阅读说明：本技术 电感器件布线架构、集成电路及通信设备 (Inductance device wiring architecture, integrated circuit and communication equipment ) 是由 叶辉 于 2019-03-29 设计创作，主要内容包括：本申请实施例公开一种电感器件布线架构,包括电感器件及位于电感器件下方的多个虚拟金属。其中,多个虚拟金属排布在多层金属层中,多层金属层中每层金属层对应多个虚拟金属的部分虚拟金属,在远离电感器件的方向上,多层金属层中的至少两层金属层对应的虚拟金属的排布面积递增。上述电感器件布线架构能够减少对电感器件性能的不良影响,并提高产品良率。本申请实施例还公开一种集成电路和一种通信设备。(The embodiment of the application discloses inductance device wiring framework, including inductance device and a plurality of dummy metal that are located inductance device below. The plurality of virtual metals are distributed in the plurality of metal layers, each metal layer in the plurality of metal layers corresponds to part of the virtual metals of the plurality of virtual metals, and the distribution areas of the virtual metals corresponding to at least two metal layers in the plurality of metal layers are increased in the direction away from the inductor. The wiring structure of the inductance device can reduce the adverse effect on the performance of the inductance device and improve the product yield. The embodiment of the application also discloses an integrated circuit and communication equipment.)