阅读说明：本技术 用于冷却电气部件的流量分配器、包括这种流量分配器的半导体模块以及流量分配器的制造方法 (Flow distributor for cooling electrical components, semiconductor module comprising such a flow distributor, and method for producing a flow distributor ) 是由 乔治·韦格 于 2019-09-17 设计创作，主要内容包括：提供了一种流量分配器(1),用于将电气部件的输热流体流(2)分配跨过通过流体被冷却和/或加热的表面。该分配器包括被配置为引导该流体流跨过该表面的至少一个流动通道,这些流动通道是在两侧通过壁(4)来界定的以便在这些流动通道(3)内形成用于该流体流(2)的路径(6),并且包括延伸到该至少一个流动通道(3)中的壁段(5)；并且这些壁段(5)中的至少一个包括至少一个旁路通路(7)以连接由该壁段(5)分离的两个相邻空间(8),其中该至少一个旁路通路(7)以倾斜取向(10)从该壁段的一侧延伸到另一侧,以便为该流体流(2)的一部分建立短路流(9)。此外,提供了一种制造这种流量分配器的方法,该流量分配器具有嵌入件,该嵌入件具有本发明的流量分配器的壁结构,该嵌入件是通过注射成型或通过3D打印制造的。(A flow distributor (1) is provided for distributing a flow (2) of a heat transfer fluid of an electrical component across a surface to be cooled and/or heated by the fluid. The distributor comprises at least one flow channel configured to guide the fluid flow across the surface, the flow channels being bounded on both sides by walls (4) so as to form paths (6) for the fluid flow (2) within the flow channels (3), and comprising wall segments (5) extending into the at least one flow channel (3); and at least one of the wall sections (5) comprises at least one bypass passage (7) to connect two adjacent spaces (8) separated by the wall section (5), wherein the at least one bypass passage (7) extends from one side of the wall section to the other side in an inclined orientation (10) to establish a short-circuit flow (9) for a portion of the fluid flow (2). Furthermore, a method of manufacturing such a flow distributor is provided, the flow distributor having an insert with the wall structure of the flow distributor of the invention, the insert being manufactured by injection molding or by 3D printing.)