阅读说明：本技术 电子装置的封装基板结构及其制造方法 (Packaging substrate structure of electronic device and manufacturing method thereof ) 是由 陈旭东 张智明 赖文钦 丁国斌 于 2019-01-30 设计创作，主要内容包括：本发明公开一种电子装置的封装基板结构及其制造方法。所述电子装置的封装基板结构包括：一复合式电路板,包括由一硬板、一软板及一接触垫所构成的电路板；一芯片,通过一粘结材固定于该硬板的一芯片区上,其中该芯片区的表面是经历表面改质处理,而改变该粘结材于该表面的润湿性,避免粘结胶体溢流；以及一封合材,设置于该硬板上,以包覆并保护该芯片。(The invention discloses a packaging substrate structure of an electronic device and a manufacturing method thereof. The package substrate structure of the electronic device comprises: a composite circuit board, which comprises a circuit board composed of a hard board, a soft board and a contact pad; a chip fixed on a chip region of the hard board by an adhesive material, wherein the surface of the chip region is subjected to surface modification treatment to change the wettability of the adhesive material on the surface and avoid overflow of the adhesive colloid; and a sealing material arranged on the hard board to cover and protect the chip.)

1. A package substrate structure of an electronic device, comprising:

the composite circuit board comprises a circuit board consisting of a hard board, a soft board and a contact pad;

the chip is fixed on the chip area of the hard board through the adhesive material, wherein the surface of the chip area is subjected to surface modification treatment, so that the wettability of the adhesive material on the surface is changed, and the overflow of the adhesive colloid is avoided; and

the sealing material is arranged on the hard board to cover and protect the chip.

2. The package substrate structure of claim 1, wherein the hard plate and the contact pad are made of epoxy resin, phenolic resin, polyimide, polyurethane formaldehyde, fiberglass, teflon, ceramic, or any combination thereof.

3. The package substrate structure of claim 1, wherein the rigid board has a flat surface, and the chip is directly bonded and fixed on the chip area.

4. The package substrate structure of claim 1, wherein the bottom of the hard plate has a bottom plate, and wherein an open area penetrates the hard plate and exposes a surface of the bottom plate to provide the chip region for accommodating a chip.

5. The package substrate structure of claim 1, wherein an open area extends into the hard plate to form a cavity and expose an inner surface of the hard plate to provide the chip region for receiving a chip.

6. A package substrate structure according to any of claims 3 to 5, wherein the surface modification treatment comprises a plasma treatment process.

7. The package substrate structure of any of claims 3 to 5, wherein the surface modification treatment comprises coating a coating or forming a barrier wall around the chip region by the coating.

8. The package substrate structure of any of claims 3 to 5, wherein the surface modification treatment comprises a surface roughening step to make the chip region have a rough surface.

9. The package substrate structure of claim 1, wherein the chip comprises an integrated circuit chip, an image sensor chip, a display device chip, or an integrated optical device chip.

10. The package substrate structure of claim 1, wherein the flexible board is a flexible substrate comprising polyimide.

11. A method for manufacturing a package substrate structure of an electronic device comprises the following steps:

providing a composite circuit board comprising a hard board, a soft board and a contact pad;

fixing the chip on the chip area of the hard board through an adhesive material, wherein the surface of the chip area is subjected to surface modification treatment, so that the wettability of the adhesive material on the surface is changed, and the overflow of an adhesive colloid is avoided; and

and covering the sealing material and protecting the chip on the hard board.

12. The method according to claim 11, wherein the hard plate and the contact pad are made of epoxy resin, phenolic resin, polyimide, polyurethane-formaldehyde, fiberglass, teflon, ceramic, or any combination thereof.

13. The method for manufacturing a package substrate structure as claimed in claim 11, wherein the rigid board has a flat surface and directly bonds and fixes the chip to the chip area.

14. The method as claimed in claim 11, wherein the bottom of the rigid board has a bottom plate, and wherein an opening region is formed to penetrate the rigid board and expose a surface of the bottom plate to provide the chip region for accommodating a chip.

15. The method as claimed in claim 11, wherein an open area is formed to penetrate into the hard plate to form a cavity and expose an inner surface of the hard plate to provide the chip region for accommodating a chip.

16. The method of fabricating a package substrate structure according to any of claims 13 to 15, wherein the surface modification process is a plasma processing procedure.

17. The method according to any of claims 13-15, wherein the surface modification treatment comprises coating a coating or forming a barrier wall around the chip region.

18. The method according to any of claims 13-15, wherein the surface modification treatment comprises a surface roughening step to make the chip region have a rough surface.

19. The method of claim 11, wherein the chip comprises an integrated circuit chip, an image sensor chip, a display device chip, or an integrated optical device chip.

20. The method of claim 11, wherein the flexible substrate is a flexible substrate comprising polyimide.

Technical Field

The present invention relates to a package substrate structure of an electronic device, and more particularly, to a package structure of a modular electronic device and a method for manufacturing the same.

Background

As research and development of electronic devices, such as smart phones, tablet computers and notebook computers, are gradually developed toward light, thin and high performance, research and development approaches of internal components, such as circuit boards, are also gradually miniaturized. A combined circuit board module formed by combining a flexible circuit board (flexible circuit board) and a rigid circuit board (rigid circuit board) is a direction in which the development of the combined circuit board module is greatly advanced.

The solution for solving the problem of thinning the packaged circuit board further comprises the step of flip-chip mounting the electronic element chip in a concave groove on the circuit board, so that the overall height of the modular packaged circuit board structure is reduced. However, the cost of manufacturing miniaturized flip-chip packages is high, and the difficulty of manufacturing is also increased greatly. In addition, in the process of flip-chip mounting the electronic component chip on the circuit board, the colloid for bonding the electronic component chip and the circuit board is easy to overflow laterally to the side surface of the chip, which affects the electrical property and causes the reduction of the quality reliability.

Disclosure of Invention

In view of the above, the present invention provides a package substrate structure of a modular electronic device and a method for manufacturing the same, which changes the wettability (wettability) of the adhesive material on the surface of the circuit board through a proper surface modification process to avoid the overflow phenomenon of the adhesive.

According to an aspect of the present invention, a package substrate structure of an electronic device is provided, including: a composite circuit board, which comprises a circuit board composed of a hard board, a soft board and a contact pad; a chip fixed on a chip region of the hard board by an adhesive material, wherein the surface of the chip region is subjected to surface modification treatment to change the wettability of the adhesive material on the surface and avoid overflow of the adhesive colloid; and a sealing material arranged on the hard board to cover and protect the chip.

According to another aspect of the present invention, a method for manufacturing a package substrate structure of an electronic device is provided, including: providing a composite circuit board comprising a hard board, a soft board and a contact pad; fixing a chip on a chip region of the hard board through an adhesive material, wherein the surface of the chip region is subjected to surface modification treatment, so that the wettability of the adhesive material on the surface is changed, and the overflow of an adhesive colloid is avoided; and coating a sealing material and protecting the chip on the hard board.

Additional aspects of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The aspects of the invention will be understood and attained by means of the elements and combinations particularly pointed out in the appended claims. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.

Drawings

The present invention will be understood and appreciated more fully from the detailed description of various embodiments of the invention, taken in conjunction with the accompanying drawings of which:

fig. 1A to fig. 1C are schematic cross-sectional views of package substrate structures of electronic devices according to various embodiments of the invention; and

fig. 2 is a partially enlarged schematic view of a chip region of a package substrate structure according to an embodiment of the invention.

Description of the symbols

100a, 100b, 100c package substrate structure

110 hard board

111. 111a, 111b, 111c chip regions

112 open area

114 open area

120 soft board

130 contact pad

140 chip

145 adhesive colloid

150 sealing material

160 base plate

180 barrier wall

Detailed Description

The invention discloses a packaging substrate structure of a modularized electronic device and a manufacturing method thereof. The glue overflow phenomenon is that the side of the bonding glue body overflows outwards to the side face of the chip, and then the electrical property of the flip chip package and the reduction of the product reliability are influenced. In order to make the description of the present invention more complete and complete, reference is made to the following description taken in conjunction with the accompanying drawings, wherein like reference numerals represent like elements. However, the devices, elements and process steps described in the following examples are only for illustrating the present invention and are not intended to limit the scope of the present invention.

Fig. 1A is a schematic cross-sectional view illustrating a package substrate structure of an electronic device according to an embodiment of the invention. As shown in fig. 1A, a package substrate structure 100a of an electronic device includes a circuit board module composed of a hard board 110, a soft board 120 and a contact pad 130. The hard board 110 and the contact pad 130 can be made of a rigid circuit board with the same material and height, such as epoxy resin and glass cloth meeting IPC standard 1017. The hard plate 110 and the contact pad 130 are made of epoxy resin, phenolic resin, polyimide, polyurethane-formaldehyde, glass fiber, teflon, ceramic, or any combination thereof. The flexible board 120 is a flexible substrate including Polyimide (PI). The contact pads 130 are configured to connect to an external circuit or control unit.

A chip 140 is fixed on a chip region 111a of the hard plate 110 by an adhesive 145. The hard board 110 has a substantially flat surface, and the chip 140 is directly bonded and fixed on the chip region 111a, wherein the surface of the chip region is subjected to a surface modification treatment to change the wettability of the bonding material 145 on the surface, thereby avoiding the overflow phenomenon of the bonding colloid.

A sealing material 150 disposed on the hard plate 110 to cover and protect the chip 140.

Fig. 1B is a schematic cross-sectional view illustrating a package substrate structure of an electronic device according to another embodiment of the invention. As shown in fig. 1B, a package substrate structure 100B of an electronic device includes a circuit board module composed of a hard board 110, a soft board 120 and a contact pad 130.

The bottom of the rigid plate 110 has a bottom plate 160, such as a stainless steel sheet or metal foil. An open area 112 penetrates the hard plate 110 and exposes the surface of the bottom plate 160 to provide the chip region 111b for accommodating a chip. A chip 140 is fixed on the chip region 111a by an adhesive 145. The surface of the chip region is subjected to surface modification treatment to change the wettability of the adhesive 145 on the surface, thereby avoiding the overflow phenomenon of the adhesive.

A sealing material 150 disposed on the hard plate 110 to cover and protect the chip 140.

Fig. 1C is a schematic cross-sectional view illustrating a package substrate structure of an electronic device according to another embodiment of the invention. As shown in fig. 1C, a package substrate structure 100C of an electronic device includes a circuit board module composed of a hard board 110, a soft board 120 and a contact pad 130.

An open region 114 extends into the hard plate 110 to form a cavity and expose the inner sidewall and bottom surface of the hard plate to provide the chip region 111c for accommodating a chip. A chip 140 is fixed on the chip region 111c by an adhesive 145. According to an embodiment of the present invention, the chip 140 includes an integrated circuit chip, an image sensor chip, a display device chip, or an integrated optical device chip. The surface of the chip region is subjected to surface modification treatment to change the wettability of the adhesive 145 on the surface, thereby avoiding the overflow phenomenon of the adhesive.

A sealing material 150 disposed on the hard plate 110 to cover and protect the chip 140.

In the package substrate structure provided in the above embodiment, the surface of the chip region is subjected to surface modification treatment, so as to change the wettability of the adhesive material on the surface and avoid the overflow phenomenon of the adhesive colloid. According to an embodiment of the present invention, the surface modification process includes a plasma treatment process, such as a carbon tetrafluoride or argon plasma treatment step, to change the surface polarity of the chip region by bombarding the surface of the chip region with charged particles, thereby causing the contact angle between the adhesive colloid and the surface to change. When the contact angle is greater than a specific angle, for example, when the contact angle is < 32 °, the flooding phenomenon can be effectively prevented.

According to another embodiment of the present invention, the surface modification treatment comprises applying a coating, such as ink, on the surface of the chip region to change the hydrophilicity of the surface, thereby causing the contact angle between the adhesive colloid and the surface to change. Alternatively, a barrier rib 180 is formed around the chip region by the coating (see fig. 2) to prevent the adhesive from overflowing.

Fig. 2 is a partially enlarged schematic view of a chip region of a package substrate structure according to an embodiment of the invention. An opening region 112/114 is formed in the hard board 110 to form a chip accommodating space, and the bottom surface of the opening region is a chip region 111. A coating layer, such as ink, oil material, solder mask, text ink, is applied to the surface of the chip region, or a barrier wall 180 is formed around the chip region 111 by the coating layer. When the flip-chip packaging step is performed, the chip 140 is placed in the chip region, so that the adhesive 145 can be effectively prevented from overflowing.

According to another embodiment of the present invention, the surface modification treatment comprises a surface roughening step to make the chip region have a rough surface, for example, a plasma treatment is used to form a matte surface, and the rough surface can be left naturally after removing the copper foil. When the surface roughness reaches a specific critical value or range, for example, by using a copper foil with a copper surface roughness of less than or equal to 8 μm, the adhesive colloid can be effectively prevented from overflowing, the electrical property can be prevented from deteriorating, and the reliability can be improved.

According to the above embodiments, the present invention further provides a method for manufacturing a package substrate structure of an electronic device, which includes providing a composite circuit board including a hard board 110, a soft board 120 and a contact pad 130. The flip-chip package process is performed, a chip 140 is fixed on a chip region 111 of the hard board by an adhesive 145, wherein the surface of the chip region is subjected to surface modification treatment to change the wettability of the adhesive on the surface and prevent the adhesive from overflowing. A sealant 150 is used to cover and protect the chip on the rigid board.

The surface modification treatment is a plasma treatment process, which is to coat a coating or form a barrier wall around the chip region by the coating, or to perform a surface roughening step to make the chip region have a rough surface. Based on proper surface modification treatment steps, the wettability of the bonding material on the surface of the circuit board is improved, the electrical property deterioration caused by the overflow phenomenon of the bonding colloid is effectively avoided, and the reliability of the product is improved.

Although the present invention has been described in connection with the preferred embodiments, it is not intended to limit the scope of the invention, and those skilled in the art will recognize that many changes and modifications may be made thereto without departing from the spirit and scope of the invention. The scope of the invention should be determined from the following claims.