阅读说明：本技术 纳米合金材料的制作方法、纳米合金材料及电子产品 (Manufacturing method of nano alloy material, nano alloy material and electronic product ) 是由 夏祥国 李林军 任诗举 于 2020-06-10 设计创作，主要内容包括：本发明公开一种纳米合金材料的制作方法、由该制作方法制得的纳米合金材料、及应用该纳米合金材料的电子产品,纳米合金材料的制作方法包括：提供一铝箔薄膜层,该铝箔薄膜层的厚度大于或者等于10微米,且小于或者等于100微米；在铝箔薄膜层表面上进行气相沉积,在表面上形成至少一可焊接金属层,该可焊接金属层的厚度大于或者等于0.05微米,且小于或者等于15微米；本发明通过在铝箔薄膜层上设置可焊接金属层,大幅降低了可焊接纳米合金材料的成本。(The invention discloses a method for manufacturing a nano alloy material, the nano alloy material manufactured by the manufacturing method and an electronic product applying the nano alloy material, wherein the method for manufacturing the nano alloy material comprises the following steps: providing an aluminum foil film layer, wherein the thickness of the aluminum foil film layer is more than or equal to 10 micrometers and less than or equal to 100 micrometers; performing gas phase deposition on the surface of the aluminum foil film layer, and forming at least one weldable metal layer on the surface, wherein the thickness of the weldable metal layer is greater than or equal to 0.05 micrometer and less than or equal to 15 micrometers; the invention greatly reduces the cost of the weldable nano alloy material by arranging the weldable metal layer on the aluminum foil film layer.)

1. A method for manufacturing a nano alloy material is characterized by comprising the following steps:

providing an aluminum foil film layer, wherein the thickness of the aluminum foil film layer is more than or equal to 10 micrometers and less than or equal to 100 micrometers;

and performing vapor deposition on the surface of the aluminum foil film layer to form at least one weldable metal layer on the surface, wherein the thickness of the weldable metal layer is greater than or equal to 0.05 micrometer and less than or equal to 15 micrometers.

2. The method of claim 1, wherein the solderable metal layer is a metal layer formed of any one or more of copper, nickel, zinc, indium, tin, silver, gold, and magnesium, or an alloy layer formed of any two or more metals.

3. The method of making a nanoalloy material of claim 2, wherein the solderable metal layer is formed of copper or an alloy of copper with nickel, zinc, indium, tin, silver, gold, magnesium.

4. The method of claim 1, wherein the metal layer is formed by vacuum deposition.

5. The method of claim 4, wherein the metal layer is formed by sputtering under conditions of a vacuum of 0.01Pa to 0.5Pa, a continuous winding plating rate of 0.01m/min to 300 m/min, a current of 1A to 50A, and a voltage of 200V to 700V.

6. The method of claim 1, wherein the step of forming at least one solderable metal layer on the surface of the aluminum foil film layer comprises:

carrying out vacuum plating on the surface of the aluminum foil film layer, wherein the thickness of a metal layer subjected to vacuum plating is more than or equal to 0.1 micrometer and less than or equal to 1 micrometer;

and performing water electroplating on the material subjected to vacuum electroplating, wherein the thickness of a metal layer subjected to water electroplating is greater than or equal to 1 micrometer and less than or equal to 10 micrometers.

7. A nanoalloy material produced by the method of any one of claims 1 to 6.

8. The nano-alloy material of claim 7, wherein the nano-alloy material comprises an aluminum foil film layer and at least one solderable metal layer formed on a surface of the aluminum foil film layer.

9. The nano-alloy material of claim 8, wherein the number of the solderable metal layers is 1-3, the thickness of different solderable metal layers is the same or different, and the material of different solderable metal layers is the same or different.

10. An electronic product comprising an electronic product body, wherein the nano alloy material as set forth in any one of claims 7 to 9 is mounted on the electronic product body.

Technical Field

The invention relates to the technical field of nano alloy materials, in particular to a method for manufacturing a nano alloy material, the nano alloy material manufactured by the method and an electronic product applying the nano alloy material.

Background

The strip provides a bonding location for the connection of the lamp, is an electrically conductive and weldable material. Has good conductivity and solderability. The lamp strip is long in service life (the normal service life is generally 8-10 ten thousand hours), energy-saving, green and environment-friendly, and thus the lamp strip gradually exposes the corners in various decoration industries. However, the existing lamp strips are all made of copper materials, so that the cost of the lamp strips is high. Meanwhile, the lamp strip is required to be welded, so that the lamp strip cannot be replaced by aluminum foil with low price, and the lamp strip is high in cost, so that the development of the lamp strip is hindered.

Disclosure of Invention

The invention mainly aims to provide a method for manufacturing a nano alloy material, and aims to obtain a nano alloy material which can realize the function of a lamp strip and has better flexibility.

In order to achieve the above object, the present invention provides a method for manufacturing a nano alloy material, comprising:

providing an aluminum foil film layer, wherein the thickness of the aluminum foil film layer is more than or equal to 10 micrometers and less than or equal to 100 micrometers;

and performing gas phase deposition on the surface of the aluminum foil film layer, and forming at least one weldable metal layer on the surface of the aluminum foil film layer, wherein the thickness of the weldable metal layer is greater than or equal to 0.05 micrometer and less than or equal to 15 micrometers.

Optionally, the solderable metal layer is a metal layer formed of any one of copper, nickel, zinc, indium, tin, silver, gold, magnesium, or an alloy layer formed of any two or more metals.

Optionally, the solderable metal layer is formed of copper or a copper alloy.

Optionally, the metal layer is formed by vacuum plating.

Optionally, the metal layer is formed by sputtering under the process conditions of a vacuum degree of 0.01Pa to 0.5Pa, a continuous winding plating speed of 0.01m/min to 300 m/min, a current of 1A to 50A, and a voltage of 200V to 700V.

Optionally, after the step of depositing the metal layer, the method for manufacturing the nano alloy material further includes:

and carrying out anti-oxidation treatment on the weldable metal layer.

Optionally, the step of forming at least one solderable metal layer on the surface of the aluminum foil film layer includes:

carrying out vacuum plating on the surface of the aluminum foil film layer, wherein the thickness of a metal layer subjected to vacuum plating is more than or equal to 0.1 micrometer and less than or equal to 1 micrometer;

and performing water electroplating on the material subjected to vacuum electroplating, wherein the thickness of a metal layer subjected to water electroplating is greater than or equal to 1 micrometer and less than or equal to 10 micrometers.

The invention also provides a nano alloy material prepared by the preparation method of the nano alloy material;

the manufacturing method of the nano alloy material comprises the following steps:

providing an aluminum foil film layer, wherein the thickness of the aluminum foil film layer is more than or equal to 10 micrometers and less than or equal to 100 micrometers;

and performing gas phase deposition on the surface of the aluminum foil film layer, and forming at least one weldable metal layer on the surface of the aluminum foil film layer, wherein the thickness of the weldable metal layer is greater than or equal to 0.05 micrometer and less than or equal to 15 micrometers.

Optionally, the nano alloy material includes an aluminum foil film layer and at least one solderable metal layer formed on a surface of the aluminum foil film layer.

Optionally, the number of the solderable metal layers is 1 to 3, the thicknesses of the solderable metal layers of different layers are the same or different, and the materials of the solderable metal layers of different layers are the same or different.

The invention also provides an electronic product which comprises an electronic product body and the nano alloy material arranged on the electronic product body.

According to the manufacturing method of the nano alloy material, the surface of the aluminum foil thin film layer is processed, so that a good plating effect can be obtained when the thickness of the aluminum foil thin film layer is reduced to 10 micrometers, and a metal layer with good weldability can be formed on the surface of the aluminum foil thin film layer; therefore, the formed nano alloy material can meet the welding requirement of the lamp strip and greatly reduce the manufacturing cost of the lamp strip. And because the thickness of the aluminum foil thin layer is very small, the metal layer can be well deposited on the hole walls of the formed through holes by punching the aluminum foil thin layer, the weldable metal layer is communicated with the weldable metal layer in the through holes, a more reliable welding spot is provided for the welding of the lamp strip, and the welding effect is favorably improved. Compared with the traditional lamp strip, the nanometer alloy material is very thin, has better flexibility compared with the lamp strip, further improves the using effect and the using flexibility of the nanometer alloy material when being applied to electronic products, and can replace the traditional lamp strip to fill the gap of flexible weldable materials below 100 micrometers. In addition, the nano alloy material of the invention does not need electroplating or chemical plating, and has simple process, environmental protection and low cost.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic cross-sectional structural view of a first embodiment of a nanoalloy material of the invention;

FIG. 2 is a schematic cross-sectional structural view of a second embodiment of the nano-alloy material of the present invention;

FIG. 3 is a schematic cross-sectional view of a third embodiment of a nanoalloy material of the invention;

FIG. 4 is a schematic cross-sectional structural view of another embodiment of the nano-alloy material of the present invention;

FIG. 5 is a schematic cross-sectional structural view of another embodiment of the nano-alloy material of the present invention;

FIG. 6 is a schematic cross-sectional view of another embodiment of the nano-alloy material of the present invention;

FIG. 7 is a schematic cross-sectional view of another embodiment of the nano-alloy material of the present invention.

The reference numbers illustrate:

the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that, in the embodiment of the present invention, references to directional indications (such as up, down, left, right, front, and back … …) are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indication is changed accordingly.

In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

The invention provides a method for manufacturing a nano alloy material, which comprises the following steps:

an aluminum foil film layer is provided.

The aluminum foil layer is made of aluminum foil or alloy aluminum foil (aluminum alloy foil), that is, the aluminum foil layer can be made of aluminum foil or alloy aluminum foilAluminiumThe alloy aluminum foil is added with a small amount of other alloying elements. The aluminum foil can form three states of hard state, intermediate state and soft state according to the demand, and the aluminum foil thin layer in this embodiment can also use specific state according to different specific working condition demands. The thickness of the aluminum foil film layer is greater than or equal to 10 micrometers and less than or equal to 100 micrometers. The thickness of aluminium foil thin layer should not be too big, and when the thickness of aluminium foil thin layer was greater than 100 microns, its weight increase, the pliability reduces, is unfavorable for the buckling of lamp area. The thickness of the aluminum foil film layer is not too thin, and when the thickness is less than 10 micrometers, the aluminum foil film layer is easy to damage in the welding process, and the use of the lamp strip is not facilitated.

And carrying out pretreatment on the aluminum foil film layer. The pretreatment comprises baking the aluminum foil film layer to dry the surface of the aluminum foil film layer. The baking temperature ranges from 45 ℃ to 80 ℃, and the baking time can range from 1 hour to 24 hours. It will be appreciated that the pre-treatment is not essential and may be selected according to the actual conditions and requirements of the product.

And punching the pre-treated aluminum foil thin film layer to form a plurality of through holes on the aluminum foil thin film layer. The aperture range of the plurality of through holes is 0.1-100 microns, preferably 0.1-3 microns; the pitch of the plurality of through holes ranges from 0.1 microns to 100 microns, preferably from 0.1 microns to 10 microns. The shape of the through hole can be any shape, such as a circle, a triangle, a quadrangle or other irregular shapes. The arrangement of the through holes can also be any arrangement.

And respectively carrying out vapor deposition on the surfaces of the aluminum foil thin film layers, and respectively forming at least one metal layer on each surface and the hole walls of the through holes. The metal layer may be deposited by vacuum coating, such as sputtering, evaporation coating, or other known vacuum coating methods. Taking sputtering as an example, the metal target used may be one or more of copper, nickel, cobalt, zinc, indium, tin, silver, gold, aluminum, titanium, iron, magnesium, and zirconium, or an alloy target of any two or more of the above metals. The coating process conditions can be as follows: the vacuum degree is 0.01Pa-0.5Pa, the continuous winding plating speed is 0.01-300 m/min (m/min), the current is 1A-50A, and the voltage is 200V-700V. The thickness of the solderable metal layer is greater than or equal to 0.05 microns and less than or equal to 15 microns, and preferably, the thickness of the metal layer is greater than or equal to 0.1 microns and less than or equal to 10 microns. It will be appreciated that the thickness of the layer of solderable metal may also be chosen according to the actual requirements of the product. It is worth noting that the thickness of the solderable metal layer is not too small, and if it is less than 0.05 μm, it will be too thin to provide sufficient bonding depth, making it difficult to perform its soldering function. The thickness of the solderable metal layer should not be too big yet, and when being greater than 15 microns, will make the cost of lamp area when lamp area thickness and weight increase, still improved the lamp area.

Because the thickness of the aluminum foil film layer is very small, after the weldable metal layer is deposited, the hole walls of the through holes can be well covered by the weldable metal layer, so that the weldable metal layers in the through holes and on the aluminum foil film layer are conducted, and the lamp strip is favorably welded. Compared with the traditional lamp strip, the nano alloy material disclosed by the invention is simple in process, environment-friendly and low in cost.

It will be appreciated that it is also possible to plate each surface of the aluminium foil film layer with a plurality of layers of solderable metal, such as 2-6 layers, preferably 2-3 layers. The materials of different metal layers plated on the same surface of the aluminum foil film layer can be the same or different, and the thicknesses of the different metal layers can be the same or different; the metal layers plated on different surfaces of the aluminum foil film layer can be the same or different in material, and the metal layers plated on different surfaces can be the same or different in thickness; the number of layers of metal layers plated on different surfaces may be the same or different. All the above can be selected according to the actual requirements of the product.

With regard to the number of layers and the material of the solderable metal layers, different solderable metal layers can obtain nano-alloy materials with different physical properties. As will be described below by way of example, the solderable metal layers include a first metal layer 610 and a second metal layer 620, the first metal layer 610 covers the surface of the aluminum foil thin film layer 600, and the second metal layer 620 is located on a side of the first metal layer 610 opposite to the aluminum foil thin film layer 600; the first metal layer 610 is made of a copper material or a copper alloy material, and the second metal layer 620 is made of a nickel material. The aluminum foil thin film layer 600 cannot be directly welded, and after the first metal layer 610 made of copper or copper alloy material is vacuum-plated, the material has solderability, and the conductivity (the resistivity of copper and copper alloy is lower than that of aluminum) and strength (the strength of copper is higher than that of aluminum when the thickness and width are the same) of the material are improved. The first metal layer 610 and the aluminum foil thin film layer 600 are protected from oxidation by disposing the second metal layer 620 made of a nickel material on the outer side of the first metal layer 610. That is, by simultaneously disposing the first metal layer 610 and the second metal layer 620, not only the nano-alloy material has solderability, but also the conductivity, strength and oxidation resistance of the material are greatly improved.

In some embodiments, to further improve solderability, the solderable metal layer further includes a third metal layer 630, the third metal layer 630 is located between the first metal layer 610 and the second metal layer 620, and the third metal layer 630 is made of a tin material. By providing the third metal layer 630 made of a tin material between the first metal layer 610 and the second metal layer 620, convenience of soldering the material and reliability after soldering are greatly improved due to high solderability of the tin material.

In some embodiments, to improve the ease of use of the nanoalloy material, the nanoalloy material also has an etched structure that penetrates the nanoalloy material. The etched pattern can be various, such as patterns, circuits and the like, and can be determined according to actual conditions. For example, when the nano-alloy material is used to make a light strip, circuitry for powering and mounting the lamp bead may be etched thereon.

It is understood that after the vacuum coating is finished, the metal layer can be subjected to post-treatment. The post-treatment comprises the step of carrying out anti-oxidation treatment on the metal layer by using an over-oxygen protective agent so as to enhance the oxidation resistance of the nano alloy material.

It should be noted that, in some embodiments, in order to save the manufacturing cost of the material, the specific steps of forming at least one solderable metal layer on the surface of the aluminum foil film layer include:

carrying out vacuum plating on the surface of the aluminum foil film layer, wherein the thickness of a metal layer subjected to vacuum plating is more than or equal to 0.1 micrometer and less than or equal to 1 micrometer;

and performing water electroplating on the material subjected to vacuum electroplating, wherein the thickness of a metal layer subjected to water electroplating is greater than or equal to 1 micrometer and less than or equal to 10 micrometers.

Specifically, in the present embodiment, the main purpose is to reduce the cost by the combined plating while making the aluminum foil film layer have weldability. Different metals and different thicknesses are plated on the aluminum foil thin film layer, so that the shielding performance of aluminum can be improved, and the aluminum can be plated with acid-base resistant metals and can pass a salt spray test. The surface of the aluminum plating can be plated with metal with good conductivity to improve the electrical property. The surface of the aluminum foil thin film layer can not be directly plated in a conventional electroplating mode, so that vacuum electroplating is firstly carried out on the surface of the aluminum foil thin film layer, the minimum thickness range of the vacuum electroplating is more than 0 and less than or equal to 0.1 micrometer (0-0.1um), and the maximum value is 1 micrometer. After the surface of the aluminum foil film layer is subjected to vacuum plating, a conventional plating mode can be performed, wherein the minimum thickness range of the conventional plating is 0.1-1 micron, and the maximum thickness value of the conventional plating is 10 microns. So, earlier make the aluminium foil thin layer have the ability of conventional electroplating through vacuum plating (thin cladding material), thickening the cladding material through conventional electroplating mode, so, both can satisfy the thickness requirement of cladding material, can be through the mode that the combination was plated again, the manufacturing cost of reduction material by a wide margin is favorable to nanometer alloy material's manufacturing and using widely.

In some embodiments, referring to fig. 7, the vacuum metal plating layer 710 is formed on two opposite sides of the aluminum foil layer 700 by vacuum plating, and then conventional electroplating is performed on the outside of the vacuum metal plating layer 710 to form the water metal plating layer 720. The thickness of the aluminum foil layer 700 is 4 microns, the thickness of the vacuum metal layer 710 is 0.01-0.1 microns, and the thickness of the water plating is 3-4 microns. Therefore, the material can be subjected to a traditional electroplating mode by performing vacuum plating in advance, and the manufacturing cost of the material is greatly reduced.

The method for producing the nano-alloy material of the present invention will be described below with reference to specific examples.