阅读说明：本技术 用于生热组件的冷却设备和方法 (Cooling apparatus and method for heat generating assembly ) 是由 大卫·赫伯特·利文斯顿 于 2018-10-16 设计创作，主要内容包括：一种冷却设备,其具有内部通道,该内部通道限定了分开的第一流动回路和第二流动回路,每个流动回路构造成以第一质量流率和第二质量流率引导冷却剂,以冷却该冷却设备的分开的第一表面和第二表面。内部通道进一步限定了冷却通道,第一流动回路和第二流动回路汇聚到其中,以冷却该冷却设备的分开的第三表面和第四表面。冷却设备可以用于同时冷却具有相似或不同冷却要求的多个电子元器件。(A cooling apparatus having an internal passage defining separate first and second flow circuits, each flow circuit configured to direct coolant at first and second mass flow rates to cool separate first and second surfaces of the cooling apparatus. The internal passage further defines a cooling passage into which the first and second flow circuits converge to cool separate third and fourth surfaces of the cooling apparatus. The cooling apparatus may be used to simultaneously cool a plurality of electronic components having similar or different cooling requirements.)

1. A cooling apparatus comprising an internal passage defining separate first and second flow circuits, each flow circuit configured to direct coolant at first and second mass flow rates to cool separate first and second surfaces of the cooling apparatus, the internal passage further defining a cooling passage into which the first and second flow circuits converge to cool separate third and fourth surfaces of the cooling apparatus.

2. The cooling apparatus of claim 1, wherein the first mass flow rate and the second mass flow rate are substantially equal.

3. The cooling apparatus of claim 1, wherein the first mass flow rate and the second mass flow rate are not equal.

4. The cooling apparatus of claim 1, wherein the first and second surfaces of the cooling apparatus are configured to be in thermal contact with a thyristor.

5. The cooling device of claim 1, wherein the third and fourth surfaces of the cooling device are configured to be in thermal contact with a resistor.

6. The cooling apparatus of claim 1, further comprising a first set of serpentine cooling microchannels and a second set of serpentine cooling microchannels adapted to flow a coolant therethrough to cool the first surface and the second surface of the cooling apparatus.

7. The cooling apparatus of claim 1, wherein the first flow circuit includes a cooling channel defined by and between the first cooling plate and the mounting block, the cooling channel defined by and between the second cooling plate and the cover plate, and the second flow circuit includes a cooling channel defined by and between the cover plate and the third cooling plate.

8. A method of cooling, comprising:

cooling coolant through separate first and second flow circuits of a cooling device, the coolant being directed at first and second mass flow rates to cool separate first and second surfaces of the cooling device; and

the first and second flow circuits are converged in a cooling passage to cool separate third and fourth surfaces of the cooling apparatus.

9. The cooling method of claim 8, wherein the first mass flow rate and the second mass flow rate are substantially equal.

10. The cooling method of claim 8, wherein the first mass flow rate and the second mass flow rate are unequal.

11. The cooling method of claim 8, further comprising: providing the cooling device with internal passages defining a first flow loop and a second flow loop and configured such that a first mass flow rate and a second mass flow rate are unequal, wherein the first mass flow rate corresponds to a first cooling requirement of a first electronic component in thermal contact with a first surface of the cooling device and the second mass flow rate corresponds to a second cooling requirement of a second electronic component in thermal contact with a second surface of the cooling device, wherein the first cooling requirement and the second cooling requirement are different.

12. The cooling method of claim 8, further comprising bringing first and second surfaces of the cooling apparatus into thermal contact with a thyristor.

13. The cooling method of claim 8, further comprising bringing third and fourth surfaces of the cooling device into thermal contact with a resistor.

14. The cooling method of claim 8, further comprising flowing a coolant through the first and second sets of serpentine cooling microchannels to cool the first and second surfaces of the cooling apparatus.

Technical Field

The present invention relates generally to methods and apparatus for cooling electronic components. More particularly, the present invention relates to a cooling apparatus adapted to simultaneously cool a plurality of electronic components.

Background

As electronic devices have evolved, the challenges of cooling electronic equipment have generally increased. As manufacturing processes are perfected and Integrated Circuits (ICs) become faster and more complex, IC devices become more complex and power hungry, resulting in higher component temperatures. Thus, the area power density increases, resulting in smaller molds dissipating higher thermal loads that cannot be properly addressed by passive heat sinks and coolers. Fig. 1 schematically depicts a thyristor as a non-limiting example of an IC component that generates a significant amount of heat, and the heat must be dissipated to ensure acceptable component lifetime. The particular structure depicted in fig. 1 is a disk, also known as a "puck" design, commonly used in Silicon Controlled Rectifier (SCR) controllers, particularly in higher current applications.

In view of the foregoing, there is a continuing need for improved systems and methods suitable for cooling electronic components.

Disclosure of Invention

The present invention provides a method and apparatus capable of simultaneously cooling a plurality of electronic components.

According to one aspect of the present invention, there is provided a cooling apparatus comprising an internal passage defining separate first and second flow circuits, each flow circuit being configured to direct coolant at first and second mass flow rates to cool separate first and second surfaces of the cooling apparatus. The internal passage further defines cooling passages into which the first and second flow circuits converge to cool separate third and fourth surfaces of the cooling apparatus.

According to another aspect of the invention, there is provided a cooling method comprising cooling coolant through separate first and second flow circuits of a cooling device, directing the coolant at first and second mass flow rates to cool separate first and second surfaces of the cooling device, and converging the first and second flow circuits in a cooling channel to cool separate third and fourth surfaces of the cooling device.

Technical effects of the above-described apparatus and method preferably include the ability to remove heat from a plurality of electronic devices using a compact cooling apparatus.

Other aspects and advantages of the present invention will be further appreciated from the following detailed description.

Drawings

Fig. 1 schematically shows a top view and a side view of a thyristor.

Fig. 2A, 2B, 2C and 2D schematically show an exploded front view, a front perspective view, a rear view and a rear perspective view, respectively, of a cooling apparatus according to one non-limiting embodiment of the present invention.

Fig. 3 schematically illustrates various assembly views of the cooling apparatus of fig. 2A-D.

Fig. 4 schematically shows various views of a first cooling plate of the cooling device of fig. 2A-D and 3.

Fig. 5 schematically illustrates various views of the mounting block of the cooling apparatus of fig. 2A-D and 3.

Fig. 6 schematically shows various views of a second cooling plate of the cooling device of fig. 2A-D and 3.

Fig. 7 schematically illustrates various views of the cover plate of the cooling device of fig. 2A-D and 3.

Fig. 8 schematically illustrates various views of a third cooling plate of the cooling apparatus of fig. 2A-D and 3.

Detailed Description

The figures show a cooling apparatus 10, the cooling apparatus 10 being configured for cooling a plurality of heat generating components, including but not limited to electronic components. The apparatus 10 is particularly well suited for cooling a pair of ice hockey type thyristors (e.g., fig. 1) and resistors used or associated therewith. The cooling device 10 combines the cooling of the ice hockey type thyristors and resistors with a cooling channel network that simultaneously directs a suitable coolant to a pair of surfaces of the device 10 that may be contacted by two different thyristors, and then to the other surfaces of the device 10 that may be contacted by one or more resistors.

The particular non-limiting embodiment of the cooling apparatus 10 shown in the drawings is an assembly of components including a first cooling plate 12 (fig. 4), a mounting block 14 (fig. 5), a second cooling plate 16 (fig. 6), a cover plate 18 (fig. 7), and a third cooling plate 20 (fig. 8) (the second cooling plate 16 and the cover plate 18 are not shown in full length in fig. 2A-D). The apparatus 10 and its components may be formed from a variety of materials, non-limiting examples of which include copper or aluminum. When assembled as shown in fig. 3, the mounting block 14 and the second cooling plate 16 cooperate to define two ports 22 and 24 through which coolant may enter and exit the apparatus 10. Since the apparatus 10 has a preferred (although not required) coolant flow direction, the ports 22 and 24 are labeled here as inlet 22 and outlet 24, respectively. For convenience, the portions of the ports 22 and 24 that are fabricated in the mounting block 14 and the second cooling plate 16 are also labeled 22 and 24. These figures further illustrate that the apparatus 10 has two through holes 26, which are not necessary for coolant flow, but rather serve to reduce the weight and thermal mass of the apparatus 10. Blind holes 28 are provided in the first cooling plate 12, the mounting block 14, the second cooling plate 16, the cover plate 18 and the third cooling plate 20 to facilitate their alignment with pins (not shown) inserted into the holes 28.

The first cooling plate 12, the second cooling plate 16, the cover plate 18 and the third cooling plate 20 define surfaces 32, 36, 38 and 40, respectively, which are adapted to be in intimate thermal contact with the heat generating assembly. To this end, these surfaces 32, 36, 38 and 40 may have a surface finish as shown in FIG. 3. Any suitable means may be used to ensure intimate thermal contact with the heat generating components. In the particular embodiment of the apparatus 10 shown in the figures, the surfaces 32 and 40 of the first cooling plate 12 and the third cooling plate 20 may be configured for individually contacting the anodes or cathodes of the separate thyristors, while the surfaces 36 and 38 of the second cooling plate 16 and the cover plate 18 may be configured for individually contacting the separate resistor groups.

As described above, coolant enters the apparatus 10 through its inlet 22, with the coolant flow being divided between a first flow circuit through inlet passages 42A in the mounting block 14 and then into the first cooling plate 12, and a second flow circuit through inlet passages 42B in the second cooling plate 16 and then through intermediate passages 44B in the cover plate 18 and then into the third cooling plate 20. Preferably, equal coolant flow is produced in the channels 42A and 42B, as the channels making up the first and second flow circuits provide substantially equal flow resistance, e.g., based on cross-sectional area, length, and flow restriction within the channels. Within the first cooling plate 12, the coolant enters at the inlet cavity 46A, travels through the serpentine cooling microchannels 48A, and exits the plate 12 through the outlet cavity 50A. Similarly, within the second cooling plate 20, the coolant enters at the inlet chamber 46B, travels through the serpentine cooling microchannels 48B, and exits the plate 20 through the outlet chamber 50B.

The coolant exiting the first cooling plate 12 passes through a series of intermediate passages 52A and 54A in the mounting block 14 and the second cooling plate 16, respectively, and then into a "zig-zag" cooling passage 56 defined by and between the second cooling plate 16 and the cover plate 18. In the non-limiting example shown in the figures, the cooling channels 56 are defined in the second cooling plate 16 and are closed by the cover plate 18. Similarly, coolant exiting the third cooling plate 20 passes through the intermediate passages 52B in the cover plate 18 and then enters the cooling passages 56. In this way, the first and second flow circuits pass through the first and third cooling plates 12 and 20, respectively, before merging at the inlets of the cooling passages 56. FIG. 6 shows that the cooling passages 56 begin at the proximal end of the second cooling plate 16 and extend along the complementary lengths of the second cooling plate 16 and the cover plate 18 to the distal end of the second cooling plate 16 and then terminate near the proximal end of the cooling plate 16. The coolant exits the cooling gallery 56 through a pair of intermediate galleries 58 and 60 in the second cooling plate 16 and mounting block 14, respectively, and then exits the cooling apparatus 10 through the outlet 24.

In view of the above, the cooling device 10 provides internal channels that define two independent flow circuits capable of directing coolant at substantially equal mass flow rates to the opposing surfaces 32 and 40 of the device 10, which opposing surfaces 32 and 40 are cooled as the coolant flows through the microchannels 48A and B of the first cooling plate 12 and the third cooling plate 20. In this manner, the apparatus 10 may be used to cool the anode side of one thyristor on one side of the apparatus 10, while the opposite side of the apparatus 10 may be used to cool the cathode side of another thyristor. The coolant then flows through the internal passages to the cooling passages 56, where other heat generating devices (e.g., resistors) may be installed for cooling.

If it is not desired that the mass flow rates through the two separate flow circuits be equal, the cooling device 10 may be configured to provide internal passages capable of directing coolant to the opposing surfaces 32 and 40 of the device 10 at different mass flow rates. This is achieved in that the channels constituting the first and second flow circuits provide different flow resistances, e.g. based on cross-sectional area, length and flow restriction within the channel. In this way, the apparatus 10 may be used to simultaneously cool multiple electronic devices, each having different cooling requirements.

Although the apparatus 10 has been described as having the coolant flow entering a single inlet 22 and then splitting it into two separate flow circuits that converge before exiting through a single outlet 24, it is contemplated and within the scope of the invention that the coolant flow may be split and converged more than once. For example, the apparatus 10 may include additional components (not shown) in which the coolant flows are additionally split one or more times after being merged in the cooling passages 56. Additionally, the coolant flow may be split and then converged in microchannels 48A and/or 48B. In this manner, the device 10 may be configured to simultaneously cool various electronic devices having different cooling requirements.

While the invention has been described in terms of specific or particular embodiments, it is evident that alternatives may be employed by those skilled in the art. For example, the cooling device 10 and its components may differ in appearance and construction from the embodiments described herein and shown in the figures, the functions of certain components of the cooling device 10 may be performed by components that differ in structure but that are capable of similar (although not necessarily identical) function, various materials may be used in the manufacture of the cooling device 10 and/or its components, and the cooling device 10 may be installed in various types of cooling or electrical systems. In addition, the invention includes additional or alternative embodiments in which one or more features or aspects of a particular embodiment may be eliminated. Therefore, it should be understood that the present invention is not necessarily limited to any of the embodiments described herein or shown in the drawings. It is also to be understood that the phraseology and terminology employed above are for the purpose of description of the disclosed embodiments and should not be regarded as limiting the scope of the invention. Accordingly, the scope of the invention is to be limited only by the following claims.