阅读说明：本技术 电子设备 (Electronic device ) 是由 鹿间和幸 宇佐美守央 于 2018-05-18 设计创作，主要内容包括：根据本发明,散热器(21)布置在电路基板(10)的下表面上。电路基板(10)在布置有集成电路装置(5)的区域(A)内具有贯穿电路基板(10)的通孔(h1)。该通孔(h1)设置有导热路径(11)。导热路径(11)将集成电路装置5和散热器(21)彼此连接。由于该构造,能够将与散热器(21)不同的部件布置在与集成电路装置(5)相同的一侧,因此能够提高部件布置的自由度。(According to the present invention, a heat sink (21) is disposed on the lower surface of the circuit substrate (10). The circuit board (10) has a through hole (h1) that penetrates the circuit board (10) in a region (A) where the integrated circuit device (5) is disposed. The through hole (h1) is provided with a heat conduction path (11). The heat conduction path (11) connects the integrated circuit device (5) and the heat sink (21) to each other. Due to this configuration, it is possible to arrange a component different from the heat sink (21) on the same side as the integrated circuit device (5), and therefore it is possible to improve the degree of freedom of component arrangement.)

1. An electronic device, comprising:

a circuit substrate having a first surface having an electronic component disposed thereon and a second surface on an opposite side of the first surface, and a through hole formed in a region where the electronic component is disposed;

a heat sink disposed on the second surface of the circuit substrate and on an opposite side of the electronic component with the circuit substrate disposed therebetween; and

a heat conduction path disposed in the through-hole of the circuit substrate and adapted to connect the electronic component and a heat sink.

2. The electronic device of claim 1,

a plurality of through holes located in the region are formed on the circuit substrate, and

providing the thermal conduction path for each of the plurality of vias.

3. The electronic device of claim 2,

the circuit substrate has a circuit pattern, and

the electric wire included in the circuit pattern is formed between two adjacent through holes of the plurality of through holes.

4. The electronic device of claim 1,

the circuit substrate includes:

a plurality of layers;

a plurality of circuit patterns formed in each of the plurality of layers; and

a connection hole adapted to penetrate the circuit substrate and electrically connect the plurality of circuit patterns, and

the size of the through hole is larger than the connection hole when viewed from the top.

5. The electronic device of claim 1,

the circuit substrate includes:

a plurality of layers;

a plurality of circuit patterns formed in each of the plurality of layers; and

a connection hole adapted to penetrate the circuit substrate and electrically connect the plurality of circuit patterns, and

the size of the through hole is substantially the same as the connection hole when viewed from the top.

6. The electronic device of claim 1,

the electronic component is an integrated circuit device,

the integrated circuit device has a heat conductive portion on a surface facing the circuit substrate, and

the size of the through hole is larger than half of the thermal conduction portion when the circuit substrate is viewed from the top.

7. The electronic device of claim 1,

a circuit is formed on the circuit substrate, and

the thermally conductive path includes a material having a higher electrical resistance than a material of the circuit.

8. The electronic device of claim 1,

a circuit is formed on the circuit substrate, and

the thermal conduction path is formed of the same material as the circuit.

9. The electronic device of claim 1,

the heat conduction path is a plating layer formed inside the through hole.

10. The electronic device of claim 1,

the electronic component is an integrated circuit device,

the integrated circuit device has a heat conductive portion on a surface facing the circuit substrate, and

the heat conduction path is connected to the heat conduction portion.

11. The electronic device of claim 1,

at least a heat-conducting sheet or a heat-conducting grease is disposed between the heat-dissipating member and the heat-conducting path.

12. The electronic device of claim 1,

the circuit substrate has a metal layer on the second surface, the metal layer being connected to the heat conduction path of the through hole and being formed integrally with the circuit substrate.

13. The electronic device of claim 1,

another component is disposed on the opposite side of the heat sink with the circuit substrate and the electronic component disposed therebetween, and

the distance between the other component and the electronic component is smaller than the thickness of the heat dissipating device in the thickness direction of the circuit board.

14. The electronic device of claim 1,

the heat conduction path includes a material having a higher thermal conductivity than a base material of the circuit substrate, and the material fills the through hole.

Technical Field

The present invention relates to a cooling structure for a heat generating component of an electronic apparatus.

Background

In some cases, in an electronic device, a heat dissipation device, such as a heat sink or heat pipe, is connected to an integrated circuit device, such as a Central Processing Unit (CPU) or a Graphics Processing Unit (GPU). In a conventional electronic apparatus, an integrated circuit apparatus is disposed on an upper side of a circuit substrate, and a heat sink is disposed above the integrated circuit apparatus (for example, japanese patent laid-open No. 2013-222275).

Disclosure of Invention

In conventional electronic apparatuses, there are cases in which the heat dissipating apparatus constitutes a limitation in arranging other components, and in which the size of the cooling structure is increased to provide sufficient cooling performance.

An electronic device proposed in the present disclosure includes a circuit substrate, a heat dissipation device, and a heat conduction path. The circuit substrate has first and second surfaces and a through hole. The electronic component is disposed on the first surface. The second surface is on an opposite side of the first surface. The circuit substrate has a through hole formed in a region where the electronic component is disposed. The heat sink is disposed on the second surface of the circuit substrate and on the opposite side of the electronic component with the circuit substrate disposed therebetween. The heat conduction path is disposed in the through hole of the circuit substrate and connects the electronic component and the heat sink. The electronic apparatus ensures a high degree of freedom in component arrangement or enhances cooling performance of the electronic component.

Drawings

Fig. 1 is a schematic cross-sectional view illustrating an example of an electronic device proposed in the present disclosure.

Fig. 2A is an enlarged cross-sectional view of a circuit substrate included in the electronic apparatus shown in fig. 1.

Fig. 2B is a plan view illustrating a region where the heat conduction path illustrated in fig. 2A is formed.

Fig. 3 is a sectional view showing a modification of the heat conduction path formed in the circuit substrate shown in fig. 2A.

Fig. 4 is a plan view showing another modification of the heat conduction path shown in fig. 2A.

Fig. 5 is a cross-sectional view showing a modification of the circuit board shown in fig. 2A.

Fig. 6 is a sectional view showing a modification of the through hole and the heat conduction path shown in fig. 1 and 2A.

Fig. 7 is a plan view showing a modification of the circuit substrate shown in fig. 1 and 2A.

Detailed Description

A description will be given below of embodiments of the electronic device proposed in the present disclosure. In the description given below, the directions indicated by Z1 and Z2 in fig. 1 will be referred to as up and down, respectively. In the description given below, the terms "upper", "lower", and the like are used to indicate relative positional relationships between parts, members, and elements of an electronic apparatus. These terms do not limit the posture of components and the like in the electronic device or the posture of the electronic device.

As shown in fig. 1, the electronic apparatus 1 has a circuit substrate 10. The circuit substrate 10 has a base material 10a, and the base material 10a includes, for example, an insulating material such as paper phenol, glass epoxy resin, or the like. A circuit pattern 15 is formed on the base 10a (see fig. 2A). The circuit substrate 10 is a multilayer board having a plurality of layers, in each of which a circuit pattern 15 is formed. The circuit substrate 10 may not be a multilayer board. For example, the circuit substrate 10 may be a double-sided board having the circuit patterns 15 only on the upper and lower surfaces thereof. Alternatively, the circuit substrate 10 may be a single panel having the circuit pattern 15 formed only on its upper surface (the surface on which the integrated circuit device or another component is mounted).

In the example of the electronic apparatus 1, the circuit substrate 10 has a hole h2, which hole h2 connects a plurality of circuit patterns 15 to each other, as shown in fig. 2A (the hole h2 will be referred to as a "connection hole"). A conductor 13 is formed inside the connection hole h2, and the plurality of circuit patterns 15 are electrically connected to each other via the conductor 13. For example, the inside of the connection hole h2 is plated with metal. Although the conductor 13 has a tubular shape in the example of the electronic apparatus 1, the conductor 13 may be formed in such a manner as to fill the connection hole h 2. As shown in fig. 2A, the connection hole h2 is, for example, a through hole penetrating the circuit board 10. In contrast, the connection hole h2 may be a recess that does not penetrate the circuit substrate 10. The circuit substrate 10 also has a through hole h1 for forming the heat conduction path 11, which will be described later.

As shown in fig. 1, the electronic component is disposed on the upper surface (first surface) of the circuit substrate 10. The electronic component is, for example, a heat generating component that generates heat during operation. In the example of the electronic apparatus 1, the integrated circuit device 5 as a heat generating component is provided on the circuit substrate 10. The integrated circuit device 5 is, for example, but not limited to, a microprocessor, a memory, an analog signal processing circuit, or other components. Furthermore, the integrated circuit device 5 may be a system in package (Sip) having a plurality of Integrated Circuit (IC) chips (silicon wafers) encapsulated inside a single package. In this case, the integrated circuit device 5 may be a Sip having a plurality of IC chips arranged horizontally side by side or a Sip having a plurality of IC chips arranged vertically side by side. In the example shown in fig. 1, the integrated circuit device 5 has two IC chips 5c and 5d, which are vertically stacked on each other. Instead of the integrated circuit device 5, an electronic component susceptible to temperature may be provided on the circuit substrate 10. Examples of such electronic components may be sensors, Light Emitting Diodes (LEDs), inverters, motors, etc.

The integrated circuit device 5 is a surface-mounted component having a plurality of terminals connected to electrode pads 16 formed on the surface of the circuit substrate 10 (see fig. 2B). In the example of the electronic apparatus 1, the integrated circuit device 5 is of a Ball Grid Array (BGA) type having a plurality of solder balls 5b on a lower surface thereof (refer to fig. 1). The solder balls 5b are each connected to the electrode pad 6. It should be noted that the integrated circuit device 5 may not be of the BGA type. For example, the integrated circuit device 5 may have a plurality of lead terminals connected to the circuit substrate 10 on the outer peripheral edges thereof, instead of solder balls. In still another example, the integrated circuit device 5 may be an insertion mounting component having terminals that are inserted into holes formed in the circuit substrate 10 and soldered.

The heat sink is provided on the lower surface (second surface) of the circuit substrate 10. As shown in fig. 1, in the example of the electronic apparatus 1, a heat sink 21 is provided on the lower surface of the circuit substrate 10. The heat sink 21 is located on the opposite side of the integrated circuit device 5 with the circuit substrate 10 disposed therebetween. That is, the heat sink 21 is disposed in such a manner as to overlap with the integrated circuit device 5 when viewed from the top. The circuit board 10 has a through hole h1 (see fig. 2A) penetrating the circuit board 10 in a region where the integrated circuit device 5 is provided. The size of the area a is adapted to the outer dimensions of the integrated circuit device 5. That is, the area a refers to an area immediately below the integrated circuit device 5. In other words, when the circuit substrate 10 is viewed from the top, the region a overlaps with the integrated circuit device 5. The through hole h1 extends from the upper surface to the lower surface of the circuit substrate 10. The heat conduction path 11 is provided in the through hole h 1. In the example of the electronic apparatus 1, in the circuit substrate 10, a plurality of through holes h1 are formed in the region a, and the heat conduction path 11 is provided in each through hole h 1. The heat conduction path 11 connects the integrated circuit device 5 and the heat sink 21, and heat is conducted from the integrated circuit device 5 to the heat sink 21 via the heat conduction path 11. The heat conduction path 11 includes a material having a higher thermal conductivity than the base material 10a of the circuit substrate 10.

This structure of the electronic apparatus 1 eliminates the need for a space for a heat sink on the upper side of the integrated circuit device 5 as shown in fig. 1, thereby making it possible to dispose another component 9 (e.g., a transmission/reception module with an antenna or the like, a sensor, an external storage device) of the electronic apparatus 1 on the upper side of the integrated circuit device 5 and ensuring a higher degree of freedom in arranging the component 9. In the example of the electronic apparatus 1, the component 9 is disposed on the opposite side of the heat sink 21 with the circuit substrate 10 and the integrated circuit device 5 disposed therebetween. That is, the component 9 is disposed close to the upper side of the integrated circuit device 5. Specifically, the distance L1 between the component 9 and the integrated circuit device 5 is less than the height H1 of the heat sink 21. Unlike the example of the electronic apparatus 1, another heat dissipation device may be provided on the upper surface of the integrated circuit device 5. As a result, two heat dissipation devices are provided on the integrated circuit device 5, thereby providing improved cooling performance.

The heat sink 21 is attached to the circuit substrate 10. The heat sink 21 is fastened to the circuit substrate 10 by a fastener such as a screw or a bolt. The heat sink 21 may be soldered to the circuit substrate 10.

It should be noted that a heat pipe may be provided on the lower surface of the circuit substrate 10 as a heat dissipating device instead of or together with the heat sink 21. The heat conducting path 11 may then connect the heat pipe and the integrated circuit device 5.

As described above, the circuit board 10 has the circuit. The circuit includes the above-described circuit pattern 15 and the conductor 13 of the connection hole h 2. The heat conduction path 11 is formed of, for example, the same material as the conductor 13. In this case, the heat conduction path 11 may be formed by the same process (plating process) as the conductor 13 during the manufacture of the circuit substrate 10. The heat conduction path 11 may be formed of the same material as the circuit pattern 15. In this case, the heat conduction path 11 may be formed through the same process as the circuit pattern 15 during the manufacture of the circuit substrate 10. It should be noted that the conductor 13 and the circuit pattern 15 may be formed of the same material. The circuit pattern 15, the conductor 13, and the heat conduction path 11 include, for example, copper.

The heat conduction path 11 may include a material different from that of the circuit. For example, the heat conduction path 11 may include a material having a higher electrical resistance than a material of the circuit. This prevents the heat conduction path 11 and the heat sink 21 connected thereto from causing electromagnetic interference (EMI). The circuit pattern 15 includes an electrically conductive material (e.g., copper), and the heat conduction path 11 includes, for example, a metal having a higher resistance than copper. The heat conduction path 11 may include an insulating material. For example, the heat conduction path 11 may include heat conduction grease (also referred to as "heat dissipation grease"). Thermally conductive grease is grease such as silicone that includes highly thermally conductive fillers (e.g., copper, silver, or aluminum particles). The heat conductive grease is filled into the through hole h1, thereby forming the heat conductive path 11.

As shown in fig. 2A, in the example of the electronic apparatus 1, the material of the heat conduction path 11 fills the through hole h1, and the heat conduction path 11 is columnar. This ensures efficient heat conduction from the integrated circuit device 5 to the heat sink 21. The structure of the heat conduction path 11 is not limited to the example shown in fig. 2A. Fig. 3 is a diagram showing another example of the heat conduction path 11 (in fig. 3, the same components as those in fig. 2A are denoted by the same reference numerals). As shown in fig. 3, the heat conduction path 11 may be a tubular path formed along the inner surface of the through hole h 1.

The heat conduction path 11 shown in fig. 2A and 3 may be formed by a plating process performed during the manufacture of the circuit substrate 10. The heat conduction path 11 may be formed, for example, by a plating process for forming the conductor 13 of the connection hole h 2. The method of forming the heat conduction path 11 is not limited to the plating process. For example, the heat conduction path 11 may be a pin formed separately from the manufacture of the circuit substrate 10. In another example, the heat conduction path 11 may be formed by injecting heat conduction grease into the through hole h1 as described above. In yet another example, the heat conduction path 11 may be integrally formed with the heat sink 21. That is, a part of the heat sink 21 may be inserted into the through hole h1 so that a part thereof serves as the heat conduction path 11.

As shown in fig. 2B, the through hole h1 is, for example, circular when the circuit substrate 10 is viewed from the top. This makes it easier to form the through-hole h1 during the manufacture of the circuit substrate 10, compared to the case where the through-hole h1 is rectangular. It should be noted that the shape of the through hole h1 is not limited to a circular shape. For example, the through hole h1 may be a long hole when the circuit substrate 10 is viewed from the top.

As described above, the connection hole h2 for connecting the plurality of circuit patterns 15 is formed in the circuit substrate 10. As shown in fig. 2A, the width W1 (diameter) of the through hole h1 may be greater than the width W2 (diameter) of the connection hole h 2. This ensures improved heat conduction efficiency from the integrated circuit device 5 to the heat sink 21.

The size of the through hole h1 is not limited to the example shown in fig. 2A. For example, as shown in fig. 3, the width W1 (diameter) of the through hole h1 may be substantially the same as the width W2 (diameter) of the connection hole h 2. This makes it possible to use the same tool in the drilling process for forming the connection hole h2 and the through hole h1 during the manufacture of the circuit substrate 10, thereby simplifying the manufacture of the circuit substrate 10. The connection hole h2 shown in fig. 3 does not penetrate the circuit substrate 10. The connection hole h2 connects the two circuit patterns 15 formed inside the circuit substrate 10.

As described above, the plurality of through holes h1 are formed in the circuit substrate 10. In the example shown in fig. 2B, the plurality of through holes h1 are arranged in a grid pattern. That is, the plurality of through holes h1 are arranged side by side vertically and horizontally at equal intervals. As shown in fig. 2A, the electric wire 15c partially included in the circuit pattern 15 may be formed between two adjacent through holes h 1. In other words, the through-holes h1 may be arranged in such a manner as to avoid the electric wires of the circuit pattern 15.

Fig. 4 is a plan view showing a modified example of the heat conduction path 11. In the example shown in fig. 4, the circuit substrate 10 has a plurality of heat conduction paths 11A, 11B, and 11C. An electric wire 15a included in a part of the circuit pattern 15 is formed between each pair of adjacent heat conduction paths 11A, 11B, and 11C. The heat conduction paths 11A, 11B, and 11C are different in shape and/or size when the circuit substrate 10 is viewed from the top. Specifically, although the heat conduction paths 11A and 11C are rectangular, the heat conduction path 11B is in the shape of the letter L. The heat conduction path 11B is bent to match the electric wire 15 a. The shapes of the heat conduction paths 11A, 11B, and 11C may be appropriately changed to match the shape of the circuit pattern 15. Further, the end portions 11A (end portions of the through holes h1) of the heat conduction paths 11A, 11B, and 11C may be formed in a circular shape. This facilitates, for example, the formation of the through-hole h1 where the heat conduction paths 11A, 11B, and 11C are formed.

As shown in fig. 1, the integrated circuit device 5 has a thermal pad 5a on its lower surface. In the example of the integrated circuit device 5, although the solder balls 5b are formed on the outer sides of the thermal pads 5a, the positions of the thermal pads 5a are not limited thereto. The thermal pad 5a has a size larger than a terminal for transmitting and receiving a signal, such as a solder ball 5b, when the integrated circuit device 5 is viewed from the bottom. The heat conduction path 11 is connected to the heat conduction pad 5a of the integrated circuit device 5. In the example of the electronic apparatus 1, the plurality of heat conduction paths 11 are located in the region B (refer to fig. 2B) of the heat conduction pad 5a and are connected to the heat conduction pad 5 a. The thermal pad 5a includes, for example, metal.

The thermal pad 5a may be used to electrically connect with the circuit substrate 10. For example, the thermal pad 5a may be used as a ground line. That is, in the case where the heat conduction path 11 is a conductor, the heat conduction path 11 may be connected to a ground line formed in the circuit substrate 10, thereby electrically and thermally connecting the heat conduction path 11 and the heat conduction pad 5a to each other. Unlike this example, the thermal pad 5a may not be used for electrical connection with the circuit substrate 10. That is, the heat conduction path 11 and the heat conduction pad 5a may be electrically independent from the circuit of the circuit substrate 10.

As shown in fig. 1, a connection member 31 for thermally connecting the thermal pad 5a and the thermal conduction path 11 may be provided between the thermal pad 5a and the thermal conduction path 11. In the case where both the heat conduction pad 5a and the heat conduction path 11 include metal, the connection member 31 is, for example, solder. That is, in the case where both the thermal pad 5a and the thermal conduction path 11 contain metal, they are electrically and thermally connected to each other by, for example, solder. The connection member 31 is not limited to solder. For example, the connection member 31 may be a thermally conductive grease (also referred to as "heat dissipation grease") or a thermally conductive sheet. The connecting member 31 is not necessarily limited to the heat conductive grease or the heat conductive sheet as long as the connecting member 31 can be deformed to accommodate the tolerance between the heat conductive path 11 and the heat conductive pad 5 a.

As shown in fig. 1, a connection member 32 for thermally connecting the heat sink 21 and the heat conduction path 11 may be disposed between the heat sink 21 and the heat conduction path 11. The connecting member 32 is, for example, a heat conductive sheet. The heat conductive sheet is elastic in the thickness direction of the circuit substrate 10. This ensures the connection stability between the heat sink 21 and the heat conduction path 11, and minimizes the force acting on the integrated circuit device 5 when the heat sink 21 is pressed against the circuit substrate 10. A thermally conductive sheet including silicone resin or acrylic resin may be used. The connecting member 32 may be the thermally conductive grease described above. Even in this case, the connection stability between the heat sink 21 and the heat conduction path 11 can be ensured.

Fig. 5 is a diagram showing a modification of the circuit board 10 (in fig. 5, the same components as those in fig. 2A are denoted by the same reference numerals). In the example shown in fig. 5, the circuit substrate 10 has a metal layer 18 on its lower surface (surface facing the heat sink 21). For example, the metal layer 18 is formed on the entire area where the plurality of through holes h1 are formed and the plurality of heat conduction paths 11 are connected. When the circuit board 10 has the metal layer 18, the heat sink 21 is connected to the metal layer 18. In this case, the heat spreader 21 may be in direct contact with the metal layer 18. Alternatively, a connecting member 32 as the above-described heat conductive sheet, heat conductive grease, or other member may be provided between the heat sink 21 and the metal layer 18. The metal layer 18 is formed of, for example, the same material as the circuit pattern 15. This allows the metal layer 18 and the circuit pattern 15 (specifically, the circuit pattern 15 formed on the lower surface of the circuit substrate 10) to be formed by the same process during the manufacture of the circuit substrate 10.

It should be noted that, in the example shown in fig. 5, a metal layer 17 for connecting the plurality of heat conduction paths 11 is also formed on the upper surface of the circuit substrate 10. For example, the metal layer 17 is formed on the entire area where the plurality of through holes h1 are formed and the plurality of heat conduction paths 11 are connected. In the case where the circuit substrate 10 has the metal layer 17, the thermal pad 5a of the integrated circuit device 5 is connected to the metal layer 17. In this case, the thermal pad 5a may be soldered to the metal layer 17. Instead of welding, a connecting member 31 as the above-described heat conductive sheet, heat conductive grease, or other member may be provided between the heat conductive pad 5a and the metal layer 17. The metal layer 17 is formed of, for example, the same material as the circuit pattern 15. This allows the metal layer 17 and the circuit pattern 15 (specifically, the circuit pattern 15 formed on the upper surface of the circuit substrate 10) to be formed by the same process during the manufacture of the circuit substrate 10.

Fig. 6 is a cross-sectional view showing a modification of the heat conduction path 11. In fig. 6, the same components as those in fig. 1 are denoted by the same reference numerals. In the example of the electronic apparatus 100 shown in fig. 6, the circuit substrate 10 has a through hole h 3. The width W3 of the through hole h3 is greater than the width W2 of the above-mentioned connection hole h 2. More specifically, the width W3 is even larger than the interval W4 between two solder balls 5 b. Width W3 is greater than half the size of thermal pad 5a of integrated circuit device 5. The width W3 may substantially fit the width of the thermal pad 5a of the integrated circuit device 5. The heat conduction path 111 is filled in the through hole h 3. That is, the heat conduction path 111 is formed over the entire area of the through hole h 3. The formation of the relatively large through hole h3 allows for more efficient heat conduction from the integrated circuit device 5 to the heat sink 21.

As described above, the integrated circuit device 5 may be a Sip having a plurality of IC chips (silicon wafers) sealed within a single package. Fig. 7 is a plan view showing an example of the circuit substrate 10 on which the integrated circuit device 5 as described above is mounted. In the figure, the region D indicates a region where the integrated circuit device 5 is disposed. The regions D1, D2, and D3 respectively indicate the positions of a plurality of IC chips of the integrated circuit device 5. Heat conduction paths 111A and 111B for connecting the integrated circuit device 5 and the heat sink 21 are formed in the circuit substrate 10. The positions of the heat conduction paths 111A and 111B correspond to the positions of the IC chips of the integrated circuit device 5. That is, the heat conduction paths 111A and 111B are located in the regions D1 and D2, respectively. This ensures effective cooling of the IC chip of the integrated circuit arrangement 5. The heat conduction paths 111A and 111B do not necessarily have the same shape. The shapes of the heat conduction paths 111A and 111B may be appropriately changed to match the positions of the respective IC chips and the circuit patterns 15 formed in the circuit substrate 10.

It should be noted that some IC chips of the integrated circuit device 5 may not be provided with a heat conduction path. For example, a thermal conduction path may not be provided for those IC chips that generate only a small amount of heat. In the example shown in fig. 7, no thermal conduction path is provided for the IC chip disposed in the region D3.

As described above, in the examples of the electronic apparatus 1 and the electronic apparatus 100, the heat sink 21 is provided on the lower surface of the circuit substrate 10. The circuit substrate 10 has through holes h1 and h3 penetrating the circuit substrate 10 in the region a where the integrated circuit device 5 is provided. The heat conduction paths 11, 111A, and 111B are provided in the through holes h1 and h 3. The heat conduction paths 11, 111A, and 111B connect the integrated circuit device 5 and the heat sink 21, thereby allowing heat conduction from the integrated circuit device 5 to the heat sink 21 via the heat conduction paths 11, 111A, and 111B. The heat conduction paths 11, 111A, and 111B include a material having a higher thermal conductivity than the base material 10a of the circuit substrate 10. These structures of the electronic apparatus 1 and the electronic apparatus 100 ensure a high degree of freedom in arranging other components of the electronic apparatus. In the case where another heat dissipating device is provided on the upper surface of the integrated circuit device 5, unlike the examples of the electronic apparatus 1 and the electronic apparatus 100, two heat dissipating devices are provided on the integrated circuit device 5, thereby contributing to improved cooling performance.

It should be noted that the present invention is not limited to the above-described embodiments, and may be modified in various ways.