阅读说明：本技术 一种用于大功率半导体芯片散热的微通道装置 (Micro-channel device for heat dissipation of high-power semiconductor chip ) 是由 李建国 王凤 黄海 于 2020-12-04 设计创作，主要内容包括：本发明公开了一种用于大功率半导体芯片散热的微通道装置,包括散热上盖板,所述散热上盖板上设置有与散热水流方向平行的梯形散热翅片,所述梯形散热翅片横截面的斜边与垂直线的夹角为1°～2°；固定在所述散热上盖板下方的散热底座,所述散热底座上开设有用于放置所述梯形散热翅片的凹槽,该凹槽底部开设有位于所述凹槽两侧的进水口、出水口。本发明结构简单,通过在散热上盖板采用梯形散热翅片结构,梯形散热翅片横截面的斜边与垂直线的夹角为1°～2°,使得梯形散热翅片根部厚大能够快速的进行热传导,梯形散热翅片能够承受大流量水流产生的根部应力,且该设计角度能够使根部产生最佳的导热效率。(The invention discloses a microchannel device for heat dissipation of a high-power semiconductor chip, which comprises a heat dissipation upper cover plate, wherein trapezoidal heat dissipation fins parallel to the direction of heat dissipation water flow are arranged on the heat dissipation upper cover plate, and the included angle between the inclined edge of the cross section of each trapezoidal heat dissipation fin and a vertical line is 1-2 degrees; the heat dissipation base is fixed below the heat dissipation upper cover plate, a groove for placing the trapezoidal heat dissipation fins is formed in the heat dissipation base, and a water inlet and a water outlet which are located on two sides of the groove are formed in the bottom of the groove. The heat dissipation structure is simple, the upper heat dissipation cover plate is of a trapezoidal heat dissipation fin structure, and the included angle between the inclined edge of the cross section of each trapezoidal heat dissipation fin and the vertical line is 1-2 degrees, so that the root of each trapezoidal heat dissipation fin is thick and can conduct heat quickly, the trapezoidal heat dissipation fins can bear root stress generated by large-flow water flow, and the root can generate optimal heat conduction efficiency through the designed angle.)

1. A microchannel device for dissipating heat from a high power semiconductor chip, comprising:

the heat dissipation device comprises a heat dissipation upper cover plate (1), wherein trapezoidal heat dissipation fins (3) parallel to the heat dissipation water flow direction are arranged on the heat dissipation upper cover plate, and the included angle between the inclined sides of the cross sections of the trapezoidal heat dissipation fins (3) and a vertical line is 1-2 degrees;

the heat dissipation base (2) is fixed below the heat dissipation upper cover plate (1), a groove (21) used for placing the trapezoidal heat dissipation fins (3) is formed in the heat dissipation base, and a water inlet (4) and a water outlet (5) located on two sides of the groove are formed in the bottom of the groove.

2. The micro-channel device for dissipating heat of a high power semiconductor chip as claimed in claim 1, wherein the heat dissipating base (2) has arc grooves (6) on four sides for enlarging the heat dissipating area.

3. The microchannel device for dissipating heat of a high power semiconductor chip as claimed in claim 1, wherein the trapezoidal heat dissipating fins (3) are disposed in parallel with each other.

4. The microchannel device for dissipating heat of a high power semiconductor chip as claimed in claim 1, wherein the length of the trapezoidal heat dissipating fin (3) is equal to the depth of the groove (21).

5. The microchannel device for dissipating heat of a high power semiconductor chip as claimed in claim 1, wherein the horizontal section of the groove (21) has a rounded rectangular structure.

6. The micro-channel device for dissipating heat of a high-power semiconductor chip as claimed in claim 1, wherein the material of the heat-dissipating upper cover plate (1) and the heat-dissipating base (2) is oxygen-free copper.

Technical Field

The invention relates to the technical field of semiconductor chip heat dissipation, in particular to a micro-channel device for heat dissipation of a high-power semiconductor chip.

Background

Nowadays, with the increase of chip power and the improvement of integration level, the heating power of a single chip is significantly increased, and the traditional heat dissipation technology is difficult to meet the heat dissipation requirement of the single high-power chip; and traditional heat abstractor cooling water flow is less, if increase water flow for satisfying the high-power chip heat dissipation passageway of monomer, the passageway is inside also can form great water pressure like this, especially pin type heat dissipation passageway, hardly satisfies such intensity requirement, and long-term the use can lead to inside heat dissipation needle root intensity not enough, leads to the root fracture to lead to the chip heat dissipation to become invalid, lead to the chip to burn out even, consequently, traditional heat abstractor is more and more difficult to satisfy the user demand.

Disclosure of Invention

The present invention is directed to a micro-channel device for heat dissipation of a high power semiconductor chip, so as to solve the above problems.

In order to achieve the purpose, the invention provides the following technical scheme:

a microchannel device for dissipating heat from a high power semiconductor chip, comprising:

the heat dissipation device comprises a heat dissipation upper cover plate, wherein trapezoidal heat dissipation fins parallel to the direction of heat dissipation water flow are arranged on the heat dissipation upper cover plate, and the included angle between the inclined edge of the cross section of each trapezoidal heat dissipation fin and a vertical line is 1-2 degrees;

the heat dissipation base is fixed below the heat dissipation upper cover plate, a groove for placing the trapezoidal heat dissipation fins is formed in the heat dissipation base, and a water inlet and a water outlet which are located on two sides of the groove are formed in the bottom of the groove.

As a further scheme of the invention: the four sides of the heat dissipation base are provided with arc grooves for enlarging the heat dissipation area.

As a further scheme of the invention: the trapezoidal radiating fins are arranged in parallel.

As a further scheme of the invention: the length of the trapezoidal radiating fin is equal to the depth of the groove.

As a further scheme of the invention: the horizontal section of the groove is in a round-corner rectangular structure.

As a further scheme of the invention: the material used by the heat dissipation upper cover plate and the heat dissipation base is oxygen-free copper.

Compared with the prior art, the invention has the beneficial effects that: according to the invention, the upper radiating cover plate adopts a trapezoidal radiating fin structure, the root of the trapezoidal radiating fin is thick and can conduct heat rapidly, the trapezoidal radiating fin can bear root stress generated by high-flow water flow, the problem that the root strength of an internal radiating needle is insufficient under the use of a traditional radiating channel under high flow is avoided, the included angle between the inclined edge of the cross section of the trapezoidal radiating fin and a vertical line is 1-2 degrees, and the design angle can enable the root to generate optimal heat conduction efficiency; the four sides of the heat dissipation base are provided with arc grooves for enlarging the heat dissipation area.

Drawings

FIG. 1 is an exploded view of the present invention;

FIG. 2 is a schematic view of a heat dissipating upper cover plate according to the present invention;

FIG. 3 is an enlarged view taken at A in FIG. 2;

FIG. 4 is a schematic top view of a heat sink base;

FIG. 5 is a schematic bottom structure view of the heat dissipation base;

FIG. 6 is a front view of a heat sink base;

fig. 7 is a side view of a heat sink base.

In the figure: 1-radiating upper cover plate, 2-radiating base, 21-groove, 3-trapezoidal radiating fin, 4-water inlet, 5-water blowing inlet and 6-arc groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, in an embodiment of the present invention, a microchannel device for heat dissipation of a high-power semiconductor chip includes a heat dissipation upper cover plate 1, a trapezoidal heat dissipation fin 3 parallel to a heat dissipation water flow direction is disposed on the heat dissipation upper cover plate, and an included angle between an oblique side of a cross section of the trapezoidal heat dissipation fin 3 and a vertical line is 1 to 2 degrees; and the heat dissipation base 2 is fixed below the heat dissipation upper cover plate 1, a groove 21 for placing the trapezoidal heat dissipation fins 3 is formed in the heat dissipation base, and a water inlet 4 and a water outlet 5 which are positioned on two sides of the groove are formed in the bottom of the groove.

Specifically, trapezoidal radiating fins 3 of the radiating upper cover plate 1 are clamped into grooves 21 of the radiating base 2, the rectangular size of the horizontal section of the radiating upper cover plate 1 is consistent with that of the horizontal section of the radiating base 2, so that the radiating upper cover plate 1 and the radiating base are brazed and fixed together to form an airtight channel, and the material used for the radiating upper cover plate 1 and the radiating base 2 is oxygen-free copper.

Specifically, referring to fig. 2-3, the trapezoidal heat dissipation fins 3 are disposed on one side of the heat dissipation upper cover plate 1, the five trapezoidal heat dissipation fins 3 are disposed in parallel on the heat dissipation upper cover plate 1, and the length of the trapezoidal heat dissipation fins 3 is equal to the depth of the groove 21, so that the trapezoidal heat dissipation fins 3 are clamped in the groove 21 of the heat dissipation base 2, and the groove 21 can be divided into a plurality of closed channels; the cross section of the trapezoidal radiating fin 3 is trapezoidal, a base connected with the radiating upper cover plate 1 is a thicker base body, namely the lower bottom edge of the trapezoid, when cooling water forms large-flow water flow in the radiating fin, larger root stress is formed in the cross section direction of the radiating fin, and the traditional pin type radiating structure cannot bear the stronger root stress at all, so that failure can occur in the long-term use process; the included angle between the inclined edge of the cross section of the trapezoidal radiating fin 3 and the vertical line is 1-2 degrees, and the optimal heat conduction efficiency can be generated within the design angle range; the design of the trapezoidal radiating fin 3 enables the invention to bear larger water flow pressure, effectively solves the radiating problem of a high-power chip and prolongs the service life of the chip.

Specifically, referring to fig. 4-7, a groove 21 for placing a trapezoidal heat dissipation fin 3 to form a closed channel is formed on the heat dissipation base 2, a horizontal section of the groove 21 is a rounded rectangle, a water inlet 4 and a water outlet 5 are formed at the bottom of the groove 21 and located at two sides of the groove, cooling water forms a certain water flow in an annular water tank at the side of the groove through the water inlet 4, and a water flow passage is formed through the water outlet 5; the four sides of the heat dissipation base 2 are provided with arc grooves 6 for enlarging the heat dissipation area, so that the heat dissipation area of the micro-channel device is increased, and the heat dissipation efficiency is further improved.

The heat dissipation device is novel in structure and stable in operation, when the heat dissipation device is used, the trapezoidal heat dissipation fins 3 are clamped with the grooves 21, the heat dissipation upper cover plate 1 and the heat dissipation base 2 are brazed to form a closed channel, cooling water flows in through the water inlet 4 and flows out through the water outlet 5 to form a water flow channel to cool a chip, when the cooling water forms large-flow water flow in the trapezoidal heat dissipation fins, large root stress is formed in the cross section direction of the heat dissipation fins, and the microchannel device can bear large water flow pressure, so that the heat dissipation problem of a high-power chip is effectively solved.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.