阅读说明：本技术 一种电路板以及电子设备 (Circuit board and electronic equipment ) 是由 李茂兴 余航 于 2020-03-23 设计创作，主要内容包括：本发明公开了一种电路板以及电子设备。所述电路板包括：电路板本体,所述电路板本体开设有通槽；加强部,所述电路板本体设置于所述加强部上；芯片,所述芯片设置在所述加强部上且位于所述电路板的通槽内,所述芯片与所述电路板本体电性连接；所述芯片与所述加强部正对的表面具有第一区域和第二区域,所述第一区域与所述加强部形成缓冲空间；所述第二区域涂覆有粘结剂,所述芯片通过所述粘接剂与所述加强部固定连接。本发明有效改善了电路板中芯片翘曲状况。(The invention discloses a circuit board and an electronic device. The circuit board includes: the circuit board comprises a circuit board body, wherein the circuit board body is provided with a through groove; the circuit board body is arranged on the reinforcing part; the chip is arranged on the reinforcing part and positioned in the through groove of the circuit board, and the chip is electrically connected with the circuit board body; the surface of the chip opposite to the reinforcing part is provided with a first area and a second area, and the first area and the reinforcing part form a buffer space; the second area is coated with an adhesive, and the chip is fixedly connected with the reinforcing part through the adhesive. The invention effectively improves the warping condition of the chip in the circuit board.)

1. A circuit board, comprising:

the circuit board comprises a circuit board body, wherein the circuit board body is provided with a through groove;

the circuit board body is arranged on the reinforcing part;

the chip is arranged on the reinforcing part and positioned in the through groove of the circuit board, and the chip is electrically connected with the circuit board body;

the surface of the chip opposite to the reinforcing part is provided with a first area and a second area, and the first area and the reinforcing part form a buffer space; the second area is coated with an adhesive, and the chip is fixedly connected with the reinforcing part through the adhesive.

2. The circuit board of claim 1, wherein a recessed groove is provided on the reinforcing portion at a position corresponding to the first region of the chip, the recessed groove constituting the buffer space.

3. The circuit board of claim 1, wherein a carrier is disposed on the stiffener at a position corresponding to the second region of the chip;

the second area of the chip is fixedly connected with the bearing part through the adhesive, and the first area of the chip, the bearing part and the reinforcing part form the buffer space.

4. The circuit board of claim 2, wherein the length of the first direction of the recess slot is less than the length of the first direction of the chip.

5. The circuit board of claim 3, wherein the carrier is at least one of black glue and gold balls wound by gold wires.

6. The circuit board of claim 3, wherein the thickness of the carrier in the second direction is less than the thickness of the circuit board body in the second direction, the second direction being perpendicular to the first direction.

7. The circuit board of claim 1, wherein the stiffener is a metal stiffener.

8. The circuit board of claim 1, wherein the chip is at least one of a photo sensor chip, a pressure sensor chip, an inertial sensor chip, and a temperature sensor chip.

9. An electronic device, characterized in that the electronic device comprises a circuit board according to any one of claims 1 to 8.

Technical Field

The present invention relates to the field of semiconductor technologies, and in particular, to a circuit board and an electronic device.

Background

At present, under the conventional chip structure of 1/2.6' inch and smaller, the packaging structure of the chip is as follows: the chip is directly fixed on the circuit board. For example, the small photosensitive chip adopts the packaging structure, and under the condition of ensuring the reliability of the optical filter of the camera module, the influence of dirt on photographing can be effectively reduced.

However, with the diversified demands of users, the small chip cannot meet the demands of users, and the large chip integrates more functions. If the chip with large size still adopts the packaging structure, the defects are as follows: the chip of large-scale size need be fixed on bigger size's circuit board, and the size is big more as the circuit board, and the deformation risk is bigger in the processing procedure, and the deformation of circuit board further influences the roughness of chip, leads to the chip warpage.

Disclosure of Invention

The invention aims to provide a novel technical scheme of a circuit board to solve the technical problem that a chip is easy to warp and deform in the prior art.

To solve the above technical problem, the embodiment of the present invention is implemented as follows:

in a first aspect, a circuit board is provided. The circuit board includes:

the circuit board comprises a circuit board body, wherein the circuit board body is provided with a through groove;

the circuit board body is arranged on the reinforcing part;

the chip is arranged on the reinforcing part and positioned in the through groove of the circuit board, and the chip is electrically connected with the circuit board body;

the surface of the chip opposite to the reinforcing part is provided with a first area and a second area, and the first area and the reinforcing part form a buffer space; the second area is coated with an adhesive, and the chip is fixedly connected with the reinforcing part through the adhesive.

In a second aspect, an electronic device is provided. The electronic equipment comprises a shell and the circuit board;

the circuit board is disposed in the housing.

In the embodiment of the invention, the surface of the chip opposite to the reinforcing part is provided with the first area and the second area, and the problem of chip warping deformation of the circuit board is effectively solved by forming the buffer space between the first area and the reinforcing part.

Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.

Fig. 1 is a schematic diagram of a circuit board structure according to the present invention.

FIG. 2 is a second schematic diagram of the circuit board structure of the present invention.

Fig. 3 is a third schematic diagram of the circuit board structure according to the present invention.

FIG. 4 is a fourth schematic diagram of the circuit board structure of the present invention.

Description of reference numerals:

01-a circuit board body; 02-a reinforcement; 03-adhesive; 04-chip; 05-a buffer region; 06 through grooves; 07-an electrical connection wire; 00-a bearing part; 031-an adhesive located in the second region; 032-an adhesive located in said first region.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

According to one embodiment of the present disclosure, a circuit board is provided. Referring to fig. 1 to 2, the circuit board includes:

the circuit board comprises a circuit board body 01, wherein a through groove 06 is formed in the circuit board body; for example, during the manufacturing process, the through groove 06 is formed by directly digging a hole on the circuit board body 01.

The circuit board body 01 is arranged on the reinforcing part 02; for example, the reinforcing part 02 is fixedly connected with the circuit board body 01; for example, an adhesive is used to fix the two components, or the circuit board body 01 and the reinforcing portion 02 may be integrally formed during the manufacturing process.

The chip 04 is arranged on the reinforcing part 02 and is positioned in the through groove 06, and the chip 04 is electrically connected with the circuit board body 01; for example, the chip 04 and the circuit board body 01 are electrically connected through the electrical connection line 07.

The surface of the chip 04 opposite to the reinforcing part 102 is provided with a first area and a second area, and the first area and the reinforcing part form a buffer space 05; the second region is coated with an adhesive 031, and the chip 04 is fixedly connected to the reinforcing portion 102 by the adhesive 031.

For example, the chip 04 has a predetermined shape, and the chip 04 may have a rectangular shape, a circular shape, or the like. The surface of the chip 04 facing the reinforcing part is provided with a first area and a second area, wherein the first area is a central area of the chip, and the second area is an edge area of the chip; wherein the central region may be understood as a region close to the geometric center of the chip and the edge region may be understood as a region away from the geometric center of the chip.

The surface of the chip of the present embodiment, which is opposite to the reinforcing part, is provided with a first area and a second area, and the problem of chip warpage deformation of the circuit board is effectively solved by forming a buffer space between the first area and the reinforcing part.

In an alternative embodiment, referring to fig. 1, a concave groove is formed in the position of the reinforcing portion 02 corresponding to the first region B of the chip, and the concave groove forms the buffer space 05.

For example, a through groove 06 is formed in the circuit board body 01 by using equipment, wherein the shape of the through groove 06 includes a rectangle, a circle and the like, and the shape of the through groove 06 is not limited in the present invention, wherein the shape of the through groove 06 matches with the shape of the chip 04. When the reinforcing part 02 is fixed with the circuit board body 01 provided with the through groove 06, the through groove 06 can expose partial surface of the reinforcing part, and the chip 04 is arranged in the through groove 06.

When the chip 04 is disposed in the through groove 06, the second area a of the chip 04 is coated with an adhesive 031, and the chip 04 is fixedly connected to the reinforcing part 102 by the adhesive 031 coated on the second area a.

The reinforcing part 02 is provided with a concave groove at a position corresponding to the first region B of the chip, when the chip 04 is fixed on the reinforcing part 02 through an adhesive 031, the first region B of the chip is suspended, a gap is formed between the first region B and the concave groove, and the height of the gap is substantially consistent with the depth of the concave groove. The buffer space 05 of the present example is specifically configured as follows: the surface of the first region B and the inner side wall of the concave groove are enclosed to form the buffer space 05, and the warping condition of the chip is effectively improved through the structural design of the circuit board.

In this example, the circuit board body 01 is provided with the through-grooves 06 by a grooving process, thereby forming the circuit board body 01 having the through-grooves 06. Fixedly connecting a circuit board body 01 with a through groove 06 with a reinforcing part 02, wherein the reinforcing part 02 can improve the rigidity of the circuit board body on one hand; on the other hand, the chip 04 is conveniently arranged on the circuit board.

Optionally, the size of the through-groove 06 is larger than that of the chip 04, so that the chip 06 can be disposed in the through-groove 06 to be fixed with the reinforcement 02; when the chip 06 is disposed in the through groove 06 and fixed to the reinforcing portion 02, a regulation region is formed between the side wall of the chip 04 and the circuit board body 01, wherein the regulation region is configured as follows: the side wall of the chip 04, the side wall of the circuit board body 01 and the upper surface of the reinforcing part 02 close to the circuit board body 01 are enclosed to form the adjusting area. The adjusting area is used for reducing the bending degree of the chip when the chip is bent due to the fact that the adhesive 031 is cured, and the chip is pressed against the side wall of the circuit board body 01 when the chip is bent, so that the bending deformation of the chip is improved.

In an alternative example, refer to fig. 3, wherein the embodiment is different from fig. 1 in that an adhesive 03 is applied on a surface of the chip opposite to the reinforcing part in the embodiment, and the adhesive 03 includes an adhesive 032 located in the first region B and an adhesive 031 located in the second region a.

In the present embodiment, the chip 04 is disposed in the through groove 06, wherein the adhesive 031 in the second area a fixes the chip 04 on the reinforcing portion 02, so as to improve the connection between the chip and the reinforcing portion.

In this example, a buffer space 05 is formed between the adhesive 032 located in the first region and the reinforcing part 102, and the buffer space 05 is used to bring the adhesive 032 located in the first region into contact with the outside air.

In this example chip 04, when it is fixed to reinforcing portion 02 by adhesion, buffer space 05 can be formed between the adhesive in the first region and reinforcing portion 02; after the buffer space is formed, the adhesive in the first area and the adhesive in the second area can be in contact with the outside air, the curing speeds of the adhesive in the first area and the adhesive in the second area are kept consistent, the curing speeds of the adhesives coated at different positions are kept consistent, the internal stress is uniformly distributed, the problem of warping deformation of the chip can be effectively solved, and the function of the chip is optimized. For example, when the chip is a photosensitive chip, the circuit board of the example can improve the warping deformation degree of the photosensitive chip; when the sensitization chip is used to the module of making a video recording, can improve the quality of shooing of the module of making a video recording.

In an alternative embodiment, referring to fig. 2, a bearing part 00 is disposed on the reinforcing part 02 at a position corresponding to the second region a of the chip; the carrier part 00 is fixedly connected to the adhesive 031, and the first region B of the chip, the carrier part 00, and the reinforcing part 02 form the buffer space 05.

The carrier part 00 has a predetermined height, and when the carrier part 00 is fixedly connected with the adhesive 031 located in the second region, the first region B of the chip is suspended, wherein the buffer space is specifically configured as follows: the surface of the first region, two side surfaces opposite to the two bearing parts 00, and the upper surface of the reinforcing part close to the circuit board body 01 are encircled to form the buffer region. The structural design of the circuit board can effectively reduce the warping deformation degree of the chip.

In an alternative embodiment, refer to fig. 4, wherein the embodiment is different from fig. 2 in that the surface of the chip opposite to the reinforced portion is coated with an adhesive 03 in the embodiment, and the adhesive 03 includes an adhesive 032 located in the first region B and an adhesive 031 located in the second region a. When the chip 04 is lifted by the carrier part 00, the adhesive 032 located in the second region a is fixedly connected to the lifting pad, the adhesive 032 located in the first region is suspended, and a buffer space 05 is formed between the adhesive 032 located in the first region and the reinforcing part 102.

This example can realize the effect that the curing speed of the adhesive 032 located in the first region is consistent with that of the adhesive 031 located in the second region, and during the curing process, the internal stresses of the adhesive 032 located in the first region and the adhesive 031 located in the second region are consistent, so that the spaces where the first region and the second region of the chip are pulled down by the adhesive are consistent, and when the adhesive 03 is used to fix the chip to the circuit board 01, the degree of warpage deformation of the chip is effectively reduced.

In an alternative embodiment, referring to fig. 2 and 4, the bearing part 00 is at least one of black glue and gold ball wound by gold wire. For example, the bearing part 00 is a three-dimensional structure, and a fixing structure with a certain height is formed by coating and curing black glue, for example, and the fixing structure is the bearing part 00. It can be understood that, the local part of the reinforcing part is subjected to the heightening treatment by adopting the mode, so that the area which is not subjected to the heightening treatment is correspondingly suspended, and the warping deformation condition of the chip can be effectively improved.

Optionally, the shape of the bearing part 00 includes but is not limited to: long strips, spaced long strips, long strips shaped like a Chinese character mi, sinusoidal waveforms, square waveforms, etc.

In an alternative embodiment, referring to fig. 1, the length of the first direction of the recess groove is smaller than the length of the first direction of the chip. Wherein the first direction is the direction of arrow a in fig. 1; when the length of the first direction of the concave groove is smaller than that of the chip, on one hand, the chip 04 is convenient to be fixed on the reinforcing part 02; on the other hand, the adhesive 032 located in the first region is located above the concave groove, and the first region and the concave groove form the buffer region 05, so that the problem of warpage of the chip can be solved.

In an alternative embodiment, the reinforcement 02 is a metal reinforcement plate. For example, the metal reinforcing plate is a steel plate.

In an alternative embodiment, as shown in fig. 2 and 4, the thickness of the bearing part 00 in the second direction is smaller than the thickness of the circuit board body 01 in the second direction, and the second direction is perpendicular to the first direction. Wherein the second direction is the direction indicated by arrow b. When the thickness of the bearing part 00 in the second direction is smaller than that of the circuit board body 01 in the second direction, when the chip is bent, the chip is propped against the side wall of the circuit board body 01, so that the bending degree of the second area of the chip is reduced, the bending degrees of the first area B and the second area A of the chip are balanced, and the bending degree of the chip is improved.

In an optional embodiment, the chip 04 is at least one of a photosensitive chip, a pressure sensor chip, an inertial sensor chip, and a temperature sensor chip.

For example, when the chip 04 is a photosensitive chip, the size of the photosensitive chip may be 1/5 "-1/3" -1/2.6 "to 1/1.7" or even larger, and the large-size photosensitive chip is adopted to increase the number of pixels under the condition of the same pixel size, so as to improve the photographing resolution; the large-size photosensitive chip is adopted, so that the area of a single pixel point can be increased under the same resolution, the lighting capacity of the pixel point is improved, and the photographing effect in a dark environment is improved. When set up the sensitization chip on the circuit board, can effectively solve the warpage problem of chip, improve the roughness of sensitization chip, when the sensitization chip was used to the module of making a video recording, improved the imaging quality of the module of making a video recording simultaneously.

Optionally, when the chip groups are formed by combining different types of chips, the flatness of the surfaces of the chips can be improved by arranging the chip groups on the circuit board; when the chip set is applied to the electronic equipment, the functions of the electronic equipment are enriched.

According to another aspect of the present invention, an electronic device is provided. The electronic device includes:

a housing and the circuit board; the circuit board is disposed in the housing. When the circuit board is applied to electronic equipment, the functions of the electronic equipment can be improved and optimized, and the diversified requirements of users are met.

While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.