Integrated circuit packaging shell
阅读说明:本技术 集成电路封装外壳 (Integrated circuit packaging shell ) 是由 庞士德 阮怀其 于 2019-09-24 设计创作,主要内容包括:本发明公开了一种集成电路封装外壳,包括底板、台板、横向导轨、纵向滑轨、散热装置和放置装置;所述底板上设有台板,所述台板上平行安装有两个纵向滑轨,所述纵向滑轨上滑动设有两个横向导轨,两个所述横向导轨上分别滑动设有两个用于固定集成电路的放置装置,所述底板和台板中心设有对封装时起散热保护的散热装置。本发明结构简单,使用方便,可以固定不同大小的芯片,制冷片和散热风扇对集成电路封装时产生的热量进行传递散热,增强装置的散热效果,上减震弹簧和下减震弹簧对封装时的集成电路起到了很好的缓冲减震的作用,减小了封装时对集成电路本身造成损害的可能。(The invention discloses an integrated circuit packaging shell which comprises a bottom plate, a bedplate, a transverse guide rail, a longitudinal slide rail, a heat dissipation device and a placement device, wherein the bottom plate is provided with a bottom plate; the bottom plate is provided with a bedplate, the bedplate is provided with two longitudinal slide rails in parallel, the longitudinal slide rails are provided with two transverse guide rails in a sliding manner, the two transverse guide rails are respectively provided with two placing devices for fixing an integrated circuit in a sliding manner, and the centers of the bottom plate and the bedplate are provided with heat dissipation devices for heat dissipation protection during packaging. The integrated circuit packaging device is simple in structure and convenient to use, chips with different sizes can be fixed, the refrigerating sheet and the cooling fan can transfer and dissipate heat generated during integrated circuit packaging, the heat dissipation effect of the device is enhanced, the upper damping spring and the lower damping spring play a good role in buffering and damping the integrated circuit during packaging, and the possibility of damage to the integrated circuit during packaging is reduced.)
1. An integrated circuit package housing, comprising: the device comprises a bottom plate, a bedplate, a transverse guide rail, a longitudinal slide rail, a heat dissipation device and a placement device;
the bottom plate is provided with a bedplate, the bedplate is provided with two longitudinal slide rails in parallel, the longitudinal slide rails are provided with two transverse guide rails in a sliding manner, the two transverse guide rails are respectively provided with two placing devices for fixing an integrated circuit in a sliding manner, and the centers of the bottom plate and the bedplate are provided with heat dissipation devices for heat dissipation protection during packaging.
2. The integrated circuit package housing of claim 1, wherein: the heat dissipation device comprises a refrigeration piece, a heat dissipation fan and a through hole, the heat dissipation fan is installed at the center of the bedplate, the through hole used for heat dissipation is formed in the bedplate, and the refrigeration piece is installed at the bottom of the bedplate.
3. The integrated circuit package housing of claim 1 or 2, wherein: the heat dissipation device further comprises a heat conduction plate, and the heat conduction plate is arranged on the bottom plate.
4. The integrated circuit package housing of claim 1, wherein: the placing device comprises two sliding seats and a fixed platform, and the two sliding seats are respectively arranged on the two transverse guide rails in a sliding manner. And the four corresponding side surfaces of the sliding seat are provided with fixing platforms for placing integrated circuits.
5. The integrated circuit package housing of claim 4, wherein: the fixed platform comprises press plate guide rails arranged on two sides of the sliding seat and an operating rod arranged in the press plate guide rails, a press plate is arranged between the operating rods, an upper damping spring is arranged in the middle of the press plate, a placing plate is arranged on the sliding seat below the press plate, and a lower damping spring is arranged between the placing plate and the sliding seat.
6. The integrated circuit package housing of claim 5, wherein: the operating rod is movably connected with the pressure plate guide rail through a fastening bolt.
7. The integrated circuit package housing of claim 1, wherein: and fastening bolts are arranged on the threads on the two sides of the transverse guide rail, and the transverse guide rail is movably connected with the longitudinal slide rail through the fastening bolts.
8. The integrated circuit package housing of claim 1 or 4, wherein: and the side surface of the sliding seat is provided with a fastening bolt in a threaded manner, and the sliding seat is movably connected with the transverse guide rail through the fastening bolt.
9. The integrated circuit package housing of claim 2, wherein: the number of the through holes is set to be 1-30.
10. The integrated circuit package housing of claim 1, wherein: and a support rod is arranged between the bottom plate and the bedplate.
Technical Field
The invention relates to the technical field of integrated circuit packaging, in particular to an integrated circuit packaging shell.
Background
An integrated circuit is a microelectronic device or component. The transistor, the resistor, the capacitor, the inductor and other elements and wires required in a circuit are interconnected together by adopting a certain process, are manufactured on a small or a plurality of small semiconductor wafers or medium substrates, and are then packaged in a tube shell to form a micro structure with the required circuit function; all the elements are structurally integrated, so that the electronic elements are greatly miniaturized, low in power consumption, intelligent and high in reliability.
The integrated circuit packaging shell is used as a carrier of the circuit board, not only plays a role in electrically connecting a bonding point in the circuit board with an external circuit, but also provides a stable and reliable working environment for the integrated circuit board, plays a role in mechanical or environmental protection for the integrated circuit board, and the circuit board packaging mainly needs to have the following four functions: fixed pin system, the physics nature protection, the heat dissipation is protected and the reinforcing to environmental nature, current device is in the installation of shell and bottom plate, the external world can apply the effort for the encapsulation shell usually, thereby can lead to the encapsulation shell to warp, the deformation of encapsulation shell often can lead to the fact destruction to the circuit board in the casing, and its sealed effect is only considered to current encapsulation shell, but its heat dispersion has been ignored, and current encapsulation is simple place external force when leading to the encapsulation easily on the board and causes the damage to integrated circuit.
Disclosure of Invention
The present invention is directed to solving, at least to some extent, one of the technical problems in the related art. Therefore, the integrated circuit packaging shell is simple in structure and convenient to use, chips with different sizes can be fixed, the refrigerating plate and the radiating fan can transfer and radiate heat generated during packaging of the integrated circuit, the radiating effect of the device is enhanced, the upper damping spring and the lower damping spring play a good role in buffering and damping the integrated circuit during packaging, and the possibility of damage to the integrated circuit during packaging is reduced.
The integrated circuit packaging shell comprises a bottom plate, a bedplate, a transverse guide rail, a longitudinal slide rail, a heat dissipation device and a placement device, wherein the bottom plate is provided with a bottom plate;
the bottom plate is provided with a bedplate, the bedplate is provided with two longitudinal slide rails in parallel, the longitudinal slide rails are provided with two transverse guide rails in a sliding manner, the two transverse guide rails are respectively provided with two placing devices for fixing an integrated circuit in a sliding manner, and the centers of the bottom plate and the bedplate are provided with heat dissipation devices for heat dissipation protection during packaging.
Preferably, the heat dissipation device comprises a refrigeration piece, a heat dissipation fan and a through hole, the heat dissipation fan is installed at the center of the bedplate, the through hole for heat dissipation is formed in the bedplate, and the refrigeration piece is installed at the bottom of the bedplate.
Preferably, the heat dissipation device further comprises a heat conduction plate, and the heat conduction plate is arranged on the bottom plate.
Preferably, the placing device comprises a sliding seat and a fixed platform, and two sliding seats are respectively arranged on the two transverse guide rails in a sliding manner. And the four corresponding side surfaces of the sliding seat are provided with fixing platforms for placing integrated circuits.
Preferably, the fixed platform comprises press plate guide rails arranged on two sides of the sliding seat and an operating rod arranged in the press plate guide rails, a press plate is arranged between the operating rods, an upper damping spring is arranged in the middle of the press plate, a placing plate is arranged on the sliding seat below the press plate, and a lower damping spring is arranged between the placing plate and the sliding seat.
Preferably, the operating rod is movably connected with the pressure plate guide rail through a fastening bolt.
Preferably, the threads on the two sides of the transverse guide rail are provided with fastening bolts, and the transverse guide rail is movably connected with the longitudinal slide rail through the fastening bolts.
Preferably, the lateral surface of the sliding seat is threaded with a fastening bolt, and the sliding seat is movably connected with the transverse guide rail through the fastening bolt.
Preferably, the number of the through holes is set to be 1-30.
Preferably, a support rod is arranged between the bottom plate and the bedplate.
The beneficial effects of the invention are as follows: the integrated circuit packaging device is simple in structure and convenient to use, the chips with different sizes can be fixed, the refrigeration piece and the cooling fan can transfer and dissipate heat generated during packaging of the integrated circuit, the heat dissipation effect of the device is enhanced, the upper damping spring and the lower damping spring play a good role in buffering and damping the integrated circuit during packaging, and the possibility of damaging the integrated circuit during packaging is reduced.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic structural diagram of an integrated circuit package according to the present invention;
FIG. 2 is a top view of an integrated circuit package housing in accordance with the present invention;
fig. 3 is a schematic structural view of the fixed platform in fig. 1.
In the figure: 1-bottom plate, 2-platen, 3-slide seat, 4-fastening bolt, 5-transverse guide rail, 6-longitudinal slide rail, 7-fixed platform, 71-press plate guide rail, 72-operating lever, 73-upper damping spring, 74-press plate, 75-placing plate, 76-lower damping spring, 8-supporting rod, 9-heat conducting plate, 10-refrigeration piece, 11-cooling fan and 12-through hole.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic views illustrating only the basic structure of the present invention in a schematic manner, and thus show only the constitution related to the present invention.
Examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Referring to fig. 1-3, an integrated circuit package housing comprises a
be equipped with
The heat dissipation device comprises a
The placing device comprises a sliding
The working principle is as follows: the integrated circuit packaging device has the advantages that chips with different sizes are adjusted to corresponding positions through the movable matching of the longitudinal sliding
The standard parts used in the invention can be purchased from the market, the special-shaped parts can be customized according to the description of the specification and the accompanying drawings, the specific connection mode of each part adopts conventional means such as bolts, rivets, welding and the like mature in the prior art, the machinery, parts and equipment adopt conventional models in the prior art, and the circuit connection adopts the conventional connection mode in the prior art, and the details are not described, and the content not described in detail in the specification belongs to the prior art known by persons skilled in the art.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
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