Packaging element and manufacturing method thereof
阅读说明:本技术 封装元件及其制作方法 (Packaging element and manufacturing method thereof ) 是由 吴淑媛 张文斌 于 2018-06-22 设计创作,主要内容包括:本发明公开了一种封装元件及其制作方法,封装元件包括基板单元、被动单元、导体单元、封装单元与电媒介单元。被动单元设置在基板单元上。导体单元与被动单元设置在基板单元的同一侧且电连接于被动单元。封装单元覆盖被动单元与导体单元。电媒介单元电接触导体单元且被封装单元所裸露。借此,本发明所提供的封装元件能够被应用在电子设备上。(The invention discloses a packaging element and a manufacturing method thereof. The passive unit is arranged on the substrate unit. The conductor unit and the passive unit are arranged on the same side of the substrate unit and are electrically connected with the passive unit. The packaging unit covers the passive unit and the conductor unit. The electric medium unit electrically contacts the conductor unit and is exposed by the encapsulation unit. Therefore, the packaging element provided by the invention can be applied to electronic equipment.)
1. A packaged component, comprising:
a substrate unit;
a passive unit disposed on the substrate unit;
the conductor unit and the passive unit are arranged on the same side of the substrate unit and are electrically connected to the passive unit;
a packaging unit covering the passive unit and the conductor unit; and
and the electric medium unit is electrically contacted with the conductor unit and is exposed by the packaging unit.
2. The packaged component of claim 1, wherein the substrate unit comprises a base layer and a planar layer on the base layer, the passive unit is on the planar layer, and the conductor unit is on the base layer and connected to the base layer.
3. The package component of claim 1, wherein the substrate unit comprises a base layer and a planar layer on the base layer, and wherein the passive unit and the conductor unit are both on the planar layer.
4. The package component of claim 1, wherein the conductor unit comprises at least one first conductive member and at least one second conductive member on the substrate unit, the at least one first conductive member and the at least one second conductive member being electrically connected to the passive unit; the package unit is disposed on the substrate, and the package unit is disposed on the substrate, wherein at least one of the first conductive members and at least one of the second conductive members are partially covered by the package unit, at least one of the first conductive members has a plurality of first contact portions, at least one of the second conductive members has a plurality of second contact portions, and the electrical media unit is electrically connected to the plurality of first contact portions and the plurality of second contact portions.
5. The package component of claim 4, wherein the electrical medium unit comprises a plurality of first electrode layers separated from each other and a plurality of second electrode layers separated from each other, each of the first electrode layers is electrically connected to the corresponding first contact portion, and each of the second electrode layers is electrically connected to the corresponding second contact portion.
6. The package component of claim 1, wherein the passive unit comprises:
at least one coil, located on the substrate unit, and adjacent to and electrically connected to the conductor unit; and
at least one isolation layer covering at least one of the coils and adjacent to the conductor unit, the at least one isolation layer being covered by the encapsulation unit.
7. A method of making a packaged component, comprising the steps of:
providing a substrate unit;
forming a passive unit on the substrate unit;
forming a conductor unit on the substrate unit, the conductor unit being adjacent to and electrically connected to the passive unit; and
covering the packaging unit on the passive unit and the conductor unit to manufacture a packaging main body;
wherein, the packaging main body is cut, and an electric medium unit is formed to be electrically connected with the conductor unit, so as to manufacture a plurality of packaging elements; alternatively, an electric medium unit is formed to be electrically connected to the conductor unit, and the package body is cut to make a plurality of the package elements.
8. The method of claim 7, wherein the step of providing the substrate unit further comprises the steps of:
providing a base layer; and
forming a planar layer on the base layer;
wherein the passive unit is located on the flat layer, and the conductor unit is located on the substrate layer and connected to the substrate layer.
9. The method of claim 7, wherein the step of providing the substrate unit further comprises the steps of:
providing a base layer; and
forming a planar layer on the base layer;
wherein the passive unit and the conductor unit are both located on a flat layer.
10. The method for manufacturing a package component according to claim 7, further comprising the steps of, in the step of forming the conductor unit on the substrate unit:
forming at least one first conductive member and at least one second conductive member on the substrate unit, wherein the at least one first conductive member and the at least one second conductive member are electrically connected to the passive unit;
the package unit is disposed on the substrate, and the package unit is disposed on the substrate, wherein at least one of the first conductive members and at least one of the second conductive members are partially covered by the package unit, at least one of the first conductive members has a plurality of first contact portions, at least one of the second conductive members has a plurality of second contact portions, and the electrical media unit is electrically connected to the plurality of first contact portions and the plurality of second contact portions.
11. The method of claim 10, wherein the step of forming the electrical connection between the electrical medium unit and the conductor unit further comprises the steps of:
forming a plurality of first electrode layers separated from each other and a plurality of second electrode layers separated from each other;
each electrode layer is electrically connected to the corresponding first contact portion, and each second electrode layer is electrically connected to the corresponding second contact portion.
12. The method as claimed in claim 7, further comprising the steps of, in the step of forming the passive unit on the substrate unit:
forming at least one coil on the substrate unit; and
and forming at least one isolation layer on at least one of the coils, wherein the at least one isolation layer is adjacent to the conductor unit and covered by the packaging unit.
Technical Field
The present invention relates to a package device and a method for fabricating the same, and more particularly, to a package device applicable to an electronic device and a method for fabricating the same.
Background
With the development of technology, different passive device package products have been developed in the field of passive devices for electronic devices or electronic products.
Disclosure of Invention
The present invention provides a package device and a method for manufacturing the same, which is directed to overcome the shortcomings of the prior art.
In order to solve the above technical problem, one technical solution of the present invention is to provide a package device, which includes a substrate unit, a passive unit, a conductor unit, a package unit, and an electrical medium unit. The passive unit is arranged on the substrate unit. The conductor unit and the passive unit are arranged on the same side of the substrate unit and are electrically connected with the passive unit. The packaging unit covers the passive unit and the conductor unit. The electric medium unit electrically contacts the conductor unit and is exposed by the encapsulation unit.
Preferably, the substrate unit includes a base layer and a flat layer on the base layer, the passive unit is on the flat layer, and the conductor unit is on the base layer and connected to the base layer.
Preferably, the substrate unit includes a base layer and a flat layer on the base layer, and the passive unit and the conductor unit are both located on the flat layer.
Preferably, the conductor unit includes at least one first conductive member and at least one second conductive member located on the substrate unit, and the at least one first conductive member and the at least one second conductive member are electrically connected to the passive unit; the packaging unit is used for partially covering at least one first conductive piece and at least one second conductive piece, the at least one first conductive piece is provided with a plurality of first contact parts, the at least one second conductive piece is provided with a plurality of second contact parts, and the electric media unit is electrically connected with the plurality of first contact parts and the plurality of second contact parts.
Preferably, the electrical medium unit includes a plurality of first electrode layers separated from each other and a plurality of second electrode layers separated from each other, each of the electrode layers is electrically connected to the corresponding first contact portion, and each of the second electrode layers is electrically connected to the corresponding second contact portion.
Preferably, the passive unit comprises: at least one coil, which is positioned on the substrate unit, is adjacent to the conductor unit and is electrically connected with the conductor unit; and at least one isolation layer covering the at least one coil and adjacent to the conductor unit, the at least one isolation layer being covered by the encapsulation unit.
In order to solve the above technical problem, another technical solution of the present invention is to provide a method for manufacturing a package device, including the following steps: providing a substrate unit; forming a passive unit on the substrate unit; forming a conductor unit on the substrate unit, wherein the conductor unit is adjacent to and electrically connected with the passive unit; the packaging unit is covered on the passive unit and the conductor unit to form a packaging body. Wherein, cutting the packaging main body, forming an electric medium unit to be electrically connected with the conductor unit, and manufacturing a plurality of packaging elements; alternatively, the electric medium unit is formed to be electrically connected to the conductor unit, and the package body is cut to manufacture a plurality of package elements.
Preferably, in the step of providing the substrate unit, the following steps are further included:
providing a base layer; and
forming a planar layer on the base layer;
the passive unit is located on the flat layer, and the conductor unit is located on the base layer and connected to the base layer.
Preferably, in the step of providing the substrate unit, the following steps are further included:
providing a base layer; and
forming a planar layer on the base layer;
wherein, the passive unit and the conductor unit are both positioned on the flat layer.
Preferably, in the step of forming the conductor unit on the substrate unit, the following steps are further included:
forming at least one first conductive member and at least one second conductive member on the substrate unit, the at least one first conductive member and the at least one second conductive member being electrically connected to the passive unit;
the packaging unit is used for partially covering at least one first conductive piece and at least one second conductive piece, the at least one first conductive piece is provided with a plurality of first contact parts, the at least one second conductive piece is provided with a plurality of second contact parts, and the electric media unit is electrically connected with the plurality of first contact parts and the plurality of second contact parts.
Preferably, in the step of forming the electrical connection between the electrical medium unit and the conductor unit, the following steps are further included:
forming a plurality of first electrode layers separated from each other and a plurality of second electrode layers separated from each other;
each electrode layer is electrically connected to the corresponding first contact portion, and each second electrode layer is electrically connected to the corresponding second contact portion.
Preferably, in the step of forming the passive unit on the substrate unit, the method further comprises the steps of:
forming at least one coil on the substrate unit; and
at least one isolation layer is formed on the at least one coil, the at least one isolation layer is adjacent to the conductor unit and covered by the packaging unit.
The invention has the advantages that the packaging element and the manufacturing method thereof can manufacture a plurality of packaging elements by forming the passive unit on the substrate unit, forming the conductor unit on the substrate unit, wherein the conductor unit is adjacent to and electrically connected with the passive unit, covering the packaging unit on the passive unit and the conductor unit to manufacture a packaging main body, and cutting the packaging main body to form an electric medium unit to be electrically connected with the conductor unit; or, forming the electric medium unit to be electrically connected with the conductor unit, and cutting the packaging main body to manufacture a plurality of packaging elements, so as to provide a user with a packaging element applicable to electronic equipment and a manufacturing method thereof.
For a better understanding of the features and technical content of the present invention, reference should be made to the following detailed description of the invention and accompanying drawings, which are provided for purposes of illustration and description only and are not intended to limit the invention.
Drawings
Fig. 1 is a flow chart of a method for manufacturing a package device according to the present invention.
Fig. 2A to 2F are side views of a first structure to a sixth structure of the package component according to the first embodiment of the invention.
Fig. 2G is a perspective view of the package device according to the first embodiment of the invention.
Fig. 3A to 3J are side views of a first structure to a tenth structure of a package component according to a second embodiment of the invention.
Fig. 3K to 3M are first to third perspective views of a package component according to a second embodiment of the invention.
Fig. 4 is a side view of a package device according to a third embodiment of the present invention.
Fig. 5 is a side view of a package device according to a fourth embodiment of the present invention.
Detailed Description
The following description is provided for the embodiments of the present disclosure relating to "package component and method for making the same" by specific embodiments, and those skilled in the art can understand the advantages and effects of the present disclosure from the disclosure of the present disclosure. The invention is capable of other and different embodiments and its several details are capable of modification and various changes in detail without departing from the spirit and scope of the invention. The drawings of the present invention are for illustrative purposes only and are not intended to be drawn to scale. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.
It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are used primarily to distinguish one element from another element or from one signal to another signal. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.
First, please refer to fig. 1, which is a flowchart illustrating a method for fabricating a package device according to the present invention. As shown in the drawings, the present invention provides a method for manufacturing a package device, which may include the following steps:
step S20: providing a substrate unit;
step S21: forming a passive unit on the substrate unit;
step S22: forming a conductor unit on the substrate unit, wherein the conductor unit is adjacent to and electrically connected with the passive unit; and
step S23: the packaging unit is covered on the passive unit and the conductor unit to form a packaging body.
After step S23, the method for manufacturing the package device of the present invention can proceed to step S24 or step S25, as follows.
Step S24: cutting the packaging main body, and forming an electric medium unit to be electrically connected with the conductor unit to manufacture a plurality of packaging elements;
step S25: forming an electric medium unit to be electrically connected with the conductor unit, and cutting the package body to manufacture a plurality of package elements.
The packaging element manufactured by the manufacturing method of the packaging element can be applied to electronic equipment. The package component of the present invention can have various embodiments through the manufacturing method of the package component, which will be further described below.
First embodiment
Referring to fig. 2A to 2G, fig. 2A to 2F are side views of a first structure to a sixth structure of a package device according to a first embodiment of the present invention, and fig. 2G is a perspective view of the package device according to the first embodiment of the present invention, and the manufacturing method of the package device according to the present invention is combined with fig. 1. As can be seen from the above figures, the package device 1 of the present invention includes a
Specifically, the package device 1 of the present invention can be manufactured through the steps S20 to S24 or the steps S20 to S25 in the manufacturing method of the package device, and in the embodiment, the steps S20 to S24 are taken as an illustration, but not limited thereto. Further, the
Before step S24, the present invention may print an iron oxide paste on the top surface of the package body Z (i.e., the surface covering the package unit 13), and then polish the top surface and the bottom surface of the package body Z (i.e., the bottom of the substrate unit 10) to thin the
In one preferred embodiment, the
In another preferred embodiment, the
For example, the package device 1 of the present invention can be formed by the step further included in the step S21 of the method for manufacturing the package device to form the
It is noted that in the process of forming the
However, the package device and the method for fabricating the same of the present invention are not limited to the above examples.
Second embodiment
Referring to fig. 3A to 3M, fig. 3A to 3J are side views illustrating a first structure to a tenth structure of a package device according to a second embodiment of the present invention, and fig. 3K to 3M are side views illustrating a first perspective view to a third perspective view of a package device according to a second embodiment of the present invention, and are matched with the method for manufacturing the package device according to the present invention, fig. 1, and fig. 2A to 2G. As shown in the drawings, the package device in this embodiment has similar operations to the same components of the package device in the first embodiment, and therefore, the description is omitted, and it should be noted that, in this embodiment, the
Specifically, the difference between the present embodiment and the first embodiment is that the
In addition, in the present embodiment, it is preferable to have a plurality of embodiments, one of which is shown in fig. 3A to 3G, and the other is shown in fig. 3A to 3D (a) and then fig. 3H to 3J. Further, the difference between the two embodiments is that the conductive pillars formed by the
In this embodiment, after step S23, in addition to printing the iron oxide glue on the top surface of the package body Z and polishing the top surface and the bottom surface of the package body Z (i.e., the bottom of the substrate unit 10), the
It should be noted that the package component 1 of the present embodiment can be manufactured by steps S20 to S24 or steps S20 to S25 in the manufacturing method of the package component, wherein steps S20 to S24 are the same as those of the first embodiment, and therefore, are not described in detail herein; since the difference between the step S25 and the step S24 is only the sequence of the steps of forming the electrical media unit and cutting the package body, it is not described in detail herein.
However, the package device and the method for fabricating the same of the present invention are not limited to the above examples.
Third embodiment
Referring to fig. 4, fig. 4 is a schematic side view of a package device according to a third embodiment of the present invention, and the package device manufacturing method of the present invention is combined with fig. 1 and fig. 2A to 3I. As shown in the figures, the package component in this embodiment is similar to the same components of the package components in the previous embodiments, and is not repeated herein, and it is worth noting that in this embodiment, the
For example, the
Then, after step S23, an iron oxide paste may be printed on the top surface of the package body Z, and the top surface and the bottom surface (i.e., the bottom of the substrate unit 10) of the package body Z may be ground, so that the
However, the package device and the method for fabricating the same of the present invention are not limited to the above examples.
Fourth embodiment
Referring to fig. 5, fig. 5 is a schematic side view of a structure of a package device according to a fourth embodiment of the present invention, and the package device manufacturing method of the present invention is combined with fig. 1 and fig. 2A to 4. As shown in the figures, the package device in the present embodiment has similar operations to the same components of the package devices in the previous embodiments, and thus, the description thereof is omitted, and it is worth noting that the difference from the
Specifically, the
It should be noted that the
However, the package device and the method for fabricating the same of the present invention are not limited to the above examples.
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