阅读说明：本技术 一种带有散热盖的ssd存储芯片封装结构及制造方法 (SSD storage chip packaging structure with heat dissipation cover and manufacturing method ) 是由 庞宝龙 刘海涛 王蕊 于 2019-10-14 设计创作，主要内容包括：本发明公开了一种带有散热盖的SSD存储芯片封装结构及制造方法,结构包括：基板；存储芯片,多个所述存储芯片依次堆叠并粘在基板的正面上；相邻所述存储芯片之间、存储芯片基板之间均通过键合线电性连接；导电柱,所述导电柱设置在存储芯片周边的所述基板上；导电柱与基板电性连接；塑封体,所述塑封体包覆基板、存储芯片、键合线和导电柱；导电柱顶部露出塑封体表面；控制芯片,所述控制芯片贴装在基板的背面,控制芯片与基板电性连接；及散热盖,所述散热盖包覆在控制芯片外部,且散热盖与控制芯片及基板背面粘接。通过贴散热盖和两面塑封的方式,既达到有效散热的目的和减小封装结构的体积,从而提升质量和降低成本。(The invention discloses an SSD storage chip packaging structure with a heat dissipation cover and a manufacturing method thereof, wherein the structure comprises the following steps: a substrate; a plurality of memory chips stacked in sequence and adhered on the front surface of the substrate; the adjacent memory chips and the memory chip substrate are electrically connected through bonding wires; the conductive column is arranged on the substrate at the periphery of the memory chip; the conductive column is electrically connected with the substrate; the plastic package body wraps the substrate, the memory chip, the bonding wire and the conductive column; the top of the conductive column is exposed out of the surface of the plastic package; the control chip is attached to the back surface of the substrate and electrically connected with the substrate; and the heat dissipation cover is coated outside the control chip and is bonded with the control chip and the back of the substrate. By means of the mode of sticking the heat dissipation cover and plastic packaging on two sides, the purpose of effectively dissipating heat is achieved, the size of the packaging structure is reduced, and therefore quality is improved, and cost is reduced.)

1. The utility model provides a SSD storage chip packaging structure with heat dissipation lid which characterized in that includes:

a substrate (2);

a plurality of memory chips (5), wherein the memory chips (5) are sequentially stacked and adhered to the front surface of the substrate (2); the adjacent memory chips (5) and the substrate (2) of the memory chip (5) are electrically connected through bonding wires (6);

the conductive column (3), the said conductive column (3) is set up on the said base plate (2) of the memory chip (5) periphery; the conductive column (3) is electrically connected with the substrate (2);

the plastic package body (4), the substrate (2), the memory chip (5), the bonding wire (6) and the conductive column (3) are coated by the plastic package body (4); the top of the conductive post (3) is exposed out of the surface of the plastic package body (4);

the control chip (7), the said control chip (7) is pasted on the back of the base plate (2), the control chip (7) is connected with electrical behavior of the base plate (2);

and the heat dissipation cover (1) is coated outside the control chip (7), and the heat dissipation cover (1) is bonded with the control chip (7) and the back of the substrate (2).

2. The SSD storage chip package structure with the heat dissipation cover as set forth in claim 1, wherein the conductive pillars (3) are copper pillars.

3. The SSD storage chip packaging structure with the heat dissipation cover as set forth in claim 1, wherein the conductive posts (3) are connected with the substrate (2) through conductive glue; the conductive adhesive is conductive silver adhesive or tin paste.

4. The SSD storage chip package structure with the heat dissipation cover as set forth in claim 1, wherein a thermally conductive adhesive (8) is disposed between the surface of the control chip (7) and the heat dissipation cover (1), and the control chip (7) is connected to the back surface of the substrate (2) through a plurality of conductive bumps (9).

5. The SSD storage chip package structure with the heat dissipation cover according to claim 4, characterized in that an underfill (10) is disposed in the gap of the conductive bump (9) between the control chip (7) and the substrate (2).

6. The SSD storage chip packaging structure with the heat dissipation cover as recited in claim 1, wherein the heat dissipation cover (1) has a receiving cavity with a planar bottom, and the control chip (7) is disposed at the bottom of the receiving cavity and bonded by glue.

7. The SSD storage chip package structure with the heat dissipation cover as set forth in claim 1, wherein the substrate (2) is provided with substrate holes, and conductive materials are filled in the substrate holes for electrically connecting the front and back sides of the substrate (2).

8. A manufacturing method of an SSD storage chip packaging structure with a heat dissipation cover is characterized by comprising the following steps:

mounting a storage chip (5) on the substrate (2);

the adjacent memory chips (5) and the substrate (2) of the memory chip (5) are electrically connected through bonding wires (6);

attaching a conductive column (3) on the substrate (2) at the periphery of the memory chip (5); the conductive column (3) is electrically connected with the substrate (2);

the substrate (2), the memory chip (5), the bonding wire (6) and the conductive column (3) are coated by using a plastic package body (4);

polishing the plastic package body (4) to enable the tops of the conductive posts (3) to be exposed out of the surface of the plastic package body (4);

the control chip (7) is attached to the back surface of the substrate (2), and the control chip (7) is electrically connected with the substrate (2);

the heat dissipation cover (1) is coated outside the control chip (7), and the heat dissipation cover (1) is bonded with the control chip (7) and the back of the substrate (2).

Technical Field

The invention relates to the technical field of semiconductor packaging, in particular to an SSD storage chip packaging structure with a heat dissipation cover and a manufacturing method thereof.

Background

With the continuous development of science and technology, people have higher and higher demands on consumer electronic products,

the memory chip in the electronic product is a key core component, and the packaging requirements for the chip are higher and higher, and the trend is that the size is small and the capacity is large.

For a traditional SSD packaged chip, the area is large, the heat dissipation of the product is poor, and the product performance and the packaging size are difficult to meet the requirements of customers.

Disclosure of Invention

The invention provides an SSD storage chip packaging structure with a heat dissipation cover and a manufacturing method thereof. Thereby improving the packaging quality.

In order to achieve the purpose, the invention adopts the following technical means:

an SSD storage chip package structure with a heat dissipation cover, comprising:

a substrate;

a plurality of memory chips stacked in sequence and adhered on the front surface of the substrate; the adjacent memory chips and the memory chip substrate are electrically connected through bonding wires;

the conductive column is arranged on the substrate at the periphery of the memory chip; the conductive column is electrically connected with the substrate;

the plastic package body wraps the substrate, the memory chip, the bonding wire and the conductive column; the top of the conductive column is exposed out of the surface of the plastic package;

the control chip is attached to the back surface of the substrate and electrically connected with the substrate;

and the heat dissipation cover is coated outside the control chip and is bonded with the control chip and the back of the substrate.

The conductive column is a copper column.

The conductive column is connected with the substrate through conductive adhesive; the conductive adhesive is conductive silver adhesive or tin paste.

And a heat-conducting glue is arranged between the surface of the control chip and the heat-radiating cover, and the control chip is connected with the back surface of the substrate through a plurality of conductive lugs.

An underfill is disposed in a gap between the control chip and the substrate.

The heat dissipation cover is provided with an accommodating cavity with a plane bottom, and the control chip is arranged at the bottom of the accommodating cavity and is bonded through glue.

The substrate is provided with a substrate hole, and conductive materials are filled in the substrate hole and used for electrically conducting the front side and the back side of the substrate.

A manufacturing method of an SSD storage chip packaging structure with a heat dissipation cover comprises the following steps:

mounting a storage chip on a substrate;

the adjacent memory chips and the memory chip substrate are electrically connected through bonding wires;

attaching the conductive columns on the substrate at the periphery of the memory chip; the conductive column is electrically connected with the substrate;

the substrate, the storage chip, the bonding wire and the conductive column are coated by the plastic package body;

polishing the plastic package body to enable the top of the conductive post to be exposed out of the surface of the plastic package body;

attaching a control chip to the back surface of the substrate, wherein the control chip is electrically connected with the substrate;

and coating the heat dissipation cover outside the control chip, and bonding the heat dissipation cover with the control chip and the back of the substrate.

Compared with the prior art, the invention has the following advantages:

the SSD storage chip packaging structure with the heat dissipation cover adopts a double-sided packaging scheme, a storage chip is pasted on the front side and is conducted with a substrate after bonding, a copper column is pasted on the front side, the plastic packaging surface is polished after plastic packaging to expose the copper column, the copper column is used as a lead-out pin, a control chip is pasted on the back side, bonding is conducted with the substrate, and the heat dissipation cover (sheet) is pasted on the surface of the control chip. By means of the mode of sticking the heat dissipation cover and plastic packaging on two sides, the purpose of effectively dissipating heat is achieved, the size of the packaging structure is reduced, and therefore quality is improved, and cost is reduced.

The manufacturing method of the invention achieves the purpose of effective heat dissipation, reduces the volume of the packaging structure, simplifies the manufacturing process, improves the quality and reduces the cost by sticking the heat dissipation cover and plastic packaging on two sides.

Drawings

FIG. 1: is a structural schematic diagram of the bottom plate of the invention;

FIG. 2: installing a memory chip schematic diagram on a substrate carrier;

FIG. 3: the memory chip is bonded with the substrate by using a bonding wire;

FIG. 4: the schematic diagram of the periphery of the memory chip is attached by using a copper column;

FIG. 5: using a plastic packaging material to plastically package the schematic diagram;

FIG. 6: polishing to expose the surface of the copper pillar;

FIG. 7: attaching the control chip to the back of the substrate;

FIG. 8: the schematic diagram of the surface of the control chip is that a heat dissipation cover (sheet) is attached;

in the figure, 1: heat dissipation cover, 2: substrate, 3: copper column, 4: plastic packaging material, 5: a memory chip; 6: bonding wire, 7: control chip, 8: heat conducting glue; 9: a conductive bump; 10: an underfill body.

Detailed Description

In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, shall fall within the scope of protection of the present invention.

It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a single embodiment.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1, which is a schematic view of a bottom plate structure of the present invention, an SSD memory chip package structure with a heat dissipation cover includes:

a substrate 2;

a plurality of memory chips 5, wherein the memory chips 5 are sequentially stacked and adhered on the front surface of the substrate 2; the adjacent memory chips 5 and the substrate 2 of the memory chip 5 are electrically connected through bonding wires 6;

the conductive column 3, the said conductive column 3 is set up on the said base plate 2 of the periphery of the memory chip 5; the conductive column 3 is electrically connected with the substrate 2;

the plastic package body 4 wraps the substrate 2, the memory chip 5, the bonding wire 6 and the conductive column 3; the top of the conductive column 3 is exposed out of the surface of the plastic package body 4;

the control chip 7 is attached to the back surface of the substrate 2, and the control chip 7 is electrically connected with the substrate 2;

and the heat dissipation cover 1 is coated outside the control chip 7, and the heat dissipation cover 1 is bonded with the control chip 7 and the back of the substrate 2.

Preferably, the conductive pillar 3 is a copper pillar.

The conductive column 3 is connected with the substrate 2 through conductive adhesive; the conductive adhesive is conductive silver adhesive or tin paste.

In a preferred embodiment, the heat dissipation cover 1 has a receiving cavity with a flat bottom, and the control chip 7 is placed at the bottom of the receiving cavity and bonded by glue.

The substrate 2 is provided with a substrate hole, and a conductive material is filled in the substrate hole and used for electrically conducting the front side and the back side of the substrate 2.

In a preferred embodiment, a thermal conductive adhesive 8 is disposed between the surface of the control chip 7 and the heat dissipation cover 1, and the control chip 7 is connected to the back surface of the substrate 2 through a plurality of conductive bumps 9. An underfill 10 is disposed in the gap of the conductive bump 9 between the control chip 7 and the substrate 2.

The double-sided packaging scheme is adopted, the storage chip is pasted on the front side, the storage chip is connected with the substrate after bonding, the copper column is pasted on the front side, the plastic package surface is polished after plastic package to expose the copper column, the copper column serves as a lead-out pin, the control chip is pasted on the back side, the bonding is connected with the substrate, and the radiating cover (sheet) is pasted on the surface of the control chip. By means of the mode of sticking the heat dissipation cover and plastic packaging on two sides, the purpose of effectively dissipating heat is achieved, the size of the packaging structure is reduced, and therefore quality is improved, and cost is reduced.

The manufacturing method of the SSD storage chip packaging structure with the heat dissipation cover is characterized by comprising the following steps of:

mounting a storage chip 5 on the substrate 2;

the adjacent memory chips 5 and the substrate 2 of the memory chip 5 are electrically connected through bonding wires 6;

attaching the conductive pillars 3 to the substrate 2 around the memory chip 5; the conductive column 3 is electrically connected with the substrate 2;

the substrate 2, the memory chip 5, the bonding wire 6 and the conductive column 3 are coated by using a plastic package body 4;

polishing the plastic package body 4 to enable the tops of the conductive posts 3 to be exposed out of the surface of the plastic package body 4;

the control chip 7 is attached to the back surface of the substrate 2, and the control chip 7 is electrically connected with the substrate 2;

the heat dissipation cover 1 is coated outside the control chip 7, and the heat dissipation cover 1 is bonded with the control chip 7 and the back of the substrate 2. By means of the mode of sticking the heat dissipation cover and plastic packaging on two sides, the purpose of effectively dissipating heat is achieved, the size of the packaging structure is reduced, and therefore quality is improved, and cost is reduced.