阅读说明：本技术 一种芯片封装结构 (Chip packaging structure ) 是由 刘绵州 刘鑫 刘准亮 刘伟康 黄葵军 黄伟希 于 2019-11-13 设计创作，主要内容包括：本发明属于芯片封装的技术领域,具体涉及一种芯片封装结构,包括电路板(1)及焊接于所述电路板(1)的IC封装(2),所述电路板(1)和所述IC封装(2)之间设置有固态胶(3),所述固态胶(3)完全包围所述电路板(1)和所述IC封装(2)之间形成的缝隙,使得所述IC封装(2)粘接所述电路板(1)。本发明能够包围电路板和IC封装之间形成的缝隙,提高电路板和芯片之间的可靠性,同时,防止杂质灰尘从两者之间缝隙进入,有利于提高产品的防尘和防潮性能,从而提高产品的可靠性。(The invention belongs to the technical field of chip packaging, and particularly relates to a chip packaging structure which comprises a circuit board (1) and an IC package (2) welded on the circuit board (1), wherein a solid glue (3) is arranged between the circuit board (1) and the IC package (2), and the solid glue (3) completely surrounds a gap formed between the circuit board (1) and the IC package (2), so that the IC package (2) is bonded with the circuit board (1). The invention can surround the gap formed between the circuit board and the IC package, improve the reliability between the circuit board and the chip, prevent impurity and dust from entering from the gap between the circuit board and the chip, and is beneficial to improving the dustproof and moistureproof performance of the product, thereby improving the reliability of the product.)

1. A chip packaging structure is characterized in that: the circuit board comprises a circuit board (1) and an IC package (2) welded on the circuit board (1), wherein a solid adhesive (3) is arranged between the circuit board (1) and the IC package (2), and the solid adhesive (3) completely surrounds a gap formed between the circuit board (1) and the IC package (2) so that the IC package (2) is bonded on the circuit board (1).

2. The chip package structure of claim 1, wherein: the bottom of the solid adhesive tape (3) is provided with a double-sided adhesive tape (4), and the double-sided adhesive tape (4) is used for fixing the solid adhesive tape (3) on the circuit board (1).

3. The chip package structure of claim 1, wherein: the surface of the circuit board (1) corresponding to the solid glue (3) is provided with a groove (5), and the groove (5) is used for fixing the solid glue (3) on the circuit board (1).

4. The chip package structure of claim 1, wherein: the surface of the circuit board (1) corresponding to the solid glue (3) is provided with solder paste points (6), and the solder paste points (6) are used for fixing the solid glue (3) on the circuit board (1).

5. The chip package structure of claim 1, wherein: the circuit board (1) comprises a board body (11) and a plurality of bonding pads (12) arranged on the surface of the board body (11), the positions of the bonding pads (12) correspond to those of the IC package (2), and the IC package (2) is electrically connected with the circuit board (1) through the bonding pads (12).

6. The chip package structure of claim 5, wherein: the circuit board (1) is provided with a plurality of lines which respectively correspond to and are electrically connected with the bonding pads (12).

7. The chip package structure of claim 1, wherein: the solid glue (3) is arranged around the edge of the IC package (2).

8. The chip package structure of claim 1, wherein: the solid glue (3) extends to the outside of the IC package (2).

9. The chip package structure of claim 1, wherein: the solid glue (3) is of a multilayer solid structure.

10. The chip package structure of claim 1, wherein: the solid glue (3) is sheet-shaped or strip-shaped.

Technical Field

The invention belongs to the technical field of chip packaging, and particularly relates to a chip packaging structure.

Background

With the wide application and rapid development of mobile terminals and consumer electronics, the area of the chip is gradually reduced, and the chip is required to have better heat dissipation to meet the demand of rapid charging. This requires smaller, thinner, lighter, higher current, lower on-resistance, and better heat dissipation from the circuit chip.

However, since the leads of the lead frame are used to provide external electrical connections, additional lead space is required, which increases the area of the original chip by at least 20%. In other circuit chips, the chip is flip-chip bonded to the lead frame, although a large current capacity can be provided, the lead frame still needs an additional pin space, and the packaging area is large.

The inventors have found that the existing packaging solutions have at least the following drawbacks: because there is the gap between circuit board and the chip, lead to the stability between circuit board and the chip poor, impurity dust gets into from the gap between the two easily moreover, influences the reliability of product.

Disclosure of Invention

The invention aims to: to prior art's not enough, provide a chip package structure, can surround the gap that forms between circuit board and the IC encapsulation, improve the reliability between circuit board and the chip, simultaneously, prevent that impurity dust from getting into from the gap between the two, be favorable to improving the dustproof and the humidity resistance of product to improve the reliability of product.

In order to achieve the purpose, the invention adopts the following technical scheme:

a chip packaging structure comprises a circuit board and an IC package welded on the circuit board, wherein solid glue is arranged between the circuit board and the IC package and completely surrounds a gap formed between the circuit board and the IC package, so that the IC package is bonded with the circuit board.

As an improvement of the chip packaging structure of the present invention, a double-sided tape is disposed at a bottom of the solid-state adhesive, and the double-sided tape is used for fixing the solid-state adhesive to the circuit board.

As an improvement of the chip packaging structure of the present invention, a groove is disposed on a surface of the circuit board corresponding to the solid-state adhesive, and the groove is used for fixing the solid-state adhesive to the circuit board.

As an improvement of the chip packaging structure of the present invention, a solder paste dot is disposed on a surface of the circuit board corresponding to the solid-state adhesive, and the solder paste dot is used for fixing the solid-state adhesive to the circuit board.

As an improvement of the chip package structure of the present invention, the circuit board includes a board body and a plurality of pads disposed on a surface of the board body, positions of the plurality of pads correspond to positions of the IC package, and the IC package is electrically connected to the circuit board through the pads.

As an improvement of the chip package structure of the present invention, the circuit board is provided with a plurality of lines, and the plurality of lines respectively correspond to and are electrically connected to the plurality of pads.

As an improvement of the chip package structure of the present invention, the solid adhesive is disposed around an edge of the IC package.

As an improvement of the chip package structure of the present invention, the solid adhesive extends to the outside of the IC package.

As an improvement of the chip packaging structure of the present invention, the solid adhesive has a multilayer solid structure.

As an improvement of the chip packaging structure of the present invention, the solid glue is in the shape of a sheet or a reel.

The invention has the beneficial effects that the circuit board comprises the circuit board and the IC package welded on the circuit board, solid glue is arranged between the circuit board and the IC package, and the solid glue completely surrounds a gap formed between the circuit board and the IC package, so that the IC package is bonded with the circuit board. Because the gap exists between the circuit board and the chip in the existing design, the stability between the circuit board and the chip is poor, and the impurity and dust easily enter from the gap between the circuit board and the chip to influence the reliability of the product, therefore, the gap formed between the circuit board and the IC package is completely surrounded by the solid glue, the gap between the circuit board and the IC package is filled, the displacement of the IC package caused by external mechanical vibration is prevented, the stability between the circuit board and the IC package is improved, the IC package can be bonded on the circuit board after being heated and melted, the gap between the circuit board and the IC package is favorably reduced, the reliability between the circuit board and the IC package is ensured, the probability of open circuit or short circuit is reduced, the service life of the product is prolonged, meanwhile, compared with the scheme of not surrounding the IC package, the dust or the impurity can not enter the inner part through the gap between the circuit, the sealing performance between the two is improved, so that the dustproof and moistureproof effects of the product are improved, the probability of open circuit or short circuit is reduced, and the reliability of the product is improved; the IC package is soldered to the circuit board by means of reflow soldering, the generated heat melts the solid glue during the reflow soldering process, and the solid glue completely surrounds a gap formed between the circuit board and the IC package after being cooled and solidified. The invention can surround the gap formed between the circuit board and the IC package, improve the reliability between the circuit board and the chip, prevent impurity and dust from entering from the gap between the circuit board and the chip, and is beneficial to improving the dustproof and moistureproof performance of the product, thereby improving the reliability of the product.

Drawings

Fig. 1 is a schematic structural view before packaging in embodiment 1 of the present invention.

Fig. 2 is a schematic structural diagram of the packaged structure in embodiment 1 of the present invention.

Fig. 3 is a schematic structural view before packaging in embodiment 2 of the present invention.

Fig. 4 is a schematic structural view before packaging in embodiment 3 of the present invention.

Wherein: 1-a circuit board; 2-IC packaging; 3-solid glue; 11-a plate body; 12-a pad; 4-double sided adhesive tape; 5-a groove; 6-solder paste spot.

Detailed Description

As used in the specification and in the claims, certain terms are used to refer to particular components. As one skilled in the art will appreciate, manufacturers may refer to a component by different names. This specification and claims do not intend to distinguish between components that differ in name but not function. In the following description and in the claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to. "substantially" means within an acceptable error range, and a person skilled in the art can solve the technical problem within a certain error range to substantially achieve the technical effect.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", horizontal ", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

The present invention will be described in further detail below with reference to the accompanying drawings, but the present invention is not limited thereto.