阅读说明：本技术 0.4mm节距的主引线陶瓷小外形外壳及功率器件 (0.4 mm-pitch main lead ceramic small-outline shell and power device ) 是由 杨振涛 彭博 于 2019-11-12 设计创作，主要内容包括：本发明提供了一种0.4mm节距的主引线陶瓷小外形外壳及功率器件,属于陶瓷封装技术领域,包括陶瓷体、多个主焊盘、主引线、辅助焊盘以及辅助引线,多个主焊盘沿陶瓷体的上端面或下端面相对的两长边均匀布设；主引线与一一对应与主焊盘连接,主引线的节距为0.4mm,所述主引线为折弯件；辅助焊盘对称设于所述陶瓷体相对的两短边；辅助引线一一对应设于所述辅助焊盘上,且向所述陶瓷体外延伸。本发明提供的0.4mm节距的主引线陶瓷小外形外壳,能够实现陶瓷封装小外形外壳的电镀且节距能达到0.4m。(The invention provides a 0.4 mm-pitch main lead ceramic small-outline shell and a power device, which belong to the technical field of ceramic packaging, and comprise a ceramic body, a plurality of main bonding pads, main leads, auxiliary bonding pads and auxiliary leads, wherein the main bonding pads are uniformly distributed along two opposite long edges of the upper end surface or the lower end surface of the ceramic body; the main leads are connected with the main bonding pads in one-to-one correspondence, the pitch of the main leads is 0.4mm, and the main leads are bent pieces; the auxiliary bonding pads are symmetrically arranged on two opposite short sides of the ceramic body; the auxiliary leads are arranged on the auxiliary bonding pads in a one-to-one correspondence manner and extend out of the ceramic body. The main lead ceramic small-outline shell with the 0.4mm pitch provided by the invention can realize electroplating of a ceramic packaging small-outline shell, and the pitch can reach 0.4 m.)

A 1.0.4mm pitch main lead ceramic low profile package comprising:

a ceramic body provided with a core cavity for packaging a chip;

the main bonding pads are uniformly distributed along two opposite long edges of the upper end surface or the lower end surface of the ceramic body;

the main leads are the same as the main bonding pads in number, are respectively arranged on two long sides of the ceramic body and are connected with the main bonding pads in a one-to-one correspondence mode, the pitch of the main leads is 0.4mm, and the main leads are bending pieces;

the auxiliary bonding pads are symmetrically arranged on two opposite short sides of the ceramic body; and

and the auxiliary leads are arranged on the auxiliary bonding pads in a one-to-one correspondence manner and extend out of the ceramic body.

2. A 0.4mm pitch main lead ceramic low profile package according to claim 1, wherein the main lead comprises a soldering portion, an inclined portion and an extended portion connected in sequence, wherein an end of the soldering portion remote from the inclined portion is provided with a bent portion inclined in a direction away from the ceramic body, an intersection of the soldering portion and the inclined portion is located in an end face of the ceramic body, two soldering spaces are formed between the bent portion and the inclined portion and the ceramic body, the soldering spaces are used for filling solder when the main lead is soldered to the ceramic body, and the filled solder forms a solder fillet at both soldering spaces.

3. The 0.4mm pitch main lead ceramic small outline package according to claim 2, wherein an angle between the bent portion and the end face of the ceramic body is greater than or equal to an angle between the inclined portion and the end face of the ceramic body.

4. A 0.4mm pitch main lead ceramic low profile package in accordance with claim 2, wherein said bond length of said bond to said main land is 0.6-0.8 mm.

5. The 0.4mm pitch primary lead ceramic low profile package of claim 1, wherein said primary pads have a length of 1.0mm or more and a width of 0.2-0.3mm, and wherein the spacing between two adjacent primary pads in a same side is 0.1mm or more.

6. A 0.4mm pitch main lead ceramic low profile package in accordance with claim 1, wherein said main lead has a width of 0.15 ± 0.05mm and a thickness of 0.1 ± 0.05 mm.

7. A 0.4mm pitch main lead ceramic low profile package in accordance with claim 1, wherein the degree of location of said main lead is 0.15mm or less.

8. A 0.4mm pitch main lead ceramic low profile package in accordance with claim 1, wherein the bond finger width in the core cavity is 0.06mm and the bond finger pitch is 0.05 mm.

9. The 0.4mm pitch main lead ceramic low profile package of claim 1, wherein the ceramic body has a wall thickness of 0.5mm or greater and a core cavity bottom thickness of 0.3mm or greater.

10. A power device comprising a 0.4mm pitch main lead ceramic low profile package as claimed in any one of claims 1 to 9.

Technical Field

The invention belongs to the technical field of ceramic packaging, and particularly relates to a main lead ceramic small-outline shell with 0.4mm pitch and a power device.

Background

The CSOP shell is a miniaturized surface-mounted shell, the wing-shaped main lead of the CSOP shell is more beneficial to absorbing the stress between the shell and a PCB, the reliability is improved, and the CSOP shell is widely applied to amplifiers, drivers, memories, comparators and the like.

At present, a 0.40mm pitch product of a plastic Package SOP (Small Out-Line Package) device is generally used, the 0.40mm pitch product is mainly manufactured by a plastic Package process, a chip is mounted on a plastic Package substrate, finally, the chip is encapsulated by a molding compound, a main lead is led Out from the middle of a shell, and the plastic Package structure has hidden troubles in the aspects of Package airtightness, internal thermal property, storage, application and other reliability.

In order to meet the requirement of high reliability, and simultaneously to be compatible with foreign 0.40mm pitch plastic package devices and also to meet the requirement of continuous reduction of the size, pitch and the like of the shell for miniaturization of the devices, a ceramic package small-outline shell (CSOP) is required to be adopted for ceramic package. However, the circuit performance of part of devices requires that the electric potentials of the sealing area and the core area are isolated and are not electrically connected with the PCB, so that the sealing area and the core area are not communicated with any outer pin in the tube shell in an isolated suspension state without leading-out treatment. In order to ensure the firmness of the main lead, the tube shell with the outer main lead is required to be electroplated with nickel and gold, the tube shell is placed in a plating solution during electroplating, the nickel and gold electroplating of the tube shell is realized by electrifying the main lead frame of the tube shell with current, and the sealing area and the core area are in an isolated state and are not communicated with the outer main lead frame, so that the nickel and gold electroplating cannot be realized; in addition, the pitch of the main lead of the ceramic package small outline package (CSOP) device can only reach 0.50mm, and the requirements of the SOP device can not be met.

Disclosure of Invention

The invention aims to provide a 0.4 mm-pitch main lead ceramic small-outline shell, and aims to solve the technical problems that the conventional ceramic packaging small-outline shell cannot realize electroplating and the pitch cannot reach 0.4 mm.

In order to achieve the purpose, the invention adopts the technical scheme that: the ceramic small-outline shell with the main lead wire of 0.4mm pitch comprises a ceramic body provided with a core cavity for packaging a chip, a plurality of main bonding pads, a main lead wire, an auxiliary bonding pad and an auxiliary lead wire, wherein the main bonding pads are uniformly distributed along two opposite long edges of the upper end surface or the lower end surface of the ceramic body; the number of the main leads is the same as that of the main bonding pads, the main leads are connected with the main bonding pads in a one-to-one correspondence mode, the pitch of the main leads is 0.4mm, and the main leads are bent pieces; the auxiliary bonding pads are symmetrically arranged on two opposite short sides of the ceramic body; and the auxiliary leads are arranged on the auxiliary bonding pads in a one-to-one correspondence manner and extend out of the ceramic body.

As another embodiment of this application, the main lead includes welding part, rake and the epitaxial portion of connecting in order, the welding part is kept away from the one end of rake is equipped with to keeping away from the portion of bending of the direction slope of ceramic body, the welding part with the crossing department of rake is located in the terminal surface of ceramic body, bend the portion with the rake with constitute two welding contained angles between the ceramic body, the welding contained angle is used for the main lead with solder when the ceramic body welds is filled to make the solder of filling all form the solder cornerite in two welding contained angles departments.

As another embodiment of the present application, an included angle between the bent portion and the end surface of the ceramic body is greater than or equal to an included angle between the inclined portion and the end surface of the ceramic body.

As another embodiment of the present application, a bonding length of the bonding part and the main pad is 0.6-0.8 mm.

As another embodiment of the application, the length of the main bonding pad is greater than or equal to 1.0mm, the width of the main bonding pad is 0.2-0.3mm, and the distance between two adjacent main bonding pads in the same side is greater than or equal to 0.1 mm.

As another embodiment of the present application, the width of the main lead is 0.15 + -0.05 mm, and the thickness of the main lead is 0.1 + -0.05 mm.

As another embodiment of the present application, the position degree of the main lead is 0.15mm or less.

As another embodiment of the application, the width of the bonding fingers in the core cavity is 0.06mm, and the spacing between the bonding fingers is 0.05 mm.

As another embodiment of the present application, the ceramic body has a wall thickness of 0.5mm or more and a core cavity bottom thickness of 0.3mm or more.

The invention also provides a power device which comprises the 0.4mm pitch main lead ceramic small-outline shell.

The ceramic small-outline shell of the main lead with the 0.4mm pitch provided by the invention has the beneficial effects that: compared with the prior art, the 0.4mm pitch main lead ceramic small-outline shell is manufactured by packaging the small-outline shell with ceramic, so that the purpose of preparing the 0.4mm pitch small-outline ceramic packaging shell with ceramic is achieved; for the electroplating of realization tube, set up supplementary pad and auxiliary lead wire on the ceramic body, through the electroplating of the seal district area and core region with little lead wire realization of two electroplating assistance at the ceramic body minor face designs, seal district area and core region communicate to the auxiliary lead wire at the tube back through the inside interconnecting hole of ceramic body, and then realize the intercommunication with the lead frame, thereby realize the electroplating of seal district area and core region, then cut the processing with the lead frame of tube minor face along the edge of tube appearance, just can realize the isolation of seal district area and core region again, consequently, the lead wire that increases can not lead to the fact the influence to the product.

The power device provided by the invention adopts the shell, utilizes the ceramic to package the small-outline shell and manufactures the ceramic shell with the 0.4mm pitch, so that the purpose of preparing the small-outline ceramic package shell with the 0.4mm pitch by utilizing the ceramic is realized, and meanwhile, the electroplating of the shell can be realized.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a 0.4mm pitch ceramic low profile housing for a main lead, according to an embodiment of the present invention;

FIG. 2 is a schematic top view of the structure of FIG. 1;

FIG. 3 is a schematic bottom view of the structure of FIG. 1;

FIG. 4 is a schematic structural diagram of a 0.4mm pitch ceramic low profile package for a main lead according to a second embodiment of the present invention;

FIG. 5 is a schematic top view of the structure of FIG. 4;

FIG. 6 is a bottom view of the structure of FIG. 4;

fig. 7 is a schematic structural diagram of a 0.4mm pitch main lead ceramic small-outline package with a lead frame removed according to an embodiment of the present invention.

In the figure: 1. index identification; 2. a main pad; 3. a main lead; 31. an extension portion; 32. an inclined portion; 33. welding the part; 34. a bending part; 4. a core cavity; 5. a ceramic body; 6. a bonding finger; 7. solder wrap angle; 8. a heat sink; 9. a sealing ring; 10. a lead frame; 11. an auxiliary pad; 12. and auxiliary leads.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Referring to fig. 1-7, a 0.4mm pitch ceramic low profile housing of the present invention will now be described. The 0.4 mm-pitch main lead ceramic small-outline shell comprises a ceramic body 5 provided with a core cavity 4 for packaging a chip, a plurality of main bonding pads 2 and a main lead 3, wherein the main bonding pads 2 are uniformly distributed along two opposite long edges of the upper end surface or the lower end surface of the ceramic body 5; the number of the main leads 3 is the same as that of the main bonding pads 2, the main leads are connected with the main bonding pads 2 in a one-to-one correspondence mode, the pitch of the main leads 3 is 0.4mm, and the main leads are bent pieces; the auxiliary bonding pads 11 are symmetrically arranged on two opposite short sides of the ceramic body; and auxiliary leads 12 which are arranged on the auxiliary bonding pads 11 in a one-to-one correspondence manner and extend outward of the ceramic body.

Compared with the prior art, the 0.4 mm-pitch main lead ceramic small-outline shell provided by the invention is manufactured by packaging the small-outline shell with ceramic, so that the purpose of preparing the 0.4 mm-pitch small-outline ceramic packaging shell with ceramic is realized; in order to realize the electroplating of the tube shell, an auxiliary bonding pad 11 and an auxiliary lead 12 are arranged on the ceramic body, the electroplating of the sealing area and the core area is realized by designing two small leads for assisting the electroplating on the short side of the ceramic body, the sealing area and the core area are communicated to the auxiliary lead 12 on the back of the tube shell through interconnection holes in the ceramic body, and further communicated with the lead frame 10, so that the electroplating of the sealing area and the core area is realized, then the lead frame 10 on the short side of the tube shell is cut along the edge of the shape of the tube shell, see fig. 7, the isolation of the sealing area and the core area can be realized, and the added auxiliary lead 12 cannot influence products.

In this embodiment, an auxiliary pad 11 and an auxiliary lead 12 are respectively disposed on two opposite short sides of the ceramic body, the sealing ring and the chip region of the ceramic case are connected to the auxiliary pad 11 on the back side of the ceramic body through the interconnection hole inside the ceramic body, and further connected to the peripheral lead frame 10 through the auxiliary lead 12, and then the case can be electroplated. After the electroplating is completed, the lead frame 10 is cut along the edge of the housing, so that the isolation of the sealing area and the core area can be realized, and the added lead wire can not influence the product. Wherein the interconnected pores in the ceramic body are metallized pores.

Specifically, the auxiliary bonding pad is arranged in the middle of the short side of the ceramic body, and the auxiliary lead is led out perpendicular to the short side of the ceramic body and connected with the lead frame.

Referring to fig. 3 and 5, the main lead 3 includes a soldering portion 33, an inclined portion 32 and an extending portion 31 connected in sequence, one end of the soldering portion 33 away from the inclined portion 32 is provided with a bent portion 34 inclined in a direction away from the ceramic body 5, an intersection of the soldering portion 33 and the inclined portion 32 is located in an end surface of the ceramic body 5, two soldering included angles are formed between the bent portion 34 and the inclined portion 32 and the ceramic body 5, the soldering included angles are used for filling solder when the main lead 3 is soldered to the ceramic body 5, and the filled solder forms a solder fillet 7 at both soldering included angles.

When the center distance between the main lead 3 and the main lead 3 reaches 0.40mm, the width of the main lead 3, the width of the main pad 2, the external dimension of the ceramic body 5 and the like all need to be reduced, in order to realize the purpose of miniaturization and meet the requirement of reliability, through improving the main lead 3, both ends of the welding part 33 of the main lead 3 are respectively provided with a bending part 34 and an inclined part 32, through an included angle formed between the bending part 34 and the inclined part 32 and the ceramic body 5, the main lead 3 and the main pad 2 form two effective three-dimensional brazing structures, the effective area of the wrapping angles of both ends of the welding part 33 of the main lead 3 is increased, the effect of the wrapping angles of both ends of the welding part 33 is strengthened, good 'meniscus' welding wrapping angles 7 can be formed at both ends of the welding part 33 of the main lead 3, the impact of an external force on a metallization layer is relieved, and the reliability of the welding strength of the main lead, thereby realizing the application of the ceramic package with 0.4mm pitch in a small-outline package shell.

In the present embodiment, the structure of the auxiliary lead 12 is the same as that of the main lead.

Referring to fig. 3 and 5, as a specific embodiment of the ceramic small-outline package with 0.4mm pitch for the main lead provided by the present invention, an included angle between the bending portion 34 and the end surface of the ceramic body 5 is greater than or equal to an included angle between the inclined portion 32 and the end surface of the ceramic body 5.

As an embodiment of the present invention, referring to fig. 1 and 4, the bonding length between the bonding portion 33 and the main pad 2 is 0.6-0.8 mm. As the main leads 3 of the shell are mainly distributed on two sides of the long edge of the ceramic body 5, the welding length of the main lead 3 of the ceramic shell with the current 0.5 pitch is 0.4-0.45mm, and compared with the welding length of the main lead 3 with the current 0.5 pitch, the welding length is increased, and the welding strength is improved.

As a specific implementation manner of the embodiment of the present invention, please refer to fig. 2 to 3, 5 and 6, the width of the main lead 3 is 0.15 ± 0.05mm, and the thickness of the main lead 3 is 0.1 ± 0.05 mm. In combination with the bonding length, for the main lead 3 with 0.40mm pitch, the effective bonding area is reduced by 25% compared with that of the main lead 3 with 0.50mm pitch under the same bonding condition, so as to meet the requirement of miniaturization. Meanwhile, the welding length is increased, the welding reliability is improved, and the welding strength and reliability are guaranteed through the two welding included angles. The distance B between the center distances of the adjacent main leads 3 is 0.4 +/-0.05 mm, and the distance D between the adjacent main leads 3 is 0.15 +/-0.05 mm.

When the center distance of the main lead reaches 0.40mm, the width of the main lead 3 is only 0.10-0.20mm, the main lead 3 is thin and easy to deform, and the assembly welding of the main lead 3 and the tube shell cannot be realized. Therefore, on the premise that the structural size of each part is reduced, the miniaturization of the appearance of the shell is realized, and the requirements on strength and reliability are also met.

As a specific implementation manner of the embodiment of the present invention, the position degree of the main lead 3 is less than or equal to 0.15 mm. By setting the position deviation, the welding position of the main lead 32 is ensured to be accurate, and the pitch requirement between the main leads 3 is further ensured.

In this embodiment, the flatness of the extension portion 31 connected to the PCB is not more than 0.1 mm. And the welding reliability of the main lead 3 and the PCB is improved by limiting the flatness.

In this embodiment, the length of the main bonding pad 2 is greater than or equal to 1.0mm, the width of the main bonding pad is 0.2-0.3mm, and the distance between two adjacent main bonding pads 2 in the same side is greater than or equal to 0.1 mm. In this embodiment, the central value of the width of the main pad 2 of the flat housing of the ceramic four-side main lead 3 with the 0.40mm pitch is 0.28mm, and taking the central value of the width of the main pad 2 of the flat housing of the ceramic four-side main lead 3 with the 0.40mm pitch as an example, the width is reduced by 20% compared with the width of the main pad 2 with the 0.50mm pitch by 0.35mm, and at this time, the welding length of the lead should be lengthened as much as possible to ensure the welding strength of the main lead 3. Wherein, the distance B between the centers of the adjacent main pads 2 is 0.4 +/-0.05 mm.

Referring to fig. 2, as a specific implementation manner of the embodiment of the present invention, the width of the bonding fingers 6 in the core cavity 4 is 0.06mm, and the pitch of the bonding fingers 6 is 0.05 mm. That is, the minimum width of the bonding fingers 6 can be 0.06mm, and the minimum pitch of the bonding fingers 6 can be 0.05mm, which meets the requirement for a ceramic case with a miniaturized size.

Referring to fig. 1 and 4, as an embodiment of the present invention, the wall thickness of the ceramic body 5 is greater than or equal to 0.5mm, and the bottom thickness of the core cavity 4 is greater than or equal to 0.3 mm. That is, on the premise of meeting the reliability, the narrowest side wall of the tube shell can be 0.50mm, the 4-substrate core cavity of the tube shell can be 0.30mm, and the requirement of miniaturization of the ceramic shell with 0.4mm pitch is met.

As a specific implementation manner of the embodiment of the present invention, please refer to fig. 1 to 4, the external dimension of the housing is greater than or equal to 3mm × 3 mm. That is, the minimum dimension of the shell can reach 3mm × 3mm, while the minimum dimension of the shell with 0.5 pitch at present is 5 × 5mm, under the condition of the same pin number, the pitch of 0.40mm is adopted, the external dimension of the shell in the length direction can be reduced by more than 18% compared with the shell with 0.50mm pitch, compared with the conventional tube shell, the overall dimension of the tube shell is effectively reduced, and the development trend of miniaturization design is met. Therefore, through a series of changes of the design of the main lead 3, the width of the main pad 2, the center distance of the main pad 2, the distance of the bonding fingers 6 and the like, on the premise of ensuring the welding strength and reliability of the main lead 3, the external dimension of the prepared ceramic shell with 0.4mm pitch is reduced, the shell miniaturization is realized, the plastic package shell is replaced, and the prepared shell has the advantages of good reliability, plasticity and sealing performance of ceramic materials, higher insulating performance and excellent high-frequency characteristic, the linear expansion coefficient of the ceramic shell is very close to that of an electronic component, and the ceramic shell has stable chemical performance and high thermal conductivity. Therefore, the ceramic shell has the characteristics of multilayer wiring, high reliability, high air tightness and the like. The digital logic chip, the analog transceiver circuit, the memory, the passive element and the like are internally packaged to realize higher packaging density and better system function, can be widely applied to amplifiers, drivers, memories, comparators and the like, and is suitable for various high-density integrated circuit systems such as advanced communication engines, SRAM, shaft angle converters and the like.

Referring to fig. 1 to 6, the product is composed of a ceramic part, a sealing ring 9 (if necessary), a main lead 3, a heat sink 8 (if necessary) and an insulating ceramic strip (if necessary), wherein the ceramic part is made of 90% of alumina and is manufactured by adopting a multilayer alumina ceramic tungsten metallization high-temperature co-firing process, the sealing ring 9 and the main lead 3 are made of iron-nickel alloy or iron-nickel-cobalt alloy, the heat sink 8 is made of tungsten-copper, molybdenum-copper, CPC and the like, and the ceramic part, the sealing ring 9, the heat sink 8 and the main lead 3 are welded by adopting silver-copper solder. The metal sealing ring 9 is used for gold-tin sealing, parallel seam welding or laser seam welding sealing, and the heat sink 8 is used for chip grounding or heat dissipation.

The standard CSOP main lead 3 take-off is divided into top and bottom take-off. The top lead-out structure is shown in fig. 4, pins need to be subjected to secondary forming during board-level installation, the forming height of a main lead is large, thermal stress between a PCB and a shell is easy to absorb, and the lead-out structure is suitable for ceramic parts with large sizes in the width direction of a ceramic body 5. The bottom lead-out structure is low in forming height of a main lead and weak in stress absorption capacity, and is suitable for a structure with a small size in the width direction of a porcelain piece, as shown in fig. 1.

The ceramic shell provided by the embodiment also meets the following characteristics: the number of the main leads 3 is at least 4, the number of the main leads 3 is at most 352, one or more cavities (up to 20 cavities) are formed, a plurality of chips and various passive elements can be mounted in the cavities, and the packaging requirement of high integration level of users is met; the ceramic shell has the characteristics of multilayer wiring, high reliability, high air tightness, strong heat dissipation capacity and the like; the ceramic case may have a wiring structure of 2 to 50 layers; the packaging air tightness is high, and the air tightness meets the requirement of being less than or equal to 1 multiplied by 10 < -3 > Pa cm3/s, A4; the reliability is high, can satisfy temperature cycle: -65 ℃ -175 ℃, 200 times, constant acceleration: 30000g, Y1 direction, 1 min.

In the present embodiment, referring to fig. 2, 3, 5 and 6, index marks 1 for easy identification are provided in the main pad 2 and the core cavity 4. The core cavity 4 is provided with an alignment mark or an alignment mark, the alignment mark is a circular or triangular structural graph, and the alignment cavity is of a cross or L-shaped structure positioning cavity structure, so that the chip can be accurately mounted conveniently. In order to facilitate the direction alignment during the device test and board level installation, the sealing surface is provided with an obvious direction index mark 1, and in order to facilitate the position identification during the automatic bonding, a cross-shaped or L-shaped alignment identification mark is added on the outermost bonding finger 6 at each side.

The flat case of 0.4mm pitch ceramic two-side main lead 3 provided in this example is made of Al ₂O ₃The multilayer co-firing technology of AlN, glass ceramic and the like comprises the following specific processes: after the casing is cast and hot cutAfter punching cavity, punching hole and metallizing hole, printing, positioning, laminating and hot-cutting into single green ceramic piece, sintering, soldering, nickel-plating and gold-plating so as to finally form single ceramic shell.

The invention also provides a power device which comprises the ceramic two-side main lead 3 flat shell with the 0.4mm pitch. Because the small-outline shell is packaged by the ceramic, the ceramic shell with the 0.4mm pitch is manufactured, so that the purpose of preparing the small-outline ceramic packaging shell with the 0.4mm pitch by the ceramic is realized. The power devices include amplifiers, drivers, memories, comparators, etc.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.