High-heat-dissipation high-frequency transistor three-dimensional packaging structure

文档序号:139776 发布日期:2021-10-22 浏览:39次 中文

阅读说明:本技术 一种高散热高频晶体管立体式封装结构 (High-heat-dissipation high-frequency transistor three-dimensional packaging structure ) 是由 李伟 于 2021-07-17 设计创作,主要内容包括:本发明公开了一种高散热高频晶体管立体式封装结构,包括盒体,以及放置在盒体内的晶体管本体,晶体管本体上固定连接有插针,盒体的底部固定连接有保护筒,盒体内固定连接有容纳盒,容纳盒的数量具体为两组,且两组容纳盒对称分布在盒体内,容纳盒内填充有氟化液,容纳盒上固定连接有导热弹片,导热弹片与晶体管本体贴合,盒体内固定连接有伸缩杆,伸缩杆上远离盒体的一端固定连接有第一垫板,第一垫板与晶体管本体贴合,伸缩杆上套接有第一弹簧,第一弹簧的两端分别与盒体和第一垫板相抵,容纳盒上设有用于清刷电路板的清刷机构。本发明具备防护效果好,具有降温功能,且能对线路板进行清刷养护的优点。(The invention discloses a high-heat-dissipation high-frequency transistor three-dimensional packaging structure which comprises a box body and transistor bodies arranged in the box body, wherein contact pins are fixedly connected to the transistor bodies, a protection barrel is fixedly connected to the bottom of the box body, accommodating boxes are fixedly connected in the box body, the accommodating boxes are two in number and are symmetrically distributed in the box body, fluorinated liquid is filled in the accommodating boxes, heat-conducting elastic pieces are fixedly connected to the accommodating boxes and are attached to the transistor bodies, telescopic rods are fixedly connected in the box body, one ends, far away from the box body, of the telescopic rods are fixedly connected with first base plates, the first base plates are attached to the transistor bodies, first springs are sleeved on the telescopic rods, two ends of each first spring are respectively abutted to the box body and the corresponding first base plate, and cleaning mechanisms for cleaning circuit boards are arranged on the accommodating boxes. The invention has the advantages of good protection effect, cooling function and cleaning and maintaining of the circuit board.)

1. The utility model provides a three-dimensional packaging structure of high heat dissipation high frequency transistor, includes box body (1) to and place transistor body (2) in box body (1), fixedly connected with contact pin (201) on transistor body (2), contact pin (201) are connected on the circuit board, its characterized in that: the bottom of the box body (1) is fixedly connected with a protective barrel (102), the protective barrel (102) is sleeved on a contact pin (201), the inner diameter of the protective barrel (102) is larger than the outer diameter of the contact pin (201), the box body (1) is internally and fixedly connected with two containing boxes (101), the number of the containing boxes (101) is specifically two, the two containing boxes (101) are symmetrically distributed in the box body (1), the containing boxes (101) are filled with fluorinated liquid, the containing boxes (101) are fixedly connected with heat-conducting elastic sheets (1011), the heat-conducting elastic sheets (1011) are attached to the transistor body (2), the box body (1) is internally and fixedly connected with a telescopic rod (9), one end of the telescopic rod (9) far away from the box body (1) is fixedly connected with a first base plate (901), the first base plate (901) is attached to the transistor body (2), and the telescopic rod (9) is sleeved with a first spring (9011), two ends of the first spring (9011) are respectively abutted against the box body (1) and the first base plate (901), and a cleaning mechanism for cleaning the circuit board is arranged on the accommodating box (101).

2. The three-dimensional package structure of high heat dissipation and high frequency transistor as claimed in claim 1, wherein: the brushing mechanism comprises a first barrel body (3) and a second barrel body (4), the first barrel body (3) and the second barrel body (4) are correspondingly fixedly connected on symmetrically distributed accommodating boxes (101), the first barrel body (3) and the second barrel body (4) are communicated with the accommodating boxes (101), cylindrical rods (301) are connected in the first barrel body (3) and the second barrel body (4) in a sliding manner, positioning convex strips (3011) are arranged on the cylindrical rods (301), sliding chutes matched with the positioning convex strips (3011) are formed in the first barrel body (3) and the second barrel body (4), threaded rods (3012) are fixedly connected on the cylindrical rods (301) on the first barrel body (3), a first mounting seat (3021) is fixedly connected in the box body (1), the threaded rods (3012) are connected in the first mounting seat (3021) in a sliding manner, threaded rods (302) are connected on the first mounting seat (3021) in a rotating manner, a screw thread section of thick bamboo (302) threaded connection is on threaded rod (3012), the first installation pole of fixedly connected with (3022) is gone up in a screw thread section of thick bamboo (302), it is connected with second installation pole (3023) to rotate on first installation pole (3022), the one end fixedly connected with brush head (3024) of first installation pole (3022) are kept away from in second installation pole (3023), set up on box body (1) and install pole (3023) complex logical groove with the second, be equipped with the stabilizing mean who is used for firm transistor body (2) on box body (1).

3. The three-dimensional package structure of high heat dissipation and high frequency transistor as claimed in claim 2, wherein: the brushing mechanism further comprises a rack (401), the rack (401) is fixedly connected to a cylindrical rod (301) located in the second cylinder (4), the box body (1) is connected with a rotating shaft (5) in a rotating mode, two ends of the rotating shaft (5) are respectively fixedly connected with a first gear (501) and a second gear (502), the first gear (501) is meshed with the rack (401), the rotating shaft (5) is sleeved with a torsion spring (503), two ends of the torsion spring (503) are respectively fixedly connected to the second gear (502) and the box body (1), the rotating shaft (5) is coaxially and fixedly connected with a cam (504), the cam (504) is fixedly connected with an eccentric rod (5041), the box body (1) is internally fixedly connected with a second mounting seat (1001), the second mounting seat (1001) is connected with a positioning rod (5053) in a sliding mode, the positioning rod (5053) is fixedly connected with a hollow strip (505), the novel transistor cleaning device is characterized in that the eccentric rod (5041) is connected into the hollow bar (505) in a sliding mode, one side, far away from the positioning rod (5053), of the hollow bar (505) is fixedly connected with a mounting plate (5051), a poking plate (5052) is fixedly connected onto the mounting plate (5051), the poking plate (5052) abuts against the second mounting rod (3023), a reinforcing mechanism used for reinforcing the contact between the heat conduction elastic sheet (1011) and the transistor body (2) is arranged on the cleaning mechanism, and a fan mechanism used for assisting the cleaning mechanism is arranged on the cleaning mechanism.

4. The three-dimensional package structure of high heat dissipation and high frequency transistor as claimed in claim 3, wherein: the reinforcing mechanism comprises an actuating rod (701), the actuating rod (701) is connected to the box body (1) in a sliding mode, a transverse rod (7012) is fixedly connected to the actuating rod (701), the transverse rod (7012) is abutted to a heat conduction elastic sheet (1011), a supporting block (1012) is fixedly connected to the accommodating box (101), the supporting block (1012) is abutted to the transverse rod (7012), a driving lever (7013) is fixedly connected to the actuating rod (701), a second mounting rod (3023) is abutted to the driving lever (7013), and a maintenance mechanism for maintaining the circuit board is arranged on the reinforcing mechanism.

5. The three-dimensional package structure of high heat dissipation and high frequency transistor as claimed in claim 4, wherein: maintenance mechanism includes piston cylinder (7), piston cylinder (7) fixed connection is in the bottom of box body (1), the bottom fixedly connected with piston plate (7011) of actuating lever (701), piston plate (7011) sliding connection is in piston cylinder (7), the bottom fixedly connected with of box body (1) embeds box (702) that has circuit board maintenance liquid, box (702) are linked together through supply tube (704) and piston cylinder (7), fixedly connected with discharge pipe (703) on piston cylinder (7), all be equipped with check valve (7031) on supply tube (704) and discharge pipe (703).

6. The three-dimensional package structure of high heat dissipation and high frequency transistor as claimed in claim 2, wherein: the stabilizing mechanism comprises an installation barrel (8), the installation barrel (8) is fixedly connected to the box body (1), an ejector rod (801) is connected to the installation barrel (8) in a sliding mode, a second base plate (8011) is fixedly connected to the ejector rod (801), a second spring (803) is sleeved on the ejector rod (801) and the installation barrel (8), two ends of the second spring (803) are respectively abutted to the box body (1) and the second base plate (8011), the second base plate (8011) is attached to the transistor body (2), a pressure lever (802) is connected to the installation barrel (8) in a threaded mode, the pressure lever (802) is abutted to the ejector rod (801), a connecting column (8021) is coaxially and fixedly connected to the pressure lever (802), a round rod (8022) is fixedly connected to the connecting column (8021), a second installation rod (3023) is abutted to the round rod (8022), and the number of the round rod (8022) is specifically two groups, and the included angle between the two sets of round bars (8022) is ninety degrees.

7. The three-dimensional package structure of high heat dissipation and high frequency transistor as claimed in claim 3, wherein: the fan mechanism comprises a rectangular plate (6), a circular ring (602) is fixedly connected to the rectangular plate (6), a cylindrical shaft (601) is connected to the box body (1) in a rotating mode, a third gear (6011) is fixedly connected to the cylindrical shaft (601), the third gear (6011) is meshed with the second gear (502), a U-shaped groove (6012) is formed in the cylindrical shaft (601), and a sliding block matched with the U-shaped groove (6012) is arranged on the circular ring (602).

8. The three-dimensional package structure of high heat dissipation and high frequency transistor of claim 7, wherein: the box body (1) is fixedly connected with a limiting column (603), and a through hole matched with the limiting column (603) is formed in the rectangular plate (6).

Technical Field

The invention relates to the technical field of transistors, in particular to a high-heat-dissipation high-frequency transistor three-dimensional packaging structure.

Background

The transistor is a solid semiconductor device, has multiple functions of detection, rectification, amplification, switching, voltage stabilization, signal modulation and the like, can control output current based on input voltage as a variable current switch, is different from a common mechanical switch, utilizes an electric signal to control opening and closing of the transistor, and can be switched at a very high speed.

The transistor produces a large amount of heats easily at the during operation, and current transistor radiating effect is not good, and current transistor does not possess the safeguard function simultaneously, damages when receiving the striking easily, and the transistor is connected on the circuit board, if too much lack the maintenance of circuit board dust also can cause the contact failure of transistor and circuit board to lose its effect.

Disclosure of Invention

The invention aims to provide a high-heat-dissipation high-frequency transistor three-dimensional packaging structure which has the advantages of good protection effect, cooling function and capability of cleaning and maintaining a circuit board, and solves the problems in the background art.

In order to achieve the purpose, the invention provides the following technical scheme: a high-heat-dissipation high-frequency transistor three-dimensional packaging structure comprises a box body and a transistor body placed in the box body, wherein contact pins are fixedly connected to the transistor body and are connected to a circuit board, a protection barrel is fixedly connected to the bottom of the box body and is sleeved on the contact pins, the inner diameter of the protection barrel is larger than the outer diameter of the contact pins, two containing boxes are fixedly connected in the box body, the containing boxes are symmetrically distributed in the box body, a fluorinated liquid is filled in the containing boxes, a heat conduction elastic sheet is fixedly connected to the containing boxes and is attached to the transistor body, a telescopic rod is fixedly connected in the box body, a first base plate is fixedly connected to one end, far away from the box body, of the telescopic rod, the first base plate is attached to the transistor body, and a first spring is sleeved on the telescopic rod, the two ends of the first spring are respectively abutted against the box body and the first base plate, and the containing box is provided with a brushing mechanism for brushing the circuit board.

Preferably, the cleaning mechanism comprises a first barrel and a second barrel, the first barrel and the second barrel are correspondingly and fixedly connected to symmetrically distributed accommodating boxes, the first barrel and the second barrel are communicated with the accommodating boxes, cylindrical rods are slidably connected in the first barrel and the second barrel, positioning convex strips are arranged on the cylindrical rods, chutes matched with the positioning convex strips are formed in the first barrel and the second barrel, a threaded rod is fixedly connected to the cylindrical rod on the first barrel, a first mounting seat is fixedly connected in the first barrel, the threaded rod is slidably connected in the first mounting seat, a threaded barrel is rotatably connected to the first mounting seat, the threaded barrel is in threaded connection with the threaded rod, a first mounting rod is fixedly connected to the threaded barrel, and a second mounting rod is rotatably connected to the first mounting rod, the one end fixedly connected with brush head that first installation pole was kept away from to second installation pole, set up on the box body with second installation pole complex logical groove, be equipped with the stabilizing mean who is used for firm transistor body on the box body.

Preferably, the brushing mechanism further comprises a rack, the rack is fixedly connected to a cylindrical rod in the second cylinder, the box body is rotatably connected with a rotating shaft, two ends of the rotating shaft are respectively and fixedly connected with a first gear and a second gear, the first gear is meshed with the rack, a torsion spring is sleeved on the rotating shaft, two ends of the torsion spring are respectively and fixedly connected to the second gear and the box body, the rotating shaft is coaxially and fixedly connected with a cam, an eccentric rod is fixedly connected to the cam, a second mounting seat is fixedly connected to the box body, a positioning rod is slidably connected to the second mounting seat, a hollow rod is fixedly connected to the positioning rod, the eccentric rod is slidably connected to the hollow rod, a mounting plate is fixedly connected to one side of the hollow rod far away from the positioning rod, a stirring plate is fixedly connected to the mounting plate, and the stirring plate is abutted against the second mounting rod, the cleaning mechanism is provided with a reinforcing mechanism for reinforcing the contact between the heat conduction elastic sheet and the transistor body, and the cleaning mechanism is provided with a fan mechanism for assisting the cleaning mechanism.

Preferably, the reinforcing mechanism comprises a driving rod, the driving rod is connected to the box body in a sliding mode, a cross rod is fixedly connected to the driving rod and abuts against the heat conduction elastic sheet, a supporting block is fixedly connected to the accommodating box and abuts against the cross rod, a driving lever is fixedly connected to the driving rod, the second mounting rod abuts against the driving lever, and a maintenance mechanism for maintaining the circuit board is arranged on the reinforcing mechanism.

Preferably, the maintenance mechanism includes a piston cylinder, piston cylinder fixed connection is in the bottom of box body, the bottom fixedly connected with piston plate of actuating lever, piston plate sliding connection is in the piston cylinder, the bottom fixedly connected with of box body embeds the box that has circuit board maintenance liquid, the box is linked together through supply tube and piston cylinder, fixedly connected with discharge pipe on the piston cylinder, all be equipped with the check valve on supply tube and the discharge pipe.

Preferably, firm mechanism is including the installation section of thick bamboo, installation section of thick bamboo fixed connection is on the box body, sliding connection has the ejector pin in the installation section of thick bamboo, fixedly connected with second backing plate on the ejector pin, the second spring has been cup jointed on ejector pin and the installation section of thick bamboo, the both ends of second spring offset with box body and second backing plate respectively, the laminating of second backing plate and transistor body, installation section of thick bamboo internal thread connection has the depression bar, the depression bar offsets with the ejector pin, coaxial fixedly connected with spliced pole on the depression bar, fixedly connected with round bar on the spliced pole, second installation pole offsets with the round bar, the quantity of round bar specifically is two sets of, and two sets of contained angle between the round bar specifically is ninety degrees.

Preferably, the fan mechanism comprises a rectangular plate, a circular ring is fixedly connected to the rectangular plate, a cylindrical shaft is rotatably connected to the box body, a third gear is fixedly connected to the cylindrical shaft and meshed with the second gear, a U-shaped groove is formed in the cylindrical shaft, and a sliding block matched with the U-shaped groove is arranged on the circular ring.

Preferably, the box body is fixedly connected with a limiting column, and the rectangular plate is provided with a through hole matched with the limiting column.

Compared with the prior art, the invention has the following beneficial effects: the transistor body cannot be directly impacted by arranging the box body and the first spring and the second spring, the box body can be buffered by the first spring and the second spring when being impacted, the containing box is arranged, the fluorinated liquid is filled in the containing box, so that the heat of the transistor body can be discharged, the cleaning mechanism operates to clean the circuit board near the transistor body when the heat productivity of the transistor body is large by arranging the cleaning mechanism, so that the transistor body is well contacted with the circuit board, the heat conduction elastic sheet can be restored to be contacted with the transistor body after buffering the impact force deformation of the outside to the box body, the piston cylinder sprays the circuit board maintenance liquid to the circuit board when the cleaning mechanism operates by arranging the maintenance mechanism, the circuit board can be maintained, and the transistor body cannot shake relative to the box body in the cleaning process by arranging the stabilizing mechanism, the dust cleaned by the brush head can be blown away by arranging the fan mechanism, so that the dust is prevented from falling to the original position.

Drawings

FIG. 1 is a schematic view of the external structure of the present invention;

FIG. 2 is a schematic view of the structure of part A of FIG. 1 according to the present invention;

FIG. 3 is a schematic view of the internal structure of the present invention;

FIG. 4 is a schematic view of the structure of portion B of FIG. 3 according to the present invention;

FIG. 5 is a schematic view of the structure of portion C of FIG. 3 according to the present invention;

FIG. 6 is a schematic view of the cam of the present invention;

FIG. 7 is a schematic view of the structure of the containment box of the present invention;

FIG. 8 is a schematic view of a reinforcement mechanism according to the present invention;

FIG. 9 is a schematic structural view of the brushing mechanism of the present invention;

FIG. 10 is a schematic structural view of the mounting cartridge of the present invention;

fig. 11 is a schematic structural view of the maintenance mechanism of the present invention.

In the figure: 1. a box body; 1001. a second mounting seat; 101. accommodating the box; 1011. a heat conductive elastic sheet; 1012. a support block; 102. a protective cylinder; 2. a transistor body; 201. inserting a pin; 3. a first cylinder; 301. a cylindrical rod; 3011. positioning the convex strip; 3012. a threaded rod; 302. a threaded barrel; 3021. a first mounting seat; 3022. a first mounting bar; 3023. a second mounting bar; 3024. a brush head; 4. a second cylinder; 401. a rack; 5. a rotating shaft; 501. a first gear; 502. a second gear; 503. a torsion spring; 504. a cam; 5041. an eccentric rod; 505. a hollow bar; 5051. mounting a plate; 5052. a poking plate; 5053. positioning a rod; 6. a rectangular plate; 601. a cylindrical shaft; 6011. a third gear; 6012. a U-shaped groove; 602. a circular ring; 603. a limiting column; 7. a piston cylinder; 701. a drive rod; 7011. a piston plate; 7012. a cross bar; 7013. a deflector rod; 702. a box body; 703. a discharge pipe; 7031. a one-way valve; 704. a supply pipe; 8. mounting the cylinder; 801. a top rod; 8011. a second backing plate; 802. a pressure lever; 8021. connecting columns; 8022. a round bar; 803. a second spring; 9. a telescopic rod; 901. a first backing plate; 9011. a first spring.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example 1:

referring to fig. 1, fig. 3, fig. 7 and fig. 9, the present invention provides a technical solution: a high-heat-dissipation high-frequency transistor three-dimensional packaging structure comprises a box body 1 and a transistor body 2 arranged in the box body 1, wherein contact pins 201 are fixedly connected to the transistor body 2, the contact pins 201 are connected to a circuit board, a protection cylinder 102 is fixedly connected to the bottom of the box body 1, the protection cylinder 102 is sleeved on the contact pins 201, the inner diameter of the protection cylinder 102 is larger than the outer diameter of the contact pins 201, accommodating boxes 101 are fixedly connected to the inside of the box body 1, the number of the accommodating boxes 101 is specifically two, the two accommodating boxes 101 are symmetrically distributed in the box body 1, a fluorinated liquid is filled in the accommodating boxes 101, a heat conduction elastic sheet 1011 is fixedly connected to the accommodating boxes 101, the heat conduction elastic sheet is attached to the transistor body 2, a telescopic rod 9 is fixedly connected to the inside of the box body 1, a first base plate 901 is fixedly connected to one end, far away from the box body 1, of the telescopic rod 9 is attached to the transistor body 2, a first spring 9011 is sleeved on the telescopic rod 9, the two ends of the first spring 9011 respectively abut against the box body 1 and the first base plate 901, and a cleaning mechanism for cleaning the circuit board is arranged on the accommodating box 101.

The box body 1 is sleeved on the transistor body 2, the transistor body 2 is connected to a circuit board through a contact pin 201, the heat conduction elastic sheet 1011 is attached to the transistor body 2, the accommodating box 101 is filled with fluorinated liquid, so that when the heat generated by the transistor body 2 is conducted out to the container 101 through the heat conductive elastic sheet 1011, so that the fluorinated liquid in the containing box 101 absorbs heat to dissipate heat of the transistor body 2, the first spring 9011 and the heat conducting elastic sheet 1011 sleeved on the telescopic rod 9 can buffer when the box body 1 receives vibration or impact, the transistor body 2 is protected from being damaged, and meanwhile, the outer diameter of the protection cylinder 102 is larger than that of the contact pin 201, thereby can avoid contact pin 201 to be broken when box body 1 rocks, make the vaporization inflation of fluoride liquid when transistor body 2 produces a large amount of heats, the mechanism operation of brushing this moment cleans the circuit board near transistor body 2.

Referring to fig. 1, 2, 3, 4, 5, 6 and 9, the brushing mechanism includes a first barrel 3 and a second barrel 4, the first barrel 3 and the second barrel 4 are correspondingly and fixedly connected to the symmetrically distributed accommodating boxes 101, and both the first barrel 3 and the second barrel 4 are communicated with the accommodating boxes 101, both the first barrel 3 and the second barrel 4 are connected with a cylindrical rod 301 in a sliding manner, a positioning protrusion 3011 is arranged on the cylindrical rod 301, both the first barrel 3 and the second barrel 4 are provided with chutes matched with the positioning protrusion 3011, a threaded rod 3012 is fixedly connected to the cylindrical rod 301 on the first barrel 3, a first mounting seat 3021 is fixedly connected to the inside of the box body 1, the threaded rod 3012 is connected in a sliding manner to the first mounting seat 3021, a threaded barrel 302 is rotatably connected to the first mounting seat 3021, the threaded barrel 302 is connected to the threaded rod 3012, a first mounting rod 3022 is fixedly connected to the threaded barrel 302, the first mounting rod 3022 is rotatably connected with a second mounting rod 3023, one end of the second mounting rod 3023, which is away from the first mounting rod 3022, is fixedly connected with a brush head 3024, the cartridge body 1 is provided with a through groove matched with the second mounting rod 3023, the cartridge body 1 is provided with a stabilizing mechanism for stabilizing the transistor body 2, the brushing mechanism further comprises a rack 401, the rack 401 is fixedly connected to a cylindrical rod 301 located in the second cartridge body 4, the cartridge body 1 is rotatably connected with a rotating shaft 5, two ends of the rotating shaft 5 are respectively and fixedly connected with a first gear 501 and a second gear 502, the first gear 501 is engaged with the rack 401, the rotating shaft 5 is sleeved with a torsion spring 503, two ends of the torsion spring 503 are respectively and fixedly connected to the second gear 502 and the cartridge body 1, the rotating shaft 5 is coaxially and fixedly connected with a cam 504, the cam 504 is fixedly connected with an eccentric rod 5041, the cartridge body 1 is fixedly connected with a second mounting seat 1001, the second mounting seat 1001 is slidably connected with a positioning rod 5053, the positioning rod 5053 is fixedly connected with a hollow bar 505, the eccentric bar 5041 is connected in the hollow bar 505 in a sliding manner, one side of the hollow bar 505, which is far away from the positioning rod 5053, is fixedly connected with a mounting plate 5051, the mounting plate 5051 is fixedly connected with a poking plate 5052, the poking plate 5052 abuts against a second mounting rod 3023, the cleaning mechanism is provided with a reinforcing mechanism for reinforcing the contact between the heat conduction elastic sheet 1011 and the transistor body 2, and the cleaning mechanism is provided with a fan mechanism for assisting the cleaning mechanism.

When the heat generated by the transistor body 2 is too large, the fluorinated liquid is vaporized and expanded, at this time, the cylindrical rods 301 in the first barrel 3 and the second barrel 4 both slide outwards, the threaded rod 3012 is synchronously pushed outwards when the cylindrical rod 301 in the first barrel 3 slides outwards, the position of the threaded barrel 302 cannot be changed because the threaded barrel 302 is rotationally connected to the first mounting seat 3021, the threaded barrel 302 rotates when the threaded rod 3012 is inserted into the threaded barrel 302, at this time, the first mounting rod 3022 fixedly connected to the threaded barrel 302 swings from the top of the cartridge 1 to the bottom of the cartridge 1, so that the brush head 3024 synchronously runs to the lower part of the cartridge 1, at this time, the second mounting rod 3023 is located between the two sets of poking plates 5052, when the cylindrical rod 301 in the second barrel 4 slides outwards, the rack 401 synchronously slides outwards, at this time, the rack 401 is engaged with the first gear 501, so that the first gear 501 rotates, so that the rotating shaft 5 and the second gear 502 rotate synchronously, and the torsion spring 503 has potential energy, when the rotating shaft 5 rotates, the cam 504 synchronously rotates, at the same time, the eccentric rod 5041 slides in the hollow bar 505, the positioning rod 5053 fixedly connected with the hollow bar 505 slides on the second mounting seat 1001, so that the vertical position of the hollow bar 505 is not changed, and the hollow bar 505 horizontally reciprocates, a certain gap is left between the two groups of toggle plates 5052, so that when the second mounting rod 3023 swings to the lower side of the case body 1, the second mounting rod 3023 is located between the two sets of toggle plates 5052, the rack 401 is not engaged with the first gear 501 after sliding, and the elastic potential energy of the torsion spring 503 is released, the rotating shaft 5 rotates, and the mounting plate 5051 slides horizontally and reciprocally, so that the second mounting rod 3023 is pushed to swing relative to the first mounting rod 3022, and the brush head 3024 cleans the circuit board near the transistor body 2.

Referring to fig. 1, 3, 4 and 8, the reinforcing mechanism includes a driving rod 701, the driving rod 701 is slidably connected to the box body 1, a cross rod 7012 is fixedly connected to the driving rod 701, the cross rod 7012 abuts against a heat conducting elastic sheet 1011, a supporting block 1012 is fixedly connected to the accommodating box 101, the supporting block 1012 abuts against the cross rod 7012, a driving lever 7013 is fixedly connected to the driving rod 701, a second mounting rod 3023 abuts against the driving lever 7013, and a maintenance mechanism for maintaining the circuit board is arranged on the reinforcing mechanism.

The second installation pole 3023 is the arc-shaped swing to the actuating lever 701 can be lifted when the second installation pole 3023 swings and contacts the driving lever 7013, and the cross rod 7012 fixedly connected to the actuating lever 701 is lifted upwards to extrude the heat conduction elastic sheet 1011, so that the heat conduction elastic sheet 1011 is attached to the transistor body 2 tightly, and the heat conduction elastic sheet 1011 extruded and deformed when the box body 1 collides is received can contact the transistor body 2 to conduct heat.

Referring to fig. 1, 3 and 11, the maintenance mechanism includes a piston cylinder 7, the piston cylinder 7 is fixedly connected to the bottom of the box body 1, a piston plate 7011 is fixedly connected to the bottom of the driving rod 701, the piston plate 7011 is slidably connected to the inside of the piston cylinder 7, a box body 702 with a circuit board maintenance liquid inside is fixedly connected to the bottom of the box body 1, the box body 702 is communicated with the piston cylinder 7 through a supply pipe 704, a discharge pipe 703 is fixedly connected to the piston cylinder 7, and a check valve 7031 is arranged on both the supply pipe 704 and the discharge pipe 703.

When the second mounting rod 3023 does not contact the driving rod 701, the driving rod 701 descends under the action of gravity, so that the driving rod 701 reciprocates up and down, the piston plate 7011 on the driving rod 701 slides in the piston cylinder 7, the piston cylinder 7 draws the circuit board maintenance liquid in the box body 702 through the supply pipe 704 and discharges the circuit board maintenance liquid onto the circuit board from the discharge pipe 703, and the circuit board is maintained.

Referring to fig. 1, fig. 3, fig. 9, and fig. 10, the stabilizing mechanism includes a mounting cylinder 8, the mounting cylinder 8 is fixedly connected to the box body 1, a push rod 801 is slidably connected to the mounting cylinder 8, a second backing plate 8011 is fixedly connected to the push rod 801, a second spring 803 is sleeved on the push rod 801 and the mounting cylinder 8, two ends of the second spring 803 respectively abut against the box body 1 and the second backing plate 8011, the second backing plate 8011 abuts against the transistor body 2, a press rod 802 is connected to the mounting cylinder 8 through an internal thread, the press rod 802 abuts against the push rod 801, a connection column 8021 is coaxially and fixedly connected to the press rod 802, a round rod 8022 is fixedly connected to the connection column 8021, a second mounting rod 3023 abuts against the round rod 8022, the number of the round rods 8022 is specifically two, and an included angle between the two sets of round rods 8022 is specifically ninety degrees.

When the second mounting rod 3023 swings downwards, the second mounting rod 3023 contacts the round rod 8022, at this time, the pressing rod 802 rotates, the pressing rod 802 is screwed in the mounting cylinder 8, so that the pressing rod 802 moves in the mounting cylinder 8 when rotating to extrude the ejector rod 801, at this time, the ejector rod 801 cannot slide relative to the mounting cylinder 8, the second base plate 8011 abuts against the transistor body 2, so that the position of the transistor body 2 relative to the box body 1 is fixed, so that the transistor body 2 cannot shake relative to the box body 1 when a subsequent cleaning mechanism operates, and the ejector rod 801 can slide relative to the mounting cylinder 8 when the pressing rod 802 does not extrude the ejector rod 801, at this time, the effect of the second spring 803 can buffer when the box body 1 receives impact, and the transistor body 2 is protected from being damaged.

Referring to fig. 1, 2, 3 and 5, the fan mechanism includes a rectangular plate 6, a circular ring 602 is fixedly connected to the rectangular plate 6, a cylindrical shaft 601 is rotatably connected to the box body 1, a third gear 6011 is fixedly connected to the cylindrical shaft 601, the third gear 6011 is meshed with the second gear 502, a U-shaped groove 6012 is formed in the cylindrical shaft 601, a sliding block matched with the U-shaped groove 6012 is arranged on the circular ring 602, a limiting column 603 is fixedly connected to the box body 1, and a through hole matched with the limiting column 603 is formed in the rectangular plate 6.

Rectangular plate 6 slides on spacing post 603, and rectangular plate 6 fixed connection is on ring 602, thereby make ring 602 can not take place to rotate, slider on ring 602 just can slide in U type groove 6012 when cylinder axle 601 rotates this moment, U type groove 6012 encircles the sinusoidal type groove on cylinder axle 601 for end to end, thereby ring 602 just can drive rectangular plate 6 and slide on spacing post 603 when cylinder axle 601 rotates, thereby the rectangular plate 6 of motion can produce the flow of air current, make the dust of flowing air current with brush head 3024 brush down blow away.

Example 2:

referring to fig. 1-11, a three-dimensional package structure of a high-heat-dissipation high-frequency transistor comprises a box body 1 and a transistor body 2 arranged in the box body 1, wherein pins 201 are fixedly connected to the transistor body 2, the pins 201 are connected to a circuit board, a protection cylinder 102 is fixedly connected to the bottom of the box body 1, the protection cylinder 102 is sleeved on the pins 201, the inner diameter of the protection cylinder 102 is larger than the outer diameter of the pins 201, two containing boxes 101 are fixedly connected to the box body 1, the containing boxes 101 are specifically two in number, the two containing boxes 101 are symmetrically distributed in the box body 1, the containing boxes 101 are filled with a fluorinated liquid, a heat-conducting elastic sheet 1011 is fixedly connected to the containing boxes 101, the heat-conducting elastic sheet 1011 is attached to the transistor body 2, an expansion link 9 is fixedly connected to the box body 1, a first base plate 901 is fixedly connected to one end of the expansion link 9 far away from the box body 1, and the first base plate 901 is attached to the transistor body 2, a first spring 9011 is sleeved on the telescopic rod 9, two ends of the first spring 9011 are respectively abutted against the box body 1 and the first base plate 901, and a cleaning mechanism for cleaning the circuit board is arranged on the accommodating box 101;

the brushing mechanism comprises a first barrel body 3 and a second barrel body 4, the first barrel body 3 and the second barrel body 4 are correspondingly and fixedly connected to symmetrically distributed accommodating boxes 101, the first barrel body 3 and the second barrel body 4 are communicated with the accommodating boxes 101, cylindrical rods 301 are respectively and slidably connected in the first barrel body 3 and the second barrel body 4, positioning convex strips 3011 are arranged on the cylindrical rods 301, chutes matched with the positioning convex strips 3011 are respectively arranged on the first barrel body 3 and the second barrel body 4, a threaded rod 3012 is fixedly connected on the cylindrical rod 301 arranged on the first barrel body 3, a first mounting seat 3021 is fixedly connected in the box body 1, the threaded rod 3012 is slidably connected in the first mounting seat 3021, a threaded barrel 302 is rotatably connected on the first mounting seat 3021, the threaded barrel 302 is in threaded connection with the threaded rod 3012, a first mounting rod 3022 is fixedly connected on the threaded barrel 302, a second mounting rod 3023 is rotatably connected on the first mounting rod 3022, one end of the second mounting rod 3023 far away from the first mounting rod 3022 is fixedly connected with a brush head 3024, the case body 1 is provided with a through groove matched with the second mounting rod 3023, the case body 1 is provided with a stabilizing mechanism for stabilizing the transistor body 2, the brushing mechanism further comprises a rack 401, the rack 401 is fixedly connected to a cylindrical rod 301 in the second cylinder body 4, the case body 1 is rotatably connected with a rotating shaft 5, two ends of the rotating shaft 5 are respectively fixedly connected with a first gear 501 and a second gear 502, the first gear 501 is engaged with the rack 401, the rotating shaft 5 is sleeved with a torsion spring 503, two ends of the torsion spring 503 are respectively fixedly connected to the second gear 502 and the case body 1, the rotating shaft 5 is coaxially and fixedly connected with a cam 504, the cam 504 is fixedly connected with an eccentric rod 5041, a second mounting seat 1001 is fixedly connected in the case body 1, a positioning rod 5053 is slidably connected to the second mounting seat 1001, a hollow strip is fixedly connected to the positioning rod 5053, the eccentric rod 5041 is connected in the hollow bar 505 in a sliding manner, one side of the hollow bar 505 far away from the positioning rod 5053 is fixedly connected with a mounting plate 5051, the mounting plate 5051 is fixedly connected with a poking plate 5052, the poking plate 5052 abuts against the second mounting rod 3023, the cleaning mechanism is provided with a reinforcing mechanism for reinforcing the contact between the heat-conducting elastic sheet 1011 and the transistor body 2, and the cleaning mechanism is provided with a fan mechanism for assisting the cleaning mechanism;

the reinforcing mechanism comprises a driving rod 701, the driving rod 701 is connected to the box body 1 in a sliding mode, a cross rod 7012 is fixedly connected to the driving rod 701, the cross rod 7012 abuts against a heat conduction elastic sheet 1011, a supporting block 1012 is fixedly connected to the accommodating box 101, the supporting block 1012 abuts against the cross rod 7012, a shifting rod 7013 is fixedly connected to the driving rod 701, a second mounting rod 3023 abuts against the shifting rod 7013, and a maintenance mechanism for maintaining the circuit board is arranged on the reinforcing mechanism;

the maintenance mechanism comprises a piston cylinder 7, the piston cylinder 7 is fixedly connected to the bottom of the box body 1, the bottom of the driving rod 701 is fixedly connected with a piston plate 7011, the piston plate 7011 is connected in the piston cylinder 7 in a sliding manner, the bottom of the box body 1 is fixedly connected with a box body 702 with a built-in circuit board maintenance liquid, the box body 702 is communicated with the piston cylinder 7 through a supply pipe 704, a discharge pipe 703 is fixedly connected to the piston cylinder 7, and the supply pipe 704 and the discharge pipe 703 are both provided with a check valve 7031;

the stabilizing mechanism comprises a mounting barrel 8, the mounting barrel 8 is fixedly connected to the box body 1, a push rod 801 is slidably connected to the mounting barrel 8, a second backing plate 8011 is fixedly connected to the push rod 801, a second spring 803 is sleeved on the push rod 801 and the mounting barrel 8, two ends of the second spring 803 abut against the box body 1 and the second backing plate 8011 respectively, the second backing plate 8011 is attached to the transistor body 2, a press rod 802 is connected to the mounting barrel 8 through a thread, the press rod 802 abuts against the push rod 801, a connecting column 8021 is coaxially and fixedly connected to the press rod 802, a round rod 8022 is fixedly connected to the connecting column 8021, a second mounting rod 3023 abuts against the round rod 8022, the number of the round rods 8022 is specifically two, and an included angle between the two sets of round rods 8022 is ninety degrees;

fan mechanism includes rectangular plate 6, fixedly connected with ring 602 on rectangular plate 6, it is connected with cylinder axle 601 to rotate on the box body 1, fixedly connected with third gear 6011 on the cylinder axle 601, third gear 6011 and the meshing of second gear 502, U type groove 6012 has been seted up on the cylinder axle 601, be equipped with on the ring 602 with U type groove 6012 complex slider, fixedly connected with spacing post 603 on the box body 1, set up on the rectangular plate 6 with spacing post 603 complex through-hole.

When the heat generation of the transistor body 2 is too large, the fluorinated liquid is vaporized and expanded, at this time, the cylindrical rods 301 in the first cylinder 3 and the second cylinder 4 both slide outwards, the first mounting rod 3022 swings from the top of the case 1 to the bottom of the case 1 when the cylindrical rod 301 in the first cylinder 3 slides outwards, the rack 401 slides outwards synchronously when the cylindrical rod 301 in the second cylinder 4 slides outwards, the rotating shaft 5 and the second gear 502 rotate synchronously, at this time, the torsion spring 503 has potential energy, the rack 401 no longer meshes with the first gear 501 after continuing sliding, the elastic potential energy of the torsion spring 503 is released, the mounting plate 5051 slides horizontally and reciprocally, the second mounting rod 3023 is pushed to swing relative to the first mounting rod 3022, the brush head 3024 cleans the circuit board near the transistor body 2, the second mounting rod 3023 swings in an arc shape, so that the driving rod 701 is lifted when the second mounting rod 3023 swings to contact with the shift lever 7013, at this time, the cross rod 7012 fixedly connected to the driving rod 701 rises upwards to press the heat conductive elastic sheet 1011, so that the heat conductive elastic sheet 1011 is tightly attached to the transistor body 2, so that the heat conductive elastic sheet 1011 extruded and deformed when the box body 1 is collided can contact with the transistor body 2 to conduct heat, when the second mounting rod 3023 does not contact the driving rod 701, the driving rod 701 descends under the action of gravity, so that the driving rod 701 reciprocates up and down, and thus the piston plate 7011 on the driving rod 701 slides in the piston cylinder 7, so that the piston cylinder 7 draws the circuit board maintenance liquid in the box body 702 through the supply pipe 704 and discharges the circuit board from the discharge pipe 703, when the second mounting rod 3023 swings downwards, the second mounting rod contacts the round rod 8022, at this time, the pressing rod 802 rotates, the second backing plate 8011 abuts against the transistor body 2, so that the position of the transistor body 2 relative to the box body 1 is fixed, when the cylindrical shaft 601 rotates, the slider on the round ring 602 slides in the U-shaped groove 6012, when the cylindrical shaft 601 rotates, the circular ring 602 drives the rectangular plate 6 to slide on the limiting post 603, so that the moving rectangular plate 6 generates airflow.

The working principle is as follows: when the high-heat-dissipation high-frequency transistor three-dimensional packaging structure is used, the box body 1 is sleeved on the transistor body 2, the transistor body 2 is connected onto a circuit board through the contact pin 201, the heat conducting elastic sheet 1011 is attached to the transistor body 2, and the containing box 101 is filled with fluorinated liquid, so that heat generated by the transistor body 2 is guided out of the containing box 101 through the heat conducting elastic sheet 1011, the fluorinated liquid in the containing box 101 absorbs the heat to dissipate heat of the transistor body 2, the first spring 9011 and the heat conducting elastic sheet 1011 sleeved on the telescopic rod 9 can buffer when the box body 1 receives vibration or impact, the transistor body 2 is protected from being damaged, meanwhile, the outer diameter of the protection cylinder 102 is larger than that of the contact pin 201, and the contact pin 201 can be prevented from being broken when the box body 1 shakes;

when the heat generated by the transistor body 2 is too large, the fluorinated liquid is vaporized and expanded, at this time, the cylindrical rods 301 in the first barrel 3 and the second barrel 4 both slide outwards, the threaded rod 3012 is synchronously pushed outwards when the cylindrical rod 301 in the first barrel 3 slides outwards, the position of the threaded barrel 302 cannot be changed because the threaded barrel 302 is rotationally connected to the first mounting seat 3021, the threaded barrel 302 rotates when the threaded rod 3012 is inserted into the threaded barrel 302, at this time, the first mounting rod 3022 fixedly connected to the threaded barrel 302 swings from the top of the cartridge 1 to the bottom of the cartridge 1, so that the brush head 3024 synchronously runs to the lower part of the cartridge 1, at this time, the second mounting rod 3023 is located between the two sets of poking plates 5052, when the cylindrical rod 301 in the second barrel 4 slides outwards, the rack 401 synchronously slides outwards, at this time, the rack 401 is engaged with the first gear 501, so that the first gear 501 rotates, so that the rotating shaft 5 and the second gear 502 rotate synchronously, and the torsion spring 503 has potential energy, when the rotating shaft 5 rotates, the cam 504 synchronously rotates, at the same time, the eccentric rod 5041 slides in the hollow bar 505, the positioning rod 5053 fixedly connected with the hollow bar 505 slides on the second mounting seat 1001, so that the vertical position of the hollow bar 505 is not changed, and the hollow bar 505 horizontally reciprocates, a certain gap is left between the two groups of toggle plates 5052, so that when the second mounting rod 3023 swings to the lower side of the case body 1, the second mounting rod 3023 is located between the two sets of toggle plates 5052, the rack 401 is not engaged with the first gear 501 after sliding, and the elastic potential energy of the torsion spring 503 is released, the rotating shaft 5 rotates, and at the moment, the mounting plate 5051 horizontally slides back and forth, so that the second mounting rod 3023 is pushed to swing relative to the first mounting rod 3022, and the brush head 3024 cleans the circuit board near the transistor body 2;

the second mounting rod 3023 swings in an arc shape, so that the driving rod 701 is lifted when the second mounting rod 3023 swings and contacts the shift lever 7013, and the cross rod 7012 fixedly connected to the driving rod 701 is lifted upwards at this time to press the heat-conducting elastic sheet 1011, so that the heat-conducting elastic sheet 1011 is tightly attached to the transistor body 2, and the heat-conducting elastic sheet 1011 deformed by the pressing when the box body 1 collides can contact the transistor body 2 to conduct heat;

when the second mounting rod 3023 does not contact the driving rod 701, the driving rod 701 descends under the action of gravity, so that the driving rod 701 reciprocates up and down, the piston plate 7011 on the driving rod 701 slides in the piston cylinder 7, the piston cylinder 7 pumps the circuit board maintenance liquid in the box body 702 through the supply pipe 704 and then discharges the circuit board maintenance liquid onto the circuit board through the discharge pipe 703, and the circuit board is maintained;

when the second mounting rod 3023 swings downwards, the second mounting rod contacts the round rod 8022, the pressing rod 802 rotates, the pressing rod 802 is in threaded connection with the mounting cylinder 8, so that the pressing rod 802 moves in the mounting cylinder 8 to extrude the ejector rod 801 when rotating, the ejector rod 801 cannot slide relative to the mounting cylinder 8 at the moment, the second base plate 8011 abuts against the transistor body 2, the position of the transistor body 2 relative to the box body 1 is fixed, the transistor body 2 cannot shake relative to the box body 1 when a subsequent cleaning mechanism operates, the ejector rod 801 can slide relative to the mounting cylinder 8 when the pressing rod 802 does not extrude the ejector rod 801, and the box body 1 can be buffered when being impacted by the action of the second spring 803 at the moment, so that the transistor body 2 is protected from being damaged;

rectangular plate 6 slides on spacing post 603, and rectangular plate 6 fixed connection is on ring 602, thereby make ring 602 can not take place to rotate, slider on ring 602 just can slide in U type groove 6012 when cylinder axle 601 rotates this moment, U type groove 6012 encircles the sinusoidal type groove on cylinder axle 601 for end to end, thereby ring 602 just can drive rectangular plate 6 and slide on spacing post 603 when cylinder axle 601 rotates, thereby the rectangular plate 6 of motion can produce the flow of air current, make the dust of flowing air current with brush head 3024 brush down blow away.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

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