Detection substrate, preparation method thereof, detection device and detection method
阅读说明:本技术 检测基板及其制备方法、检测装置和检测方法 (Detection substrate, preparation method thereof, detection device and detection method ) 是由 吕志军 董立文 宋晓欣 张锋 崔钊 刘文渠 孟德天 王利波 于 2019-09-24 设计创作,主要内容包括:本发明实施例提供一种检测基板及其制备方法、检测装置和检测方法。检测基板包括基底,所述基底包括多个通孔,所述通孔内嵌设有电极柱,所述基底包括检测区域和焊盘区域,所述检测区域包括驱动电路,所述焊盘区域设置有焊盘,所述焊盘通过所述驱动电路与所述电极柱连接。本发明通过引入检测基板,实现了在巨量转移前对发光元件进行点亮检测,保证了巨量转移前发光元件的良品率,降低了巨量转移后的修复比例,有效克服现有巨量检测方式不能保证巨量转移前发光元件的良品率等问题。(The embodiment of the invention provides a detection substrate, a preparation method thereof, a detection device and a detection method. The detection substrate comprises a base, the base comprises a plurality of through holes, electrode columns are embedded in the through holes, the base comprises a detection area and a pad area, the detection area comprises a driving circuit, the pad area is provided with pads, and the pads are connected with the electrode columns through the driving circuit. The invention realizes the lighting detection of the light-emitting element before the mass transfer by introducing the detection substrate, ensures the yield of the light-emitting element before the mass transfer, reduces the repair proportion after the mass transfer, and effectively solves the problems that the prior mass detection mode can not ensure the yield of the light-emitting element before the mass transfer.)
1. The utility model provides a detection substrate, its characterized in that, includes the base, the base includes a plurality of through-holes, the embedded electrode post that is equipped with of through-hole, the base includes detection area and pad region, detection area includes drive circuit, the pad region is provided with the pad, the pad passes through drive circuit with the electrode post is connected.
2. The detection substrate according to claim 1, wherein the base includes a first surface and a second surface opposite to the first surface, the electrode posts protrude from the first surface and the second surface, respectively, a first contact is formed on a side of the first surface, and a second contact is formed on a side of the second surface.
3. The detection substrate of claim 2, wherein the first surface is provided with a conductive adhesive layer, and the conductive adhesive layer comprises a plurality of conductive adhesive blocks covering the first contacts.
4. The detection substrate according to claim 2, wherein the pad and the driving circuit are provided on the second surface, and the pad is connected to the second contact of the electrode post through the driving circuit.
5. The detection substrate of claim 4, wherein the driving circuit comprises a plurality of gate lines and a plurality of data lines connected to the bonding pads, the plurality of gate lines and the plurality of data lines are perpendicularly crossed to define a plurality of test units, at least one of the plurality of test units is provided with a thin film transistor, a gate electrode of the thin film transistor is connected to the gate lines, a first electrode of the thin film transistor is connected to the data lines, and a second electrode of the thin film transistor is connected to the second contact of the electrode pillar; or the driving circuit comprises a connecting wire, one end of the connecting wire is connected with the bonding pad, and the other end of the connecting wire is connected with the second contact of the electrode column.
6. The detection substrate of claim 1, wherein a seed layer is disposed on the sidewall of the through hole, the seed layer is a tubular structure, the electrode posts are post structures disposed in the seed layer, and the outer surfaces of the electrode posts are closely attached to the inner surface of the seed layer.
7. A preparation method of a detection substrate is characterized by comprising the following steps:
providing a substrate comprising a plurality of through holes, wherein the substrate comprises a detection area and a pad area;
forming electrode columns in the through holes;
and forming a driving circuit in the detection area, forming a bonding pad in the bonding pad area, and connecting the bonding pad with the electrode column through the driving circuit.
8. The method of manufacturing according to claim 7, wherein forming electrode pillars within the plurality of through-holes comprises:
depositing a metal film on the substrate having the plurality of through holes;
patterning the metal film through a patterning process to form a seed layer on the side wall of the through hole;
forming an electrode column in the through hole by an electroplating process; the electrode posts respectively protrude out of the first surface and the second surface of the substrate, a first contact is formed on one side of the first surface, and a second contact is formed on one side of the second surface; the second surface is a surface opposite the first surface.
9. A detection device, comprising:
a carrier substrate for carrying the detection substrate according to claims 1 to 6;
the transfer equipment is used for transferring a plurality of elements to be detected to the detection substrate, and pins of the elements to be detected are in direct contact with the conductive adhesive blocks of the detection substrate;
and the control mechanism is electrically connected with the bonding pad of the detection substrate and is used for applying an electric signal to the element to be detected.
10. The inspection device of claim 9, wherein the elements to be inspected are light emitting diodes, and further comprising an automatic optical inspection device for capturing images of a plurality of light emitting diodes to generate an illuminated map from which unlit light emitting diodes are determined.
11. A method of detection, comprising:
arranging the detection substrate as claimed in claims 1-6 on a carrier substrate, wherein a bonding pad of the detection substrate is electrically connected with a control mechanism;
transferring a plurality of elements to be detected to the detection substrate by transfer equipment, wherein pins of the elements to be detected are in direct contact with the conductive adhesive blocks of the detection substrate;
a control mechanism applies an electrical signal to the element to be detected.
12. The method of claim 11, wherein the component to be tested is a light emitting diode, further comprising:
the automatic optical detection device collects images of a plurality of light emitting diodes, generates a lighting map, and determines unlighted light emitting diodes through the lighting map.
Technical Field
The invention relates to the technical field of display, in particular to a detection substrate for detecting a large number of light-emitting diodes, a preparation method thereof, a detection device and a detection method.
Background
Light Emitting Diode (LED) technology has been developed for nearly thirty years, has features of small volume, high brightness and low energy consumption, and provides a solid foundation for its wider application from the original solid state lighting power supply to the backlight source in the display field to the LED display screen. With the development of chip fabrication and packaging technologies, submillimeter Light Emitting Diode (Mini LED) displays with a size of about 100 micrometers and Micro Light Emitting Diode (Micro LED) displays with a size of less than 50 micrometers gradually become a hot spot of display panels. Among them, Micro LED display has significant advantages of low power consumption, high color gamut, ultrahigh resolution, ultra-thin, etc., and is expected to become a more excellent display technology to replace Organic Light Emitting Diode (OLED) display.
Disclosure of Invention
The technical problem to be solved by the embodiments of the present invention is to provide a detection substrate, a method for manufacturing the detection substrate, a detection apparatus, and a detection method, so as to overcome the problem that the conventional bulk detection method cannot ensure the yield of light emitting devices before bulk transfer.
In order to solve the technical problem, an embodiment of the present invention provides a detection substrate, including a substrate, where the substrate includes a plurality of through holes, electrode pillars are embedded in the through holes, the substrate includes a detection area and a pad area, the detection area includes a driving circuit, the pad area is provided with a pad, and the pad is connected to the electrode pillars through the driving circuit.
Optionally, the substrate includes a first surface and a second surface opposite to the first surface, the electrode posts protrude from the first surface and the second surface, respectively, a first contact is formed on one side of the first surface, and a second contact is formed on one side of the second surface.
Optionally, a conductive adhesive layer is disposed on the first surface, and the conductive adhesive layer includes a plurality of conductive adhesive blocks covering the first contacts.
Optionally, the pad and the driving circuit are disposed on the second surface, the pad being connected to the second contact of the electrode column through the driving circuit.
Optionally, the driving circuit includes a plurality of gate lines and a plurality of data lines connected to the pad, the plurality of gate lines and the plurality of data lines are vertically crossed to define a plurality of test units, at least one of the plurality of test units is provided with a thin film transistor, a gate electrode of the thin film transistor is connected to the gate line, a first electrode of the thin film transistor is connected to the data line, and a second electrode of the thin film transistor is connected to the second contact of the electrode pillar; or the driving circuit comprises a connecting wire, one end of the connecting wire is connected with the bonding pad, and the other end of the connecting wire is connected with the second contact of the electrode column.
Optionally, a seed layer is arranged on the side wall of the through hole, the seed layer is of a tubular structure, the electrode column is of a column structure arranged in the seed layer, and the outer surface of the electrode column is tightly attached to the inner surface of the seed layer.
In order to solve the above technical problem, an embodiment of the present invention provides a method for manufacturing a detection substrate, including:
providing a substrate comprising a plurality of through holes, wherein the substrate comprises a detection area and a pad area;
forming electrode columns in the through holes;
and forming a driving circuit in the detection area, forming a bonding pad in the bonding pad area, and connecting the bonding pad with the electrode column through the driving circuit.
Optionally, forming electrode pillars within the plurality of vias comprises:
depositing a metal film on the substrate having the plurality of through holes;
patterning the metal film through a patterning process to form a seed layer on the side wall of the through hole;
forming an electrode column in the through hole by an electroplating process; the electrode posts respectively protrude out of the first surface and the second surface of the substrate, a first contact is formed on one side of the first surface, and a second contact is formed on one side of the second surface; the second surface is a surface opposite the first surface.
In order to solve the above technical problem, an embodiment of the present invention provides a detection apparatus, including:
the bearing substrate is used for bearing the detection substrate;
the transfer equipment is used for transferring a plurality of elements to be detected to the detection substrate, and pins of the elements to be detected are in direct contact with the conductive adhesive blocks of the detection substrate;
and the control mechanism is electrically connected with the bonding pad of the detection substrate and is used for applying an electric signal to the element to be detected.
Optionally, the element to be detected is a light emitting diode, and the device further comprises an automatic optical detection device, wherein the automatic optical detection device is used for collecting images of a plurality of light emitting diodes, generating a lighting map, and determining unlighted light emitting diodes through the lighting map.
In order to solve the above technical problem, an embodiment of the present invention provides a detection method, including:
arranging the detection substrate on a bearing substrate, wherein a bonding pad of the detection substrate is electrically connected with a control mechanism;
transferring a plurality of elements to be detected to the detection substrate by transfer equipment, wherein pins of the elements to be detected are in direct contact with the conductive adhesive blocks of the detection substrate;
a control mechanism applies an electrical signal to the element to be detected.
Optionally, the element to be detected is a light emitting diode, and further includes:
the automatic optical detection device collects images of a plurality of light emitting diodes, generates a lighting map, and determines unlighted light emitting diodes through the lighting map.
The embodiment of the invention provides a detection substrate and a preparation method thereof, a detection device and a detection method, and by introducing the detection substrate, the detection of an element to be detected before mass transfer is realized, the yield of the element to be detected before mass transfer is ensured, the repair proportion after mass transfer is reduced, and the problems that the yield of the element to be detected before mass transfer cannot be ensured by the existing mass detection mode and the like are effectively solved.
Of course, not all of the advantages described above need to be achieved at the same time in the practice of any one product or method of the invention. Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the embodiments of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the example serve to explain the principles of the invention and not to limit the invention. The shapes and sizes of the various elements in the drawings are not to scale and are merely intended to illustrate the invention.
FIG. 1 is a schematic structural diagram of a detection substrate according to an embodiment of the invention;
FIG. 2 is a schematic view of a substrate according to an embodiment of the present invention;
FIG. 3 is a schematic diagram illustrating a first metal film deposited according to an embodiment of the present invention;
FIG. 4 is a schematic view of a seed layer pattern formed according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of an embodiment of the present invention after patterning electrode pillars;
FIG. 6 is a schematic diagram illustrating a protective layer pattern formed according to an embodiment of the present invention;
FIG. 7 is a diagram illustrating a driver circuit and a pad pattern formed according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of an equivalent circuit of a driver circuit and a bonding pad in a test substrate according to an embodiment of the invention;
FIG. 9 is a schematic diagram of a TFT-electrode pillar connection in a test substrate according to an embodiment of the invention;
FIG. 10 is a schematic diagram illustrating an example of a patterned packaging layer according to an embodiment of the present invention;
FIG. 11 is a diagram illustrating another structure of a driver circuit and a bonding pad on a test substrate according to an embodiment of the invention;
FIG. 12 is a schematic view of a detection substrate disposed on a carrier substrate according to an embodiment of the invention;
fig. 13 is a schematic view of transferring a light emitting element by the transferring apparatus according to the embodiment of the present invention.
Description of reference numerals:
10-a substrate; 11 — a first surface; 12 — a second surface;
20-seed layer; 30-electrode column; 31 — a first contact;
32 — a second contact; 40, a protective layer; 41-conductive rubber blocks;
51-a drive circuit; 52-bonding pads; 53-encapsulation layer;
100-a carrier substrate; 200-detecting the substrate; 300 — an external detection device;
400-a transfer device; 401 — transfer plate; 402-a transfer head;
403 — a controller; 500-a light emitting element; 501-pin.
Detailed Description
The mass transfer technique transfers a large number (usually several tens to several hundreds of thousands) of Micro/Mini LEDs onto a driving circuit board to form an LED array, and the mass inspection technique inspects the Micro/Mini LEDs before the mass transfer. At present, the existing massive detection mode is only to perform appearance detection on the plane and 3D morphology of the Micro/Mini LED so as to remove the Micro/Mini LED with defects such as poor cracks.
The inventor of the application finds that although the existing huge detection can remove the Micro/Mini LED with appearance defects, the Micro/Mini LED with qualified appearance still has the defects of incapability of lighting and the like, so that the existing huge detection mode cannot ensure the yield of the Micro/Mini LED before huge transfer. Because the yield of the Micro/Mini LED is low before the mass transfer, the Micro/Mini LED bound (binding) to the driving circuit board can not be lightened, so that the repair proportion is high after the mass transfer, the transfer efficiency of the Micro/Mini LED is reduced, and the requirement of actual mass production cannot be met.
The following detailed description of embodiments of the invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention. It should be noted that the embodiments and features of the embodiments in the present application may be arbitrarily combined with each other without conflict.
In order to overcome the problem that the conventional bulk detection method cannot ensure the yield of light-emitting elements before bulk transfer, the embodiment of the invention provides a detection substrate for bulk detection of elements to be detected. The main structure of the detection substrate comprises a base, wherein the base comprises a plurality of through holes, electrode columns are embedded in the through holes, the base comprises a detection area and a pad area, the detection area comprises a driving circuit, the pad area is provided with pads, and the pads are connected with the electrode columns through the driving circuit.
Fig. 1 is a schematic structural diagram of a detection substrate according to an embodiment of the invention. As shown in fig. 1, the detection substrate of the embodiment of the invention includes:
the
a plurality of
a plurality of conductive adhesive blocks 41 disposed on the
a driving
and a plurality of
When the element to be detected is detected in a large amount, the
The driving circuit comprises a plurality of grid lines and a plurality of data lines, the grid lines and the data lines are perpendicularly crossed to limit a plurality of regularly arranged test units, at least one of the test units is provided with a thin film transistor and an electrode column, a gate electrode of the thin film transistor is connected with the grid lines, a first electrode of the thin film transistor is connected with the data lines, and a second electrode of the thin film transistor is connected with a second contact of the electrode column. Or the driving circuit comprises a connecting wire, one end of the connecting wire is connected with the bonding pad, and the other end of the connecting wire is connected with the second contact of the electrode column.
And a seed layer is arranged on the side wall of each through hole of the substrate and is used for forming the electrode column through an electroplating process.
And an encapsulation layer covering the driving circuit and the second contact is also arranged on the second surface of the substrate.
The embodiment of the invention provides a detection substrate, which realizes the lighting detection of a huge amount of light-emitting elements before huge amount transfer by forming an electrode column, a driving circuit and a bonding pad on a substrate, ensures the yield of the light-emitting elements before huge amount transfer, reduces the repair proportion after huge amount transfer, and effectively overcomes the problems that the existing huge amount detection mode cannot ensure the yield of the light-emitting elements before huge amount transfer.
The technical solution of this embodiment is further described below by the manufacturing process of the detection substrate of this embodiment. The "patterning process" in this embodiment includes processes of depositing a film, coating a photoresist, exposing a mask, developing, etching, and stripping the photoresist, and is a well-established manufacturing process in the related art. The "photolithography process" referred to in this embodiment includes coating film coating, mask exposure, and development, and is a well-established production process in the related art. The deposition may be performed by a known process such as sputtering, evaporation, chemical vapor deposition, etc., the coating may be performed by a known coating process, and the etching may be performed by a known method, which is not particularly limited herein. In the description of the present embodiment, it is to be understood that "thin film" refers to a layer of a material deposited or coated on a substrate. The "thin film" may also be referred to as a "layer" if it does not require a patterning process or a photolithography process throughout the fabrication process. If a patterning process or a photolithography process is required for the "thin film" in the entire manufacturing process, the "thin film" is referred to as a "thin film" before the patterning process, and the "layer" after the patterning process. The "layer" after the patterning process or the photolithography process includes at least one "pattern". Wherein, the element to be detected is exemplified by a Micro LED.
(1) A
(2) Seed layer 20 is patterned. Patterning seed layer 20 includes: the
(3)
(4) A
(5) The driving
(6) The
(7) A pattern of
Through the above process, the preparation of the detection substrate of the present embodiment is completed. In inspection, the
According to the structure and the preparation process of the detection substrate, the detection substrate for lighting the huge Micro LED before huge transfer can be formed through the electrode column embedded in the substrate, the conductive adhesive arranged on the surface of one side of the substrate, the driving circuit arranged on the surface of the other side of the substrate and the bonding pad, and the detection substrate has the advantages of being simple in structure, low in cost, easy to achieve and the like. The detection substrate of the embodiment of the invention ensures the yield of the Micro LED before the mass transfer, reduces the repair proportion after the mass transfer, and effectively overcomes the problems that the conventional mass detection mode cannot ensure the yield of the Micro LED before the mass transfer and the like. Furthermore, the existing mature process flow can be adopted for preparing the detection substrate, and the existing process equipment is utilized, so that the process compatibility is good, the process realizability is high, the practicability is high, and the application prospect is good.
It should be noted that the detection substrate and the preparation process thereof described in the embodiments of the present invention are only an example, and in practical implementation, the structure of the detection substrate may adopt other forms, and the flow of preparing the detection substrate may also adopt other orders, and this embodiment is not limited specifically herein. For example, the driving circuit may further include a common electrode, and the electrode column and the common electrode are simultaneously connected to two pins of the Micro LED during detection. For another example, the thin film transistor in the driving circuit may have a bottom gate structure or a top gate structure, and the active layer in the thin film transistor may be made of various materials such as amorphous indium gallium zinc oxide material a-IGZO, zinc oxynitride ZnON, indium zinc tin oxide IZTO, amorphous silicon a-Si, polycrystalline silicon p-Si, hexathiophene, polythiophene, and the like. For another example, the driving circuit in the detection substrate can be simplified to a connection line form. Specifically, the process of forming the driving circuit and the pad pattern may include: depositing a metal film on the second surface of the substrate, patterning the metal film through a patterning process, and forming a plurality of connection lines and a pad pattern on the second surface, wherein the plurality of connection lines are formed in the detection region, the pad is formed in the pad region, one end of each connection line is connected to the
Based on the technical idea of the foregoing embodiment, an embodiment of the present invention further provides a detection apparatus for detecting a large amount of light emitting diodes. The main structure of the detection device in the embodiment of the invention comprises a bearing substrate, a transfer device, a control mechanism and an optical detection device, wherein:
the bearing substrate is used for bearing the detection substrate of the embodiment of the invention;
the transfer equipment is used for transferring a plurality of elements to be detected to the detection substrate, and pins of the elements to be detected are in direct contact with the conductive adhesive blocks of the detection substrate;
and the control mechanism is electrically connected with the bonding pad of the detection substrate and is used for applying an electric signal to the element to be detected.
The element to be detected can be a light-emitting element such as a light-emitting diode, and the device further comprises an automatic optical detection device, wherein the automatic optical detection device is used for collecting images of a plurality of light-emitting diodes, generating a lighting map, and determining unlighted light-emitting diodes through the lighting map.
Wherein, the light emitting diode comprises a Micro LED or a Mini LED.
The technical solution of the embodiment of the present invention is explained in detail by the process of detecting the amount of light emitted from the light emitting element.
(1) The detection substrate is arranged on the bearing substrate. FIG. 12 is a schematic view of a detection substrate disposed on a carrier substrate according to an embodiment of the invention. As shown in fig. 12, before starting the mass production, the
(2) The
(3) After the alignment is completed, the
(4) When all the light-emitting elements can be lightened according to the lightening map, the conductive adhesive adhered to the pins of the light-emitting elements can be removed in a cleaning mode, then the
According to the process of the bulk detection in the embodiment of the invention, the bulk lighting detection of the light-emitting elements is realized by introducing the detection substrate, the light-emitting elements transferred in bulk can be guaranteed to be lighted, the yield of the light-emitting elements transferred in bulk is effectively guaranteed, and the repair proportion after the transfer in bulk is effectively reduced. Meanwhile, the embodiment of the invention realizes real online optical detection by introducing an automatic optical detection device and detecting unlighted light-emitting elements through a lightening map by using a high-speed high-precision vision processing technology, thereby effectively improving the detection efficiency and effectively ensuring the detection quality. Therefore, the technical scheme of the embodiment of the invention effectively solves the problems that the existing mass detection mode can not ensure the yield of the mass transfer light-emitting element, and the like, has simple detection method, short detection time and high detection precision, improves the detection and transfer efficiency of the light-emitting element, shortens the detection and transfer time, reduces the detection and transfer cost, and can meet the requirement of actual mass production.
In practical implementation, the diameter of the through holes on the substrate is adjusted to meet the test requirements of the light-emitting elements with different specifications, and the distance between the through holes on the substrate is adjusted to match with the transmission heads with different specifications. Meanwhile, the anisotropic conductive adhesive is cleaned and coated in a glue brushing mode, and the detection substrate can be reused. Therefore, the detection substrate provided by the embodiment of the invention has the advantages of simple structure, convenience in use, low detection cost, high detection reliability and the like.
Based on the technical idea of the foregoing embodiment, the embodiment of the present invention further provides a method for manufacturing a detection substrate, which is used for manufacturing a detection substrate for realizing a large amount of detection of elements to be detected. The preparation method of the detection substrate comprises the following steps:
s1, providing a substrate comprising a plurality of through holes, wherein the substrate comprises a detection area and a pad area;
s2, forming electrode columns in the through holes;
and S3, forming a driving circuit in the detection area, forming a pad in the pad area, and connecting the pad with the electrode column through the driving circuit.
Wherein, step S2 includes:
depositing a metal film on the substrate having the plurality of through holes;
patterning the metal film through a patterning process to form a seed layer on the side wall of the through hole;
forming an electrode column in the through hole by an electroplating process; the electrode posts respectively protrude out of the first surface and the second surface of the substrate, a first contact is formed on one side of the first surface, and a second contact is formed on one side of the second surface; the second surface is a surface opposite the first surface.
Wherein, step S3 includes:
and forming a driving circuit in the detection area of the second surface of the substrate, forming a pad in the pad area of the second surface of the substrate, and connecting the pad with the second contact of the electrode column through the driving circuit.
The driving circuit comprises a plurality of grid lines and a plurality of data lines which are connected with the bonding pad, the grid lines and the data lines are vertically crossed to define a plurality of testing units, thin film transistors are formed in the testing units, gate electrodes of the thin film transistors are connected with the grid lines, first electrodes of the thin film transistors are connected with the data lines, and second electrodes of the thin film transistors are connected with second contacts of the electrode columns; or the driving circuit comprises a connecting wire, one end of the connecting wire is connected with the bonding pad, and the other end of the connecting wire is connected with the second contact of the electrode column.
Wherein, still include: and forming a conductive adhesive layer on the first surface of the substrate, wherein the conductive adhesive layer comprises a plurality of conductive adhesive blocks covering the first contacts.
The specific process of the method for manufacturing a detection substrate according to the embodiment of the present invention has been described in detail in the foregoing embodiments of the detection substrate, and is not described herein again.
The embodiment of the invention provides a preparation method of a detection substrate, which realizes the detection of a huge amount of elements to be detected before huge amount transfer by forming an electrode column, a driving circuit and a bonding pad on a substrate, ensures the yield of the elements to be detected before the huge amount transfer, reduces the repair proportion after the huge amount transfer, and effectively overcomes the problems that the existing huge amount detection mode cannot ensure the yield of the elements to be detected before the huge amount transfer and the like. Furthermore, the existing mature process flow can be adopted for preparing the detection substrate, and the existing process equipment is utilized, so that the process compatibility is good, the process realizability is high, the practicability is high, and the application prospect is good.
Based on the technical concept of the foregoing embodiment, an embodiment of the present invention further provides a detection method, which uses the foregoing detection apparatus to detect a large number of elements to be detected. The detection method provided by the embodiment of the invention comprises the following steps:
arranging a detection substrate on a bearing substrate, wherein a bonding pad of the detection substrate is electrically connected with a control mechanism;
transferring a plurality of elements to be detected to the detection substrate by transfer equipment, wherein pins of the elements to be detected are in direct contact with the conductive adhesive blocks of the detection substrate;
a control mechanism applies an electrical signal to the element to be detected.
Wherein, the element to be detected can be a light emitting element, such as a light emitting diode, and further comprises:
the automatic optical detection device collects images of a plurality of light emitting diodes, generates a lighting map, and determines unlighted light emitting diodes through the lighting map.
Wherein, the light emitting diode comprises a Micro LED or a Mini LED.
The specific process of the detection method in the embodiment of the present invention has been described in detail in the foregoing detection apparatus embodiment, and is not described herein again.
The embodiment of the invention provides a detection method, which realizes the mass detection of elements to be detected by introducing a detection substrate, effectively ensures the yield of the mass transfer of the elements to be detected, and effectively reduces the repair proportion after the mass transfer. Meanwhile, the embodiment of the invention realizes real online optical detection by introducing an automatic optical detection device and detecting the element to be detected by lightening the map by using a high-speed high-precision vision processing technology, thereby effectively improving the detection efficiency and effectively ensuring the detection quality.
In the description of the embodiments of the present invention, it should be understood that the terms "middle", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "bound," "connected," and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Although the embodiments of the present invention have been described above, the above description is only for the convenience of understanding the present invention, and is not intended to limit the present invention. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
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