阅读说明：本技术 半导体器件及其制作方法 (Semiconductor devices and preparation method thereof ) 是由 胡华 薛广杰 曹开玮 李赟 于 2019-09-29 设计创作，主要内容包括：本发明提供了一种半导体器件及其制作方法,位于衬底与金属互连结构之间的刻蚀阻挡层包含至少两层子刻蚀阻挡层,其中至少一层所述子刻蚀阻挡层对紫外光的消光系数大于氮化硅对紫外光的消光系数,由此减弱形成金属互连结构时刻蚀或沉积工艺中等离子体产生的紫外光的穿透效应,从而提高器件的可靠性。(The present invention provides a kind of semiconductor devices and preparation method thereof, etching barrier layer between substrate and metal interconnection structure includes at least two straton etching barrier layers, wherein at least one layer of sub- etching barrier layer is greater than silicon nitride to the extinction coefficient of ultraviolet light to the extinction coefficient of ultraviolet light, thus the penetration effect for weakening the ultraviolet light that etching or depositing operation plasma generate when forming metal interconnection structure, to improve the reliability of device.)

1. a kind of semiconductor devices characterized by comprising substrate, the etching barrier layer on substrate and be located at described Metal interconnection structure on etching barrier layer, wherein the etching barrier layer include at least two straton etching barrier layers, at least one The layer etching barrier layer is greater than silicon nitride to the extinction coefficient of ultraviolet light to the extinction coefficient of ultraviolet light.

2. semiconductor devices as described in claim 1, which is characterized in that the material packet of at least one layer of sub- etching barrier layer Containing silicon oxynitride.

3. semiconductor devices as described in claim 1, which is characterized in that the material packet of at least one layer of sub- etching barrier layer Containing silicon rich silicon oxide.

4. semiconductor devices as claimed in claim 2, which is characterized in that the etching barrier layer includes two straton etch stoppers Layer, the material of the first sub- etching barrier layer include silicon oxynitride, and the material of the second sub- etching barrier layer includes silicon nitride.

5. semiconductor devices as claimed in claim 4, which is characterized in that the first sub- etching barrier layer is close to the lining Bottom, the second sub- etching barrier layer is far from the substrate.

6. semiconductor devices as described in claim 1, which is characterized in that the semiconductor devices also includes: MOS transistor, Between the substrate and the etching barrier layer.

7. a kind of production method of semiconductor devices characterized by comprising

One substrate is provided；

Formed etching barrier layer over the substrate, the etching barrier layer include at least two straton etching barrier layers, at least one The layer etching barrier layer is greater than silicon nitride to the extinction coefficient of ultraviolet light to the extinction coefficient of ultraviolet light；

Form metal interconnection structure on the etching barrier layer.

8. the production method of semiconductor devices as claimed in claim 7, which is characterized in that at least one layer of sub- etch stopper The material of layer includes silicon oxynitride.

9. the production method of semiconductor devices as claimed in claim 7, which is characterized in that at least one layer of sub- etch stopper The material of layer includes silicon rich silicon oxide.

10. the production method of semiconductor devices as claimed in claim 8, which is characterized in that the etching barrier layer includes two The material of straton etching barrier layer, the first sub- etching barrier layer includes silicon oxynitride, and the material of the second sub- etching barrier layer includes Silicon nitride.

Technical field

The present invention relates to technical field of manufacturing semiconductors, and in particular to a kind of semiconductor devices and preparation method thereof.

Background technique

After semiconductor devices is formed, device is connected and is connect extracts by metal interconnection, adjacent metal layer or metal Line is separated with dielectric layer.Copper wiring is widely used at present, is made by Damascus technics, however it is wide in technical process General to use plasma processing, etching, deposition of dielectric layer of etching, through-hole including metal valley etc. inevitably introduce The problem of PID (plasma induced damage, plasma damage).

Especially after device feature size diminution, process integration is improved, and the grid oxygen damage introduced by plasma is got over It is more obvious, drastically influences the working performance and service life of device.

Therefore, in order to solve the above-mentioned technical problem, it is necessary to propose a kind of new semiconductor devices and preparation method thereof.

Summary of the invention

Based on problem described above, the purpose of the present invention is to provide a kind of semiconductor devices and preparation method thereof, subtract The penetration effect for the ultraviolet light that weak etching or depositing operation plasma generate, to improve the reliability of device.

To achieve the above object, the present invention provides a kind of semiconductor devices, comprising: substrate, the etching resistance on substrate Barrier and the metal interconnection structure on the etching barrier layer, wherein the etching barrier layer includes at least two stratons Etching barrier layer, at least one layer of sub- etching barrier layer are greater than delustring of the silicon nitride to ultraviolet light to the extinction coefficient of ultraviolet light Coefficient.

Optionally, in the semiconductor devices, the material of at least one layer of sub- etching barrier layer includes silicon oxynitride.

Optionally, in the semiconductor devices, the material of at least one layer of sub- etching barrier layer is aoxidized comprising Silicon-rich Silicon.

Optionally, in the semiconductor devices, the etching barrier layer includes two straton etching barrier layers, and the first son is carved The material for losing barrier layer includes silicon oxynitride, and the material of the second sub- etching barrier layer includes silicon nitride.

Optionally, in the semiconductor devices, the first sub- etching barrier layer is close to the substrate, second son Etching barrier layer is far from the substrate.

Optionally, in the semiconductor devices, the semiconductor devices also includes: MOS transistor, is located at the substrate Between the etching barrier layer.

Correspondingly, the present invention also provides a kind of production methods of semiconductor devices, comprising:

One substrate is provided；

Forming etching barrier layer over the substrate, the etching barrier layer includes at least two straton etching barrier layers, until Few one layer of sub- etching barrier layer is greater than silicon nitride to the extinction coefficient of ultraviolet light to the extinction coefficient of ultraviolet light；

Form metal interconnection structure on the etching barrier layer.

Optionally, in the production method of the semiconductor devices, the material packet of at least one layer of sub- etching barrier layer Containing silicon oxynitride.

Optionally, in the production method of the semiconductor devices, the material packet of at least one layer of sub- etching barrier layer Containing silicon rich silicon oxide.

Optionally, in the production method of the semiconductor devices, the etching barrier layer includes two straton etch stoppers Layer, the material of the first sub- etching barrier layer include silicon oxynitride, and the material of the second sub- etching barrier layer includes silicon nitride.

Compared with prior art, in semiconductor devices provided by the invention and preparation method thereof, it is located at substrate and metal is mutual Linking the etching barrier layer between structure includes at least two straton etching barrier layers, wherein at least one layer of sub- etching barrier layer pair The extinction coefficient of ultraviolet light is greater than silicon nitride to the extinction coefficient of ultraviolet light, thus weaken when forming metal interconnection structure etching or The penetration effect for the ultraviolet light that depositing operation plasma generates, to improve the reliability of device.

Detailed description of the invention

Fig. 1 is the structural schematic diagram of semiconductor device.

Fig. 2 is the flow chart of the production method of semiconductor devices provided by one embodiment of the invention.

Fig. 3 is the structural schematic diagram of semiconductor devices provided by one embodiment of the invention.

Specific embodiment

Fig. 1 is the structural schematic diagram of semiconductor device.It please refers to shown in Fig. 1, the semiconductor devices includes: substrate 10, the dielectric layer 11 of MOS transistor 12 and the encirclement MOS transistor 12 on the substrate 10.The MOS crystal Pipe 12 includes source electrode and drain electrode in the substrate 10, grid oxic horizon 12a on 10 surface of substrate and Grid on the grid oxic horizon 12a, projection of the grid on the substrate 10 be located at the source electrode with it is described Between drain electrode, positioned at the side wall of the grid oxic horizon 12a and the grid two sides.Through-hole is formed in the dielectric layer 12 To expose the grid and the source electrode or drain electrode, metal is filled in the through-hole and forms metal plug 13.

Etching stop layer 14 is formed on the dielectric layer 12, the material of the etching stop layer 14 preferably nitrogenizes Silicon is formed with metal interconnection structure on etching stop layer 14, in Fig. 1, dielectric layer 15 between illustrating only from level to level, described Patterned photoresist layer 16 is formed on interlayer dielectric layer 15.Later, it needs with patterned photoresist layer 16 for exposure mask pair The interlayer dielectric layer 15 is performed etching to form groove 17 in the interlayer dielectric layer 15, and the etching is that plasma is carved Erosion, as shown in figure 1 shown in arrow 18.

However, the high-energy photons 19 (ultraviolet light) that glow discharge generates can penetrate during plasma etching The etching stop layer 14 causes to damage to the grid oxic horizon 12a, and then influences the working performance of semiconductor devices and make Use the service life.

Based on the above issues, the present invention provides a kind of semiconductor devices, comprising: substrate, the etch stopper on substrate Layer and the metal interconnection structure on the etching barrier layer, wherein the etching barrier layer is carved comprising at least two stratons Barrier layer is lost, at least one layer of sub- etching barrier layer is greater than silicon nitride to the delustring system of ultraviolet light to the extinction coefficient of ultraviolet light Number.

Correspondingly, the present invention also provides a kind of production methods of semiconductor devices, comprising: provide a substrate；Form etching Over the substrate, the etching barrier layer includes at least two straton etching barrier layers on barrier layer, at least one layer of sub- etching Barrier layer is greater than silicon nitride to the extinction coefficient of ultraviolet light to the extinction coefficient of ultraviolet light；Metal interconnection structure is formed at the quarter It loses on barrier layer.

Quarter in semiconductor devices provided by the invention and preparation method thereof, between substrate and metal interconnection structure Losing barrier layer includes at least two straton etching barrier layers, delustring system of the wherein at least one layer of sub- etching barrier layer to ultraviolet light Number is greater than silicon nitrides to the extinction coefficient of ultraviolet light, thus weaken when forming metal interconnection structure etching or depositing operation it is medium from The penetration effect for the ultraviolet light that daughter generates, to improve the reliability of device.

To keep the contents of the present invention more clear and easy to understand, below in conjunction with Figure of description, the contents of the present invention are done into one Walk explanation.Certainly the invention is not limited to the specific embodiment, and general replacement well known to those skilled in the art is also contained Lid is within the scope of the present invention.

Obviously, the described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.Based on this hair Embodiment in bright, all other implementation obtained by those of ordinary skill in the art without making creative efforts Example, shall fall within the protection scope of the present invention.Secondly, the present invention has carried out detailed statement using schematic diagram, the present invention is being described in detail When example, for ease of description, schematic diagram is not partially enlarged in proportion to the general scale, should not be to this as restriction of the invention.

Fig. 3 is the structural schematic diagram of semiconductor devices provided by one embodiment of the invention.It please refers to described in Fig. 3, it is described Semiconductor devices includes: substrate 100, the etching barrier layer 140 on substrate 100 and be located at the etching barrier layer 140 On metal interconnection structure, wherein the etching barrier layer 140 include at least two straton etching barrier layers, at least one layer described in Sub- etching barrier layer is greater than silicon nitride to the extinction coefficient of ultraviolet light to the extinction coefficient of ultraviolet light.

Compared with being simply formed with the etching stop layer that one layer is made of silicon nitride in the prior art, in the present invention, etch-stop Only layer is stacked by the sub- etching stop layer of multilayer, extinction coefficient of the wherein at least one layer of sub- etching barrier layer to ultraviolet light Greater than silicon nitride to the extinction coefficient of ultraviolet light, thus weaken when forming metal interconnection structure plasma in etching or depositing operation The penetration effect for the ultraviolet light that body generates, to improve the reliability of device.

In an embodiment of the present invention, the material of at least one layer of sub- etching barrier layer includes silicon oxynitride (SiON), The silicon oxynitride is greater than silicon nitride to the extinction coefficient of ultraviolet light, to weaken wearing for ultraviolet light to the extinction coefficient of ultraviolet light Penetration effect.

In an alternative embodiment of the invention, the material of at least one layer of sub- etching barrier layer includes silicon rich silicon oxide (SRO, Silicon Rich Oxide), the silicon rich silicon oxide are greater than silicon nitride to ultraviolet light to the extinction coefficient of ultraviolet light Extinction coefficient, to weaken the penetration effect of ultraviolet light.

As a preferred embodiment, it please referring to shown in Fig. 3, the etching barrier layer 140 includes two straton etching barrier layers, the The material of one sub- etching barrier layer 141 includes silicon oxynitride, and the material of the second sub- etching barrier layer 142 includes silicon nitride.It is described First 141 layers of sub- etch stopper is close to the substrate, and the second sub- etching barrier layer 142 is far from the substrate.

The semiconductor devices further includes MOS transistor 120.The MOS transistor 120 includes: being located at the substrate 100 Surface simultaneously extends to the source electrode in the substrate 100 and drain electrode, the grid oxic horizon 120a on 100 surface of substrate with And the grid on the grid oxic horizon 120a, projection of the grid on the substrate 10 are located at the source electrode and institute It states between drain electrode, positioned at the side wall of the grid oxic horizon 120a and the grid two sides.The semiconductor devices further includes being situated between Matter layer 110, the dielectric layer 110 covers the MOS transistor 120, and is also formed with through-hole in the dielectric layer 110, institute It states through-hole and exposes the grid and the source electrode or the drain electrode, be filled with metal in the through-hole and form metal plug 130. Certainly, other semiconductor structures can also be formed on the substrate 100, be not limited in the MOS transistor 120.

It is formed with metal interconnection structure on the etching stop layer 140, in the present embodiment, is situated between illustrating only from level to level Matter layer 150 is formed with patterned photoresist layer 160 on the interlayer dielectric layer 150.It needs with the patterned photoetching Glue-line 160 is used as exposure mask, performs etching the interlayer dielectric layer 150 to form groove in the interlayer dielectric layer 150 170。

The etching using plasma etches (arrow 180 as shown in Figure 3), although in plasma etch process In, glow discharge can generate high-energy photons (ultraviolet light), but delustring of the first sub- etching barrier layer 141 to ultraviolet light Coefficient is greater than extinction coefficient of the silicon nitride to ultraviolet light, i.e., extinction coefficient of the described first sub- etching barrier layer 141 to ultraviolet light It is relatively high, the penetration effect of ultraviolet light can be weakened, thus prevent ultraviolet light from causing to damage to the grid oxic horizon 120a, with This improves the reliability of device.

Certainly, during being subsequently formed metal interconnection structure, the ultraviolet light of depositing operation plasma generation It can be weakened by the described first sub- etching barrier layer 141, to reduce the lower section grid oxic horizon 120a by ultraviolet light institute Caused by damage, improve the reliability of device.

It is understood that the embodiment of the present invention is the explanation carried out by taking MOS transistor as an example, the etching barrier layer 140 structure can improve the damage of the grid oxic horizon as caused by plasma.When being formed with other on the substrate 10 Semiconductor structure, etching barrier layer of the present invention can also prevent the loss of the semiconductor structure.

The present invention also provides a kind of production methods of semiconductor devices, are used to form above-mentioned semiconductor devices.The present invention The semiconductor devices is not limited to production method production.Fig. 2 is semiconductor device provided by one embodiment of the invention The flow chart of the production method of part.The production method of semiconductor devices in the present embodiment is carried out below in conjunction with attached drawing 2 and attached drawing 3 It is described in detail.

In the step s 100, a substrate 100 is provided.The material of first substrate 100 can be monocrystalline silicon (Si), monocrystalline Germanium (Ge), SiGe (GeSi) or silicon carbide (SiC), are also possible to silicon-on-insulator (SOI), germanium on insulator (GOI)；Or also It can be the III-V compound such as other materials, such as GaAs.In the present embodiment, the material of the substrate 100 is preferred For monocrystalline silicon (Si).Various semiconductor structures can also be formed on the substrate 100, the embodiment of the present invention is with MOS transistor For be illustrated, but be not limited to MOS transistor.

It please refers to shown in Fig. 3, the MOS transistor 120 includes: positioned at 10 surface of substrate and extending to the substrate Source electrode and drain electrode in 10, grid oxic horizon 120a on 10 surface of substrate and are located at the grid oxic horizon Grid on 120a, projection of the grid on the substrate 10 are located at described between the source electrode and the drain electrode The side wall of grid oxic horizon 120a and the grid two sides.The semiconductor devices further includes dielectric layer 110, the dielectric layer The 110 covering MOS transistors 120, and through-hole is also formed in the dielectric layer 110, the through-hole exposes the grid Pole and the source electrode or the drain electrode, the through-hole is interior to form metal plug 130 filled with metal.

In step s 200, etching barrier layer 140 is formed on the substrate 100, and the etching barrier layer 140 includes extremely Few two straton etching barrier layers, at least one layer of sub- etching barrier layer are greater than silicon nitride to ultraviolet to the extinction coefficient of ultraviolet light The extinction coefficient of light.

In an embodiment of the present invention, the material of at least one layer of sub- etching barrier layer includes silicon oxynitride, the nitrogen Silica is greater than silicon nitride to the extinction coefficient of ultraviolet light to the extinction coefficient of ultraviolet light, so that weakens ultraviolet light penetrates effect It answers.

In an alternative embodiment of the invention, the material of at least one layer of sub- etching barrier layer includes silicon rich silicon oxide, institute It states silicon rich silicon oxide and silicon nitride is greater than to the extinction coefficient of ultraviolet light, to weaken wearing for ultraviolet light to the extinction coefficient of ultraviolet light Penetration effect.

As a preferred embodiment, it please referring to shown in Fig. 3, the etching barrier layer 140 includes two straton etching barrier layers, the The material of one sub- etching barrier layer 141 includes silicon oxynitride, and the material of the second sub- etching barrier layer 142 includes silicon nitride.It is described First 141 layers of sub- etch stopper is close to the substrate, and the second sub- etching barrier layer 142 is far from the substrate.

In step S300, metal interconnection structure is formed on the etching barrier layer 140.In the embodiment of the present invention, only Show from level to level between dielectric layer 150.Patterned photoresist layer 160 is formed on the interlayer dielectric layer 150.Need with The patterned photoresist layer 160 is used as exposure mask, performs etching the interlayer dielectric layer 150 to form groove 170.

The etching using plasma etches (arrow 180 as shown in Figure 3), although in plasma etch process In, glow discharge can generate high-energy photons (ultraviolet light), but delustring of the first sub- etching barrier layer 141 to ultraviolet light Coefficient is greater than extinction coefficient of the silicon nitride to ultraviolet light, i.e., extinction coefficient of the described first sub- etching barrier layer 141 to ultraviolet light It is relatively high, the penetration effect of ultraviolet light can be weakened, thus prevent ultraviolet light from causing to damage to the grid oxic horizon 120a, with This improves the reliability of device.

In conclusion being located at substrate and metal interconnection structure in semiconductor devices provided by the invention and preparation method thereof Between etching barrier layer include at least two straton etching barrier layers, wherein at least one layer of sub- etching barrier layer is to ultraviolet light Extinction coefficient be greater than silicon nitride to the extinction coefficient of ultraviolet light, thus weaken etching when forming metal interconnection structure or deposition work The penetration effect for the ultraviolet light that skill plasma generates, to improve the reliability of device.

Foregoing description is only the description to present pre-ferred embodiments, not to any restriction of the scope of the invention, this hair Any change, the modification that the those of ordinary skill in bright field does according to the disclosure above content, belong to the protection of claims Range.