阅读说明：本技术 半导体封装结构及其形成方法 (Semiconductor packaging structure and forming method thereof ) 是由 黄文宏 于 2021-07-22 设计创作，主要内容包括：本发明涉及一种半导体封装结构及其形成方法。该半导体封装结构包括：第一基板,包括内埋于第一基板的电子元件；第二基板,位于第一基板上方；其中,电子元件通过第二基板与第一基板电性连接。(The invention relates to a semiconductor packaging structure and a forming method thereof. The semiconductor package structure includes: a first substrate including an electronic element embedded therein; a second substrate positioned above the first substrate; the electronic element is electrically connected with the first substrate through the second substrate.)