阅读说明：本技术 功率转换装置 (Power conversion device ) 是由 清家康平 林亮兵 于 2017-04-21 设计创作，主要内容包括：具有：半导体模块,该半导体模块具有半导体开关元件；散热器,该散热器用于半导体模块的冷却；弹簧构件,该弹簧构件用于将半导体模块按压至散热器；壳体,该壳体收容半导体模块和弹簧构件；以及桥状结构,通过将壳体安装于散热器,该桥状结构通过弹簧构件将半导体模块按压至散热器。(Semiconductor module is included, which has thyristor；Radiator, the radiator are used for the cooling of semiconductor module；Spring member, the spring member are used to semiconductor module being pressed into radiator；Shell, the shell accommodate semiconductor module and spring member；And bridge-like structure, by the way that shell is installed on radiator, which is pressed into radiator for semiconductor module by spring member.)

1. a kind of power conversion device comprising:

Semiconductor module, the semiconductor module have thyristor；

Radiator, the radiator are used for the cooling of the semiconductor module；

Spring member, the spring member are used to the semiconductor module being pressed into the radiator；

Shell, the shell accommodate the semiconductor module and the spring member；And

Bridge-like structure, by the way that the shell is installed on the radiator, the bridge-like structure passes through the spring member for institute It states semiconductor module and is pressed into the radiator.

2. power conversion device as described in claim 1, which is characterized in that

The shell is configured at the semiconductor module installment surface of the radiator, and the shell when being installed on the radiator Body is fixed in a manner of screw threads for fastening from the face opposite with the semiconductor module installment surface of the radiator.

3. power conversion device as claimed in claim 2, which is characterized in that

The power conversion device also has the cover for covering the shell,

For the cover to be screwed to the threaded hole of the shell and is used to for the radiator being screwed to described The threaded hole of shell is shared.

4. power conversion device as described in claim 1, which is characterized in that

The power conversion device also has the cover for covering the shell,

The shell and the cover are anchored on the radiator together.

5. power conversion device as described in claim 1, which is characterized in that

The shell has the cover for covering the semiconductor module accommodated and the spring member.

6. power conversion device as described in claim 3 or 4, which is characterized in that

The power conversion device, which also has, to be arranged between the radiator and the shell and the shell and the lid Washer between portion.

7. such as power conversion device described in any one of claims 1 to 6, which is characterized in that

The bridge-like structure is provided with multiple according to the number for the semiconductor module for being pressed into the radiator.

8. the power conversion device as described in any one of claims 1 to 7, which is characterized in that

The bridge-like structure is integrally constituted with the shell.

9. the power conversion device as described in any one of claims 1 to 7, which is characterized in that

The bridge-like structure is configured to different components from the shell.

10. power conversion device as claimed in any one of claims 1-9 wherein, which is characterized in that

Shell is formed by aluminium alloy or kirsite.

11. power conversion device as claimed in any one of claims 1-9 wherein, which is characterized in that

Shell is formed by resin material.

Technical field

The present invention relates to a kind of power conversion devices including radiator structure.

Background technique

In existing power conversion device, using the semiconductor module with semiconductor element.Due to semiconductor module It can generate heat in switch, it is therefore preferable that being allowed to cool.As the cooling means of semiconductor module, for example, following sides can be enumerated Method: semiconductor module is installed on radiator, and semiconductor module is cooled down by radiator.

In existing power conversion device, semiconductor module is pressed into radiator by spring member.Thereby, it is possible to improve The close contact of semiconductor module and radiator, to improve thermal conductivity.That is, semiconductor module becomes prone to dissipate Heat.

In the prior art, spring member is configured on the semiconductor module for the upper surface for being configured at radiator, further Ground, configured with the reinforcing beam for reinforcement spring component on spring member.Hole is formed through in above-mentioned reinforcing beam.In addition, In the state that reinforcing beam is Chong Die with spring member, reinforcing beam is anchored on by heat sink side by screw, to make semiconductor Module and radiator are in close contact (for example, referring to patent document 1).

Summary of the invention

The technical problems to be solved by the invention

However, in the prior art, there are following technical problems.

In the above prior art, in order to which semiconductor module is pressed into radiator, spring member and reinforcing beam are needed.Therefore, Existing power conversion device has more components number.In addition, existing power conversion device due to components number become it is more, Thus exist and the technical problems such as limitation or assembling procedure increase are generated to the intracorporal structure of shell.

The present invention is in order to solve the above-mentioned technical problem to be formed, its object is to obtain a kind of power conversion device, The power conversion device includes the structure of the components number compared with the past that can reduce enclosure interior and assembling procedure.

Technical scheme applied to solve the technical problem

Power conversion device of the invention includes semiconductor module, which has thyristor；It dissipates Hot device, the radiator are used for the cooling of semiconductor module；Spring member, the spring member are scattered for semiconductor module to be pressed into Hot device；Shell, the shell accommodate semiconductor module and spring member；And bridge-like structure, by the way that shell is installed on radiator, Semiconductor module is pressed into radiator by spring member by the bridge-like structure.

Invention effect

According to the present invention, for the purpose of the cooling of the heat generating components such as semiconductor module, energized components, as in spring member Top install and fix the substitution of reinforcing beam, setting can press the structure of spring member by installing and fixing shell, To have the structure that semiconductor module can be fixed on to radiator by the installation of shell.As a result, can obtain A kind of power conversion device, the power conversion device include the components number and assembling compared with the past that can make enclosure interior The structure of process reduction.

Detailed description of the invention

Fig. 1 is the stereo unfolding figure of the power conversion device of embodiment of the present invention one.

Fig. 2 be include embodiment of the present invention one Fig. 1 structure power conversion device cross-sectional view.

Fig. 3 is the stereo unfolding figure of the power conversion device of embodiment of the present invention two.

Fig. 4 be include embodiment of the present invention two Fig. 3 structure power conversion device cross-sectional view.

Fig. 5 is the stereo unfolding figure of the power conversion device of embodiment of the present invention three.

Fig. 6 be include embodiment of the present invention three Fig. 5 structure power conversion device cross-sectional view.

Fig. 7 is the stereo unfolding figure of the power conversion device of embodiment of the present invention four.

Fig. 8 be include embodiment of the present invention four Fig. 7 structure power conversion device cross-sectional view.

Fig. 9 is the stereo unfolding figure of the power conversion device of embodiment of the present invention five.

Figure 10 be include embodiment of the present invention five Fig. 9 structure power conversion device cross-sectional view.

Figure 11 is the stereo unfolding figure of the power conversion device of embodiment of the present invention six.

Specific embodiment

Hereinafter, being illustrated using preferred embodiment of the attached drawing to power conversion device of the invention.In addition, of the invention It is not limited to the above embodiment.