阅读说明：本技术 一种新型引线框架结构及封装结构 (Novel lead frame structure and packaging structure ) 是由 韩艳 周曼莉 于 2019-08-01 设计创作，主要内容包括：本发明涉及一种新型引线框架结构及封装结构,所述引线框架结构包括复数个框架结构单元,所述框架结构单元包括基岛(1)、引脚(2)和连杆(3),所述基岛(1)包括复数个点胶区(11),所述点胶区(11)通过连接部(12)与相邻的点胶区(11)连接,所述基岛(1)通过连筋(4)与连杆(3)相连,所述基岛(1)周围设置有引脚(2),所述引脚(2)之间通过中筋(5)相连,所述中筋(5)与连杆(3)相连。本发明一种新型引线框架结构及封装结构,它能够有效的解决现有封装存在的芯片底部孔洞、分层和溢胶问题。(The invention relates to a novel lead frame structure and a packaging structure, wherein the lead frame structure comprises a plurality of frame structure units, each frame structure unit comprises a base island (1), pins (2) and a connecting rod (3), each base island (1) comprises a plurality of dispensing areas (11), each dispensing area (11) is connected with the corresponding adjacent dispensing area (11) through a connecting part (12), each base island (1) is connected with each connecting rod (3) through a connecting rib (4), the pins (2) are arranged around each base island (1), the pins (2) are connected through middle ribs (5), and the middle ribs (5) are connected with the connecting rods (3). The invention relates to a novel lead frame structure and a packaging structure, which can effectively solve the problems of holes at the bottom of a chip, layering and glue overflow in the existing packaging.)

1. A novel lead frame structure is characterized in that: the frame structure unit comprises a plurality of frame structure units, each frame structure unit comprises a base island (1), pins (2) and a connecting rod (3), each base island (1) comprises a plurality of glue dispensing areas (11), each glue dispensing area (11) is connected with the adjacent glue dispensing area (11) through a connecting portion (12), each base island (1) is connected with the corresponding connecting rod (3) through a connecting rib (4), the pins (2) are arranged on the periphery of each base island (1), the pins (2) are connected through middle ribs (5), and the middle ribs (5) are connected with the corresponding connecting rods (3).

2. The novel lead frame structure of claim 1, wherein: the base island (1) is provided with a hollow area.

3. The novel lead frame structure of claim 1, wherein: the dispensing area (11) is circular, rectangular or triangular in shape.

4. The novel lead frame structure of claim 1, wherein: the width of the connecting part (12) is smaller than that of the dispensing area (11).

5. A novel packaging structure is characterized in that: the novel LED packaging structure comprises a base island (1), pins (2) and chips (6), wherein the pins (2) are arranged around the base island (1), the base island (1) comprises a plurality of dispensing areas (11), the dispensing areas (11) are connected with adjacent dispensing areas (11) through connecting portions (12), adhesive glue (8) is arranged on the dispensing areas (11), the back of each chip (6) is connected with the plurality of dispensing areas (11) through the adhesive glue (8), the front of each chip (6) is connected with the corresponding pin (2) through bonding wires (7), and plastic packaging materials (9) are wrapped on the peripheries of the base island (1), the chips (6), the bonding wires (7) and part of the pins (2).

6. The novel packaging structure of claim 5, wherein: the size of the chip (6) is larger than the area size of the base island (1).

7. The novel packaging structure of claim 5, wherein: the dispensing area (11) is circular, rectangular or triangular in shape.

8. The novel packaging structure of claim 5, wherein: the width of the connecting part (12) is smaller than that of the dispensing area (11).

Technical Field

The invention relates to a novel lead frame structure and a packaging structure, and belongs to the technical field of semiconductor packaging.

Background

Modern electronic information technology is rapidly developed, and electronic products are developed in the direction of miniaturization, portability and multi-functionalization, which drives the development trend of miniaturization of semiconductor packaging products, and therefore, the packaging design is required to utilize the packaging space to the maximum extent and reduce the size of the semiconductor packaging products.

A lead frame structure is also developed toward miniaturization as a part of a package structure, and generally, the lead frame structure includes a base material and a base island, a connecting rib, and a pin formed in the base material, and reducing the size of the base island is also a method for reducing the size of the lead frame structure.

In the packaging process, the chip mounting is to load and fix the chip on the base island of the lead frame to prepare for the next step of wire bonding. In the mounting process, an adhesive is generally used to fix the chip on the base island of the lead frame, and firstly, an adhesive (such as a conductive adhesive) needs to be dispensed on the surface of the base island of the lead frame by using a dispensing device, then, the chip is pressed above the adhesive, and the adhesive is spread under the whole chip by the gravity and the pressure of the chip to fix the chip. In order to ensure the coverage rate of the adhesive and avoid the problem of holes at the bottom of the chip, the adhesive is often required to completely cover the bottom of the chip and part of the side surface of the chip, which requires that the size of the base island of the conventional lead frame must be larger than that of the chip, and this limits the development of miniaturization of the package structure.

In addition, for large chip products, the glue amount of the adhesive glue is difficult to control when the glue is dispensed on the traditional frame, which can cause holes at the bottom of the chip, delamination or glue overflow to the surface of the chip, resulting in poor reliability or electrical performance, and the glue thickness can not be stably controlled.

Disclosure of Invention

The invention aims to solve the technical problem of providing a novel lead frame structure and a packaging structure aiming at the prior art, and can effectively solve the problems of chip bottom holes, layering and glue overflow in the prior packaging.

The technical scheme adopted by the invention for solving the problems is as follows: the utility model provides a novel lead frame structure, it includes a plurality of frame structure units, frame structure unit includes base island, pin and connecting rod, the base island includes a plurality of dispensing district, the dispensing district is connected with adjacent dispensing district through connecting portion, the base island links to each other with the connecting rod through linking the muscle, be provided with the pin around the base island, link to each other through well muscle between the pin, well muscle links to each other with the connecting rod.

Preferably, the base island is formed with a hollowed-out region.

Preferably, the shape of the dispensing area is circular, rectangular or triangular.

Preferably, the width of the connecting part is smaller than that of the dispensing area.

The utility model provides a novel packaging structure, it includes base island, pin and chip, the pin sets up around the base island, the base island includes a plurality of dispensing district, the dispensing district is connected through connecting portion and adjacent dispensing district, be provided with the adhesive on the dispensing district and glue, the chip back is glued through the adhesive and is distinguished with a plurality of dispensing and link to each other, be connected through the bonding wire between chip surface and the pin, base island, chip and the peripheral cladding of part pin have plastic envelope material.

Preferably, the chip size is larger than the size of the base island region.

Preferably, the shape of the dispensing area is circular, rectangular or triangular.

Preferably, the width of the connecting part is smaller than that of the dispensing area.

Compared with the prior art, the invention has the advantages that:

1. the base island is designed in a hollow way, and only the dispensing area is required to dispense glue when the chip is mounted, so that the size of the chip can be larger than that of the base island, the occupancy rate of the chip occupying the base island can be further improved, the space utilization rate of a lead frame is improved, and the packaged product is miniaturized;

2. the original design has a large base island, the bottom of the chip is easy to have a cavity when the chip is mounted, and the base island is easy to be layered. The invention adopts a new design to reduce the base island, and the frame hollow design increases a plurality of dispensing points, thereby reducing the base island layering and cavity risk at the bottom of the chip;

3. the base island is designed in a hollow way, so that mold flow can smoothly flow in the process of encapsulation, and the encapsulation and glue injection efficiency is greatly improved;

4. if the chip of the original design scheme adopts a large chip, only a glue brushing process can be adopted, but the chip mounting process has high cost. The invention adds a plurality of glue dispensing points, and can mount the chip by adopting a glue dispensing process, thereby reducing the chip mounting cost.

Drawings

Fig. 1 is a schematic diagram of a novel lead frame structure according to the present invention.

Fig. 2 is a schematic view of a single frame construction unit of fig. 1.

Fig. 3 is a top view of a novel package structure of the present invention.

Fig. 4 is a cross-sectional view of a novel package structure of the present invention.

Wherein:

base island 1

Dispensing zone 11

Connecting part 12

Pin 2

Connecting rod 3

Connecting rib 4

Middle rib 5

Chip 6

Bonding wire 7

Adhesive glue 8

And (5) plastic packaging material 9.

Detailed Description

The invention is described in further detail below with reference to the accompanying examples.

As shown in fig. 1 and 2, the novel lead frame structure according to the present invention includes a plurality of frame structure units, each frame structure unit includes a base island 1, pins 2 and a connecting rod 3, the base island 1 includes a plurality of dispensing areas 11, the dispensing areas 11 are connected to adjacent dispensing areas 11 through connecting portions 12, the base island 1 is connected to the connecting rod 3 through connecting ribs 4, the pins 2 are disposed around the base island 1, the pins 2 are connected to each other through middle ribs 5, and the middle ribs 5 are connected to the connecting rod 3;

a hollow area is formed on the base island 1;

the shape of the dispensing area 11 can be circular, rectangular or triangular;

the width of the connecting part 12 is smaller than that of the dispensing area 11.

As shown in fig. 3, the novel packaging structure according to the present invention includes a base island 1, pins 2 and a chip 6, where the pins 2 are disposed around the base island 1, the base island 1 includes a plurality of dispensing areas 11, the dispensing areas 11 are connected to adjacent dispensing areas 11 through connection portions 12, an adhesive 8 is disposed on the dispensing areas 11, the back of the chip 6 is connected to the dispensing areas 11 through the adhesive 8, the front of the chip 6 is connected to the pins 2 through bonding wires 7, and the peripheries of the base island 1, the chip 6, the bonding wires 7 and a part of the pins 2 are coated with a molding compound 9;

the size of the chip 6 is larger than the size of the region of the base island 1;

the shape of the dispensing area 11 can be circular, rectangular or triangular;

the width of the connecting part 12 is smaller than that of the dispensing area 11.

In addition, the present invention also includes other embodiments, and any technical solutions formed by equivalent transformation or equivalent replacement should fall within the protection scope of the claims of the present invention.