阅读说明：本技术 封装结构、电子设备及其制备方法 (Packaging structure, electronic equipment and preparation method thereof ) 是由 罗立德 郭健炜 胡骁 张弛 于 2019-03-29 设计创作，主要内容包括：本申请实施例提供一种封装结构,包括封装基板和芯片,所述封装基板包括相对设置的封装面和底面,所述芯片设置于所述封装面上,所述底面上设置有N个焊盘,至少两个相邻且电气属性相同的所述焊盘之间通过导电片连接,以形成加强焊盘。上述封装结构与电路板组装时,与所述加强焊盘相对应的焊球受热变形彼此连接形成覆盖所述加强焊盘的大体积焊球,大体积焊球具有较好的疲劳强度,在所述封装结构和电路板组装后在进行温度循环测试或者使用过程中,大体积焊球能均匀地分散其所承受的应力,不易产生疲劳裂纹而断裂,有效提高了所述封装结构和电路板组装后的板级可靠性。本申请实施例还提供一种电子设备及其制备方法。(The embodiment of the application provides a packaging structure, including packaging substrate and chip, packaging substrate is including relative packaging face and the bottom surface that sets up, the chip set up in on the packaging face, be provided with a N pad on the bottom surface, at least two adjacent and electrical property is the same connect through the conducting strip between the pad to form the enhancement pad. When the packaging structure is assembled with the circuit board, the solder balls corresponding to the reinforcing welding pads are mutually connected through thermal deformation to form large-volume solder balls covering the reinforcing welding pads, the large-volume solder balls have better fatigue strength, and can uniformly disperse the stress borne by the large-volume solder balls in the temperature cycle test or use process after the packaging structure and the circuit board are assembled, so that fatigue cracks are not easy to generate and break, and the board-level reliability of the assembled packaging structure and the assembled circuit board is effectively improved. The embodiment of the application also provides electronic equipment and a preparation method thereof.)