阅读说明：本技术 一种陶瓷、塑料封装的抗辐照结构 (Anti-irradiation structure for ceramic and plastic packaging ) 是由 李守委 黄彦 于 2021-01-12 设计创作，主要内容包括：本发明公开一种陶瓷、塑料封装的抗辐照结构,属于集成电路封装领域。本发明提供的一种抗辐照结构不局限于陶瓷封装结构,亦可用于塑料封装结构。选用有机聚合物材料,并通过掺杂无机非金属材料来加固有机材料涂层的抗辐照性能,在电路内外表面选用涂覆的方式进行覆盖,对电路整体的抗电子辐照、伽马射线辐照性能等抗辐照性能进行加固。本发明结构清晰明了,工艺可行性较高,并可兼容多种封装结构。(The invention discloses an anti-irradiation structure packaged by ceramics and plastics, belonging to the field of integrated circuit packaging. The anti-radiation structure provided by the invention is not limited to a ceramic packaging structure, and can also be used for a plastic packaging structure. The irradiation resistance of the organic material coating is reinforced by selecting an organic polymer material and doping an inorganic non-metallic material, the inner surface and the outer surface of the circuit are covered by adopting a coating mode, and the irradiation resistance of the whole circuit, such as electron irradiation resistance, gamma ray irradiation resistance and the like, is reinforced. The invention has clear structure and higher process feasibility and can be compatible with various packaging structures.)

1. An irradiation-resistant structure of a ceramic package, comprising:

a ceramic envelope;

a semiconductor chip disposed inside the ceramic package;

the cover plate is assembled with the ceramic tube shell through a cap sealing process;

and the organic material coating is arranged on the inner surface or the outer surface of the cover plate.

2. The ceramic encapsulated radiation-resistant structure of claim 1 wherein the organic material coating is formed by doping an organic polymeric material with an inorganic non-metallic material.

3. The ceramic encapsulated radiation-resistant structure of claim 1 wherein said inorganic non-metallic material comprises carbon and boron; the organic polymeric material comprises polyethylene.

4. The ceramic packaged radiation-resistant structure of claim 1, wherein the semiconductor chip is a non-flip-chip bonded type chip or a flip-chip bonded type chip;

when the semiconductor chip is a non-flip-chip type chip, the non-flip-chip type chip is attached to the inside of the ceramic tube shell through a bonding material and is interconnected with the ceramic tube shell through a bonding wire;

when the semiconductor chip is a flip chip, the flip chip is interconnected with the ceramic tube shell through a flip-chip bonding process, and filling materials are filled between the flip chip and the ceramic tube shell.

5. An irradiation resistant structure for a plastic package, comprising:

a plastic substrate;

a semiconductor chip disposed inside the ceramic package;

an encapsulant encapsulating the plastic substrate and the semiconductor chip;

and the organic material coating is arranged on the outer surface of the encapsulating material.

6. The plastic encapsulated radiation resistant structure of claim 5 wherein said organic material coating is formed by doping an organic polymeric material with an inorganic non-metallic material.

7. The plastic encapsulated radiation resistant structure of claim 5 wherein said semiconductor chip is a non-flip-chip bonded type chip or a flip-chip bonded type chip;

when the semiconductor chip is a non-flip-chip type chip, the non-flip-chip type chip is attached to the inside of the ceramic tube shell through a bonding material and is interconnected with the plastic substrate through a bonding wire;

when the semiconductor chip is a flip chip, the flip chip is interconnected with the ceramic tube shell through a flip-chip bonding process, and filling materials are filled between the flip chip and the plastic substrate.

8. An irradiation resistant structure for a plastic package, comprising:

a plastic substrate;

the flip chip is arranged on the plastic substrate through an inverted buckle welding process and is interconnected with the plastic substrate;

a heat dissipation plate bonded to the flip chip via an adhesive material;

and the organic material coating is arranged on the outer surface or the inner surface of the heat dissipation plate.

9. The plastic encapsulated radiation resistant structure of claim 8 wherein said organic material coating is formed by doping an organic polymeric material with an inorganic non-metallic material.

10. The plastic encapsulated radiation resistant structure of claim 8 wherein a filler material is filled between said flip chip type chip and said plastic substrate.

Technical Field

The invention relates to the technical field of integrated circuit packaging, in particular to an anti-irradiation structure for ceramic and plastic packaging.

Background

When the integrated circuit packaging products are put into the industrial technical fields of satellite-borne, ship-borne, missile-borne and the like in large quantity. Therefore, the packaging technology of the integrated circuit is more rigorous, and in order to meet the extravehicular space environment of the product, the selected devices and materials need to meet the assessment requirements of aerospace level or more than general military level and have stronger radiation resistance.

Nowadays, the integration level of system-in-package is rapidly increased, and the requirements of miniaturization, low cost and high integration level of modern electronic equipment systems are more common, so that the traditional anti-radiation structure for shielding the circuit through a metal plate or a metal cover in the traditional sense cannot meet the current requirements.

Therefore, under the current trend of miniaturization, high power and high integration of electronic systems, the circuit with excellent radiation resistance is realized, and a new radiation resistance structure packaged by ceramic and plastic is urgently needed to be developed.

Disclosure of Invention

The invention aims to provide an anti-radiation structure of a ceramic and plastic package, which solves the problem that the traditional metal plate or metal cover for shielding radiation cannot meet the current requirement.

In order to solve the above technical problem, the present invention provides an irradiation-resistant structure of ceramic package, comprising:

a ceramic envelope;

a semiconductor chip disposed inside the ceramic package;

the cover plate is assembled with the ceramic tube shell through a cap sealing process;

and the organic material coating is arranged on the inner surface or the outer surface of the cover plate.

Optionally, the organic material coating is formed by doping an organic polymer material with an inorganic non-metallic material.

Optionally, the inorganic non-metallic material comprises carbon and boron; the organic polymeric material comprises polyethylene.

Optionally, the semiconductor chip is a non-flip-chip or flip-chip type chip;

when the semiconductor chip is a non-flip-chip type chip, the non-flip-chip type chip is attached to the inside of the ceramic tube shell through a bonding material and is interconnected with the ceramic tube shell through a bonding wire;

when the semiconductor chip is a flip chip, the flip chip is interconnected with the ceramic tube shell through a flip-chip bonding process, and filling materials are filled between the flip chip and the ceramic tube shell.

The invention also provides an anti-irradiation structure of plastic package, comprising:

a plastic substrate;

a semiconductor chip disposed inside the ceramic package;

an encapsulant encapsulating the plastic substrate and the semiconductor chip;

and the organic material coating is arranged on the outer surface of the encapsulating material.

Optionally, the organic material coating is formed by doping an organic polymer material with an inorganic non-metallic material.

Optionally, the semiconductor chip is a non-flip-chip or flip-chip type chip;

when the semiconductor chip is a non-flip-chip type chip, the non-flip-chip type chip is attached to the inside of the ceramic tube shell through a bonding material and is interconnected with the plastic substrate through a bonding wire;

when the semiconductor chip is a flip chip, the flip chip is interconnected with the ceramic tube shell through a flip-chip bonding process, and filling materials are filled between the flip chip and the plastic substrate.

The invention also provides an anti-irradiation structure of plastic package, comprising:

a plastic substrate;

the flip chip is arranged on the plastic substrate through an inverted buckle welding process and is interconnected with the plastic substrate;

a heat dissipation plate bonded to the flip chip via an adhesive material;

and the organic material coating is arranged on the outer surface or the inner surface of the heat dissipation plate.

Optionally, the organic material coating is formed by doping an organic polymer material with an inorganic non-metallic material.

Optionally, a filling material is filled between the flip chip and the plastic substrate.

The invention provides an anti-irradiation structure packaged by ceramics and plastics, which has the following beneficial effects:

(1) the coating position of the organic material coating is not limited, and the organic material coating comprises the inner surface and the outer surface of a circuit, so that the organic material coating can be realized on most mainstream packaging forms;

(2) the organic polymer material is doped with the inorganic non-metallic material to form a novel organic material coating, so that the irradiation resistance of the packaging body is greatly improved;

(3) the process has high feasibility, and the technical means adopted by the structure is in a mature stage.

Drawings

FIG. 1 is a schematic view of a non-flip-chip type ceramic package radiation-resistant structure;

FIG. 2 is a schematic view of another non-flip-chip type ceramic package structure for resisting radiation;

FIG. 3 is a schematic view of an irradiation-resistant structure of a flip-chip type ceramic package;

FIG. 4 is a schematic view of another flip-chip ceramic package structure;

FIG. 5 is a schematic view of a non-flip-chip type chip plastic package radiation-resistant structure;

FIG. 6 is a schematic view of a flip chip type plastic package radiation-resistant structure;

FIG. 7 is a schematic view of another flip-chip type plastic package structure for radiation protection;

fig. 8 is a schematic view of a third flip-chip type plastic package radiation-resistant structure.

Detailed Description

The radiation-resistant structure of the ceramic and plastic package provided by the invention is further described in detail with reference to the accompanying drawings and specific embodiments. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.

Example one

The first embodiment of the invention provides an irradiation-resistant structure packaged by ceramic, which is shown in fig. 1 and comprises a ceramic tube shell 11, a non-flip-chip type chip 13, a cover plate 16 and an organic material coating 15. The non-flip chip 13 is attached to the inside of the ceramic package 11 through a bonding material 12 and is interconnected with the ceramic package 11 through a bonding wire 14; the cap plate 16 is assembled with the ceramic envelope 11 by a capping process.

The organic material coating 15 realizes the radiation such as electron radiation resistance and gamma ray radiation resistance; the organic material coating 15 may be disposed on the inner surface of the cover plate 16, as shown in fig. 1; the organic material coating 15 may also be disposed on the outer surface of the cover plate 16, as shown in fig. 2. The organic material coating 15 is formed by doping an organic polymer material with an inorganic non-metallic material, so that the radiation resistance of the packaging body is greatly improved. The organic polymer material may be polyethylene and the inorganic non-metallic material may be carbon or boron.

Example two

The second embodiment of the present invention provides an irradiation-resistant structure packaged by ceramic, the structure of which is shown in fig. 3, and the irradiation-resistant structure includes a ceramic package 31, a flip chip 35, a cover plate 34, and an organic material coating 33. The flip chip 35 is interconnected with the ceramic tube shell 31 through a flip-chip bonding process, and a filling material 32 is filled between the flip chip 35 and the ceramic tube shell 31; the cap plate 34 is assembled with the ceramic package 31 by a capping process.

The organic material coating 33 realizes the radiation resistance to electron radiation, gamma ray radiation and the like; the organic material coating 33 may be disposed on the inner surface of the cover plate 34, as shown in fig. 3; the organic material coating 33 may also be disposed on the outer surface of the cover plate 34, as shown in fig. 4. The organic material coating 33 is formed by doping an organic polymer material with an inorganic non-metallic material, so that the radiation resistance of the packaging body is greatly improved.

EXAMPLE III

The third embodiment of the invention provides an irradiation-resistant structure packaged by plastic, and the structure of the irradiation-resistant structure is shown in fig. 5, and the irradiation-resistant structure comprises a plastic substrate 51, a non-flip-chip bonding chip 54, an encapsulating material 52 and an organic material coating 56. The non-flip chip 54 is attached to the inside of the ceramic package 51 through an adhesive material 55, and is interconnected with the plastic substrate 51 through a bonding wire 53; the encapsulating material 52 encapsulates the plastic substrate 51 and the non-flip-chip type chip 54; the organic material coating 56 is disposed on the outer surface of the encapsulant 52 to achieve electron irradiation and gamma ray irradiation resistance. The organic material coating 56 is formed by doping an organic polymer material with an inorganic non-metallic material, so that the radiation resistance of the packaging body is greatly improved.

Example four

The fourth embodiment of the present invention provides an irradiation-resistant structure packaged by plastic, the structure of which is shown in fig. 6, and the irradiation-resistant structure includes a plastic substrate 61, a flip chip 63, an encapsulant 62, and an organic material coating 65. The flip chip 63 is interconnected with the plastic substrate 61 through a flip-chip bonding process, and a filling material 64 is filled between the flip chip 63 and the plastic substrate 61; the encapsulation material 62 encapsulates the plastic substrate 61 and the flip chip type chip 63; the organic material coating 65 is disposed on the outer surface of the encapsulant 62 to achieve electron irradiation and gamma ray irradiation resistance. The organic material coating 65 is formed by doping an organic polymer material with an inorganic non-metallic material, so that the radiation resistance of the packaging body is greatly improved.

EXAMPLE five

The fifth embodiment of the present invention provides another radiation-resistant structure packaged by plastic, which is shown in fig. 7 and includes a plastic substrate 71, a flip chip 75, a heat dissipation plate 76, and an organic material coating 74. The flip chip 75 is arranged on the plastic substrate 71 through an upside-down buckle welding process and is interconnected with the plastic substrate 71, and a filling material 72 is filled between the flip chip 75 and the plastic substrate 71; the heat sink 76 is bonded to the flip chip 75 by an adhesive 73.

The organic material coating 74 realizes the radiation such as electron radiation resistance and gamma ray radiation resistance; the organic material coating 74 may be disposed on an outer surface of the heat dissipation plate 76, as shown in fig. 7; the organic material coating 74 may also be disposed on the inner surface of the heat dissipation plate 76, as shown in fig. 8. When the organic material coating 74 may also be disposed on the inner surface of the heat dissipation plate 76, the organic material coating 74 is located between the heat dissipation plate 76 and the adhesive material 73. The organic material coating 74 is formed by doping an organic polymer material with an inorganic non-metallic material, so that the radiation resistance of the packaging body is greatly improved.

The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims.