阅读说明：本技术 一种高导热的ic散热结构 (IC heat radiation structure with high heat conductivity ) 是由 邝旭东 于 2021-07-07 设计创作，主要内容包括：本发明公开了一种高导热的IC散热结构,包括底座、IC芯片、连接框、安装机构、冷却箱、风冷机构、循环机构、导热座,所述底座的内部固定连接有IC芯片,所述底座的内部接触有连接框,所述连接框的内部固定连接有冷却箱,所述冷却箱的内部固定连接有导热座,所述底座的内部设置有安装机构,所述冷却箱的内部设置有风冷机构,所述冷却箱上设置有循环机构,所述连接框与所述IC芯片接触,所述导热座与IC芯片接触,所述冷却箱与IC芯片接触。本发明涉及一种高导热的IC散热结构,具有良好的散热效果与散热结构便于拆卸的特点。(The invention discloses a high-heat-conductivity IC heat dissipation structure which comprises a base, an IC chip, a connecting frame, an installation mechanism, a cooling box, an air cooling mechanism, a circulating mechanism and a heat conduction seat, wherein the IC chip is fixedly connected inside the base, the connecting frame is contacted with the inside of the base, the cooling box is fixedly connected inside the connecting frame, the heat conduction seat is fixedly connected inside the cooling box, the installation mechanism is arranged inside the base, the air cooling mechanism is arranged inside the cooling box, the circulating mechanism is arranged on the cooling box, the connecting frame is contacted with the IC chip, the heat conduction seat is contacted with the IC chip, and the cooling box is contacted with the IC chip. The invention relates to a high-heat-conduction IC heat dissipation structure which has the characteristics of good heat dissipation effect and convenience in disassembly of the heat dissipation structure.)

1. The utility model provides a high heat conduction's IC heat radiation structure, includes base (1), IC chip (2), connection frame (3), installation mechanism (4), cooler bin (5), air-cooled mechanism (6), circulation mechanism (7), heat conduction seat (8), its characterized in that: the internal fixedly connected with IC chip (2) of base (1), the internal contact of base (1) has connecting frame (3), the internal fixedly connected with cooler bin (5) of connecting frame (3), the internal fixedly connected with heat conduction seat (8) of cooler bin (5), the inside of base (1) is provided with installation mechanism (4), the inside of cooler bin (5) is provided with forced air cooling mechanism (6), be provided with circulation mechanism (7) on cooler bin (5), connecting frame (3) with IC chip (2) contact, heat conduction seat (8) and IC chip (2) contact, cooler bin (5) and IC chip (2) contact.

2. The IC heat dissipation structure of claim 1, wherein: the mounting mechanism (4) comprises a mounting groove (41), inclined plane fixture blocks (42), a first spring (43), a mounting block (44), a moving rod (45), a baffle (46), a second spring (47), an inclined plane driving block (48) and a limiting ring (49), wherein the connecting frame (3) is provided with four uniformly distributed mounting grooves (41), the base (1) is connected with the four uniformly distributed inclined plane fixture blocks (42) in a sliding manner, the inclined plane fixture blocks (42) are connected with the mounting groove (41) in a sliding manner, the base (1) is provided with the first springs (43) uniformly distributed, the base (1) is fixedly connected with the four uniformly distributed limiting rings (49) in the inner portion, the limiting ring (49) is connected with the inclined plane fixture blocks (42) in a sliding manner, the connecting frame (3) is fixedly connected with the four uniformly distributed mounting blocks (44) in the outer side, the inside sliding connection of installation piece (44) has carriage release lever (45), the one end fixedly connected with baffle (46) of carriage release lever (45), the outside of carriage release lever (45) is provided with spring two (47), the other end fixedly connected with inclined plane drive block (48) of carriage release lever (45), inclined plane drive block (48) with inclined plane fixture block (42) contact, inclined plane drive block (48) with installation piece (44) contact.

3. The IC heat dissipation structure of claim 2, wherein: one end of the first spring (43) is fixedly connected with the base (1), and the other end of the first spring (43) is fixedly connected with the inclined plane clamping block (42).

4. The IC heat dissipation structure of claim 3, wherein: one end of the second spring (47) is fixedly connected with the mounting block (44), and the other end of the second spring (47) is fixedly connected with the baffle (46).

5. The IC heat dissipation structure of claim 4, wherein: air-cooled mechanism (6) include heat-conducting plate (61), louvre (62), fan case (63), heat dissipation fan (64), case (65) of giving vent to anger, condenser plate (66), back flow (67), a plurality of evenly distributed's of upper end fixedly connected with heat-conducting plate (61) of heat-conducting seat (8), set up a plurality of evenly distributed's louvre (62) on heat-conducting plate (61), fixedly connected with fan case (63) are gone up in cooler bin (5), the inside fixedly connected with heat dissipation fan (64) of fan case (63), fixedly connected with air outlet box (65) are gone up in cooler bin (5), the inside fixedly connected with condenser plate (66) of air outlet box (65), left lower extreme fixedly connected with back flow (67) of air outlet box (65).

6. The IC heat dissipation structure of claim 5, wherein: the number of the heat dissipation fans (64) is four, and the four heat dissipation fans (64) are uniformly distributed on the fan box (63).

7. The IC heat dissipation structure of claim 6, wherein: the circulating mechanism (7) comprises a water pipe (71), a water pump (72), a flow divider (73), a conveying pipe (74), a water tank (75), a tank cover (76), a filter cover (77), a connecting pipe (78), a sponge plate (79) and a filter screen (70), the water pipe (71) is fixedly connected inside the heat conducting seat (8), the water pump (72) is fixedly connected to the upper end of the heat conducting seat (8), the flow divider (73) is fixedly connected to the upper end of the water pump (72), the conveying pipe (74) is fixedly connected to the upper end of the flow divider (73), the water tank (75) is fixedly connected to the upper end of the cooling tank (5), the tank cover (76) is hinged inside the water tank (75), the filter cover (77) is fixedly connected to the lower end of the water tank (75), the sponge plate (79) is fixedly connected inside the filter cover (77), and the filter screen (70) is fixedly connected inside the filter cover (77), filter screen (70) with sponge board (79) contact, filter mantle (77) with cooling tank (5) fixed connection, water pipe (71) with the output fixed connection of water pump (72), conveyer pipe (74) are followed pass in cooling tank (5) and water tank (75), filter mantle (77) with linking frame (3) contact.

8. The IC heat dissipation structure of claim 7, wherein: the lower extreme fixedly connected with connecting pipe (78) of water tank (75), connecting pipe (78) with filter mantle (77) fixed connection, connecting pipe (78) with sponge board (79) contact.

Technical Field

The invention belongs to the technical field of IC chips, and particularly relates to a high-heat-conductivity IC heat dissipation structure.

Background

An IC Chip (Integrated Circuit Chip) is a Chip formed by placing an Integrated Circuit formed by a large number of microelectronic devices (transistors, resistors, capacitors, etc.) on a plastic substrate. The IC chip comprises a wafer chip and a packaging chip, a corresponding IC chip production line consists of a wafer production line and a packaging production line, and the IC chip is required to be matched with a heat dissipation structure to dissipate heat of the IC chip in use, but the existing heat dissipation structure has some problems: 1. the poor radiating effect in the prior art leads to the fact that the heat inside the IC can not be effectively radiated, leads to the fact that the temperature of the IC is too high and the service life is reduced; 2. when IC overhauls in needs, will demolish heat radiation structure earlier, heat radiation structure installs on the base, is not convenient for demolish for heat radiation structure practicality reduces. Therefore, it is desirable to design a highly thermally conductive heat dissipation structure for an IC.

The invention content is as follows:

the present invention is directed to solving the above problems by providing a highly thermally conductive heat dissipation structure for an IC, which solves the problems mentioned in the background art.

In order to solve the above problems, the present invention provides a technical solution of a high thermal conductivity IC heat dissipation structure:

the utility model provides a high heat conduction's IC heat radiation structure, includes base, IC chip, connection frame, installation mechanism, cooler bin, forced air cooling mechanism, circulation mechanism, heat conduction seat, the inside fixedly connected with IC chip of base, the inside contact of base has the connection frame, the inside fixedly connected with cooler bin of connection frame, the inside fixedly connected with heat conduction seat of cooler bin, the inside of base is provided with installation mechanism, the inside of cooler bin is provided with forced air cooling mechanism, be provided with circulation mechanism on the cooler bin, the connection frame with the IC chip contact, heat conduction seat and IC chip contact, the cooler bin contacts with the IC chip.

Preferably, the mounting mechanism comprises a mounting groove, an inclined plane fixture block, a first spring, a mounting block, a moving rod, a baffle, a second spring, an inclined plane driving block and a limiting ring, wherein the connecting frame is provided with four uniformly distributed mounting grooves, the base is internally and slidably connected with four uniformly distributed inclined plane fixture blocks, the inclined plane fixture blocks are slidably connected with the mounting grooves, the base is internally provided with four uniformly distributed first springs, the base is internally and fixedly connected with four uniformly distributed limiting rings, the limiting rings are slidably connected with the inclined plane fixture blocks, the outer side of the connecting frame is fixedly connected with four uniformly distributed mounting blocks, the inner part of each mounting block is slidably connected with the moving rod, one end of the moving rod is fixedly connected with the baffle, the outer side of the moving rod is provided with the second spring, and the other end of the moving rod is fixedly connected with the inclined plane driving block, the inclined plane driving block is in contact with the inclined plane clamping block, and the inclined plane driving block is in contact with the mounting block.

Preferably, one end of the first spring is fixedly connected with the base, and the other end of the first spring is fixedly connected with the inclined plane clamping block.

Preferably, one end of the second spring is fixedly connected with the mounting block, and the other end of the second spring is fixedly connected with the baffle.

As preferred, air-cooled mechanism includes heat-conducting plate, louvre, fan case, heat dissipation fan, play gas tank, condenser plate, back flow, a plurality of evenly distributed's of the upper end fixedly connected with heat-conducting plate of heat-conducting seat, set up a plurality of evenly distributed's louvre on the heat-conducting plate, fixedly connected with fan case on the cooler bin, the inside fixedly connected with heat dissipation fan of fan case, fixedly connected out the gas tank on the cooler bin, the inside fixedly connected with condenser plate of play gas tank, the left lower extreme fixedly connected with back flow of play gas tank.

Preferably, the number of the heat dissipation fans is four, and the four heat dissipation fans are uniformly distributed on the fan box.

Preferably, the circulating mechanism comprises a water pipe, a water pump, a flow divider, a conveying pipe, a water tank, a tank cover, a filter cover, a connecting pipe, a sponge plate and a filter screen, the water pipe is fixedly connected inside the heat conducting seat, the water pump is fixedly connected to the upper end of the heat conducting seat, the flow divider is fixedly connected to the upper end of the water pump, the conveying pipe is fixedly connected to the upper end of the flow divider, the water tank is fixedly connected to the upper end of the cooling tank, the tank cover is hinged inside the water tank, the filter cover is fixedly connected to the lower end of the water tank, the sponge plate is fixedly connected inside the filter cover, the filter screen is in contact with the sponge plate, the filter cover is fixedly connected to the cooling tank, the water pipe is fixedly connected to the output end of the water pump, and the conveying pipe passes through the cooling tank and the water tank, the filter cover is in contact with the connecting frame.

Preferably, the lower end of the water tank is fixedly connected with a connecting pipe, the connecting pipe is fixedly connected with the filter cover, and the connecting pipe is in contact with the sponge plate.

The invention has the beneficial effects that: the invention relates to a high heat conduction IC heat dissipation structure, which has the characteristics of good heat dissipation effect and convenient disassembly of the heat dissipation structure, and has the following two beneficial effects compared with the traditional high heat conduction IC heat dissipation structure in specific use:

firstly, through adding a heat dissipation fan, a sponge plate, a water pump and other structures on a cooling box, in the working process of an IC chip, the water pump and the heat dissipation fan are started, the water pump supplies water to the sponge plate, the interior of the sponge plate is filled with cooling water, the suction force generated by the heat dissipation fan can ensure that air sucked into the cooling box can enter the cooling box after being cooled by water in the sponge plate, and then the air is contacted with a hotter heat conduction plate to be gasified, so that the heat conduction plate can be cooled through gasification heat absorption, and the cooling effect of the IC chip can be improved;

secondly, through adding on the joint frame and establishing inclined plane drive block, spring two and carriage release lever isotructure, when needs dismantle joint frame and cooler bin, press the carriage release lever and can shift out the inclined plane fixture block from the joint frame through the inclined plane of inclined plane drive block, alright accomplish the dismantlement to joint frame and cooler bin to can make the maintenance to the IC chip more convenient.

Description of the drawings:

for ease of illustration, the invention is described in detail by the following detailed description and the accompanying drawings.

FIG. 1 is a perspective view of the overall construction of the present invention;

FIG. 2 is a front cross-sectional view of FIG. 1 of the present invention;

FIG. 3 is a right side view of the thermal plate of FIG. 2 of the present invention;

FIG. 4 is a left side view of the fan case of FIG. 2 of the present invention;

FIG. 5 is a right side view of the delivery tube of FIG. 2 of the present invention;

FIG. 6 is an enlarged view of the portion A of FIG. 2 according to the present invention;

fig. 7 is an enlarged view of the structure of the part B of fig. 2 according to the present invention.

In the figure: 1. a base; 2. an IC chip; 3. a connecting frame; 4. an installation mechanism; 5. a cooling tank; 6. an air cooling mechanism; 7. a circulating mechanism; 8. a heat conducting base; 41. mounting grooves; 42. an inclined plane fixture block; 43. a first spring; 44. mounting blocks; 45. a travel bar; 46. a baffle plate; 47. a second spring; 48. an inclined plane driving block; 49. a limiting ring; 61. a heat conducting plate; 62. heat dissipation holes; 63. a fan case; 64. a heat dissipation fan; 65. an air outlet box; 66. a condensing plate; 67. a return pipe; 71. a water pipe; 72. a water pump; 73. a flow divider; 74. a delivery pipe; 75. a water tank; 76. a box cover; 77. a filter housing; 78. a connecting pipe; 79. a sponge plate; 70. and (4) a filter screen.

The specific implementation mode is as follows:

as shown in fig. 1 to 7, the following technical solutions are adopted in the present embodiment:

example (b):

the utility model provides a high heat conduction's IC heat radiation structure, includes base 1, IC chip 2, connection frame 3, installation mechanism 4, cooler bin 5, air-cooled mechanism 6, circulation mechanism 7, heat conduction seat 8, the inside fixedly connected with IC chip 2 of base 1, the inside contact of base 1 has connection frame 3, the inside fixedly connected with cooler bin 5 of connection frame 3, the inside fixedly connected with heat conduction seat 8 of cooler bin 5, the inside of base 1 is provided with installation mechanism 4, the inside of cooler bin 5 is provided with air-cooled mechanism 6, be provided with circulation mechanism 7 on the cooler bin 5, connection frame 3 with IC chip 2 contact, heat conduction seat 8 and IC chip 2 contact, cooler bin 5 and IC chip 2 contact.

Wherein, the mounting mechanism 4 comprises a mounting groove 41, a first inclined surface fixture block 42, a first spring 43, a mounting block 44, a moving rod 45, a baffle 46, a second spring 47, an inclined surface driving block 48 and a limiting ring 49, four uniformly distributed mounting grooves 41 are formed on the connecting frame 3, four uniformly distributed inclined surface fixture blocks 42 are slidably connected inside the base 1, the inclined surface fixture block 42 is slidably connected with the mounting groove 41, four uniformly distributed first springs 43 are arranged inside the base 1, four uniformly distributed limiting rings 49 are fixedly connected inside the base 1, the limiting ring 49 is slidably connected with the inclined surface fixture blocks 42, four uniformly distributed mounting blocks 44 are fixedly connected outside the connecting frame 3, the moving rod 45 is slidably connected inside the mounting block 44, the baffle 46 is fixedly connected to one end of the moving rod 45, the second spring 47 is arranged outside the moving rod 45, the other end of the moving rod 45 is fixedly connected with an inclined plane driving block 48, the inclined plane driving block 48 is in contact with the inclined plane clamping block 42, the inclined plane driving block 48 is in contact with the mounting block 44, the inclined plane inclination between the inclined plane driving block 48 and the inclined plane clamping block 42 is consistent, and the inclined plane driving block 48 can drive the inclined plane clamping block 42 to move horizontally through the inclined plane of the inclined plane clamping block 42.

One end of the first spring 43 is fixedly connected with the base 1, the other end of the first spring 43 is fixedly connected with the inclined plane clamping block 42, and the first spring 43 can drive the inclined plane clamping block 42 to automatically reset through elasticity.

One end of the second spring 47 is fixedly connected with the mounting block 44, the other end of the second spring 47 is fixedly connected with the baffle 46, and the second spring 47 can drive the inclined plane driving block 48 to automatically reset through elasticity.

Wherein, air-cooling mechanism 6 includes heat-conducting plate 61, louvre 62, fan case 63, heat dissipation fan 64, case 65, cold plate 66, back flow 67 of giving vent to anger, the heat-conducting plate 61 of a plurality of evenly distributed of upper end fixedly connected with of heat-conducting seat 8, set up a plurality of evenly distributed's louvre 62 on the heat-conducting plate 61, fixedly connected with fan case 63 on the cooler bin 5, fan case 63's inside fixedly connected with heat dissipation fan 64, fixedly connected out gas case 65 on the cooler bin 5, the inside fixedly connected with cold plate 66 of gas case 65, the left lower extreme fixedly connected with back flow 67 of gas case 65, back flow 67 can be with the inside of cooler bin 5 of discharging into of the comdenstion water that drips on the cold plate 66.

The number of the heat dissipation fans 64 is four, the heat dissipation fans 64 are uniformly distributed on the fan box 63, and the heat dissipation efficiency of the four heat dissipation fans 64 can be enhanced.

Wherein, the circulation mechanism 7 comprises a water pipe 71, a water pump 72, a flow divider 73, a delivery pipe 74, a water tank 75, a tank cover 76, a filter cover 77, a connecting pipe 78, a sponge plate 79 and a filter screen 70, the inside of the heat conduction seat 8 is fixedly connected with the water pipe 71, the upper end of the heat conduction seat 8 is fixedly connected with the water pump 72, the upper end of the water pump 72 is fixedly connected with the flow divider 73, the upper end of the flow divider 73 is fixedly connected with the delivery pipe 74, the upper end of the cooling box 5 is fixedly connected with the water tank 75, the inside of the water tank 75 is hinged with the tank cover 76, the lower end of the water tank 75 is fixedly connected with the filter cover 77, the inside of the filter cover 77 is fixedly connected with the sponge plate 79, the inside of the filter cover 77 is fixedly connected with the filter screen 70, the filter screen 70 is in contact with the sponge plate 79, the filter cover 77 is fixedly connected with the cooling box 5, the water pipe 71 is fixedly connected with the output end of the water pump 72, the delivery pipes 74 pass through the cooling tank 5 and the water tank 75, the filter cover 77 is in contact with the connection frame 3, the delivery pipes 74 can cool water while delivering water, and the tank cover 76 is provided with a stopper which is in contact with the water tank 75.

Wherein, the lower end of the water tank 75 is fixedly connected with a connecting pipe 78, the connecting pipe 78 is fixedly connected with the filter cover 77, the connecting pipe 78 is in contact with the sponge plate 79, and the connecting pipe 78 can discharge the water in the water tank 75 into the sponge plate 79.

The using state of the invention is as follows: when the IC chip 2 works, the generated heat is transmitted to the inside of the heat conducting plate 61 through the heat conducting seat 8, the water in the water tank 75 flows into the inside of the sponge plate 79 through the connecting pipe 78, then the heat radiating fan 64 is started, the heat radiating fan 64 generates suction force, the suction force is transmitted to the outer side of the filter cover 77 through the sponge plate 79 and the filter screen 70, the outside air is sucked into the inside of the filter cover 77, the moisture in the sponge plate 79 enters the inside of the cooling box 5 along with the air in the form of water mist during the suction, when the moisture in the air contacts the heat conducting plate 61, the moisture is gasified, the moisture absorbs the heat in the heat conducting plate 61 through gasification and heat absorption in the gasification process, thereby the heat radiating efficiency of the IC chip 2 can be improved, the gasified gas enters the inside of the air outlet box 65, and flows into the lower end of the cooling box 5 through the return pipe 67 after being condensed by the condensing plate 66, then water pump 72 is started, water pump 72 passes through water pipe 71 and conveys the water in cooling box 5 to the inside of water tank 75 through shunt 73 and conveyer pipe 74, thereby can make inside moisture can recycle, do not need often to add, when needing to overhaul IC chip 2, push down baffle 46, baffle 46 drives inclined plane drive block 48 through transfer bar 45 and removes, inclined plane drive block 48 can drive inclined plane fixture block 42 to remove to the inside of base 1 through the inclined plane of inclined plane fixture block 42 in the in-process that removes, when inclined plane fixture block 42 breaks away from mounting groove 41, alright dismantle connecting frame 3 and cooling box 5 and overhaul IC chip 2.

While there have been shown and described what are at present considered to be the fundamental principles of the invention and its essential features and advantages, it will be understood by those skilled in the art that the invention is not limited by the embodiments described above, which are merely illustrative of the principles of the invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the invention as defined by the appended claims and their equivalents.