阅读说明：本技术 电容器、电容结构、电容器的制作方法 (Capacitor, capacitor structure and manufacturing method of capacitor ) 是由 陆斌 沈健 于 2020-03-31 设计创作，主要内容包括：一种电容器、电容结构、电容器的制作方法,能够制备小体积、高容值密度的电容器。该电容器包括：叠层结构(120),包括至少一层电介质层(23)和多层导电层(21/22),至少一层电介质层(23)和多层导电层(21/22)形成导电层与电介质层彼此交替的结构；至少一个第一外接电极(130)和至少一个第二外接电极(140),位于叠层结构(120)的上方；至少一个第三外接电极(150)和至少一个第四外接电极(160),位于叠层结构(120)的下方；第一外接电极(130)和第三外接电极(150)电连接至多层导电层中的部分或者全部奇数层导电层,第二外接电极(140)和第四外接电极(160)电连接至多层导电层中的部分或者全部偶数层导电层。(A capacitor, a capacitor structure and a manufacturing method of the capacitor can be used for manufacturing the capacitor with small volume and high capacitance value density. The capacitor includes: a stacked structure (120) comprising at least one dielectric layer (23) and a plurality of conductive layers (21/22), the at least one dielectric layer (23) and the plurality of conductive layers (21/22) forming a structure in which conductive layers alternate with dielectric layers; at least one first external electrode (130) and at least one second external electrode (140) located above the stacked structure (120); at least one third external electrode (150) and at least one fourth external electrode (160) located below the stacked structure (120); the first external electrode (130) and the third external electrode (150) are electrically connected to some or all of the odd-numbered conductive layers among the plurality of conductive layers, and the second external electrode (140) and the fourth external electrode (160) are electrically connected to some or all of the even-numbered conductive layers among the plurality of conductive layers.)

A capacitor, comprising:

a stacked structure including at least one dielectric layer and a plurality of conductive layers forming a structure in which the conductive layers and the dielectric layers alternate with each other;

at least one first external electrode and at least one second external electrode, wherein the first external electrode and the second external electrode are positioned above the stacked structure, the first external electrode is electrically connected to some or all odd-numbered conductive layers of the plurality of conductive layers, and the second external electrode is electrically connected to some or all even-numbered conductive layers of the plurality of conductive layers;

at least one third external electrode and at least one fourth external electrode, wherein the third external electrode and the fourth external electrode are positioned below the stacked structure, the third external electrode is electrically connected to some or all odd-numbered conductive layers of the plurality of conductive layers, and the fourth external electrode is electrically connected to some or all even-numbered conductive layers of the plurality of conductive layers.

The capacitor of claim 1, further comprising:

a multi-wing structure, the laminated structure encasing the multi-wing structure.

The capacitor of claim 2, wherein the multi-wing structure comprises a plurality of sets of wing structures and a plurality of support structures, wherein each wing structure in each set of wing structures is disposed in parallel, the support structures are hollow structures, the wing structures are convex structures formed by extending outer sidewalls of the support structures along a first direction, and the first direction is a direction perpendicular to the sidewalls of the support structures.

The capacitor of claim 3, wherein some or all of the plurality of conductive layers conform to the multi-wing structure.

The capacitor of claim 3, wherein a portion of the plurality of conductive layers is conformal with the multi-wing structure and another portion of the plurality of conductive layers is complementary in shape to the multi-wing structure.

The capacitor of any one of claims 3-5, wherein a single wing structure of the plurality of sets of wing structures comprises a plurality of wings extending along the first direction.

A capacitor according to any one of claims 3 to 6, wherein a support structure of the plurality of support structures is provided with at least one axis in its hollow region, the axis being parallel to a side wall of the support structure.

The capacitor according to any one of claims 3 to 7, further comprising:

the isolating ring is positioned above the outer sides of the supporting structures and used for separating the laminated structure into an inner part and an outer part, the first external electrode and the second external electrode are only electrically connected with the part of the inner side of the isolating ring, and the third external electrode and the fourth external electrode are only electrically connected with the part of the inner side of the isolating ring.

The capacitor of claim 8, further comprising:

at least one first conductive via structure and at least one second conductive via structure, wherein,

the first conductive via structure is located in the isolation ring, and the second conductive via structure is located in a region outside the isolation ring and close to the center of the capacitor; or the first conductive through hole structure and/or the second conductive through hole structure are/is positioned in a region close to the center of the capacitor outside the isolating ring;

the first external electrode is electrically connected to some or all of the odd-numbered conductive layers of the plurality of conductive layers through the at least one first conductive via structure, and the second external electrode is electrically connected to some or all of the even-numbered conductive layers of the plurality of conductive layers through the at least one second conductive via structure.

The capacitor according to any one of claims 3 to 9, further comprising: a ring structure located outboard of the plurality of support structures and the plurality of sets of wing structures.

The capacitor of claim 10 wherein said ring-like structure is formed by alternating stacks of layers of a first material and layers of a second material.

The capacitor of claim 11, wherein the plurality of wing structures and the plurality of support structures are formed from the first material.

A capacitor according to any one of claims 3 to 12, wherein the multi-winged structure is made of an electrically conductive material and the second external electrode is electrically connected to the multi-winged structure.

A capacitor according to any one of claims 3 to 12, wherein the multi-winged structure comprises a host material and a conductive layer or region on the surface of the host material, and the second external electrode is electrically connected to the multi-winged structure by being electrically connected to the host material and the conductive layer or region on the surface of the host material.

The capacitor according to any one of claims 3 to 14, further comprising: and the filling structure coats the laminated structure and fills a gap formed by the laminated structure.

The capacitor according to any one of claims 3 to 15, further comprising: and the substrate is arranged below the multi-wing structure.

The capacitor of claim 16, wherein the fin structures of the plurality of sets of fin structures in contact with the substrate have regions of discontinuity between different support structures.

The capacitor of claim 17 wherein said substrate forms a substrate trench at said discontinuous region, said stacked structure further disposed within said substrate trench.

The capacitor of any one of claims 16 to 18, wherein the support structure extends through the substrate such that a lower surface of the substrate exposes the laminate structure.

The capacitor according to claim 19, wherein the third external electrode and/or the fourth external electrode is electrically connected to a region of the multilayer conductive layer in the support structure.

The capacitor according to any one of claims 16 to 20, wherein the substrate is made of a conductive material, and the third external electrode is electrically connected to a conductive layer of the plurality of conductive layers in contact with the substrate through the substrate.

The capacitor according to any one of claims 2 to 21, wherein the first external electrode and/or the second external electrode are electrically connected to conductive layers of the plurality of conductive layers through a first interconnect structure located over the multi-wing structure.

The capacitor of claim 22, wherein the first interconnect structure comprises at least one first insulating layer, at least one first conductive via structure, and at least one second conductive via structure, wherein the at least one first insulating layer is located over the multi-wing structure, wherein the first and second conductive via structures extend through the at least one first insulating layer, wherein the first external electrode is electrically connected to some or all of the odd-numbered conductive layers of the plurality of conductive layers through the at least one first conductive via structure, and wherein the second external electrode is electrically connected to some or all of the even-numbered conductive layers of the plurality of conductive layers through the at least one second conductive via structure.

The capacitor according to any one of claims 2 to 23, wherein the third external electrode and/or the fourth external electrode are electrically connected to conductive layers of the plurality of conductive layers through a second interconnect structure located under the multi-wing structure.

The capacitor of claim 24, wherein said second interconnect structure comprises at least one second insulating layer, at least one third conductive via structure, and at least one fourth conductive via structure, wherein said at least one second insulating layer is located below said multi-fin structure, wherein said third and fourth conductive via structures extend through said at least one second insulating layer, wherein said third external electrode is electrically connected to some or all of said odd-numbered conductive layers of said plurality of conductive layers through said at least one third conductive via structure, and wherein said fourth external electrode is electrically connected to some or all of said even-numbered conductive layers of said plurality of conductive layers through said at least one fourth conductive via structure.

The capacitor of any one of claims 1 to 25, further comprising: the first electrode layer is arranged above the laminated structure and comprises at least one first conductive area and at least one second conductive area which are separated from each other, the first conductive area forms the first external electrode, and the second conductive area forms the second external electrode.

The capacitor of any one of claims 1 to 26, further comprising: the second electrode layer is arranged below the laminated structure and comprises at least one third conductive area and at least one fourth conductive area which are separated from each other, the third conductive area forms the third external electrode, and the fourth conductive area forms the fourth external electrode.

The capacitor of any one of claims 1 to 27, wherein a conductive layer of the plurality of conductive layers comprises at least one of:

the high-temperature-resistant conductive coating comprises a heavily-doped polycrystalline silicon layer, a metal silicide layer, a carbon layer, a conductive polymer layer, an aluminum layer, a copper layer, a nickel layer, a tantalum nitride layer, a titanium nitride layer, an aluminum titanium nitride layer, a tantalum silicon nitride layer and a tantalum carbon nitride layer.

The capacitor of any one of claims 1 to 28, wherein a dielectric layer of the at least one dielectric layer comprises at least one of:

a silicon oxide layer, a silicon nitride layer, a silicon oxynitride layer, a metal oxide layer, a metal nitride layer, and a metal oxynitride layer.

A capacitive structure, comprising: a first capacitor and a second capacitor, wherein the first capacitor and the second capacitor are the capacitor as claimed in any one of claims 1 to 29, the second capacitor is located above the first capacitor, and the first external electrode of the first capacitor is electrically connected to the third external electrode of the second capacitor, and the second external electrode of the first capacitor is electrically connected to the fourth external electrode of the second capacitor.

The capacitive structure of claim 30 further comprising: a third capacitor according to any one of claims 1 to 29, the third capacitor being located below the first capacitor, and a third external electrode of the first capacitor being electrically connected to a first external electrode of the third capacitor, and a fourth external electrode of the first capacitor being electrically connected to a second external electrode of the third capacitor.

A method for manufacturing a capacitor, comprising:

preparing a stacked structure over a substrate, the stacked structure including at least one dielectric layer and a plurality of conductive layers forming a structure in which the conductive layers alternate with the dielectric layers;

preparing at least one first external electrode and at least one second external electrode, wherein the first external electrode and the second external electrode are positioned above the laminated structure, the first external electrode is electrically connected to part or all of the odd-numbered conductive layers in the multi-layered conductive layers, and the second external electrode is electrically connected to part or all of the even-numbered conductive layers in the multi-layered conductive layers;

preparing at least one third external electrode and at least one fourth external electrode, wherein the third external electrode and the fourth external electrode are positioned below the laminated structure, the third external electrode is electrically connected to part or all of the odd-numbered conductive layers in the plurality of conductive layers, and the fourth external electrode is electrically connected to part or all of the even-numbered conductive layers in the plurality of conductive layers.

The method of claim 32, further comprising:

and preparing a multi-wing structure above the substrate, wherein the laminated structure coats the multi-wing structure.

The method according to claim 33, wherein the multi-wing structure comprises a plurality of sets of wing structures and a plurality of support structures, wherein each wing structure in each set of wing structures is disposed in parallel, the support structures are hollow structures, the wing structures are convex structures formed by extending outer sidewalls of the support structures along a first direction, and the first direction is a direction perpendicular to the sidewalls of the support structures.

The method of claim 34, wherein said fabricating a multi-fin structure over said substrate comprises:

preparing a multilayer structure over the substrate, the multilayer structure comprising a plurality of layers of a first material and a plurality of layers of a second material, the plurality of layers of the first material and the plurality of layers of the second material forming a structure in which layers of the first material alternate with layers of the second material, the first material being different from the second material, and the layer of the first material being in direct contact with the substrate;

preparing a plurality of trenches on the basis of the multilayer structure, the trenches extending in a direction perpendicular to the substrate and into the substrate;

depositing the first material on the upper surface of the multilayer structure, the bottoms and the inner side walls of the plurality of grooves to form a plurality of hollow columnar first structures made of the first material as a basis for forming the plurality of support structures;

preparing a plurality of second structures in a groove shape in the remaining multilayer structure, the second structures extending to the upper surface of the substrate along a direction perpendicular to the substrate;

removing the exposed second material layer in the plurality of second structures;

and thinning the substrate to form the multi-wing structure.

The method of claim 34 or 35, wherein some or all of the plurality of conductive layers conform to the multi-wing structure.

A method according to claim 34 or 35, wherein a portion of the plurality of conductive layers conforms to the multi-wing structure and another portion of the plurality of conductive layers is complementary in shape to the multi-wing structure.

The method according to any one of claims 34 to 37, wherein a single wing structure of the plurality of sets of wing structures includes a plurality of wings extending along the first direction.

The method of any one of claims 34 to 38, wherein a support structure of the plurality of support structures is provided with at least one axis in its hollow region, the axis being parallel to a side wall of the support structure.

The method of any one of claims 34 to 39, further comprising:

preparing an isolating ring, wherein the isolating ring is positioned above the outer sides of the supporting structures, the isolating ring is used for separating the laminated structure into an inner part and an outer part, the first external electrode and the second external electrode are only electrically connected with the part of the inner side of the isolating ring, and the third external electrode and the fourth external electrode are only electrically connected with the part of the inner side of the isolating ring.

The method of claim 40, further comprising:

preparing at least one first conductive via structure and at least one second conductive via structure, wherein,

the first conductive via structure is located in the isolation ring, and the second conductive via structure is located in a region outside the isolation ring and close to the center of the capacitor; or the first conductive through hole structure and/or the second conductive through hole structure are/is positioned in a region close to the center of the capacitor outside the isolating ring;

the first external electrode is electrically connected to some or all of the odd-numbered conductive layers of the plurality of conductive layers through the at least one first conductive via structure, and the second external electrode is electrically connected to some or all of the even-numbered conductive layers of the plurality of conductive layers through the at least one second conductive via structure.

The method of any one of claims 34 to 41, wherein the capacitor further comprises: a ring structure located outside of the plurality of support structures and the plurality of sets of wing structures.

The method of claim 42, wherein the ring-like structure is formed by alternately stacking a plurality of layers of the first material and a plurality of layers of the second material.

The method according to claim 43, wherein the plurality of sets of wing structures and the plurality of support structures are formed from the first material.

The method of any one of claims 34 to 44, wherein the multi-winged structure is made of an electrically conductive material and the second external electrode is electrically connected to the multi-winged structure.

The method of any one of claims 34 to 44, wherein the multi-winged structure comprises a body material and a conductive layer or region of the surface of the body material, and the second external electrode is electrically connected to the multi-winged structure by being electrically connected to the body material and the conductive layer or region of the surface of the body material.

The method of any one of claims 34 to 46, further comprising:

and preparing a filling structure, wherein the filling structure coats the laminated structure and fills a gap formed by the laminated structure.

A method according to any one of claims 34 to 47, wherein the wing structures of the plurality of sets of wing structures in contact with the substrate present a discontinuous region between different support structures.

The method of claim 48, wherein the substrate forms a substrate trench at the discontinuous region, the stacked structure further disposed within the substrate trench.

The method of any one of claims 34 to 49, wherein the support structure extends through the substrate such that a lower surface of the substrate is exposed from the laminate structure.

The method of claim 50, wherein the third external electrode and/or the fourth external electrode is electrically connected to a region of the multilayer conductive layer in the support structure.

The method of any one of claims 34 to 51, wherein the substrate is made of a conductive material, and the third external electrode is electrically connected to a conductive layer of the plurality of conductive layers in contact with the substrate through the substrate.

The method of any one of claims 33 to 52, further comprising:

preparing a first interconnection structure, wherein the first interconnection structure is positioned above the multi-wing structure, and the first external electrode and/or the second external electrode are/is electrically connected to the conductive layers in the multi-layer conductive layers through the first interconnection structure.

The method of claim 53, wherein the first interconnect structure comprises at least one first insulating layer, at least one first conductive via structure, and at least one second conductive via structure, wherein the at least one first insulating layer is located above the multi-wing structure, wherein the first and second conductive via structures extend through the at least one first insulating layer, wherein the first external electrode is electrically connected to some or all of the odd-numbered conductive layers of the plurality of conductive layers through the at least one first conductive via structure, and wherein the second external electrode is electrically connected to some or all of the even-numbered conductive layers of the plurality of conductive layers through the at least one second conductive via structure.

The method of any one of claims 33 to 54, further comprising:

preparing a second interconnection structure, wherein the second interconnection structure is positioned below the multi-wing structure, and the third external electrode and/or the fourth external electrode are electrically connected to the conductive layers in the multiple conductive layers through the second interconnection structure.

The method of claim 55, wherein the second interconnect structure comprises at least one second insulating layer, at least one third conductive via structure, and at least one fourth conductive via structure, wherein the at least one second insulating layer is located under the multi-wing structure, wherein the third and fourth conductive via structures extend through the at least one second insulating layer, wherein the third external electrode is electrically connected to some or all of the odd-numbered conductive layers of the multi-layered conductive layers through the at least one third conductive via structure, and wherein the fourth external electrode is electrically connected to some or all of the even-numbered conductive layers of the multi-layered conductive layers through the at least one fourth conductive via structure.

The method of any one of claims 32 to 56, wherein the preparing at least one first external electrode and at least one second external electrode comprises:

preparing a first electrode layer over the stacked structure, the first electrode layer including at least one first conductive region and at least one second conductive region separated from each other, the first conductive region forming the first external electrode, the second conductive region forming the second external electrode.

The method of any one of claims 32 to 57, wherein the preparing at least one third external electrode and at least one fourth external electrode comprises:

preparing a second electrode layer under the multi-wing structure, wherein the second electrode layer comprises at least one third conductive region and at least one fourth conductive region which are separated from each other, the third conductive region forms the third external electrode, and the fourth conductive region forms the fourth external electrode.