Coating method for preventing high-speed impact

文档序号:1265449 发布日期:2020-08-25 浏览:28次 中文

阅读说明:本技术 一种防高速冲击涂层方法 (Coating method for preventing high-speed impact ) 是由 廖斌 欧阳潇 欧阳晓平 罗军 陈琳 庞盼 张旭 吴先映 英敏菊 于 2020-05-18 设计创作,主要内容包括:本发明涉及一种防高速冲击涂层方法,包括:对基体进行表面初步离子清洗;在表面清洗后的基体进行激光亚表面微结构化;对结构化表面深度清洗后进行离子注入,并退火形成伪扩散层;在所述伪扩散层之上,利用蒸发法沉积聚合物吸能膜层;利用高能离子注入对聚合物层进行金属化;利用磁过滤沉积设备在金属化层上沉积超硬金刚石涂层;循环制备聚合物层、金属化层以及超硬类金刚石层3-5次。本发明实施例提供的方法,通过基体微结构、离子注入和沉积镀膜的相结合的方式,明显提高了基体的抗高速运动物体的冲击能力。因其方法简单、易操作,且成本低、效率高,非常适合批量化生产。(The invention relates to a high-speed impact prevention coating method, which comprises the following steps: carrying out surface preliminary ion cleaning on the substrate; performing laser sub-surface micro-structuring on the substrate after surface cleaning; carrying out ion implantation after deeply cleaning the structured surface, and annealing to form a pseudo diffusion layer; depositing a polymer energy-absorbing film layer on the pseudo-diffusion layer by an evaporation method; metallizing the polymer layer by high-energy ion implantation; depositing a superhard diamond coating on the metallization layer by using magnetic filtration deposition equipment; and (3) circularly preparing the polymer layer, the metallization layer and the superhard diamond-like carbon layer for 3-5 times. The method provided by the embodiment of the invention obviously improves the impact resistance of the matrix to high-speed moving objects by combining the matrix microstructure, the ion implantation and the deposition coating. The method is simple, easy to operate, low in cost and high in efficiency, and is very suitable for batch production.)

1. A high-speed impact resistant coating method, comprising the steps of:

s110, carrying out primary surface cleaning on the substrate;

s120, performing laser subsurface microstructuring on the substrate;

s130, deeply cleaning the surface, then carrying out ion implantation by using an ion source and annealing to form a pseudo diffusion layer;

s140, depositing a polymer energy absorption film layer by an evaporation method;

s150, metalizing the polymer energy absorption film layer by high-energy ion source injection;

s160, depositing a superhard diamond coating on the metallization layer by using magnetic filtration deposition equipment;

and S170, repeatedly accumulating the polymer energy-absorbing film layer, the metallization layer and the superhard diamond coating for 3-5 times.

2. The method as claimed in claim 1, wherein the high power pulsed magnetron deposition technique is used to perform ion cleaning on the substrate, the total beam current is 2-6A, the negative pressure is 500-1000V, the high power pulsed power is 0-1MW, the temperature is 300-550 ℃, and the gas pressure is 1 × 10-210Pa below, Ar gas is introduced, and the bombardment time is 30-120 min.

3. The method as claimed in claim 1, wherein the substrate is subjected to surface microstructure design by laser, the surface is cut by ring and straight lines, the number of designed discrete structures is not less than 40, and the laser line width is 1-5 μm.

4. The method according to claim 1 or 3, wherein the laser for laser is an ultraviolet laser.

5. The method according to claim 1, wherein in step S130, the ion source is a metal vacuum vapor ion source, the implanted element for ion implantation is metal element Ti, Cr, C, Co or Hf, and during the surface ion implantation, a heating treatment is performed to form a pseudo diffusion layer, the ion implantation treatment size is not less than 800mm, the treatment beam current is not less than 10mA, and the acceleration voltage is not more than 30 KV.

6. The method of claim 1, wherein the polymer energy absorbing film layer has a thickness of 25-50 μm.

7. The method of claim 6, wherein the energy absorbing polymer film layer is deposited by an electron beam evaporation system with a width of 1000mm, a gun power of not less than 20KW, an energy of not more than 100eV, and an evaporation rate of 10-100 μm/min.

8. The method according to claim 1, wherein in step S150, the high energy ion source is a metal vacuum vapor ion source, the implanted element of the ion implantation is Ni, Mg or C, the ion implantation size is not less than 800mm, the processing beam current is not less than 5mA, the acceleration voltage is 30-80KV, and the thickness of the formed metallization layer is not less than 50 nm.

9. The method according to claim 1, wherein the magnetic filtration deposition equipment is wide beam processing equipment, the processing width is not less than 800mm, the cathode is a carbon target, the service life of the carbon target is not less than 100h, the carbon arcing current is not less than 200A, the thickness of the deposited superhard diamond coating is 1-4 μm, and the coating hardness is not less than 50 Gpa.

10. The method of claim 1, wherein the total coating thickness is 0-260 μm.

Technical Field

The invention relates to a preparation method and application of a high-speed impact prevention energy-absorbing coating, and belongs to the technical field of protective materials.

Background

Body armor is individual protective equipment worn under specific environment to ensure the survival of people, and can absorb and dissipate the kinetic energy of bullets and fragments, prevent penetration and effectively protect the protected part of human body. At present, the bulletproof vest mainly refers to a bulletproof vest for protecting the front chest and the back and preventing bullets and fragments from damaging important parts of a human body. Body armor can be divided into three types of soft and hard bodies according to the materials used. At present, the weight of hardware or software is a very important consideration. The existing soft body armor has light weight, but has a plurality of problems in the aspect of protection, such as poor protection effect and the like; the hard body armor has the advantages of good protection effect, but has the obvious defect of large mass and inconvenient carrying. The new material technology is one of the research fields which are very important in China and even all over the world, and the material surface modification technology is an important direction for the research of new materials. Through proper surface treatment, various properties of the material surface, such as the smoothness, the hardness, the abrasion resistance, the impact oxidation resistance, the sand erosion resistance, the salt mist corrosion resistance and the like of the material surface, can be obviously improved, so that the service life and the efficiency of the protective material are obviously improved, and the purposes of saving raw materials and reducing the weight of the protective material are realized.

Disclosure of Invention

In order to solve the problems, the deposition of the superhard coating on the soft substrate or the hard substrate is needed, and the key problems of weak high-speed impact resistance, heavy weight and the like are solved.

In view of this, embodiments of the present invention provide a high-speed impact resistant coating method, including the steps of:

s110, carrying out primary surface cleaning on the substrate;

s120, performing laser subsurface microstructuring on the substrate;

s130, deeply cleaning the surface, then carrying out ion implantation by using an ion source and annealing to form a pseudo diffusion layer;

s140, depositing a polymer energy absorption film layer by an evaporation method;

s150, metalizing the polymer layer by high-energy ion implantation;

s160, depositing a superhard diamond coating on the metallization layer by using magnetic filtration deposition equipment;

and S170 repeating the accumulation period for 3-5 times by the polymer layer, the metallization layer and the diamond-like carbon film layer.

Further preferably, the laser is an ultraviolet laser;

preferably, the microstructure design is carried out on the surface of the substrate, and the surface is cut by a ring shape and a straight line;

preferably, the number of the dispersion structures is not less than 40, and the laser line width is 1-5 μm.

Further preferably, the ion source is a metal vacuum vapor ion source;

preferably, the heating treatment is carried out during the surface ion implantation process of the hard or soft substrate;

preferably, the implantation element of the ion implantation is metal elements of Ti, Cr, C, Co or Hf;

preferably, the ion implantation equipment is metal vapor vacuum arc MEVVA ion implantation equipment;

preferably, the beam diameter during ion implantation is 800mm, the beam current is 5-20mA, and the cathode life is longer than 20 h.

Preferably, the polymer is deposited using an electron beam evaporation system;

preferably, the e-beam polymer has an evaporation rate of 10-100 μm/min.

Preferably, a magnetic filtration cathode vacuum arc system is adopted when the film layer is deposited;

preferably, a magnetic filtration cathode vacuum arc system is adopted when the film layer is deposited;

preferably, a magnetic filtered cathode vacuum arc system is used in depositing the film layer.

Preferably, a magnetic filtered cathode vacuum arc system is used in depositing the film layer.

Preferably, the film layer is a diamond-like carbon DLC film layer.

Preferably, the thickness of the film layer is 1-4 μm, and the hardness is not lower than 50 GPa.

Preferably, the polymer layer, the metallization layer and the diamond-like film layer repeat the accumulation period for 3-5 times;

preferably, the total thickness of the coating is 0-260. mu.m.

Compared with the prior art, the embodiment of the invention has the following advantages:

(1) an effective pinning layer is formed on the sub-surface of the substrate by utilizing an ion implantation technology, and a subsequent film layer can be well combined with the pinning layer;

(2) compared with deposition methods such as magnetron sputtering, electroplating deposition, electron beam evaporation and the like, the magnetic filtration cathode vacuum arc equipment has very high atom ionization rate of about more than 95 percent, and is very suitable for preparing super-hard and super-compact coatings. Thus, the plasma density can be increased due to high atom ionization rate, large particles are reduced during film forming, and the hardness, wear resistance, compactness, film-substrate binding force and the like of the film are improved;

(3) the ultra-high hardness and ultra-wear-resistant diamond-like carbon film layer can be prepared by adjusting the plasma transport path, the film thickness of the ultra-thick pure diamond-like carbon DLC film layer can reach 20 micrometers, and the film hardness is more than 80 Gpa;

(4) compared with the traditional magnetic filtration system, the invention has wider deposition range and longer service life of the cathode, and is more suitable for commercial production;

(5) the invention is different from the traditional integral film system, the microstructure design is firstly carried out on the substrate before film coating, the boundary of the microstructure can greatly release the impact force under the action of external force impact, the impact resistance of the film system is not reduced, and the toughness of the film system can be improved;

(6) compared with the traditional bulletproof system made of bulk materials, the invention provides the nano film layer system which is thinner, lighter, smaller in mass and more excellent in hardness and toughness.

Drawings

The accompanying drawings, which are included to provide a further understanding of embodiments of the invention, are incorporated in and constitute a part of this specification.

FIG. 1 is a schematic diagram of a substrate film structure provided in an embodiment of the invention;

FIG. 2 is a schematic flow diagram of a high-speed impact coating provided by an embodiment of the present invention;

FIG. 3 is a surface topography of a high speed impact coating in accordance with an embodiment of the present invention;

FIG. 4 is a cross-sectional view of a high-speed impact coating in accordance with an embodiment of the present invention;

FIG. 5 is a Rockwell indentation topography of a surface of an embodiment of the invention;

FIG. 6 is a surface binding force test trace according to an embodiment of the present invention;

FIG. 7 is a schematic view of the impact depth under impact of 200m/s (weight: 10g) in various embodiments of the present invention;

description of reference numerals:

101 a layer of a base body and a layer of a transparent,

102 of a layer of a polymer, the polymer layer,

103 a metal pinning layer of the metal layer,

104 of a super hard diamond-like carbon layer,

105 circular cutting lines are arranged on the outer circumference of the circular cutting line,

106 diameter cut line.

Detailed Description

The technical solution of the present invention is further described in detail by the accompanying drawings and embodiments. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention.

In addition, it should be noted that the materials and test methods used in the experiments of the present invention are generally described in this section. Although many materials and methods of operation are known in the art for the purpose of carrying out the invention, the invention is nevertheless described herein in as detail as possible. It will be apparent to those skilled in the art that the materials and methods of operation used in the present invention are well within the skill of the art, provided that they are not specifically illustrated.

S110, carrying out primary surface cleaning on the substrate;

the high-power pulse magnetron deposition technology is adopted to carry out ion cleaning on the substrate, the total beam current is 2-6A, the negative pressure is 500-1000V, the high-power pulse power is 0-1MW, the temperature is 300-550 ℃, and the air pressure is 1 × 10-210Pa below, Ar gas is introduced, and the bombardment time is 30-120 min. The high power in the cleaning process has obvious advantages compared with the traditional cleaning process route: the expression is as follows: 1) can control the size of the cleaning beamThereby controlling the temperature of the substrate; 2) removing gas adsorbed by the matrix; 3) removing organic matters and burrs; 3) and sputtering off the metal oxide film layer on the surface to expose the pollution-free atomic layer.

S120, performing laser subsurface microstructuring on the substrate;

performing sub-surface micro-structuring on the substrate by adopting an ultraviolet laser, wherein the width of the central line of the micro-structure is 1-5 mu m, and the total number of the dispersed structures is not less than 40; unlike the conventional integrated structure, the discrete structure can rapidly dissipate the energy of the impact particles at the boundary without damaging the membrane body, thereby greatly enhancing the reliability and durability of the membrane body.

S130, deeply cleaning the surface, then carrying out ion implantation by using an ion source and annealing to form a pseudo diffusion layer;

the ion source is a metal vacuum steam ion source, the injection elements of ion injection are metal elements of Ti, Cr, C, Co or Hf, and a pseudo diffusion layer is formed by heating treatment in the surface ion injection process, wherein the size of the ion injection treatment is not less than 800mm, the treatment beam current is not less than 10mA, and the acceleration voltage is not more than 30 KV.

Compared with the traditional ion implantation method, the method has the advantages that the diffusion depth of ions is greatly increased by utilizing a heating mode, the film-base bonding strength is greatly improved, and the reliability and the tolerance of the whole material are greatly improved.

S140, depositing a polymer energy absorption film layer by an evaporation method;

the polymer is evaporated by using an electron beam evaporation technology, the electron beam evaporation width is 1000mm, the power of an electron beam gun is not less than 20KW, and the energy is not higher than 100 eV.

Based on a high-power electron beam technology, the deposition speed of the polymer can reach 100 mu m/min, the molecular chain is basically kept intact during deposition, and the polymer is basically free from breakage and element deficiency caused by high energy.

S150, metalizing the polymer layer by high-energy ion implantation;

the method adopts a high-energy ion source as a metal vacuum steam ion source, implanted elements of ion implantation are Ni, Mg and C, the ion implantation size is not less than 800mm, the processing beam current is not less than 5mA, the acceleration voltage is 30-80KV, and the thickness of a formed metallization layer is not less than 50 nm. The high-energy injection can conveniently realize the deep doping of ions and improve the bonding strength of a polymer and a diamond-like interface.

S160, depositing a superhard diamond coating on the metallization layer by using magnetic filtration deposition equipment;

the magnetic filtration deposition equipment is adopted as wide beam processing equipment, the processing width is not less than 800mm, the cathode is a carbon target, the service life of the carbon target is not less than 100h, the carbon arcing current is not less than 200A, the thickness of the deposited diamond-like carbon is 1-4 mu m, and the film hardness is not less than 50 Gpa. The high hardness has good blocking effect on high-speed impact particles, the energy of the high-speed particles can be rapidly absorbed and the speed of the particles can be reduced through the energy absorption of the middle polymer layer and the blocking of the hardness layer, and the energy can be released to the maximum extent through the matching use of the energy absorption and the blocking.

S170 repeating the accumulation period of the polymer layer, the metallization layer and the diamond-like carbon film layer for 3-5 times, and the thickness is 0-260 mu m.

The electron beam evaporation, ion implantation and magnetic filtration deposition technology are circularly adopted, other parameters are kept unchanged, the accumulation times are 3-5 times, and the thickness is 0-260 mu m.

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