阅读说明：本技术 一种液冷散热装置及散热系统 (Liquid cooling heat abstractor and cooling system ) 是由 韦士腾 徐尚龙 于 2020-09-09 设计创作，主要内容包括：本发明公开了一种液冷散热装置及散热系统,液冷散热装置包括石蜡液冷散热装置和微通道散热冷板,所述石蜡液冷散热装置一表面与热源连接,所述石蜡液冷散热装置另一表面与所述微通道散热冷板连接；散热系统包括液冷散热装置、循环水泵、传感系统、控制器、储液箱和风扇,本发明将石蜡液冷散热装置与微通道散热冷板结合使用,同时采用散热系统进行智能控制,能够效地根据热源的温度变化进行及时降温,提高散热系统的散热程度。(The invention discloses a liquid cooling heat dissipation device and a heat dissipation system, wherein the liquid cooling heat dissipation device comprises a paraffin liquid cooling heat dissipation device and a micro-channel heat dissipation cold plate, one surface of the paraffin liquid cooling heat dissipation device is connected with a heat source, and the other surface of the paraffin liquid cooling heat dissipation device is connected with the micro-channel heat dissipation cold plate; the paraffin liquid cooling heat dissipation device and the micro-channel heat dissipation cold plate are combined, meanwhile, the heat dissipation system is adopted for intelligent control, the temperature can be effectively and timely reduced according to the temperature change of a heat source, and the heat dissipation degree of the heat dissipation system is improved.)

1. A liquid cooling heat dissipation device is characterized by comprising a paraffin liquid cooling heat dissipation device and a micro-channel heat dissipation cold plate, wherein one surface of the paraffin liquid cooling heat dissipation device is connected with a heat source, and the other surface of the paraffin liquid cooling heat dissipation device is connected with the micro-channel heat dissipation cold plate;

the micro-channel heat dissipation cold plate comprises a heat dissipation cover plate (1), a transition cold plate (2) and a heat sink cold plate (3) which are sequentially connected; a cover plate liquid inlet (11) and a liquid outlet (12) are arranged on the heat dissipation cover plate (1), a transition liquid inlet (21), a confluence outlet (22), a plurality of intermediate transition inlets (23) and a plurality of straight flow channels (24) are arranged on the transition cold plate (2), the transition liquid inlet (21) is communicated with the cover plate liquid inlet (11), and the intermediate transition inlets (23) are communicated with the transition liquid inlet (21) through the straight flow channels (24); the heat sink cold plate (3) is provided with a liquid collecting port (31) and a plurality of heat sink liquid inlets (32), the liquid collecting port (31) is connected with the heat sink liquid inlets (32) through a main runner (33), and the heat sink liquid inlets (32) are communicated with the middle transition inlet (23); the liquid outlet (12), the confluence outlet (22) and the liquid confluence port (31) are communicated.

2. A liquid-cooled heat sink as recited in claim 1, further comprising: still be provided with a plurality of confluent ports (25) on transition cold drawing (2), confluent port (25) with transition inlet (21) equipartition is in the export (22) outside of converging, pass through between transition inlet (21) and adjacent confluent port (25), adjacent confluent port (25) through runner (24) intercommunication, adjacent middle transition entry (23) are still connected through runner (24) to confluent port (25).

3. A liquid-cooled heat sink as recited in claim 1, further comprising: be provided with branch runner (34) between the adjacent sprue (33) of heat sink cold plate (3), branch runner (34) constitute annular channel, make the liquid that heat sink liquid inlet (32) got into disperses branch runner (34) through sprue (33), finally gathers to liquid collecting port (31).

4. A liquid-cooled heat sink as recited in claim 3, further comprising: the width of the annular channel gradually increases towards the direction close to the liquid collecting port (31).

5. A liquid-cooled heat sink as recited in claim 1, further comprising: the paraffin liquid cooling heat dissipation device comprises a paraffin cover plate (4) and a paraffin cold plate (5), wherein the paraffin cover plate (4) is connected with the heat sink cold plate (3), a plurality of U-shaped flow channel grooves (51) are formed in the paraffin cold plate (5), the U-shaped flow channel grooves (51) are not communicated, circular ring-shaped hole grooves (52) are formed in the U-shaped flow channel grooves (51), and paraffin is filled in the hole grooves.

6. A heat dissipating system based on the liquid-cooled heat dissipating device of claim 1, wherein: the liquid cooling heat dissipation device comprises the liquid cooling heat dissipation device, a circulating water pump (61), a sensing system, a controller (63), a liquid storage box (64) and a fan (62), wherein a liquid inlet (11) of a cover plate of the liquid cooling heat dissipation device, the circulating water pump (61), the liquid storage box (64) and a liquid outlet (12) are sequentially connected, and the fan (62) is used for dissipating heat of the liquid storage box (64);

the sensing system comprises

A first pressure sensor (65) and a first temperature sensor (67) which are arranged between the cover plate liquid inlet (11) and the circulating water pump (61);

a second pressure sensor (66) and a second temperature sensor (68) arranged between the liquid storage tank (64) and the liquid outlet (12);

a liquid level sensor (610) disposed on the reservoir (64);

a third temperature sensor (69) disposed on the heat source;

the controller (63) is used for receiving signals of the sensing system and controlling the circulating water pump (61) and the fan (62) by adopting a PID feedback control method or a grading control method.

Technical Field

The invention belongs to the field of mechanical heat dissipation, and particularly relates to a liquid cooling heat dissipation device and a heat dissipation system.

Background

Aiming at the problems that the heat productivity of the existing phased array antenna is larger and larger, the independent heating units are formed by the large number of T/R components, the heat flux density is high, the local high temperature is high, and the service life of the phased array antenna is greatly reduced. The conventional heat dissipation mode of a military high-power LED is almost the conventional air cooling heat dissipation mode, on a military phased array antenna, the conventional mode is mainly the air cooling heat dissipation mode, relevant reports are reported on the liquid cooling heat dissipation technology, but the mode is limited to a theoretical stage and an experimental stage, and no practical application stage exists. Taking the chip released in the years from Inter2000 to 2019 as an example, the heat treatment power consumption of the chip is increased from 57.5W to 165W in 10 years, however, the working temperature requirement of the chip is not improved, experiments show that the reliability of the electronic component is reduced by 10% when the temperature of the electronic component is increased by 2 ℃, so an effective liquid cooling heat dissipation system needs to be developed to enter the heat dissipation use of heat sources such as a phased array antenna and the like, and the service life of the heat sources such as the phased array antenna or a high-power LED and the like is greatly prolonged.

The application number is 201520509923.X, and the patent name is Fin-type micro-channel shuttle radiator, and the Fin-type shuttle-shaped micro-channel radiator adopting laser 3D printing is disclosed, the micro-channel structure described in the radiator is composed of two mutually symmetrical channels with circular cross sections, and the flow channel between the annular channels turns to a direction close to 180 ℃, so that the flow resistance is increased, the flow of micro-channel fluid is not facilitated, and the radiating effect is limited.

The patent number 201910478924.5 entitled "high efficiency heat dissipation structure for liquid cooling channel" discloses a "C" shaped groove micro-channel, which has 6 "C" shaped groove micro-channels in a circular cooling plate, however, the micro-channel of the structure occupies a small area of the cooling plate, the flowing time of fluid in the cooling plate is not long enough, and the C-shaped groove flow channel turns too much, which is not beneficial to the fluid flowing in the micro-channel, and this results in poor heat dissipation effect.

Disclosure of Invention

The invention provides a liquid cooling heat dissipation device and a heat dissipation system, aiming at solving the technical problems that the heat dissipation efficiency of the existing heat dissipation structure is low, the heat dissipation mode is single and the heat dissipation cannot be efficiently processed by an intelligent control method.

The technical scheme adopted by the invention is as follows:

a liquid cooling heat dissipation device comprises a paraffin liquid cooling heat dissipation device and a micro-channel heat dissipation cold plate, wherein one surface of the paraffin liquid cooling heat dissipation device is connected with a heat source, and the other surface of the paraffin liquid cooling heat dissipation device is connected with the micro-channel heat dissipation cold plate;

the micro-channel heat dissipation cold plate comprises a heat dissipation cover plate, a transition cold plate and a heat sink cold plate which are sequentially connected; the heat dissipation cover plate is provided with a cover plate liquid inlet and a liquid outlet, the transition cold plate is provided with a transition liquid inlet, a confluence outlet, a plurality of intermediate transition inlets and a plurality of straight flow channels, the transition liquid inlet is communicated with the cover plate liquid inlet, and the intermediate transition inlets are communicated with the transition liquid inlet through the straight flow channels; the heat sink cold plate is provided with a liquid converging port and a plurality of heat sink liquid inlets, the liquid converging port is connected with the heat sink liquid inlets through a main runner, and the heat sink liquid inlets are communicated with the middle transition inlet; the liquid outlet, the confluence outlet and the liquid confluence port are communicated.

Furthermore, a plurality of confluence ports are further arranged on the transitional cold plate, the confluence ports and the transitional liquid inlet are uniformly distributed on the outer side of the confluence outlet, the transitional liquid inlet is communicated with the adjacent confluence ports and the adjacent confluence ports through the direct current channel, and the confluence ports are further connected with the adjacent intermediate transitional inlets through the direct current channel.

Furthermore, a branch flow channel is arranged between adjacent main flow channels of the heat sink cold plate, and the branch flow channels form an annular channel, so that liquid entering the heat sink liquid inlet is dispersed to the branch flow channels through the main flow channels and finally collected to the liquid collecting port.

Further, the width of the annular channel gradually increases towards the direction close to the liquid collecting port.

Further, paraffin liquid cooling heat abstractor includes paraffin apron and paraffin cold drawing, the paraffin apron with heat sink cold drawing is connected, be provided with a plurality of "U" type runner grooves on the paraffin cold drawing, "U" type runner groove does not communicate, be provided with ring shape hole groove in "U" type runner inslot, hole inslot intussuseption paraffin.

A heat dissipation system based on a liquid cooling heat dissipation device comprises the liquid cooling heat dissipation device, a circulating water pump, a sensing system, a controller, a liquid storage box and a fan, wherein a cover plate liquid inlet, the circulating water pump, the liquid storage box and a liquid outlet of the liquid cooling heat dissipation device are sequentially connected, and the fan is used for dissipating heat of the liquid storage box;

the sensing system comprises

The first pressure sensor and the first temperature sensor are arranged between the liquid inlet of the cover plate and the circulating water pump;

the second pressure sensor and the second temperature sensor are arranged between the liquid storage tank and the liquid outlet;

a liquid level sensor arranged on the liquid storage tank;

a third temperature sensor disposed on the heat source;

the controller is used for receiving signals of the sensing system and controlling the circulating water pump and the fan by adopting a PID feedback control method or a grading control method.

In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:

the paraffin liquid cooling heat dissipation device and the micro-channel heat dissipation cold plate are combined for use, and a grading control method is used as one control method, so that the temperature can be effectively reduced in time according to the temperature change of a heat source, and the heat dissipation degree of a heat dissipation system is improved;

the structure of the paraffin heat dissipation device adopts a U-shaped runner groove, a paraffin circular ring mounting hole groove is arranged in the middle of the U-shaped runner groove of the array, paraffin can absorb most of heat generated by a heat source in the liquefaction process, cooling liquid can smoothly and orderly circulate in the runner groove, and the heat can be further transferred to a microchannel heat dissipation cold plate on the other side.

The liquid in the microchannel heat dissipation cold plate is rapidly dispersed in the transition cold plate and enters the heat sink cold plate together, the main flow channel and the branch flow channels are mutually staggered to form various paths to generate a plurality of mixed flows, so that the temperature of each position in the microchannel heat dissipation cold plate is uniform, the phenomenon of local high temperature is avoided, and the function of efficient heat dissipation can be achieved.

In the heat sink cold plate, the width of the annular channel is increased outwards layer by layer, so that the highest temperature of a heat source is reduced by 5 ℃ relative to the traditional parallel flow channel, the heat dissipation efficiency is further improved, and the purpose of efficient heat dissipation is achieved.

In a heat dissipation system, the liquid level sensor is placed in the liquid storage tank, and once the liquid storage tank, the pipeline or the microchannel is subjected to heat sinking to cause the situations of water leakage and water shortage, the liquid level sensor can rapidly detect the situations.

Drawings

The invention will now be described, by way of example, with reference to the accompanying drawings, in which:

FIG. 1 is a schematic structural diagram of a liquid-cooled heat dissipation device according to the present invention;

FIG. 2 is a schematic structural view of a heat-dissipating cover plate according to the present invention;

FIG. 3 is a schematic diagram of a transitional cold plate according to the present invention;

FIG. 4 is a schematic diagram of the structure of the heat sink cold plate of the present invention;

FIG. 5 is a schematic view of the structure of the paraffin cold plate of the present invention;

FIG. 6 is a graph of the temperature profile of a heat sink plate in the first experiment of the present invention;

FIG. 7 is a graph of the velocity profile of a heat sink plate in the first experiment of the present invention;

FIG. 8 is a graph showing the temperature distribution of the heat sink cold plate in experiment two of the present invention;

FIG. 9 is a schematic view of a prior art DC channel cooling plate;

FIG. 10 is a graph of prior art DC channel simulation results;

FIG. 11 is a system architecture diagram of the heat dissipation system of the present invention;

reference numerals:

1-heat-dissipating cover plate, 11-cover plate liquid inlet, 12-liquid outlet, 2-transitional cold plate, 21-transitional liquid inlet, 22-confluence outlet, 23-intermediate transitional inlet, 24-straight flow channel, 25-confluence outlet, 3-heat sink cold plate, 31-confluence outlet, 32-heat sink liquid inlet, 33-main flow channel, 34-branch flow channel, 4-paraffin cover plate, 5-paraffin cold plate, 51-flow channel groove, 52-circular hole groove, 61-circulating water pump, 62-fan, 63-controller, 64-liquid storage tank, 65-first pressure sensor, 66-second pressure sensor, 67-first temperature sensor, 68-second temperature sensor, 69-third temperature sensor, 610-liquid level sensor, 611-LEDs, 612-touch screen.

Detailed Description

All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.

The present invention will be described in detail with reference to the accompanying drawings.