阅读说明：本技术 一种工业用电子元件测试用散热组件 (Heat dissipation assembly for industrial electronic component test ) 是由 李爱夫 张春熹 卢佳振 高爽 于 2019-11-18 设计创作，主要内容包括：本发明公开了一种工业用电子元件测试用散热组件,涉及电子元件散热设备技术领域；为了解决不方便将其固定在微电子元器件载板问题；具体包括微电子元器件载板,所述微电子元器件载板顶部外壁设置有散热壳体,且散热壳体两侧外壁两端均安装有固定块,固定块底部外壁安装有橡胶吸盘,所述散热壳体底部外壁开设有滑动槽,且滑动槽内壁滑动连接有滑动块,所述滑动块底部外壁安装有基板,且基板底部外壁安装有导热硅脂。本发明通过设置在散热壳体上的固定块和橡胶吸盘,能够方便将装置固定在微电子元器件载板上,通过设置有伸缩弹簧和滑动块,能够保证基板下的导热硅脂与微电子元器件载板表面接触紧密,保证了散热效果。(The invention discloses a heat dissipation assembly for industrial electronic component testing, and relates to the technical field of electronic component heat dissipation equipment; in order to solve the problem that the fixing of the micro-electronic component carrier plate is inconvenient; the heat dissipation device comprises a microelectronic component support plate, wherein a heat dissipation shell is arranged on the outer wall of the top of the microelectronic component support plate, fixed blocks are installed at the two ends of the outer wall of the two sides of the heat dissipation shell, rubber suckers are installed on the outer wall of the bottom of the fixed blocks, sliding grooves are formed in the outer wall of the bottom of the heat dissipation shell, sliding blocks are connected to the inner wall of the sliding grooves in a sliding mode, a base plate is installed on the outer wall of the bottom of. The fixing block and the rubber sucker arranged on the radiating shell can conveniently fix the device on the microelectronic component carrier plate, and the telescopic spring and the sliding block are arranged, so that the heat-conducting silicone grease under the substrate can be ensured to be closely contacted with the surface of the microelectronic component carrier plate, and the radiating effect is ensured.)

1. The utility model provides an industrial radiator unit for electronic component test, includes microelectronic component support plate (5), its characterized in that, microelectronic component support plate (5) top outer wall is provided with heat dissipation casing (6), and all installs fixed block (7) at heat dissipation casing (6) both sides outer wall both ends, and rubber suction cup (2) are installed to fixed block (7) bottom outer wall, the sliding tray has been seted up to heat dissipation casing (6) bottom outer wall, and sliding tray inner wall sliding connection has sliding block (14), base plate (15) are installed to sliding block (14) bottom outer wall, and base plate (15) bottom outer wall installs heat conduction silicone grease (16), heat conduction silicone grease (16) top outer wall installs conducting strip (17), and radiating fin (12) that equidistance distributed are installed to conducting strip (17) top outer wall.

2. The heat dissipation assembly for testing industrial electronic components as claimed in claim 1, wherein the top outer wall of the sliding block (14) is provided with a retractable spring (13), and the top outer wall of the retractable spring (13) is fixedly connected with the top inner wall of the sliding groove.

3. The heat dissipation assembly for testing industrial electronic components as claimed in claim 2, wherein the bottom of the outer walls at the two ends of the heat dissipation housing (6) are respectively provided with the ventilation holes (3) distributed at equal intervals, the outer walls at the two ends of the heat dissipation housing (6) are respectively provided with the mounting slots distributed at equal intervals, and the inner walls of the mounting slots are provided with the semiconductor refrigeration sheets (4).

4. The heat dissipation assembly for testing industrial electronic components as claimed in claim 1, wherein the inner walls of two sides of the heat dissipation housing (6) are rotatably connected with the same screw rod (10), the outer wall of the circumference of the screw rod (10) is rotatably connected with a mounting block (18), and the outer wall of the bottom of the mounting block (18) is provided with a bristle plate.

5. The heat dissipation assembly for testing industrial electronic components as claimed in claim 4, wherein a limiting rod (8) is inserted into an outer wall of one side of the mounting block (18), and outer walls of two sides of the limiting rod (8) are fixedly connected with inner walls of two sides of the heat dissipation housing (6) through bolts.

6. The heat dissipation assembly for testing industrial electronic components as claimed in claim 5, wherein the motor (1) is mounted on an outer wall of one side of the heat dissipation housing (6), and an output end of the motor (1) is fixedly connected with an outer wall of one side of the screw rod (10) through a bolt.

7. The heat dissipation assembly for testing industrial electronic components as claimed in claim 6, wherein the connection frame (9) is installed on both sides of the outer wall of the two ends of the heat dissipation housing (6), and the exhaust fan (11) is installed on the outer wall of the bottom of the connection frame (9).

8. The heat dissipation assembly for testing industrial electronic components as claimed in claim 1, wherein the same protective screen (19) is slidably connected to the outer walls of the two sides of the heat dissipation housing (6), and the locking bolts (20) are rotatably connected to the bottoms of the outer walls of the two sides of the protective screen (19).

Technical Field

The invention relates to the technical field of electronic element heat dissipation equipment, in particular to a heat dissipation assembly for industrial electronic element testing.

Background

With the development of integration technology and microelectronic packaging technology, the total power density of electronic components is increasing, the physical sizes of electronic components and electronic devices tend to be small and miniaturized, and the generated heat is rapidly accumulated, so that the heat flux density around the integrated devices is also increasing, therefore, the performance of the electronic components and devices is necessarily affected by a high-temperature environment, and the electronic components are often tested intensively, so that the concentrated test of the electronic components distributed at high density also generates a large amount of heat, and a more efficient heat control scheme is needed to stabilize the test result.

Through search, chinese patent No. CN209133495U discloses a heat dissipation assembly for industrial electronic component testing, which comprises a heat conduction device and a heat dissipation device, wherein the lower end of the heat conduction device is connected with the upper end of the heat dissipation device, the upper end of the heat conduction device is a microelectronic component carrier plate, the upper surface of the microelectronic component carrier plate is provided with a microelectronic component, and the lower end of the microelectronic component is mounted on the microelectronic component carrier plate through a heat conduction insulating glue. The heat dissipation assembly for the industrial electronic element test in the patent has the following defects: however, the heat dissipation device is inconvenient to fix on the microelectronic component carrier plate, and the workload of workers is increased during installation, so that the heat dissipation device is inconvenient for people to use.

Disclosure of Invention

The invention aims to solve the defects in the prior art, and provides a heat dissipation assembly for industrial electronic element testing.

In order to achieve the purpose, the invention adopts the following technical scheme:

the utility model provides an industrial radiator unit for electronic component test, includes the microelectronic component support plate, microelectronic component support plate top outer wall is provided with the heat dissipation casing, and all installs the fixed block at heat dissipation casing both sides outer wall both ends, and rubber suction cups is installed to fixed block bottom outer wall, the sliding tray has been seted up to heat dissipation casing bottom outer wall, and sliding tray inner wall sliding connection has a sliding block, the base plate is installed to sliding block bottom outer wall, and base plate bottom outer wall installs heat conduction silicone grease, heat conduction silicone grease top outer wall installs the conducting strip, and the fin that the equidistance distributes is installed to conducting strip top outer wall.

Preferably, the outer wall of the top of the sliding block is provided with a telescopic spring, and the outer wall of the top of the telescopic spring is fixedly connected with the inner wall of the top of the sliding groove.

Preferably, the bottom of the outer walls at the two ends of the heat dissipation shell is provided with ventilation holes distributed equidistantly, the outer walls at the two ends of the heat dissipation shell are provided with mounting grooves distributed equidistantly, and the inner wall of each mounting groove is provided with a semiconductor refrigeration piece.

Preferably, the inner walls of the two sides of the heat dissipation shell are rotatably connected with the same screw rod, the outer wall of the circumference of the screw rod is rotatably connected with an installation block, and the outer wall of the bottom of the installation block is provided with a bristle plate.

Preferably, the outer wall of one side of the mounting block is inserted with a limiting rod, and the outer walls of two sides of the limiting rod are fixedly connected with the inner walls of two sides of the heat dissipation shell through bolts.

Preferably, the motor is installed on the outer wall of one side of the heat dissipation shell, and the output end of the motor is fixedly connected with the outer wall of one side of the screw rod through a bolt.

Preferably, the connecting frames are installed on two sides of the outer walls of two ends of the heat dissipation shell, and the exhaust fan is installed on the outer wall of the bottom of each connecting frame.

Preferably, the outer walls of the two sides of the heat dissipation shell are connected with the same protective net in a sliding mode, and the bottoms of the outer walls of the two sides of the protective net are connected with locking bolts in a rotating mode.

The invention has the beneficial effects that:

1. through setting up fixed block and the rubber suction cup on the heat dissipation casing, can conveniently fix the device on the microelectronic components and parts support plate, through being provided with expanding spring and sliding block, can guarantee that heat conduction silicone grease under the base plate is inseparable with microelectronic components and parts support plate surface contact, has guaranteed the radiating effect.

2. Through being provided with fin and conducting strip, can give off the heat that microelectronic components and parts work produced, guarantee the normal operating of its work, through being provided with the exhaust fan, accelerate fin surface air flow speed, improve the radiating efficiency of fin, microelectronic components's normal work has been guaranteed, through being provided with the motor, drive the installation piece removal on the lead screw, brush the fin surface through the brush hair board under the installation piece, detach the dust, the radiating effect of fin has been guaranteed.

3. Embodiment 2 can fix the protection network on the heat dissipation casing through being provided with protection network and locking bolt, and staff or winged insect mistake are met the exhaust fan when avoiding using, have improved the security that heat abstractor used.

Drawings

Fig. 1 is a schematic front view illustrating a heat dissipation assembly for testing an industrial electronic component according to the present invention;

FIG. 2 is a schematic cross-sectional view of a heat dissipation assembly for testing industrial electronic components according to the present invention;

fig. 3 is a partial schematic structural view of a heat dissipation assembly for testing industrial electronic components according to an embodiment 2 of the present invention.

In the figure: the device comprises a motor 1, a rubber sucker 2, a vent hole 3, a semiconductor refrigerating piece 4, a microelectronic component carrier plate 5, a heat dissipation shell 6, a fixing block 7, a limiting rod 8, a connecting frame 9, a lead screw 10, an exhaust fan 11, a heat dissipation piece 12, a telescopic spring 13, a sliding block 14, a base plate 15, heat-conducting silicone grease 16, a heat conduction piece 17, a mounting block 18, a protective net 19 and a locking bolt 20.

Detailed Description

The technical solution of the present patent will be described in further detail with reference to the following embodiments.

Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.

In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent.

In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.