阅读说明：本技术 一种真空镀膜制作氧氮高铝钛薄膜用于微钻孔刀具的应用 (application of oxygen-nitrogen-high-aluminum-titanium film prepared by vacuum coating for micro-drilling cutter ) 是由 曾浩恩 谭天明 于 2019-09-27 设计创作，主要内容包括：本发明涉及一种真空镀膜制作氧氮高铝钛薄膜用于微钻孔刀具的应用,制程可分为以下几个步骤：1)工件脱脂清洁；2)固定与镀件夹具；3)抽真空；4)偏压等离子体清洁；5)离子源等离子体清洁；6)TiAl；7)TiAlN提供高硬度基地；8)TiAlON层,提供润滑性薄膜,使用复合式磁控溅射制作高硬度及低摩擦系数的微钻,使用TiAlON,可以使用较易取得的设备,本发明设计合理,可大规模推广。(The invention relates to an application of an oxygen-nitrogen-high-aluminum-titanium film prepared by vacuum coating for a micro-drilling cutter, and the preparation process comprises the following steps: 1) degreasing and cleaning the workpiece; 2) fixing and plating a piece clamp; 3) vacuumizing; 4) bias plasma cleaning; 5) ion source plasma cleaning; 6) TiAl; 7) TiAlN provides a high hardness base; 8) the TiAlON layer provides a lubricating film, the composite magnetron sputtering is used for manufacturing the micro drill with high hardness and low friction coefficient, the TiAlON is used, and the equipment which is easy to obtain can be used.)

1. The application of the oxygen-nitrogen-high-aluminum-titanium film prepared by vacuum coating for micro-drilling cutters is characterized by comprising the following steps of:

degreasing and cleaning the workpiece;

Fixing and plating a piece clamp;

vacuumizing;

bias plasma cleaning;

ion source plasma cleaning;

TiAl；

TiAlN provides a high hardness base;

TiAlON layer to provide a lubricating film.

2. The application of the oxygen-nitrogen-high-aluminum-titanium film prepared by vacuum coating for the micro-drilling tool as claimed in claim 1 is characterized by comprising the following steps: putting a workpiece into a film coating chamber for vacuumizing, starting a workpiece rotating frame to rotate, starting to heat to a proper temperature after vacuumizing to 3.0 Pa, starting a process when the vacuum degree is 6x10-3 Pa, adding argon gas to 2 Pa, sequentially adjusting voltage and voltage to generate plasma for cleaning the surface of the workpiece for 10-15 minutes, then reducing the argon gas to 3x10-1 Pa, starting a Hall ion source, carrying out second-stage plasma cleaning for 10-15 minutes, starting an arc evaporation source, starting the bias voltage of a plated part, introducing Ar gas to a 1.5 x10-1 Pa plated Ti layer, and introducing N2 gas to plate a TiAlN layer on the second layer.

3. the application of the oxygen-nitrogen-high-aluminum-titanium film prepared by vacuum coating as claimed in claim 2 for micro-drilling tools is characterized in that the appropriate temperature is 350-400 ℃.

4. the application of the oxygen-nitrogen-high-aluminum-titanium film prepared by vacuum coating as claimed in claim 2 for micro-drilling tools, wherein the voltage is sequentially adjusted to 400-800V.

Technical Field

The invention relates to the technical field of coating, in particular to application of an oxygen-nitrogen-high-aluminum-titanium film prepared by vacuum coating to a micro-drilling cutter.

Background

The general tool coating film, such as TiN (TiN plating) and TIAlN (titanium aluminum nitride), has high hardness, is widely used for tool coating drill bits, but has high friction coefficient, is not suitable for micro-drilling, and most people use diamond-like coating, although the method is effective, the process time is long, the cost is high, the output is slow, and the equipment requirement is high.

Disclosure of Invention

In view of the current situation of the prior art, the technical problem to be solved by the present invention is to provide an application of an oxygen-nitrogen-high-aluminum-titanium thin film prepared by vacuum coating for micro-drilling tools.

the technical scheme adopted by the invention for solving the technical problems is as follows: an application of oxygen-nitrogen-high-aluminum-titanium film prepared by vacuum coating for micro-drilling cutter, the process can be divided into the following steps:

1) degreasing and cleaning the workpiece;

2) fixing and plating a piece clamp;

3) Vacuumizing;

4) bias plasma cleaning;

5) Ion source plasma cleaning;

6）TiAl；

7) TiAlN provides a high hardness base;

8) TiAlON layer to provide a lubricating film.

Putting the workpiece into a film coating chamber for vacuumizing, starting a workpiece rotating frame to rotate, starting heating to a proper temperature (350-. Adding argon gas to 2 Pa, sequentially adjusting voltage 400-800V to generate plasma for cleaning the surface of the workpiece for 10-15 minutes, then reducing the argon gas branch to 3x10-1 Pa, opening a Hall ion source, performing second-stage plasma cleaning for 10-15 minutes, starting an arc evaporation source, starting the bias voltage of a plated part, introducing Ar gas to a 1.5 x10-1 Pa Ti-plated layer, introducing N2 gas to the second layer to plate a TiAlN layer, then performing fractional muscle oxygen increasing proportion to plate TiAlN in a plurality of layers, and taking larger values for the current and the bias voltage of the previous layers of evaporation sources to ensure the binding force of a plating layer; the two parameters of the later layers take smaller values to ensure that the internal stress is reduced and the film layer is prevented from collapsing.

compared with the prior art, the invention has the advantages that: the invention uses the composite magnetron sputtering to manufacture the micro drill with high hardness and low friction coefficient, uses TiAlON, can use equipment which is easy to obtain, has reasonable design and can be popularized in a large scale.

drawings

FIG. 1 is a schematic view of an experimental facility for applying an oxygen-nitrogen-high-aluminum-titanium film for a micro-drilling tool according to the present invention;

FIG. 2 is a schematic diagram of a second experimental facility for applying the oxygen-nitrogen-high-aluminum-titanium thin film prepared by vacuum coating to a micro-drilling tool.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings.

the experimental set-up used in the present invention is shown in FIG. 1. Wherein, 1 is a vacuum plating chamber; 2 is a columnar magnetron sputtering target component; 3 is an air exhaust pipeline; 4 is a cathode arc evaporation source; 5 is a heater; 6 is a work rotating frame; 7 is a hanging tool; 8 is an N2 inflation system; and 9 is a biasing device.

example one, made with cathodic arc:

1. putting a workpiece into a coating chamber for vacuumizing, starting a workpiece rotating frame to rotate, starting heating to a proper temperature (350-;

2. Adding argon to 2 Pa, sequentially adjusting the voltage to 400-800V to generate plasma for cleaning the surface of the workpiece for 10-15 minutes, and then reducing the argon branch by 3x10-1 Pa;

3. A Hall ion source for performing a second stage plasma cleaning for 10-15 minutes;

4. Starting the bias voltage of 400-500V, using the starting arc evaporation source as the bottom layer, and introducing Ar gas to 1.5X 10-1Pa to plate the TiAl layer;

5. a second layer is provided with a TiAlN layer through N2 gas plating;

6. Then adding oxygen for plating TiAlON in a plurality of layers in proportion, wherein the current and bias voltage of the first plurality of layers of evaporation sources take larger values so as to ensure the binding force of the plating layer; the two parameters of the later layers take smaller values to ensure that the internal stress is reduced and the film layer is prevented from collapsing.

example two, made with HIPIMS sputtering:

1. putting a workpiece into a coating chamber for vacuumizing, starting a workpiece rotating frame to rotate, starting heating to a proper temperature (350-;

2. argon gas is added to 2 Pa, the voltage is sequentially adjusted to 400-800V to generate plasma for cleaning the surface of the workpiece for 10-15 minutes. Then reducing the argon branch by 3x10-1 Pa;

3. a Hall ion source for performing a second stage plasma cleaning for 10-15 minutes;

4. Starting a bias voltage of 400-500V, introducing Ar gas to 1.5 multiplied by 10 < -1 > Pa, starting a HIPIMS sputtering power supply to plate a TiAl layer on the bottom layer;

5. The second layer is provided with a TiAlN layer plated by N2 gas, and the bias voltage is gradually reduced to 100-150V;

6. Then, oxygen is added, a TiAlON layer is plated, and the current and bias voltage of the first few layers of evaporation sources take larger values so as to ensure the binding force of the plating layer; the two parameters of the later layers take smaller values to ensure that the internal stress is reduced and the film layer is prevented from collapsing.

compared with the prior art, the invention has the advantages that: the invention uses the composite magnetron sputtering to manufacture the micro drill with high hardness and low friction coefficient, uses TiAlON, can use equipment which is easy to obtain, has reasonable design and can be popularized in a large scale.