阅读说明：本技术 一种自由空间二维阵列探测器 (Free space two-dimensional array detector ) 是由 曲业飞 王晨阳 姜瑜斐 张洪涛 于 2020-03-12 设计创作，主要内容包括：本发明涉及一种自由空间二维阵列探测器,包括管座、热沉和探测器芯片,热沉位于管座上,探测器芯片位于热沉上,热沉上具有导电触点,探测器芯片的引脚与导电触点通过导线连接,导电触点与管脚通过导线连接。因而,本发明可以避免导线过长、容易短路的问题,提高产品的可靠性。(The invention relates to a free space two-dimensional array detector, which comprises a tube seat, a heat sink and a detector chip, wherein the heat sink is positioned on the tube seat, the detector chip is positioned on the heat sink, a conductive contact is arranged on the heat sink, a pin of the detector chip is connected with the conductive contact through a lead, and the conductive contact is connected with a pin through a lead. Therefore, the invention can avoid the problems of overlong lead and easy short circuit, and improve the reliability of the product.)

1. A free-space two-dimensional array probe, comprising:

the tube seat is provided with a pin;

a detector chip;

it is characterized in that the preparation method is characterized in that,

the detector includes:

the heat sink is positioned on the tube seat, the detector chip is positioned on the heat sink, the heat sink is provided with a conductive contact, a pin of the detector chip is connected with the conductive contact through a wire, and the conductive contact is connected with the pin through a wire.

2. The free-space two-dimensional array detector of claim 1, wherein the heat sink is flat and the detector chip and the conductive contact are in the same plane.

3. The free-space two-dimensional array probe of claim 1, wherein an absolute value of a difference between a wire length between a pin of the probe chip and the conductive contact and a wire length between the conductive contact and the pin is no more than 3 mm.

4. The free-space two-dimensional array detector of claim 1, wherein the pins of the detector chip are uniformly distributed on four sides of a first square, the conductive contacts are uniformly distributed on four sides of a second square, the pins are uniformly distributed on four sides of a third square, the centers of the first square, the second square and the third square are the same, and the four sides of the first square, the second square and the third square are respectively parallel.

5. The free-space two-dimensional array probe of claim 4, wherein the heat sink is square and the conductive contacts are distributed at edges of the square.

6. The free-space two-dimensional array probe of claim 1, wherein the pins of the probe chip are uniformly distributed on a first circle, the conductive contacts are uniformly distributed on a second circle, and the pins are uniformly distributed on a third circle, wherein the first, second and third circles are concentric circles.

7. The free-space two-dimensional array detector of claim 6, wherein the heat sink is circular and the heat sink is concentric with the first circle.

8. The free-space two-dimensional array probe according to any one of claims 4 to 7, wherein the probe chip is a 3 × 3 two-dimensional array probe chip, and the number of the pins is 12.

9. A free space two dimensional array detector according to claim 1 wherein said heat sink is rectangular and said conductive contacts are distributed on four sides of the rectangle, said conductive contacts being symmetrical about a central axis of said rectangle and said pins being distributed on both sides of said rectangle.

10. The free-space two-dimensional array probe according to claim 9, wherein the probe chip is a 4 × 4 two-dimensional array probe chip, the number of the pins is 22, two rows of pins are respectively arranged on two sides of the long side of the rectangle, the number of the pins is 4 on the outer side, the number of the pins is 6 on the inner side, and two pins are respectively arranged on two sides of the short side of the rectangle.

Technical Field

The invention relates to the technical field of free space optical detection, in particular to a free space two-dimensional array detector.

Background

Free space two-dimensional array detectors are increasingly used, and generally include a tube socket, a pin on the tube socket, and a detector chip.

The pins of the detector chip of the existing free space two-dimensional array detector are generally directly connected with the pins through wires.

Because the pin is numerous, the area is big and the detector volume is less, the pin and the pin of detector chip directly pass through the wire and connect, on the one hand, can appear the problem of wire overlength, on the other hand, short circuit easily between the wire influences the reliability of product.

Disclosure of Invention

The invention provides a free space two-dimensional array detector, which solves the technical problems that wires between pins and pins of a chip of the conventional free space two-dimensional array detector are too long and are easy to be short-circuited.

In order to achieve the purpose, the invention adopts the following technical scheme:

a free-space two-dimensional array probe, comprising:

the tube seat is provided with a pin;

a detector chip;

the detector includes:

the heat sink is positioned on the tube seat, the detector chip is positioned on the heat sink, the heat sink is provided with a conductive contact, a pin of the detector chip is connected with the conductive contact through a wire, and the conductive contact is connected with the pin through a wire.

Compared with the prior art, the technical scheme of the invention has the following technical effects: the free space two-dimensional array detector comprises a tube seat, a heat sink and a detector chip, wherein the heat sink is positioned on the tube seat, the detector chip is positioned on the heat sink, a conductive contact is arranged on the heat sink, a pin of the detector chip is connected with the conductive contact through a lead, and the conductive contact is connected with a pin through a lead. Therefore, the invention can avoid the problems of overlong lead and easy short circuit, and improve the reliability of the product.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic diagram of a free-space two-dimensional array detector 4 × 4 according to an embodiment of the present invention.

Fig. 2 is an exploded view of fig. 1.

Fig. 3 is a schematic diagram of pins of a free-space two-dimensional array detector 4 × 4 according to an embodiment of the present invention.

Fig. 4 is a schematic diagram of a heat sink of a free-space two-dimensional array detector 4 × 4 according to an embodiment of the present invention.

Fig. 5 is a schematic internal view of a free-space two-dimensional array detector 4 × 4 according to an embodiment of the present invention.

Fig. 6 is a schematic diagram of a free-space two-dimensional array detector 3 × 3 according to an embodiment of the present invention.

Fig. 7 is an exploded view of fig. 6.

Fig. 8 is a schematic diagram of pins of a free-space two-dimensional array detector in embodiment 3 × 3.

Fig. 9 is a schematic diagram of a heat sink of a free space two-dimensional array detector 3 × 3 according to an embodiment of the present invention.

Fig. 10 is a schematic internal view of a free-space two-dimensional array detector 3 × 3 according to an embodiment of the present invention.

FIG. 11 is a diagram of pins of a free-space two-dimensional array probe of 3 × 3 according to another embodiment of the present invention.

Reference numerals:

1. an airtight cap; 2. a detector chip; 3. a tube holder; 31. a pin; 4. a heat sink; 41. and a conductive contact.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected unless otherwise explicitly stated or limited. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art. In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

The embodiment provides a free space two-dimensional array detector which comprises a tube seat 3, an airtight tube cap 1, a detector chip 2 and a heat sink 4.

The airtight pipe cap 1 is a metal airtight pipe cap with an optical window, and the airtightness of the product can be realized by adopting a metal airtight packaging form.

The tube seat 3 and the airtight tube cap 1 form a closed space, the detector chip 2 and the heat sink 4 are positioned in the closed space formed by the tube seat and the airtight tube cap 1, and the tube seat 3 is provided with a pin 31.

Pin 31 is fixed on tube seat 3, and pin 31 both can weld on the circuit board, also can peg graft and use on the circuit board, has improved the flexibility of use.

The heat sink 4 is located on the header 3, with conductive contacts 41 on the heat sink 4. The conductive contacts 41 have the function of spreading the wire arrangement and shortening the length of the wire between the pads.

Detector chip 2, detector chip 2 is located on heat sink 4, and the overall dimension of detector chip 2 selects the metal structure spare of corresponding specification for use.

The pins of the detector chip 2 are connected to the conductive contacts 41 by wires, and the conductive contacts 41 are connected to the pins 31 by wires.

The present embodiment improves reliability by means of heat sink 4 switching, and avoids overlong wires or short circuits.

In order to realize the switching and reduce the length of the conducting wire as much as possible, the heat sink 4 of the present embodiment is flat, and the detector chip 2 and the conductive contact 41 are located on the same plane.

The absolute value of the difference between the length of the wire between the pin of the detector chip 2 and the conductive contact 41 and the length of the wire between the conductive contact 41 and the pin 31 does not exceed 3 mm.

Further, the length of the wire between the pin of the probe chip 2 and the conductive contact 41 is approximately the same as the length of the wire between the conductive contact 41 and the pin 31, and preferably, the length of the wire between the pin of the probe chip 2 and the conductive contact 41 is the same as the length of the wire between the conductive contact 41 and the pin 31.

The following description takes a 4 × 4 free space two-dimensional array detector and a 3 × 3 free space two-dimensional array detector as examples: