阅读说明：本技术 系统级封装模块及终端设备 (System-in-package module and terminal equipment ) 是由 胡彬 蒋然 卿湘勇 于 2019-09-06 设计创作，主要内容包括：本申请提供一种系统级封装模块及终端设备,所述系统级封装模块包括：基板、至少两个电子元器件、塑封体、开槽、导电屏蔽层和填充体；至少两个所述电子元器件设置在所述基板上,所述塑封体位于所述基板上且包裹至少两个所述电子元器件,所述开槽贯穿所述塑封体的上下表面且位于相邻两个电子元器件之间,所述导电屏蔽层覆盖在所述塑封体的上表面以及所述开槽的内表面上,所述填充体填充在所述开槽内。本申请提供一种系统级封装模块及终端设备,可提高系统级封装模块内部各电子元器件之间的电磁屏蔽效果以及系统级封装模块和外部电子元器件之间的电磁屏蔽效果。(The application provides a system in package module and terminal equipment, system in package module includes: the device comprises a substrate, at least two electronic components, a plastic package body, a slot, a conductive shielding layer and a filling body; at least two electronic components set up on the base plate, the plastic-sealed body is located just wrap up two at least on the base plate electronic components, the fluting runs through the upper and lower surface of plastic-sealed body just is located between two adjacent electronic components, electrically conductive shielding layer covers the upper surface of plastic-sealed body and on the grooved internal surface, the obturator is filled in the fluting. The application provides a system in package module and terminal equipment can improve the electromagnetic shield effect between inside each electronic components of system in package module and the electromagnetic shield effect between system in package module and outside electronic components.)

1. A system in package module, comprising: the device comprises a substrate, at least two electronic components, a plastic package body, a slot, a conductive shielding layer and a filling body;

at least two electronic components set up on the base plate, the plastic-sealed body is located just wrap up two at least on the base plate electronic components, the fluting runs through the upper and lower surface of plastic-sealed body just is located between two adjacent electronic components, electrically conductive shielding layer covers the upper surface of plastic-sealed body and on the grooved internal surface, the obturator is filled in the fluting.

2. The system-in-package module according to claim 1, wherein the conductive shielding layer covers the entire inner surface of the slot, and the filler is non-conductive.

3. The system-in-package module according to claim 2, wherein the cross-sectional shape of the slot is an inverted trapezoid.

4. The system-in-package module according to claim 2, wherein the filler comprises a non-conductive glue.

5. The system-in-package module according to claim 1, wherein the conductive shielding layer covers a portion of the inner surface of the trench, and the filler is an electrical conductor.

6. The system-in-package module according to claim 5, wherein the cross-sectional shape of the slot is T-shaped.

7. The system-in-package module according to claim 5, wherein the filler comprises a conductive glue.

8. The system-in-package module according to claim 1, wherein the notch and the edge of the system-in-package module together enclose one of the electronic components; alternatively, the first and second electrodes may be,

the slot includes an annular groove, and one of the electronic components is located in the annular groove.

9. The system-in-package module according to claim 1, wherein the upper surface of the filling body is flush with the upper surface of the conductive shielding layer above the molding body.

10. The system-in-package module according to claim 1, further comprising: a ground pad; the grounding pad is arranged on the substrate and is positioned at the bottom of the slot.

11. The system-in-package module according to claim 1, wherein the electronic component comprises: one or more of a radio frequency chip, a logic chip or a passive component.

12. A terminal device, comprising: a system-in-package module according to any of claims 1-11.

Technical Field

The application relates to the technical field of electronic equipment, in particular to a system-level packaging module and terminal equipment.

Background

The system-In package (sip) integrates various functional chips and components In one package, thereby realizing a complete function. SIP is a novel packaging technology, and has the advantages of short development cycle, more functions, lower power consumption, better performance, lower cost price, smaller volume, light weight and the like. For complex SIP packaging, radio frequency, a main chip and the like are integrated, subsystems in the packaging can mutually interfere with each other electromagnetically, and electromagnetic isolation needs to be carried out in the packaging.

Disclosure of Invention

The embodiment of the application provides a system-in-package module and terminal equipment, which can improve the electromagnetic shielding effect between electronic components in the system-in-package module and the electromagnetic shielding effect between the system-in-package module and external electronic components.

In a first aspect, an embodiment of the present application provides a system in package module, including: the device comprises a substrate, at least two electronic components, a plastic package body, a slot, a conductive shielding layer and a filling body;

at least two electronic components set up on the base plate, the plastic-sealed body is located just wrap up two at least on the base plate electronic components, the fluting runs through the upper and lower surface of plastic-sealed body just is located between two adjacent electronic components, electrically conductive shielding layer covers the upper surface of plastic-sealed body and on the grooved internal surface, the obturator is filled in the fluting.

The system-in-package module that this application embodiment provided through setting up top layer shielding and dividing the chamber shielding, can solve the mutual electromagnetic interference between the inside electronic components of system-in-package module, also can solve system-in-package module and outside electronic components's interference simultaneously.

In one possible embodiment, the conductive shielding layer covers the entire inner surface of the slot, and the filler is non-conductive.

By adopting the design, the conductive shielding layer is conducted with the substrate, so that the system-in-package module can be electrically conducted up and down, and meanwhile, the conductive shielding layer can realize the shielding between electronic components inside the system-in-package module and the shielding on the surface of the system-in-package module, namely the shielding between the system-in-package module and external electronic components.

In this embodiment, the cross-sectional shape of the slot is an inverted trapezoid.

By adopting the design, the inverted trapezoidal slotting structure is simple and easy to realize.

In this embodiment, the filling body comprises a non-conductive glue.

By adopting the design, the process difficulty and the cost of the non-conductive glue are low, and the process difficulty and the cost of the system-in-package module can be reduced.

By adopting the design, the conductive shielding layer can simultaneously realize shielding between the surface of the system-in-package module and the cavity, the cavity-splitting shielding inside the system-in-package module does not depend on conductive glue, and the non-conductive material can also be used as a filler to fill the slot, so that the process difficulty and the cost can be effectively reduced.

The system-in-package module provided by the embodiment can solve the mutual electromagnetic interference between the internal electronic components of the system-in-package module by arranging the surface layer shielding and the cavity-separating shielding, and can also solve the interference between the system-in-package module and the external electronic components, so that the electromagnetic shielding effect between the internal electronic components reaches 20-40dB, and the electromagnetic shielding effect between the system-in-package module and the external electronic components reaches 30-40 dB. Furthermore, the filling body is formed after the conductive shielding layer, so that the shielding effect can be effectively ensured.

In another possible embodiment, the conductive shielding layer covers part of the inner surface of the slot, and the filling body is an electric conductor.

By adopting the design, the conductive shielding layer is not conducted with the substrate through the filling body, so that the system-in-package module is electrically conducted up and down, the conductive shielding layer and the filling body jointly realize the shielding between the electronic components inside the system-in-package module, and the shielding between the system-in-package module and the external electronic components.

In this embodiment, the cross-sectional shape of the slot is T-shaped.

By adopting the design, the width of the T-shaped slot is narrower, the distance between the electronic components is closer, and the overall size of the system-in-package module can be further reduced.

In this embodiment, the filling body includes a conductive glue.

By adopting the design, the conductive glue can be conveniently filled into the groove through the dispensing operation.

The system-in-package module that this embodiment provided, through setting up top layer shielding and dividing the chamber shielding, can solve the mutual electromagnetic interference between the inside electronic components of system-in-package module, also can solve system-in-package module and outside electronic components's interference simultaneously, realize that electromagnetic shielding effect reaches more than 30dB between the inside electronic components, system-in-package module and outside electronic components's electromagnetic shielding effect reaches more than 30 dB. Furthermore, the filling body is formed after the conductive shielding layer, so that the shielding effect can be effectively ensured.

In a possible implementation manner, the notch and the edge of the system-in-package module together enclose one electronic component; or, the slot includes an annular groove, and one of the electronic components is located in the annular groove.

By adopting the design, a shorter slotting route can be planned by utilizing the edge of the system-in-package module according to the position of the electronic component, so that the slotting has a better partition effect, the size of the whole system-in-package module is reduced as much as possible, and the material and the process cost are saved.

In one possible embodiment, the upper surface of the filling body is flush with the upper surface of the conductive shielding layer above the plastic package body.

With the design, the surface of the system-in-package module can be neat.

In one possible embodiment, the system in package module further includes: a ground pad; the grounding pad is arranged on the substrate and is positioned at the bottom of the slot.

With the above design, the ground pad can improve the security of the system-in-package module.

In one possible embodiment, the electronic component includes: one or more of a radio frequency chip, a logic chip or a passive component.

With the above design, electronic components with different functions and different sizes can be applied to the system-in-package module.

In a second aspect, the present application provides a terminal device, comprising: a system in package module as described above.

The terminal device provided by this embodiment adopts a system-in-package module, and the system-in-package module can solve the mutual electromagnetic interference between the internal electronic components of the system-in-package module by setting the surface layer shield and the cavity-separating shield, and can also solve the interference between the system-in-package module and the external electronic components, so as to achieve the electromagnetic shielding effect between the internal electronic components of 20-30dB, and the electromagnetic shielding effect between the system-in-package module and the external electronic components of 30-40 dB. Furthermore, the filling body is formed after the conductive shielding layer, so that the shielding effect can be effectively ensured.

Drawings

Fig. 1 is a schematic partial cross-sectional view of a system-in-package module according to an embodiment of the present application;

fig. 2 is a schematic perspective view of a system-in-package module according to an embodiment of the present application;

fig. 3 is a schematic top view of a system-in-package module according to an embodiment of the present application;

fig. 4 is a schematic diagram illustrating an electromagnetic shielding effect between electronic components inside a module of a system-in-package module according to an embodiment of the present application;

fig. 5 is a schematic diagram illustrating an electromagnetic shielding effect between internal and external electronic components of a system-in-package module according to an embodiment of the present application;

fig. 6 is a schematic top view of a system in package module according to an embodiment of the present disclosure;

fig. 7 is a flowchart of a method for packaging a system-in-package module according to an embodiment of the present application;

FIG. 8 is a first process structure diagram of a packaging method according to a first embodiment of the present disclosure;

fig. 9 is a schematic process structure diagram of a packaging method according to a first embodiment of the present application;

fig. 10 is a schematic process structure diagram of a packaging method according to an embodiment of the present application;

fig. 11 is a schematic partial cross-sectional view of a system-in-package module according to a second embodiment of the present application;

fig. 12 is a schematic process structure diagram of a packaging method according to a second embodiment of the present application;

fig. 13 is a process structure diagram of a packaging method according to a second embodiment of the present application.

Description of reference numerals:

10-a substrate;

20-electronic components;

30-plastic package body;

40-slotting;

50-a conductive shielding layer;

60-a filler;

70-ground pad.

Detailed Description

The following explains key terms referred to in this application:

surface Shielding (Conformal Shielding): forming a conductive shield on the surface of the plastic package material to realize the shielding of the whole plastic package module;

compartment Shielding (Shielding): isolating the interior of the plastic package material through a conductive material to shield each cavity in the plastic package body;

system-In-package sip (system In package): various functional chips and components are integrated in one package, thereby realizing a complete function. Corresponding to a system on chip (soc) with the difference that the system-in-package is a packaging method in which different chips are arranged side by side or stacked, and the soc is a highly integrated chip product;

electromagnetic interference emi (electromagnetic interference): the method refers to that when the electronic product works, interference can be caused to other peripheral electronic products, and the electromagnetic interference category comprises conducted interference and radiated interference.

The system-in-package module and the terminal device provided by the present application are described below with reference to the accompanying drawings and specific embodiments.