阅读说明：本技术 用于冷却电气部件的流量分配器、包括这种流量分配器的半导体模块以及流量分配器的制造方法 (Flow distributor for cooling electrical components, semiconductor module comprising such a flow distributor, and method for producing a flow distributor ) 是由 乔治·韦格 于 2019-09-17 设计创作，主要内容包括：提供了一种流量分配器(1),用于将电气部件的输热流体流(2)分配跨过通过流体被冷却和/或加热的表面。该分配器包括被配置为引导该流体流跨过该表面的至少一个流动通道,这些流动通道是在两侧通过壁(4)来界定的以便在这些流动通道(3)内形成用于该流体流(2)的路径(6),并且包括延伸到该至少一个流动通道(3)中的壁段(5)；并且这些壁段(5)中的至少一个包括至少一个旁路通路(7)以连接由该壁段(5)分离的两个相邻空间(8),其中该至少一个旁路通路(7)以倾斜取向(10)从该壁段的一侧延伸到另一侧,以便为该流体流(2)的一部分建立短路流(9)。此外,提供了一种制造这种流量分配器的方法,该流量分配器具有嵌入件,该嵌入件具有本发明的流量分配器的壁结构,该嵌入件是通过注射成型或通过3D打印制造的。(A flow distributor (1) is provided for distributing a flow (2) of a heat transfer fluid of an electrical component across a surface to be cooled and/or heated by the fluid. The distributor comprises at least one flow channel configured to guide the fluid flow across the surface, the flow channels being bounded on both sides by walls (4) so as to form paths (6) for the fluid flow (2) within the flow channels (3), and comprising wall segments (5) extending into the at least one flow channel (3); and at least one of the wall sections (5) comprises at least one bypass passage (7) to connect two adjacent spaces (8) separated by the wall section (5), wherein the at least one bypass passage (7) extends from one side of the wall section to the other side in an inclined orientation (10) to establish a short-circuit flow (9) for a portion of the fluid flow (2). Furthermore, a method of manufacturing such a flow distributor is provided, the flow distributor having an insert with the wall structure of the flow distributor of the invention, the insert being manufactured by injection molding or by 3D printing.)

1. A flow distributor (1) for distributing a flow (2) of a heat-transporting fluid of an electrical component across a surface to be cooled and/or heated by the fluid, the distributor (1) comprising:

a) at least one flow channel is configured to direct the fluid flow (2) across the surface,

b) the flow channels (3) are separated from each other and bounded on both sides by walls (4) to form a path (6) for the fluid flow (2) within the flow channels (3) and comprise wall sections (5) extending into the at least one flow channel (3); and

c) at least one of the wall sections (5) comprises at least one bypass passage (7) to connect two adjacent spaces (8) separated by the wall section (5), wherein the at least one bypass passage (7) extends from one side of the wall section to the other side in an inclined orientation (10) to establish a short-circuit fluid flow (9) for a portion of the fluid flow (2).

2. A flow distributor (1) according to claim 1, wherein the wall segment (5) comprises at least one bypass passage (7) having an inclined orientation with a first angle a relative to the longitudinal direction of the walls (4), the inclined of the first angle a facing the flow direction of the fluid flow (2) so as to bypass a portion of the fluid flow and increase the swirl of the heat-transporting fluid flow within the flow channels (3).

3. A flow distributor (1) according to claim 1 or 2, wherein the bypass passage (7) comprises an inclined portion at a second angle β relative to the horizontal plane through a wall segment (5) extending perpendicular to the horizontal plane.

4. A flow distributor (1) according to any of claims 1 to 3, wherein those wall segments (5) comprise at least one bypass passage each comprising bypass passages (7), in particular perforated wall segments (5).

5. Flow distributor (1) according to any of claims 1-4, wherein the size of the bypass passages (7) is such that up to 40%, in particular up to 30%, more particularly up to 15-20%, and even more particularly up to 10-15% of the fluid flow (2) is conducted through the bypass passages (7) to the respective space (8) within the flow channel (3).

6. A flow distributor (1) for distributing a flow (2) of a heat-transporting fluid of an electrical component across a surface to be cooled and/or heated by the fluid, the distributor (1) comprising:

a) at least one flow channel is configured to direct the fluid flow (2) across the surface,

b) the flow channels (3) are separated from each other and bounded on both sides by retaining walls (4) extending in the longitudinal direction of the flow channels (3) and comprise guide wall sections (5) extending substantially perpendicularly to the longitudinal direction of the flow channels (3) in order to form a tortuous path (6) for the fluid flow (2) within the flow channels (3); and

c) at least one of the guide wall sections (5) comprises at least one bypass passage (7) to connect two adjacent meandering spaces (8) separated by the guide wall section (5), wherein the at least one bypass passage (7) extends in an inclined orientation (10) from one side to the other side of the guide wall section to establish a short-circuit fluid flow (9) for a portion of the fluid flow (2).

7. A flow distributor (1) according to claim 6, wherein the guiding wall section (5) comprises at least one bypass passage (7) having an inclined orientation with respect to the longitudinal direction of the baffle walls (4) having a first angle α, the inclined portion of which faces the flow direction of the fluid flow (2) in order to bypass a portion of the fluid flow and increase the swirl of the heat transfer fluid flow within the flow channels (3).

8. A flow distributor (1) according to claim 6 or 7, wherein the bypass passage (7) comprises an inclination of a second angle β relative to a horizontal plane by guide wall segments (5) extending perpendicular to the horizontal plane.

9. A flow distributor (1) according to any of claims 6 to 8, wherein the guide wall sections (5) comprise at least one bypass passage each comprising bypass passages (7), in particular perforated guide wall sections (5).

10. Flow distributor (1) according to any of claims 6-9, wherein the size of the bypass passages (7) is such that up to 40%, in particular up to 30%, more particularly up to 15-20%, and even more particularly up to 10-15% of the fluid flow (2) is conducted through the bypass passages (7) to the respective tortuous space (8) within the flow channel (3).

11. Flow distributor (1) according to any of claims 1 to 10, comprising a housing with an inlet manifold (12) and an outlet manifold (13) for the fluid flow (2), and comprising a bathtub (14) for receiving an insert (15) with the wall structure of the fluid distributor (1), which insert is covered by a closing plate (16) to seal the bathtub (14) outwards.

12. A flow distributor (1) according to claim 11, wherein the insert (15) comprises a two-part design with a lower structure (17) and an opposing upper structure, which each have wall structures that cooperate with each other when assembled, and with which the closure plate (16) is integrally formed.

13. A semiconductor module comprising a flow distributor (1) according to any one of claims 1 to 12.

14. An insert (15) having the wall structure of the flow distributor (1) according to any one of claims 1 to 12, the insert being manufactured by 3D printing or injection molding.

15. A method of manufacturing a flow distributor (1), wherein the insert (15) having the wall structure of the flow distributor (1) according to any one of claims 1 to 12 is manufactured by injection molding.

16. A method of manufacturing a flow distributor (1), wherein an insert (15) having a wall structure of a flow distributor (1) according to any of claims 1 to 12 is manufactured by 3D printing, the method comprising the steps of:

a) providing a computer readable medium having computer executable instructions adapted to cause a 3D printer to print the flow distributor (1); and

b) the flow distributor (1) is formed using 3D printing or additive manufacturing equipment.

17. A computer-readable medium having computer-executable instructions adapted to cause a 3D printer to print the flow distributor (1) according to any one of claims 1 to 12.