阅读说明：本技术 一种实现倒装凸点芯片互叠的三维封装结构及其制备方法 (Three-dimensional packaging structure for realizing flip bump chip mutual overlapping and preparation method thereof ) 是由 汪民 于 2020-12-11 设计创作，主要内容包括：本发明公开了一种实现倒装凸点芯片互叠的三维封装结构及其制备方法,属于集成电路芯片封装领域。所述实现倒装凸点芯片互叠的三维封装结构,包括：基板、互叠芯片单元和封装填充体；互叠芯片单元包括倒装凸点芯片和转接体；转接体一面通过粘胶膜与倒装凸点芯片远离凸点的一面粘合,转接体另一面上设有转接点,转接点用于与其他互叠芯片单元中倒装凸点芯片凸点连接；基板通过基板焊盘与倒装凸点芯片凸点连接。本发明采用回流焊工艺和Wire Bond工艺,通过简易的制备方法,实现各结构的有效连接。发明有效实现倒装凸点芯片的三维堆叠,解决倒装凸点芯片难以实现互相堆叠的困难。(The invention discloses a three-dimensional packaging structure for realizing flip bump chip mutual overlapping and a preparation method thereof, belonging to the field of integrated circuit chip packaging. The three-dimensional packaging structure for realizing the mutual overlapping of flip bump chips comprises: the packaging structure comprises a substrate, a chip unit and a packaging filler, wherein the chip unit and the packaging filler are stacked mutually; the overlapped chip unit comprises a flip bump chip and a switching body; one side of the switching body is bonded with one side of the flip bump chip far away from the bumps through an adhesive film, and switching points are arranged on the other side of the switching body and used for being connected with the bumps of the flip bump chip in other overlapped chip units; the substrate is connected with the flip bump chip through the substrate bonding pad. The invention adopts the reflow soldering process and the Wire Bond process, and realizes the effective connection of all the structures through a simple preparation method. The invention effectively realizes the three-dimensional stacking of the flip bump chips and solves the difficulty that the flip bump chips are difficult to realize mutual stacking.)

1. The utility model provides a realize flip-chip bump chip three-dimensional packaging structure who overlaps each other which characterized in that includes: the chip packaging structure comprises a substrate (1), chip units and a packaging filler, wherein the chip units are stacked on one another;

the overlapped chip unit comprises a flip bump chip (2) and an adapter (4); one surface of the adapter (4) is bonded with one surface, far away from the salient points, of the flip salient point chip (2) through the adhesive film (3), the other surface of the adapter (4) is provided with an adapter point (7), and the adapter point (7) is used for being connected with the salient points of the flip salient point chip (2) in other overlapped chip units;

the substrate (1) is connected with the bumps in the flip bump chip (2) through the substrate bonding pads (8).

2. The three-dimensional package structure for realizing flip bump chip stacking according to claim 1, wherein the interposer (4) is provided with an interposer pad (6), and the interposer pad (6) is electrically connected to the substrate pad (8).

3. The three-dimensional packaging structure for realizing flip bump chip stacking according to claim 2, wherein the transfer bonding pad (6) is connected with the substrate bonding pad (8) through a gold interconnection wire (5).

4. The three-dimensional packaging structure for realizing the mutual overlapping of the flip bump chips as claimed in claim 1, wherein at least one transfer point (7) is arranged on the transfer body (4), and a connecting circuit (9) is arranged between the transfer points (7).

5. The three-dimensional package structure for realizing flip bump chip stacking according to claim 1, wherein the interposer (4) is a silicon crystal.

6. The three-dimensional package structure for realizing flip bump chip stacking according to claim 1, wherein the transfer points (7) are tin bumps.

7. The three-dimensional packaging structure for realizing flip-chip bump interconnection of claim 1, wherein the landing pads (6) are aluminum bumps.

8. The method for manufacturing the three-dimensional packaging structure with flip bump chips stacked on each other according to any one of claims 1 to 7, comprising:

1) adopting an adhesive film (3), attaching one surface of an adapter (4) to one surface of the flip bump chip (2) far away from the bumps, processing adapter points (7) used for being connected with the bumps of other flip bump chips (2) on the other surface of the adapter (4), processing a connecting circuit (9) between the adapter points (7), and processing adapter pads (6) on the adapter (4) to prepare an overlapped chip unit;

2) connecting the bumps of the flip bump chip (2) of one of the two mutually overlapped chip units with the transfer points (7) of the other mutually overlapped chip unit by adopting a reflow soldering process between the two mutually overlapped chip units; connecting the bumps of the flip bump chip (2) at the bottom layer with the substrate bonding pads (8) by adopting a reflow soldering process; manufacturing an overlapped structure of the flip bump chip;

3) and (4) carrying out plastic package on the mutually overlapped structure of the flip bump chip, and then planting balls to obtain the three-dimensional packaging structure for realizing the mutually overlapped structure of the flip bump chip.

9. The method for manufacturing the three-dimensional packaging structure for realizing the mutual overlapping of the flip bump chips as claimed in claim 8, wherein a Wire Bond process is adopted to interconnect the adapter pad (6) and the substrate pad (8) and lead out IO.

10. The method for manufacturing the three-dimensional package structure with flip bump chips stacked on each other according to claim 8, wherein the obtained stacked structure with flip bump chips is subjected to plastic packaging by using a plastic packaging process.

Technical Field

The invention belongs to the field of integrated circuit chip packaging, and relates to a three-dimensional packaging structure for realizing flip bump chip overlapping and a preparation method thereof.

Background

With the development of semiconductor packaging technology and market application, the demand for high-density integrated chip packaging is higher and higher. For the packaging of flip bump chips, an integrated packaging form of combining a plurality of chips in a two-dimensional space can be realized, but because the flip chip has a bump structure on one surface, a packaging form of stacking in a three-dimensional space cannot be realized.

To realize the integrated packaging form of the flip bump chip three-dimensional stacking, the TSV technology can be adopted to realize the mutual stacking between the chips so as to realize the three-dimensional packaging. Due to the introduction of the TSV technology, a through hole needs to be formed inside the flip bump chip, which is relatively complex in cost and process.

Disclosure of Invention

In order to overcome the defects of the prior art, the invention aims to provide a three-dimensional packaging structure for realizing the mutual overlapping of flip bump chips and a preparation method thereof, thereby realizing the three-dimensional packaging body structure comprising a plurality of flip bump chips through a simple preparation process method and solving the technical difficulty that the flip bump chips are difficult to realize mutual stacking.

In order to achieve the purpose, the invention adopts the following technical scheme to realize the purpose:

the invention discloses a three-dimensional packaging structure for realizing flip bump chip mutual overlapping, which comprises: the packaging structure comprises a substrate, a chip unit and a packaging filler, wherein the chip unit and the packaging filler are stacked mutually; the overlapped chip unit comprises a flip bump chip and a switching body; one side of the switching body is bonded with one side of the flip bump chip far away from the bumps through an adhesive film, and switching points are arranged on the other side of the switching body and used for being connected with the bumps of the flip bump chip in other overlapped chip units; the substrate is connected with the bumps in the flip bump chip through the substrate bonding pads.

Preferably, the adapter is provided with an adapter pad, and the adapter pad is electrically connected with the substrate pad.

Further preferably, the transfer pad is connected to the substrate pad through a gold interconnection wire.

Preferably, at least one switching point is arranged on the switching body, and a connecting circuit is arranged between the switching points.

Preferably, the adaptor is a silicon crystal; the transfer points are tin bumps; the transfer bonding pad is an aluminum bump.

The invention also discloses a preparation method of the three-dimensional packaging structure for realizing the mutual overlapping of the flip bump chips, which comprises the following steps:

1) adopting an adhesive film, attaching one surface of the switching body to one surface of the flip bump chip far away from the bumps, processing switching points for connecting with other flip bump chip bumps on the other surface of the switching body, processing a connecting circuit between the switching points, and processing a switching bonding pad on the switching body to obtain a mutual stacked chip unit;

2) connecting the flip bump chip bumps of one of the two mutually overlapped chip units with the switching points of the other mutually overlapped chip unit by adopting a reflow soldering process between the two mutually overlapped chip units; connecting the flip bump chip bumps on the bottom layer with the substrate bonding pads by adopting a reflow soldering process; manufacturing an overlapped structure of the flip bump chip;

3) and (4) carrying out plastic package on the mutually overlapped structure of the flip bump chip, and then planting balls to obtain the three-dimensional packaging structure for realizing the mutually overlapped structure of the flip bump chip.

Preferably, a Wire Bond process is adopted to interconnect the adapter pad and the substrate pad and lead out the IO.

Preferably, the mutual overlapping structure of the flip bump chip is plastically packaged by adopting a plastic packaging process.

Compared with the prior art, the invention has the following beneficial effects:

the invention discloses a three-dimensional packaging structure for realizing mutual stacking of flip bump chips, which adopts a switching body and the flip bump chips which are mutually bonded to form a mutual stacking chip unit, can effectively realize the three-dimensional stacking of the flip bump chips, can effectively realize the positioning of the three-dimensional stacking through the connection of the switching point and the flip bump chip bumps in other mutual stacking chip units, and solves the problem that the flip bump chips are difficult to realize mutual stacking.

Further, compared with the existing method for stacking the flip bump chips by the TSV process, the method can be combined with the traditional gold wire interconnection process, high-cost equipment, process materials and the like required by the TSV process are not needed, and the process requirements of the three-dimensional packaging structure for stacking the flip bump chips are relatively simple and easy.

Furthermore, a connecting circuit is arranged between the transfer points, so that the interconnection of the subsequent flip bump chips can be realized. And according to the required three-dimensional stacking density of the flip bump chips, a plurality of adapters can be flexibly selected, and high-density integrated packaging is realized.

Furthermore, through the arrangement of the transfer points on the transfer body, the number and the distribution of the transfer points are included, the density of the bumps of the flip bump chip can be effectively met, and the flip bump chip has wider applicability.

The invention also discloses a preparation method of the three-dimensional packaging structure for realizing the mutual overlapping of the flip bump chips, wherein one surface of the adapter is bonded with the surface of the flip bump chip, which is far away from the bumps, by adopting an adhesive film, the point-to-point connection between two adjacent overlapped chip units is realized by processing the adapter points on the other surface of the adapter, the flip bump chip bumps of one overlapped chip unit are connected with the adapter points of the other overlapped chip unit by adopting a reflow soldering process, and the connection between the bottom layer flip bump chip and the substrate is realized by combining the reflow soldering process, so that the mutual overlapping structure of the flip bump chips is prepared; and then, obtaining the three-dimensional packaging structure for realizing the flip bump chip mutual overlapping through plastic packaging and ball mounting operation. The preparation method has the advantages of simple process, high overlapping efficiency and good stability, thereby having popularization and application values.

Drawings

FIG. 1 is a schematic diagram of substrate preparation in the method for manufacturing a three-dimensional package structure with flip bump chips stacked on each other according to the present invention;

FIG. 2 is a schematic diagram of flip bump chip bonding in the method for manufacturing a three-dimensional package structure with flip bump chips stacked on each other according to the present invention;

FIG. 3 is a schematic diagram illustrating a connection between a junction body and a substrate in the method for manufacturing a three-dimensional package structure with flip bump chips stacked on each other according to the present invention;

FIG. 4 is a schematic diagram illustrating a connection between flip chips and an interposer in a manufacturing method of a three-dimensional package structure for realizing the mutual overlapping of flip bump chips according to the present invention;

FIG. 5 is an IO outgoing schematic diagram in the manufacturing method of the three-dimensional packaging structure for realizing flip bump chip stacking according to the present invention;

FIG. 6 is a schematic diagram of a three-dimensional package structure for realizing flip bump chip stacking according to the present invention;

fig. 7 is a top view of stacked chip units in the three-dimensional package structure for realizing flip bump chip stacking according to the present invention.

Wherein: 1-a substrate; 2, flip mounting a bump chip; 3-gluing the film; 4-a transition body; 5-interconnecting gold wires; 6-landing pad; 7-a transfer point; 8-substrate pads; 9-connecting a circuit; 10-packaging plastic package component, 11-packaging structure circuit output component.

Detailed Description

In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

The invention discloses a three-dimensional packaging structure for realizing the mutual overlapping of flip bump chips, which comprises a substrate 1, a flip bump chip 2, an adapter 4, an adhesive film 3 for connecting the back surface of the flip bump chip 2 and the adapter 4, an interconnection gold wire 5 for realizing the interconnection of the adapter 4 and the substrate 1, and a plurality of adapter pads 6 arranged on the adapter 4, wherein the adapter 4 is also provided with at least one adapter point 7, and different adapter points 7 are electrically connected through a connecting circuit 9; at least one substrate bonding pad 8 is arranged on the substrate 1;

wherein, flip bump chip 2, adhesive film 3 and adaptor 4 constitute and fold chip unit each other (its plan view is as shown in fig. 7), fold chip unit each other and be connected with base plate pad 8 of base plate 1 through flip bump chip 2 bump, the switching point 7 that is equipped with on the adaptor 4 is used for being connected with flip bump chip 2 bump in other mutual chip unit, realize flip bump chip 2's three-dimensional mutual overlapping structure, it has encapsulation plastic packaging part 10 still to fill in three-dimensional mutual overlapping structure, still be equipped with packaging body circuit output part 11 in the below of base plate 1, and then realized the three-dimensional packaging structure that flip bump chip overlapped each other, its structure is as shown in fig. 6.

Specifically, the transfer pad 6 and the substrate pad 8 are connected by the gold interconnection wire 5.

Specifically, the transfer point 7 is a metal bump, preferably a tin bump; the adapter bonding pad 6 is a metal bump, preferably an aluminum bump; the interposer 4 is a silicon crystal.

The invention also discloses a preparation method of the three-dimensional packaging structure for realizing the flip bump chip mutual overlapping, which is described in detail below by combining the accompanying drawings and comprises the following steps:

step 1: the flip bump chip 2 is attached to the substrate 1 by a reflow process, as shown in fig. 1 and 2;

step 2: an adhesive film 3 is adopted, and an adapter 4 (which can be a silicon crystal) is attached to the back surface of the flip bump chip 2; the surface of the interposer 4 comprises an adapter pad 6 and an adapter point 7 (as shown in fig. 7, a connecting circuit 9 is connected between the adapter points 7 for realizing the connection between the subsequent flip chips 2); the interconnection of the transfer bonding pad 6 and the substrate bonding pad 8 is realized through the interconnection gold Wire 5 by adopting a Wire Bond process, as shown in fig. 3; manufacturing an overlapped chip unit;

and step 3: continuously realizing reflow soldering interconnection of the flip bump chips 2 and interconnection of the adapter 4, and adopting a Wire bond process to interconnect the adapter bonding pad 6 and the substrate bonding pad 8 through the interconnection gold Wire 5, realizing interconnection of the overlapped chip units and the substrate 1 and leading out IO, and realizing three-dimensional overlapping of the flip bump chips 2; finally, carrying out plastic package filling on the plastic package component 10 by adopting an MUF process, and carrying out ball planting to form a package structure circuit output component 11, thereby finally obtaining the three-dimensional package structure for realizing the mutual overlapping of flip bump chips; as shown in fig. 4 to 6, the obtained three-dimensional package structure for realizing flip bump chip stacking is shown in fig. 1.

The above-mentioned contents are only for illustrating the technical idea of the present invention, and the protection scope of the present invention is not limited thereby, and any modification made on the basis of the technical idea of the present invention falls within the protection scope of the claims of the present invention.