阅读说明：本技术 电子部件模块及其制造方法 (Electronic component module and method for manufacturing same ) 是由 杣田博史 岩本敬 末守良春 于 2018-06-27 设计创作，主要内容包括：本发明能够使贯通布线不易剥落。电子部件模块(1)具备电子部件(2)、树脂构造体(3)、贯通布线(4)、布线层(5)、以及密接层(6)。树脂构造体(3)覆盖电子部件(2)的至少一部分。贯通布线(4)贯通树脂构造体(3)。布线层(5)将电子部件(2)和贯通布线(4)电连接。密接层(6)形成在树脂构造体(3)与贯通布线(4)之间,且与树脂构造体(3)以及贯通布线(4)接触。密接层(6)包含无机绝缘膜(64)。(The invention can make the through wiring not easy to peel off. An electronic component module (1) is provided with an electronic component (2), a resin structure (3), a through-wiring (4), a wiring layer (5), and a bonding layer (6). The resin structure (3) covers at least a part of the electronic component (2). The through wiring (4) penetrates the resin structure (3). The wiring layer (5) electrically connects the electronic component (2) and the through wiring (4). The adhesion layer (6) is formed between the resin structure (3) and the through-wiring (4), and is in contact with the resin structure (3) and the through-wiring (4). The adhesion layer (6) includes an inorganic insulating film (64).)

1. An electronic component module is characterized by comprising:

an electronic component;

a resin structure covering at least a part of the electronic component;

a through wiring penetrating the resin structure;

a wiring layer electrically connecting the electronic component and the through wiring; and

an adhesion layer formed at least between the resin structure and the through wiring and in contact with the resin structure and the through wiring,

the adhesion layer contains an inorganic insulating film.

2. The electronic component module of claim 1,

the adhesion layer has:

a first contact portion provided in contact with the resin structure and the through wiring; and

and a second contact portion provided in contact with the resin structure and the wiring layer.

3. The electronic component module of claim 2,

the first close contact portion and the second close contact portion are formed integrally.

4. The electronic component module according to claim 3,

the first and second sealing portions are formed of the same material.

5. The electronic component module according to any one of claims 1 to 4,

the inorganic insulating film is a metal oxide or a metal nitride, a silicon oxide or a silicon nitride having an electrical insulating property.

6. The electronic component module according to any one of claims 1 to 5,

the adhesion layer further comprises: and a diffusion preventing film formed of a material different from the inorganic insulating film and configured to reduce diffusion of a metal.

7. The electronic component module of claim 6,

the diffusion preventing film is formed of at least one of silicon nitride and metal oxide.

8. The electronic component module according to claim 6 or 7,

the diffusion preventing film is provided between the inorganic insulating film and the through wiring.

9. The electronic component module according to any one of claims 1 to 8,

the resin structure is formed of an epoxy resin or a polyimide resin.

10. The electronic component module according to any one of claims 1 to 9,

the wiring layer is formed of a conductor containing Cu.

11. The electronic component module according to any one of claims 1 to 10, further comprising:

an electrode formed on the wiring layer; and

a resist layer formed on the wiring layer at a position different from the electrode,

the resist layer is formed of a material having lower solder wettability than the electrodes and the wiring layer.

12. The electronic component module according to any one of claims 1 to 10, further comprising:

an external connection wiring layer electrically connected to the through wiring; and

a resist layer formed on the external connection wiring layer,

the resist layer is formed of a material having lower solder wettability than the external connection wiring layer.

13. A method for manufacturing an electronic component module, comprising:

a step of preparing a laminate;

forming a conductor post serving as a base of a through wiring on the laminate;

fixing an electronic component on the laminate on which the conductor post is formed;

forming a resin structure layer serving as a base of the resin structure on the laminate;

forming a structure including the electronic component, the resin structure, the through-wiring, and the laminate by polishing the resin structure layer to a thickness of the resin structure;

removing the laminate from the structure; and

and forming a wiring layer for electrically connecting the electronic component and the through-wiring.

14. The method of manufacturing an electronic component module according to claim 13,

a step of forming an inorganic insulating layer serving as a base of an adhesion layer on the exposed surfaces of the laminate and the conductor post, between the step of fixing the electronic component and the step of forming the resin structure layer,

in the step of forming the structure, the resin structural layer is polished to a thickness that becomes the resin structure, thereby forming the structure including the electronic component, the resin structure, the through-wiring, the laminate, and the inorganic insulating layer.

15. The manufacturing method of the electronic component module according to claim 13 or 14,

the step of forming the electronic component includes:

forming a liquid resin adhesive layer on the laminate; and

and a step of pressing the electronic component to the resin adhesive layer with the surface of the electronic component facing the resin adhesive layer.

Technical Field

The present invention generally relates to an electronic component module and a method for manufacturing the same, and more particularly to an electronic component module including an electronic component and a resin structure, and a method for manufacturing the same.

Background

Conventionally, as an electronic component module, a semiconductor package including a semiconductor chip (electronic component), an insulating resin layer (resin structure), a conductive rod (through wiring), a connection terminal, a wiring layer, and a surface layer is known (for example, see patent document 1).

In the semiconductor package described in patent document 1, connection terminals are provided on the upper surface of the semiconductor chip, and the entire conductor chip except for the bottom surface portion, the connection terminals on the semiconductor chip, the conductive bars, and the wiring layer are covered with an insulating resin layer. The material of the conductive rod is, for example, Cu.

Prior art documents

Patent document

Patent document 1: japanese patent laid-open publication No. 2005-310954

Disclosure of Invention

Problems to be solved by the invention

In the conventional electronic component module described in patent document 1, the through-wiring is covered with the resin structure as described above.

However, the adhesion between the resin and the metal is generally low, and in the conventional electronic component module described in patent document 1, the adhesion between the through-wiring and the resin structure is low, and as a result, the through-wiring may be easily peeled off from the resin structure.

The present invention has been made in view of the above-described circumstances, and an object of the present invention is to provide an electronic component module in which through-wiring is less likely to peel off, and a method for manufacturing the same.

Means for solving the problems

An electronic component module according to an embodiment of the present invention includes an electronic component, a resin structure, a through-wiring, a wiring layer, and an adhesion layer. The resin structure covers at least a part of the electronic component. The through-wiring penetrates the resin structure. The wiring layer electrically connects the electronic component and the through wiring. The adhesion layer is formed at least between the resin structure and the through wiring, and is in contact with the resin structure and the through wiring. The adhesion layer contains an inorganic insulating film.

A method for manufacturing an electronic component module according to an embodiment of the present invention includes: a step of preparing a laminate; and forming a conductor post serving as a base of the through wiring on the stacked body. The method for manufacturing an electronic component module further includes: fixing an electronic component on the laminate on which the conductor post is formed; and forming a resin structural layer serving as a base of the resin structure on the laminate. The method for manufacturing an electronic component module further includes: forming a structure including the electronic component, the resin structure, the through-wiring, and the laminate by polishing the resin structure layer to a thickness of the resin structure; and removing the laminate from the structure. The method for manufacturing an electronic component module further includes: and forming a wiring layer for electrically connecting the electronic component and the through-wiring.

Effects of the invention

According to the electronic component module and the manufacturing method thereof according to the above aspect of the present invention, the through wiring can be made less likely to peel off.

Drawings

Fig. 1 is a sectional view of an electronic component module according to embodiment 1 of the present invention.

Fig. 2 is a sectional view of a communication module including the same electronic module.

Fig. 3a to 3F are cross-sectional views for explaining the method of manufacturing the electronic component module described above.

Fig. 4a to 4E are cross-sectional views for explaining the method of manufacturing the electronic component module described above.

Fig. 5 is a sectional view of an electronic component module according to embodiment 2 of the present invention.

Fig. 6a to 6F are cross-sectional views for explaining the method of manufacturing the electronic component module described above.

Fig. 7 a to 7E are cross-sectional views for explaining the method of manufacturing the electronic component module described above.

Fig. 8 is a sectional view of a main part of an electronic component module according to embodiment 3 of the present invention.

Detailed Description

Hereinafter, the electronic component module according to embodiments 1 to 3 will be described with reference to the drawings.

In the electronic component modules according to embodiments 1 to 3 below, an adhesion layer including an inorganic insulating film is provided so as to be in contact with the resin structure and the through wiring.

Fig. 1, fig. 2, fig. 3a to fig. 3F, fig. 4a to fig. 4E, fig. 5, fig. 6a to fig. 6F, and fig. 7 a to fig. 7E, which are referred to in the following embodiments and the like, are schematic diagrams, and the ratios of the sizes and thicknesses of the respective constituent elements in the diagrams do not necessarily reflect the actual dimensional ratios.

(embodiment mode 1)

(1) Integral structure of electronic component module

Hereinafter, an electronic component module 1 according to embodiment 1 will be described with reference to the drawings.

As shown in fig. 1, an electronic component module 1 according to embodiment 1 includes an electronic component 2, a resin structure 3, a plurality of (two in the illustrated example) through-wirings 4, a plurality of (two in the illustrated example) wiring layers 5, and an adhesive layer 6. In the electronic component module 1, the resin structure 3 holds the electronic component 2 and the through-wiring 4. In the electronic component module 1, the resin structure 3 protects the electronic component 2 from external impact or the like. The through-wiring 4 is located on the side of the electronic component 2 and penetrates the resin structure 3 in the thickness direction (predetermined direction) of the resin structure 3. The wiring layer 5 electrically connects the electronic component 2 and the through wiring 4.

The electronic component module 1 further includes a plurality of (two in the illustrated example) electrodes 7, an external connection wiring layer 8, and a plurality of resist layers 9 and 90. In the electronic component module 1, a plurality of electrodes 7 are provided as electrodes for external connection. The external connection wiring layer 8 is provided to electrically connect the through wiring 4 to the circuit board 10 (see fig. 2). A resist layer 9 is formed on the wiring layer 5. The resist layer 90 is formed on the external connection wiring layer 8.

The electronic component module 1 can be used as an Interposer (Interposer) interposed between an electronic component 20 (see fig. 2) different from the electronic component 2 and a circuit board 10 (see fig. 2), for example. The circuit board 10 is, for example, a printed wiring board.

(2) Each component of electronic component module

Next, each constituent element of the electronic component module 1 will be described with reference to the drawings.

(2.1) electronic component

As shown in fig. 1, the electronic component 2 has a front surface 21 and a back surface 22 on opposite sides to each other in the first direction D1 of the electronic component module 1. More specifically, the electronic component 2 is formed in a plate shape, and has a front surface 21 and a back surface 22 on opposite sides to each other in a thickness direction thereof. Furthermore, the electronic component 2 has a side face 23. The shape of the electronic component 2 in plan view (the outer peripheral shape of the electronic component 2 when viewed in the thickness direction thereof) is rectangular, but the shape is not limited to rectangular, and may be square, for example.

The electronic component 2 is, for example, a SAW (Surface Acoustic Wave) filter. However, the electronic component 2 is not limited to the SAW filter, and may be a BAW (Bulk Acoustic Wave) filter, an RF (Radio Frequency) switch, a film capacitor, or a semiconductor device, for example. The other electronic components 20 are, for example, an IC (Integrated Circuit), an inductor, and a SAW filter. In the communication module 200 (see fig. 2) including the electronic component module 1, a gap 202 (see fig. 2) is formed between the surface 21 of the electronic component 2 as the SAW filter and the other electronic component 20 described above. The electronic component module 1 is electrically connected to the electronic component 20 via a plurality of (two in the illustrated example) conductive bumps 43, and is electrically connected to the circuit board 10 via a plurality of (two in the illustrated example) conductive bumps 44.

When the electronic component 2 is a SAW filter, for example, the electronic component includes: a piezoelectric substrate having a front surface and a back surface on opposite sides to each other in a thickness direction; and a functional portion formed on a surface of the piezoelectric substrate. The piezoelectric substrate is, for example, LiTaO₃Substrate or LiNbO₃A substrate. The thickness of the piezoelectric substrate is, for example, about 200 μm. The functional section includes, for example, one or more IDT (Interdigital Transducer) electrodes. The functional portion may include a terminal electrode for external connection. The number of the terminal electrodes may be one or more. When the electronic component 2 is a SAW filter, the surface 21 of the electronic component 2 includes, for example, an exposed portion of the surface of the piezoelectric substrate and a surface exposed in the functional portion. When the electronic component 2 is a SAW filter, the structure is not limited to the structure of the piezoelectric substrate including the Bulk (Bulk), and for example, a structure having a laminated structure in which a silicon substrate, a silicon oxide film, and a piezoelectric thin film are sequentially laminated and a functional portion (IDT electrode, terminal electrode, or the like) is formed on the piezoelectric thin film may be employed. The piezoelectric film is, for example, LiTaO₃Thin films or LiNbO₃A film. When λ is the wavelength of the elastic wave determined by the electrode finger period of the IDT electrode, the thickness of the piezoelectric thin film is preferably 3.5 λ or less. The thickness of the piezoelectric thin film is, for example, about 0.5 μm. The thickness of the silicon oxide film is preferably 2.0 λ or less. The thickness of the silicon oxide film is, for example, about 0.5 μm. The thickness of the laminated structure is, for example, about 200 μm.

(2.2) resin Structure

As shown in fig. 1, the resin structure 3 is configured to hold the electronic component 2. The resin structure 3 has the first surface 31 and the second surface 32 on the opposite sides to each other in the first direction D1 of the electronic component module 1. More specifically, the resin structure 3 is formed in a plate shape and has a first surface 31 and a second surface 32 on opposite sides to each other in the thickness direction thereof. The planar shape of the resin structure 3 (the outer peripheral shape of the resin structure 3 when viewed from the first direction D1, which is the thickness direction thereof) is a rectangle. However, the planar shape of the resin structure 3 is not limited to a rectangle, and may be, for example, a square. The planar size of the resin structure 3 is larger than the planar size of the electronic component 2.

Resin structure 3 covers part of side surface 23 and back surface 22 of electronic component 2. That is, the electronic component 2 is disposed inside the resin structure 3. Resin structure 3 holds electronic component 2 with surface 21 of electronic component 2 exposed.

The resin structure 3 is made of an electrically insulating resin or the like. The resin structure 3 contains, for example, a filler mixed in the resin in addition to the resin, but the filler is not an essential component. The resin is, for example, an epoxy resin or a polyimide resin. However, the resin is not limited to the epoxy resin or the polyimide resin, and may be, for example, an acrylic resin, a urethane resin, a silicone resin, or a fluorine-based resin. Examples of the filler include inorganic fillers such as silica and alumina. The resin structure 3 may contain a black pigment such as carbon black, for example, in addition to the resin and the filler.

Further, the resin structure 3 of embodiment 1 is in contact with the electronic component 2. That is, the resin structure 3 holds the electronic component 2 in contact with the electronic component 2 without interposing another member between the electronic component 2 and the resin structure.

(2.3) through wiring

In the electronic component module 1, as shown in fig. 1, a plurality of (two in the illustrated example) through-wirings 4 are arranged on the side of the electronic component 2 in the resin structure 3. In a second direction D2 perpendicular to the first direction D1, the plurality of through-wirings 4 are located apart from the electronic component 2. The plurality of through-wires 4 are held by the resin structure 3.

The through-wiring 4 has a columnar shape (here, a columnar shape), and has a first end surface 41 and a second end surface 42 on opposite sides to each other in a direction parallel to the thickness direction of the resin structure 3. In short, the through wiring 4 has the first end face 41 and the second end face 42 on opposite sides to each other in the first direction D1. A second end 52 of the wiring layer 5, which will be described later, is laminated on the first end surface 41 of the through-wiring 4. In this way, in the electronic component module 1, the through-wiring 4 is electrically connected to the wiring layer 5.

In the electronic component module 1, the through-wiring 4 is electrically connected to the electronic component 2 via the wiring layer 5. In the electronic component module 1, the positions and the number of the through-wirings 4 are not particularly limited.

The material of the through-wiring 4 is, for example, metal or alloy. In the electronic component module 1 according to embodiment 1, the material of the through-wiring 4 is, for example, Cu. The material of the through-wiring 4 is not limited to Cu, and may be Ni, for example. The through-wiring 4 is formed by, for example, electrolytic plating.

(2.4) Wiring layer

The wiring layer 5 electrically connects the electronic component 2 and the through wiring 4 on the first surface 31 side of the resin structure 3 and the front surface 21 side of the electronic component 2. The wiring layer 5 has a first end 51 connected to the surface 21 of the electronic component 2 (the surface of the terminal portion) and a second end 52 connected to the through-wiring 4. The wiring layer 5 is disposed across the front surface 21 of the electronic component 2, the first end surface 41 of the through-wiring 4, and a second contact portion 62 of the contact layer 6 described later. The thickness of the wiring layer 5 is, for example, 5 μm or more and 10 μm or less.

The material of the wiring layer 5 is, for example, a metal or an alloy. In the electronic component module 1 according to embodiment 1, the material of the wiring layer 5 is Cu as an example. In short, the wiring layer 5 is a Cu layer. The wiring layer 5 is not limited to a single-layer structure, and may be a laminated structure in which a plurality of layers are laminated. The wiring layer 5 is formed by, for example, sputtering or plating. The method of forming the wiring layer 5 is not limited to sputtering or plating, and other methods of forming may be used.

The electronic component module 1 includes an external connection wiring layer 8 for electrically connecting the through-wiring 4 and the circuit board 10 (see fig. 2) in addition to the wiring layer 5. The external connection wiring layer 8 is formed on the second surface 32 side of the resin structure 3 across the second surface 32 of the resin structure 3 and the second end face 42 of the through wiring 4. The thickness of the external connection wiring layer 8 is, for example, 5 μm or more and 10 μm or less.

The material of the external connection wiring layer 8 is, for example, a metal or an alloy. In the electronic component module 1 according to embodiment 1, the material of the external connection wiring layer 8 is Cu, similarly to the wiring layer 5. As with the wiring layer 5, the external connection wiring layer 8 is not limited to a single-layer structure, and may be a laminated structure in which a plurality of layers are laminated. The external connection wiring layer 8 is formed by, for example, sputtering or plating. The method of forming the external connection wiring layer 8 is not limited to sputtering or plating, and other forming methods may be used.

The electronic component module 1 further includes a resist layer 90 formed on the external connection wiring layer 8. The resist layer 90 is formed of a material having lower solder wettability than the external connection wiring layer 8. The resist layer 90 is, for example, a polyimide layer. Thus, in the electronic component module 1, when the external connection wiring layer 8 is joined to the circuit board 10 or the like by solder, the solder can be suppressed from wetting and spreading on the external connection wiring layer 8.

(2.5) adhesion layer

The close contact layer 6 includes a plurality of first and second contact portions 61 and 62. Each first contact portion 61 is provided in contact with the resin structure 3 and the through-wiring 4. Each first contact portion 61 is provided to cover the entire circumferential surface of the columnar through-wiring 4 except for the first end surface 41 and the second end surface 42. The second contact portion 62 is provided along the first surface 31 of the resin structure 3 so as to be in contact with the resin structure 3 and the wiring layer 5. The plurality of first and second sealing portions 61 and 62 are formed integrally.