阅读说明：本技术 功率半导体模块衬底 (Power semiconductor module substrate ) 是由 韩波 刘天宇 冯建鑫 于 2019-11-04 设计创作，主要内容包括：本发明涉及功率半导体模块技术领域,且公开了一种功率半导体模块衬底,包括两组衬底,其特征在于：两组所述衬底通过滑动件机械连接,两组所述衬底通过柔性电路板电连接,两组衬底通过机械连接和电连接后组成一组半导体模块,所述衬底的上表面覆盖有第二金属敷层,所述衬底的下表面覆盖有第一金属敷层。该功率半导体模块衬底,通过滑动件与滑槽滑动连接,并且滑动件设置有变形件,变形件为弹性金属片,使得功率半导体模块中多组衬底之间的连接具有一定的膨胀空间,降低了连接部位断裂的几率,提高了功率半导体模块之间连接的稳定性,通过变形件弯曲90°时不会对其产生折痕或断裂,提高了滑动件的连接能力。(The invention relates to the technical field of power semiconductor modules, and discloses a power semiconductor module substrate, which comprises two groups of substrates and is characterized in that: the two groups of substrates are mechanically connected through a sliding part, the two groups of substrates are electrically connected through a flexible circuit board, the two groups of substrates form a group of semiconductor modules after being mechanically and electrically connected, the upper surface of each substrate is covered with a second metal coating, and the lower surface of each substrate is covered with a first metal coating. This power semiconductor module substrate is through slider and spout sliding connection to the slider is provided with the deformation piece, and the deformation piece is the elastic metal piece, makes the connection between the multiunit substrate in the power semiconductor module have certain expansion space, has reduced the cracked probability in connection position, has improved the stability of connecting between the power semiconductor module, can not produce the crease or fracture to it when bending 90 through the deformation piece, has improved the connection capacity of slider.)

1. A power semiconductor module substrate comprising two sets of substrates (1), characterized in that: the two groups of substrates (1) are mechanically connected through a sliding part (3), the two groups of substrates (1) are electrically connected through a flexible circuit board (2), the two groups of substrates (1) form a group of semiconductor modules after being mechanically and electrically connected, the upper surface of each substrate (1) is covered with a second metal coating (5), and the lower surface of each substrate (1) is covered with a first metal coating (4).

2. The power semiconductor module substrate of claim 1, wherein: the substrate (1) comprises a substrate base layer (101), a contact groove (102) is formed in one side of the substrate base layer (101), sliding grooves (103) are formed in two groups of opposite side faces of the contact groove (102), the sliding grooves (103) are in sliding connection with a sliding piece (3), semiconductor device contacts are arranged on the surface of the contact groove (102), and the semiconductor device contacts on the surface of the contact groove (102) are electrically connected with a flexible circuit board (2).

3. The power semiconductor module substrate of claim 1, wherein: slider (3) include two sets of connection pieces (301), the equal fixedly connected with slider (302) of two sets of opposite sides in the four groups of sides of connection piece (301), slider (302) and spout (103) sliding connection, connection piece (301) contact with the bottom of contact groove (102) to the opposite face rigid connection who contacts the surface with contact groove (102) bottom in connection piece (301) surface has deformation piece (303), two sets of connection piece (301) are connected at the both ends of deformation piece (303).

4. The power semiconductor module substrate of claim 3, wherein: the surface of the connecting piece (301) can be provided with extending pieces (304), and when the surface of the connecting piece (301) is provided with the extending pieces (304), two ends of the deforming piece (303) are respectively connected with the two groups of extending pieces (304).

5. The power semiconductor module substrate of claim 1, wherein: the surfaces of the first metal coating (4) and the second metal coating (5) are provided with semiconductor devices, and the terminals of the semiconductor devices are electrically connected with the semiconductor device contacts on the surfaces of the contact grooves (102).

6. The power semiconductor module substrate of claim 3, wherein: the deformation piece (303) is an elastic metal sheet, and the deformation piece (303) cannot be creased or broken when bent for 90 degrees.

7. The power semiconductor module substrate of claim 3, wherein: the height of the extension (304) is related to the distance between two groups of substrates (1) in the semiconductor module and the formed spatial angle.

Technical Field

The invention relates to the technical field of power semiconductor modules, in particular to a power semiconductor module substrate.

Background

In a conventional power semiconductor module, a plurality of carrier substrates are mostly arranged in a layer on a flat cooling body or a bottom plate, and power semiconductors such as IGBTs, diodes, FETs, thyristors, etc. are mounted on the substrates. The connection between the common power semiconductor module substrates adopts the matching of the clamping blocks and the clamping grooves, so that a plurality of groups of power semiconductor module substrates are connected in the space. The connection between the power semiconductor module substrates in the current market is rigid connection, so that the connection part is easy to break due to expansion with heat and contraction with cold.

Disclosure of Invention

Technical problem to be solved

Aiming at the defects of the prior art, the invention provides a power semiconductor module substrate which has the advantages that the connection among a plurality of groups of power semiconductor modules has a certain expansion space, the probability of fracture of the connection part is reduced, the stability of the connection among the power semiconductor modules is improved, and the like, and the problem that the connection part is easy to fracture due to expansion with heat and contraction with cold due to rigid connection among the power semiconductor module substrates in the current market is solved.

(II) technical scheme

In order to realize the purposes that the connection among a plurality of groups of power semiconductor modules has a certain expansion space, the probability of fracture of the connection part is reduced, and the stability of the connection among the power semiconductor modules is improved, the invention provides the following technical scheme: a power semiconductor module substrate comprising two sets of substrates, characterized in that: the two groups of substrates are mechanically connected through a sliding part, the two groups of substrates are electrically connected through a flexible circuit board, the two groups of substrates form a group of semiconductor modules after being mechanically and electrically connected, the upper surface of each substrate is covered with a second metal coating, and the lower surface of each substrate is covered with a first metal coating.

Preferably, the substrate comprises a substrate base layer, one side of the substrate base layer is provided with a contact groove, two groups of opposite side surfaces of the contact groove are provided with sliding grooves, the sliding grooves are in sliding connection with the sliding parts, the surface of the contact groove is provided with a semiconductor device contact, and the semiconductor device contact on the surface of the contact groove is electrically connected with the flexible circuit board.

Preferably, the sliding part comprises two groups of connecting pieces, two groups of opposite side faces of the four groups of side faces of the connecting pieces are fixedly connected with sliding blocks, the sliding blocks are connected with the sliding grooves in a sliding mode, the connecting pieces are in contact with the bottoms of the contact grooves, opposite faces of the surfaces of the connecting pieces, which are in contact with the bottoms of the contact grooves, are rigidly connected with deformation pieces, and the two groups of connecting pieces are connected at two ends of the deformation pieces.

Preferably, the surface of the connecting piece can be provided with extending pieces, and when the surface of the connecting piece is provided with the extending pieces, two ends of the deformation piece are respectively connected with the two groups of extending pieces.

Preferably, the semiconductor device is mounted on a surface of each of the first and second metallizations, and a terminal of the semiconductor device is electrically connected to a contact of the semiconductor device contacting a surface of the slot.

Preferably, the deformation piece is an elastic metal sheet, and the deformation piece cannot be creased or broken when bent by 90 degrees.

Preferably, the height of the extension is related to the distance between two sets of substrates in the semiconductor module and the angle of the space formed.

(III) advantageous effects

Compared with the prior art, the invention provides a power semiconductor module substrate, which has the following beneficial effects:

1. this power semiconductor module substrate is through slider and spout sliding connection to the slider is provided with the deformation piece, and the deformation piece is the elastic metal piece, makes the connection between the multiunit substrate in the power semiconductor module have certain expansion space, has reduced the cracked probability in connection position, has improved the stability of connecting between the power semiconductor module, can not produce the crease or fracture to it when bending 90 through the deformation piece, has improved the connection capacity of slider.

2. This power semiconductor module substrate can be provided with the extension through the surface of connection piece, and when the surface of connection piece was provided with the extension, the both ends of deformation piece were connected with two sets of extensions respectively for it connects more easily at three-dimensional space between the multiunit substrate in the power semiconductor module, has improved the convenience that power semiconductor module substrate used and installed.

3. According to the power semiconductor module substrate, the flexible circuit boards are adopted to be electrically connected among the multiple groups of substrates in the power semiconductor module, so that the electrical connection among the power semiconductor module substrates is stable, the influence of the movement of the substrates on the circuit stability is reduced, and the use safety of the power semiconductor module substrate is improved.

Drawings

Fig. 1-2 are schematic diagrams of a substrate structure of a power semiconductor module according to the present invention;

FIG. 3 is a schematic view of a substrate structure according to the present invention;

fig. 4 is a schematic structural diagram of a sliding member according to the present invention.

In the figure: 1. a substrate; 101. a substrate base layer; 102. a contact groove; 103. a chute; 2. a flexible circuit board; 3. a slider; 301. connecting sheets; 302. a slider; 303. a deformation member; 304. an extension member; 4. a first metal coating layer; 5. a second metallization layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-4, a power semiconductor module substrate includes two groups of substrates 1, and is characterized in that: the two groups of substrates 1 are mechanically connected through a sliding part 3, the two groups of substrates 1 are electrically connected through a flexible circuit board 2, the substrates 1 comprise substrate base layers 101, one side of each substrate base layer 101 is provided with a contact groove 102, two groups of opposite side surfaces of the contact groove 102 are provided with sliding grooves 103, the sliding grooves 103 are in sliding connection with the sliding part 3, the surface of each contact groove 102 is provided with a semiconductor device contact, the semiconductor device contact on the surface of each contact groove 102 is electrically connected with the flexible circuit board 2, the flexible circuit board 2 is adopted to electrically connect the multiple groups of substrates 1 in the power semiconductor module, so that the electric connection between the substrates of the power semiconductor module is stable, the influence of the movement of the substrates 1 on the circuit stability is reduced, the use safety of the substrates of the power semiconductor module is improved, the sliding part 3 comprises two groups, the sliding block 302 is connected with the sliding groove 103 in a sliding manner, the connecting sheet 301 is contacted with the bottom of the contact groove 102, the opposite surface of the contact surface of the connecting sheet 301 with the bottom of the contact groove 102 is rigidly connected with a deforming piece 303, two ends of the deforming piece 303 connect two groups of connecting sheets 301, the surface of the connecting sheet 301 can be provided with extending pieces 304, when the surface of the connecting sheet 301 is provided with the extending pieces 304, two ends of the deforming piece 303 are respectively connected with the two groups of extending pieces 304, the height of the extending pieces 304 is related to the distance between two groups of substrates 1 in the semiconductor module and the formed space angle, the extending pieces 304 can be arranged on the surface of the connecting sheet 301, when the surface of the connecting sheet 301 is provided with the extending pieces 304, two ends of the deforming piece 303 are respectively connected with the two groups of extending pieces 304, so that the connection between a plurality of groups of substrates 1 in the power semiconductor module is easier in a, the deformation piece 303 is an elastic metal sheet, the deformation piece 303 cannot be creased or broken when bent by 90 degrees, the connection capacity of the sliding piece 3 is improved, the power semiconductor module substrate is in sliding connection with the sliding groove 103 through the sliding piece 3, the sliding piece 3 is provided with the deformation piece 303, the deformation piece 303 is the elastic metal sheet, so that the connection among a plurality of groups of substrates 1 in the power semiconductor module has a certain expansion space, the breakage probability of the connection part is reduced, the connection stability between the power semiconductor modules is improved, two groups of substrates 1 form a group of semiconductor modules through mechanical connection and electrical connection, the upper surface of the substrate 1 is covered with the second metal coating 5, the lower surface of the substrate 1 is covered with the first metal coating 4, and semiconductor devices are mounted on the surfaces of the first metal coating 4 and the second metal coating 5, and the terminals of the semiconductor device are electrically connected to the semiconductor device contacts contacting the surface of the groove 102.

The electrical components presented in the document are all electrically connected with an external master controller and 220V mains, and the master controller can be a conventional known device controlled by a computer or the like.

When the substrate deformation device is used, the distribution of the multiple groups of substrates 1 in the three-dimensional space can be located on the same horizontal plane or not, when the multiple groups of substrates 1 are located on the same horizontal plane, the two ends of the deformation piece 303 are distributed and connected with the two groups of connecting pieces 301, the expansion deformation of the substrates 1 enables the connecting pieces 301, the sliding blocks 302 and the sliding grooves 103 to slide, further the deformation piece 303 deforms to offset the deformation of the substrates 1, and when the multiple groups of substrates 1 are not located on the same horizontal plane, the two ends of the deformation piece 303 are distributed and connected with the two groups of extension pieces 304.

To sum up, the power semiconductor module substrate is connected with the sliding groove 103 in a sliding manner through the sliding part 3, the sliding part 3 is provided with the deformation part 303, the deformation part 303 is an elastic metal sheet, so that the connection among a plurality of groups of substrates 1 in the power semiconductor module has a certain expansion space, the probability of fracture of the connection part is reduced, the stability of the connection among the power semiconductor modules is improved, the deformation part 303 cannot generate crease marks or fracture when being bent for 90 degrees, the connection capability of the sliding part 3 is improved, the surface of the connecting sheet 301 can be provided with the extension part 304, when the surface of the connecting sheet 301 is provided with the extension part 304, two ends of the deformation part 303 are respectively connected with the two groups of extension parts 304, so that the plurality of groups of substrates 1 in the power semiconductor module can be easily connected in a three-dimensional space, and the convenience of the use and installation of the power, the flexible circuit board 2 is adopted to electrically connect a plurality of groups of substrates 1 in the power semiconductor module, so that the electrical connection between the substrates of the power semiconductor module is stable, the influence of the movement of the substrates 1 on the circuit stability is reduced, and the use safety of the substrates of the power semiconductor module is improved.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.