1A of the radiator body 1 extends is suppressed by the first fixing portion 41 and the second fixing portion 42. In the present embodiment, an example of a structure in which both the first fixing portion 41 and the second fixing portion 42 are provided as the fixing portion 4 has been explained. However, the structure may be provided, for example, with only the first fixing portion 41 or only the second fixing portion 42 as the fixing portion 4.

In addition, in the present embodiment, the cutout portions 31 and the second fixing portions 42 are provided on the four corners of the heat absorbing surface 1A, but they may be provided at any position on the edge of the heat absorbing surface 1A. As a modified example, the cutout portions 31 and the second fixing portions 42 may be provided on four sides of the heat absorbing surface 1A. Even in the case where the cutout portions 31 and the second fixing portions 42 are provided on the four side faces of the heat absorbing surface 1A, the cutout portions 31 and the second fixing portions 42 have effects similar to those in the case where they are provided at the four corner portions of the heat absorbing surface 1A.

Next, an assembling method of the heat sink 100 according to the present embodiment will be explained with reference to fig. 5. As shown in fig. 5, the assembling method of the heat sink 100 includes a holding member preparing step S1 and an integral molding step S2.

First, the holding member preparation step S1 is performed.

As shown in fig. 6, the holding member preparation step S1 includes preparing the holding member 3, forming the cutout portion 31 and the through hole 32 in the holding member 3.

Next, an integral molding step S2 is performed.

The integral molding step S2 includes setting the holding member 3 in which the cutout portions 31 and the through holes 32 are formed in a mold, and pouring a heat conductive resin into the mold. By pouring the heat conductive resin into the mold, the heat conductive resin enters the cutout portion 31 and the through hole 32.

As a result, the radiator module 1 and the fixing portion 4 are integrally molded on the holding member 3, as shown in fig. 7. Specifically, the first fixing portion 41, the second fixing portion 42, and the heat sink body 1 including the base 11 and the fins 12 are integrally molded with the holding member 3 by insert molding.

In addition, as a result, the heat sink body 1 and the fixing portion 4 can be made to come into close contact with the holding member 3 based on the shapes thereof.

This completes all steps in the assembly process of the heat sink 100.

When the heat sink 100 is used, it is arranged in a state such that the heat transfer surface 3B of the holding member 3 is brought into contact with an integrated circuit element (e.g., LSI or IC). Thermal grease or the like may also be provided between the heat transfer surface 3B and the surface of the integrated circuit element. When power is supplied to the integrated circuit element in this state, heat is generated by internal resistance or the like. The heat is absorbed by the holding member 3, transferred to the heat sink body 1 through the holding member 3, and radiated outward through the fins 12 on the heat sink body 1. As a result, the temperature of the integrated circuit element can be lowered, and the element can be used for a long period of time.

When the circuit elements are repeatedly supplied with power and disconnected from power over a long period of time, the heat sink 100 expands and contracts with heat exchange. More specifically, considerable expansion and contraction occurs between the above-mentioned radiator body 1 and the holding member 3. When such expansion and contraction are repeated, there is a possibility that: the close contact of the radiator body 1 with respect to the holding member 3 will not be able to withstand the stress associated with the displacement, resulting in the holding member 3 and the radiator body 1 separating or becoming misaligned.

However, in the case of the heat sink 100 according to the present embodiment, the holding member 3 is fixed by means of the fixing portion 4 so as not to be released from the heat sink body 1. In addition, the fixing portion 4 suppresses displacement of the radiator body 1 in the plane direction in which the heat absorption surface 1A extends. Specifically, the engaging portion 41B of the first fixing portion 41 suppresses relative displacement in the central region of the holding member 3. In addition, the contact portion 42A of the second fixing portion 42 suppresses relative displacement in the region including the edge of the holding member 3. As a result, when heat enters the heat sink 100, the fixing portion 4 fixes the holding member 3 against contraction or expansion even if there is a difference between the linear thermal expansion coefficient of the heat sink body 1 and the linear thermal expansion coefficient of the holding member 3. Therefore, the possibility of separation or misalignment between the radiator body 1 and the holding member 3 can be reduced. As a result, it becomes possible to provide good heat dissipation performance over a long period of time.

In addition, the heat sink 100 according to the present embodiment is provided with a plurality of first fixing portions 1 and a plurality of second fixing portions 42. Therefore, the holding member 3 can be more firmly and stably fixed to the radiator body 1.

In addition, in the case of the assembling method for the heat sink 100 according to the present embodiment, the heat sink body 1, the first fixing portion 41, and the second fixing portion 42 are formed on the holding member 3 by means of integral molding, thereby fixing the holding member 3 to the heat sink body 1. Therefore, the holding member 3 can be firmly fixed to the radiator body 1.

The embodiments of the present invention have been explained above. Various modifications and improvements may be made to the above-mentioned structures and methods without departing from the spirit of the invention. For example, in the above-mentioned embodiments, an example of a case where an integrated circuit element is used as a heat generating body is explained. However, the heat sink 100 may be applied to any circuit element as long as it is an element requiring heat dissipation.

Fig. 8 is a diagram showing a minimum structure of the heat sink 100. It is sufficient that the heat sink 100 is provided with at least the heat sink body 1 having the heat absorbing surface 1A and the heat radiating surface 1B, the holding member 3, and the fixing portion 4.

The present application claims priority from japanese patent publication No. 2018-020533, filed on 7.2.2018, the entire disclosure of which is incorporated herein by reference.

INDUSTRIAL APPLICABILITY

According to the above-described embodiment, good heat dissipation performance can be obtained over a long period of time.

[ list of reference numerals ]

1 radiator body

3 holding member

4 fixed part

11 base part

12 fin

1A heat absorption surface

1B Heat dissipating surface

31 cut out part

32 through hole

3A contact surface

3B Heat transfer surface

41 first fixed part

41A insertion part

41B joint

42 second fixed part

42A contact part

42B connection part

S1 holding member preparation step

S2 integral molding step