阅读说明：本技术 发光元件搭载用基板以及发光装置 (Substrate for mounting light-emitting element and light-emitting device ) 是由 东登志文 古久保洋二 山口贵史 于 2020-04-24 设计创作，主要内容包括：本实施方式的一方案的发光元件搭载用基板(A)具有基台(1)以及位于基台(1)的第一面(1a)的凸部(10),第一面(1a)具有位于凸部(10)的外周的、发光元件的搭载面(1aa),凸部(10)具有与搭载面(1aa)成钝角的倾斜面(10a)。(A substrate (A) for mounting a light-emitting element, which is one aspect of the present embodiment, has a base (1) and a convex portion (10) located on a first surface (1a) of the base (1), wherein the first surface (1a) has a light-emitting element mounting surface (1aa) located on the outer periphery of the convex portion (10), and the convex portion (10) has an inclined surface (10a) that forms an obtuse angle with the mounting surface (1 aa).)

1. A substrate for mounting a light emitting element, wherein,

the substrate for mounting a light emitting element has a base and a convex portion on a first surface of the base,

the first surface has a light emitting element mounting surface located on the outer periphery of the projection,

the convex portion has an inclined surface forming an obtuse angle with the mounting surface.

2. The substrate for mounting a light-emitting element according to claim 1,

the convex portion has a plurality of the inclined surfaces.

3. The substrate for mounting a light-emitting element according to claim 2,

when the angle formed by the mounting surface and any one of the inclined surfaces is a dihedral angle,

the difference between the largest and smallest of all the dihedral angles is 3 degrees or less.

4. The substrate for mounting a light-emitting element according to any one of claims 1 to 3,

the inclined surface has an uneven area.

5. The substrate for mounting a light-emitting element according to any one of claims 1 to 4,

one end edge of the inclined surface is located at a position deeper than the first surface.

6. The substrate for mounting a light-emitting element according to any one of claims 1 to 4,

the inclined surface and the first surface are connected by a concavely curved surface.

7. The substrate for mounting a light-emitting element according to any one of claims 1 to 6,

the base and the projection are formed of a single ceramic body.

8. The substrate for mounting a light-emitting element according to any one of claims 1 to 7,

the substrate for mounting a light-emitting element has a bank portion arranged on a peripheral portion of the first surface.

9. The substrate for mounting a light-emitting element according to claim 8,

a pedestal is arranged on the first surface,

the bank is connected to the pedestal.

10. The substrate for mounting a light-emitting element according to any one of claims 1 to 9,

the first face is in the shape of a rectangle,

the convex portion has four of the inclined surfaces,

a diagonal line of the first surface is orthogonal to end edges of the four inclined surfaces on the first surface side.

11. A light-emitting device, wherein,

the light-emitting device is mounted with the light-emitting element on the light-emitting element mounting substrate according to any one of claims 1 to 10.

12. The light emitting device of claim 11,

when the first surface is divided into four regions by a first straight line passing through the center of the first surface and parallel to the first surface and a second straight line orthogonal to the first straight line and passing through the center of the first surface and parallel to the first surface,

the same number of light emitting elements are mounted in each of the areas.

Technical Field

The present disclosure relates to a light-emitting element mounting substrate and a light-emitting device.

Background

Conventionally, as a substrate for housing a light emitting element, a light emitting element housing substrate including a reflector for reflecting light emitted from a light emitting element, for example, upward on a flat plate-shaped base material is known (for example, see patent document 1).

Documents of the prior art

Patent document

Patent document 1: japanese laid-open patent publication No. 8-116127

Disclosure of Invention

The light emitting element mounting substrate according to one aspect of the present embodiment includes a base and a convex portion located on a first surface of the base, the first surface includes a light emitting element mounting surface located on an outer periphery of the convex portion, and the convex portion includes an inclined surface forming an obtuse angle with the mounting surface.

The light-emitting device of the present embodiment has the light-emitting element mounted on the light-emitting element mounting substrate.

Drawings

Fig. 1 is a perspective view showing an example of a light-emitting element mounting substrate according to the present embodiment.

Fig. 2 is a plan view of the light-emitting element mounting substrate shown in fig. 1.

Fig. 3 is a sectional view taken along line i-i of fig. 2.

Fig. 4 is a partially enlarged view of fig. 3.

Fig. 5 is a partially enlarged view of fig. 3.

Fig. 6 is a partially enlarged view of fig. 3.

Fig. 7 is a partially enlarged view of fig. 3.

Fig. 8 is a perspective view of another embodiment of the light-emitting element mounting substrate.

Fig. 9 is a cross-sectional view of fig. 8.

Fig. 10 is a partially enlarged view of fig. 9.

Fig. 11 is a top view of fig. 8.

Fig. 12 is a plan view of still another embodiment of the light-emitting element mounting substrate.

Fig. 13 is a sectional view showing one manufacturing process of the light-emitting element mounting substrate of the present embodiment.

Detailed Description

A light-emitting element mounting substrate and a light-emitting device according to the present embodiment will be described below with reference to the drawings. Here, examples of the Light Emitting element include a Laser Diode (Laser Diode) and a Light Emitting Diode (LED). The embodiments described below are particularly useful as a laser diode.

Fig. 1 and 2 are a perspective view and a plan view showing an example of the light-emitting element mounting substrate of the present embodiment. Fig. 3 is a sectional view taken along line i-i of fig. 2.

As shown in fig. 1 to 3, the light-emitting element mounting substrate a of the present embodiment includes a base 1. In fig. 1 to 3, a rectangular parallelepiped base 1 is illustrated, but the base 1 is not limited to such a shape. For example, the base 1 may have a cylindrical or triangular prism shape. The size of the base 1 is not particularly limited, and may be appropriately set according to the size of the light emitting element to be mounted.

The base 1 may use a ceramic material as a main component, but may also use a metal material, an organic material, and a glass material as a main component. For example, when the base 1 contains aluminum nitride (AlN) as a main component, the light-emitting element mounting substrate a having high thermal conductivity can be realized. Here, "containing aluminum nitride as a main component" means that the base 1 contains 80 mass% or more of aluminum nitride.

The light-emitting element mounting substrate a has a convex portion 10 on any one surface of the base 1. Hereinafter, the surface of the base 1 on which the convex portion 10 is provided is referred to as a first surface 1 a. The first surface 1a has a mounting surface 1aa for the light emitting element. The light emitting element is mounted directly or indirectly on the mounting surface 1 aa. Here, "indirectly mounted" means that the light emitting element is mounted on the mounting surface 1aa via a pedestal or the like described later, for example. Light emitted from the light emitting element (hereinafter, referred to as "emission light") is reflected by the projection 10. Therefore, the mounting surface 1aa refers to a portion of the first surface 1a on which the light emitting element is mounted. In the present embodiment, the mounting surface 1aa is a portion of the first surface 1a that does not face the convex portion 10 or a bank portion described later.

In the light-emitting element mounting substrate a, the mounting surface 1aa is located on the outer periphery of the convex portion 10. Specifically, as shown in fig. 2, the convex portion 10 may be accommodated inside the mounting surface 1aa without overlapping the outer edge lab of the mounting surface 1aa when the mounting surface 1aa is viewed in a plan view. For example, when at least a part of the convex portion 10 overlaps the outer edge 1ab of the mounting surface 1aa when the mounting surface 1aa is viewed in plan, the mounting surface 1aa may be considered to surround the outer periphery of the convex portion 10.

The arrangement of the convex portions 10 on the first surface 1a and the size of the convex portions 10 are not particularly limited as long as the mounting surface 1aa surrounds the outer periphery of the convex portions 10.

As shown in fig. 3, the convex portion 10 has an inclined surface 10a forming an obtuse angle with the mounting surface 1 aa. That is, the dihedral angle 110 formed by the mounting surface 1aa and the inclined surface 10a is greater than 90 degrees and less than 180 degrees. The inclined surface 10a can be used as a reflecting surface for light emitted from the light emitting element mounted on the mounting surface 1 aa. Therefore, by arbitrarily setting the dihedral angle 110, the direction of light obtained by reflecting the radiated light (hereinafter referred to as reflected light) can be changed. For example, when the dihedral angle 110 is about 135 degrees, the radiated light is reflected upward perpendicular to the mounting surface 1 aa. Hereinafter, "upward" refers to a direction in which the reflected light is separated from the mounting surface laa. The "upper surface" described later refers to the surface of the object on the upper side. The dihedral angle 110 is not particularly limited as long as it is larger than 90 degrees and smaller than 180 degrees, and may be larger than 105 degrees and smaller than 165 degrees, or may be larger than 120 degrees and smaller than 150 degrees.

In fig. 1 and the like, the convex portion 10 has the inclined surface 10a and the upper surface 10b continuous with the inclined surface 10a, but the shape of the convex portion 10 is not limited thereto. For example, the convex portion 10 may have a side surface orthogonal to the first surface 1 a. The convex portion 10 may be configured to have no upper surface 10b and be constituted only by the inclined surface 10a (side surface). For example, the convex portion 10 may be conical or triangular pyramidal.

As described above, in the light-emitting element mounting substrate a, the first surface 1a has the light-emitting element mounting surface 1aa located on the outer periphery of the convex portion 10, and the convex portion 10 has the inclined surface 10 a. According to such a configuration, when a plurality of light emitting elements are mounted on the mounting surface 1aa so as to surround the outer periphery of the convex portion 10, the respective radiated lights can be reflected upward by the inclined surface 10a of the convex portion 10. As a result, a plurality of radiant lights can be efficiently reflected upward by using a single substrate a for mounting a light-emitting element, and the mounting space of the substrate can be reduced as compared with the case of using a plurality of substrates.

From the above viewpoint, the convex portion 10 may have a plurality of inclined surfaces 10a, but is not limited thereto. For example, when the convex portion 10 has a conical shape or a triangular pyramid shape, the single inclined surface 10a can reflect the radiation light from the light emitting element disposed around the convex portion 10. As shown in fig. 1 and the like, the convex portion 10 may have four or more inclined surfaces 10 a.

When the convex portion 10 has a plurality of inclined surfaces 10a, the dihedral angle 110 can be appropriately set for each inclined surface 10 a. For example, the dihedral angle 110 may be set substantially the same for each inclined surface 10 a.

For example, when the dihedral angle 110 for all the inclined surfaces 10a of the convex portion 10 is about 135 degrees, the emitted light from all the light emitting elements mounted thereon is reflected upward perpendicular to the mounting surface 1aa, and therefore, the uniformity of the reflected light group (multiple reflected light) can be improved. In this case, the difference between the largest dihedral angle 110 and the smallest dihedral angle 110 among all the dihedral angles 110 may be 3 degrees or less, preferably 2 degrees or less, and more preferably 1 degree or less. According to this configuration, the deviation angle between the dihedral angles 110 is very small, and therefore the uniformity of the reflected light group can be further improved. Here, 135 degrees are exemplified as each dihedral angle 110, but the dihedral angle 110 may be appropriately set according to the purpose.

In addition, a significantly different dihedral angle 110 may be set for each inclined surface 10 a. With this configuration, the plurality of reflected lights can reach different points according to the purpose. The "distinct" dihedral angles 110 mean that the dihedral angles 110 differ by 5.0 degrees or more, for example.

For the purpose of improving the reflection efficiency of the radiated light, a Ni plating film, an Au plating film, or the like may be formed on the inclined surface 10 a. In this case, by forming the plating film to be sufficiently thin, the influence on the dihedral angle 110 formed by the inclined surface 10a and the mounting surface 1aa of the base 1 can be reduced.

As shown in fig. 4, a structure may be adopted in which a reflecting mirror 11 is provided on the inclined surface 10a and the radiant light is reflected by the reflecting mirror 11. Fig. 4 and fig. 5 to 7 described later are enlarged views of the area surrounded by the broken line 111 in fig. 3. As the reflecting mirror 11, a member obtained by depositing a dielectric multilayer film on the surface of a substrate made of metal or glass can be used. As the bonding material, a resin adhesive material can be used in addition to the Au — Sn material. When an Au-Sn material is used, the heat resistance can be improved. When the reflecting mirror 11 is provided on the inclined surface 10a, the reflecting surface 11a of the provided reflecting mirror 11 is preferably parallel to the inclined surface 10 a.

When the reflecting mirror 11 is provided on the inclined surface 10a, the inclined surface 10a may have the concave-convex area 12 as shown in fig. 5. That is, the inclined surface 10a may have a convex region 12a and a concave region 12 b. In this case, the dihedral angle 110 formed by the inclined surface 10a and the mounting surface 1aa may be an angle formed by an approximate straight line obtained from the apex of each convex region 12a and the mounting surface 1 aa.

When the inclined surface 10a has the uneven region 12, when the reflecting mirror 11 is provided on the inclined surface 10a, the uneven region 12a is a portion that is in contact with the reflecting mirror 11, but the uneven region 12b is a portion that is not in contact with the reflecting mirror 11. In this case, although not shown, the concave region 12b may be filled with a bonding material for bonding the reflecting mirror 11, and the concave region 12b may be left uncoated or coated very thinly on the convex region 12 a. Accordingly, the reflecting mirror 11 can be joined to the inclined surface 10a in a state where the reflecting mirror 11 is in direct contact with a part of the convex region 12a, and therefore, heat diffusion from the reflecting mirror 11, which becomes a high temperature due to light emission, to the inclined surface 10a can be promoted. As a result, the distortion of the reflecting mirror 11 due to the temperature change can be reduced, and thus the optical axis deviation of the reflected light can be reduced. Further, since a sufficient amount of the bonding material can be filled in the concave region 12b, the adhesiveness between the inclined surface 10a and the reflecting mirror 11 can be improved. As a result, the positioning accuracy when the reflecting mirror 11 is mounted on the inclined surface 10a can be improved, and thus the optical axis deviation of the reflected light can be reduced. The surface roughness of the inclined surface 10a may be 1 to 3 μm.

As shown in fig. 6, one end edge 10c of the inclined surface 10a may be located at a deeper position with respect to the first surface 1 a. In this case, the base 1 has a connection surface 10cc connecting the end edge 10c and the first surface 1 a. The inclined surface 10a and the connection surface 10cc form a groove 13. If the groove 13 is formed, the reflecting mirror 11 can be provided such that the end of the reflecting mirror 11 is located deeper than the first surface 1 a. As a result, the radiant light from the light emitting element mounted on the mounting surface 1aa can be easily condensed at the center of the reflecting mirror 11. When the radiant light is condensed at the center of the reflecting mirror 11, the heat generated by the radiant light can be efficiently conducted (dissipated) to the entire reflecting mirror 11, as compared with the case where the radiant light is condensed at the end of the reflecting mirror 11. Therefore, since the temperature of the reflecting mirror 11 can be prevented from being locally high, the deformation of the reflecting mirror 11 and the optical axis deviation of the reflected light can be reduced. In this case, the dihedral angle 110 formed by the inclined surface 10a and the mounting surface 1aa can be calculated from the extension lines of the inclined surface 10a and the mounting surface 1 aa.

In the groove portion 13, the inclined surface 10a may be substantially perpendicular to the connection surface 10 cc. In this case, since the end of the reflecting mirror 11 is in contact with the groove 13, the reflecting mirror 11 can be fixed in a stable state when it is disposed on the inclined surface 10 a. This can improve the positioning accuracy when the reflecting mirror 11 is mounted on the inclined surface 10a, and thus can reduce the optical axis deviation of the reflected light. Here, the substantially right angle means, for example, 85 degrees or more and 95 degrees or less, and further means 87 degrees or more and 93 degrees or less. In this case, the inclined surface 10a and the connection surface 10cc are preferably shaped to follow the outer shape of the reflecting mirror 11. For example, the inclined surface 10a and the connection surface 10cc are preferably flat (straight) surfaces.

The convex portion 10 may be mainly applied with a ceramic material, but may also be mainly applied with a metal material, an organic material, and a glass material.

In this case, the base 1 and the projection 10 may be made of the same material. According to such a configuration, since the thermal expansion coefficients of base 1 and convex portion 10 are similar, the occurrence of cracks near the joint portion between base 1 and convex portion 10 due to thermal stress is reduced.

The base 1 and the convex portion 10 may be formed integrally. That is, electricity may be configured such that an interface with an adhesive such as a resin is not formed between the base 1 and the convex portion 10. With this configuration, the thermal resistance of the light-emitting element mounting substrate a is reduced by the amount that the interface does not occur, and the light-emitting element mounting substrate a having high thermal diffusivity can be realized. For example, when base 1 and projection 10 are formed of a single ceramic body, particularly a ceramic body containing aluminum nitride (A1N) as a main component, the thermal diffusivity of light-emitting-element-mounting substrate a is further improved.

At this time, as shown in fig. 7, the inclined surface 10a of the projection 10 and the first surface 1a of the base 1 may be connected by a concave curved surface. That is, the inclined surface 10a and the first surface 1a are connected to each other so as to form a smooth curved surface, and the connection portion 14 between the inclined surface 10a and the first surface 1a does not have a corner portion. According to such a configuration, the stress generated in the vicinity of the connection portion 14 is dispersed, and therefore, the generation of cracks in the inclined surface 10a can be suppressed. As a result, the optical axis deviation of the reflected light due to the occurrence of the crack can be reduced. In this case, the dihedral angle 110 formed by the inclined surface 10a and the mounting surface 1aa can be calculated from the extension line of the flat section of the inclined surface 10a and the mounting surface 1aa, which is sufficiently far from the connection portion 14.

The light-emitting element mounting substrate a is provided with a lid body for covering the mounting surface 1aa of the base 1 as necessary. The cover has a transmittance for light having a predetermined wavelength emitted from the light emitting element. The lid is made of resin such as plastic, glass, or the like. The lid is preferably disposed so as to be separated from the projection 10. Further, as the cover, a condensing lens that condenses light emitted from the plurality of light emitting elements may be used.

As shown in fig. 8, the light-emitting element mounting substrate a may have a base 1 in which a bank 15 is disposed around the first surface 1 a. The bank 15 is disposed on the first surface 1a so as to surround the convex portion 10, and the light-emitting element is disposed between the bank 15 and the convex portion 10. In this case, the upper surface 15a of the bank 15 is located higher than the upper surface 10b of the projection 10. According to such a configuration, even when the cover on the flat plate is mounted on the light-emitting element mounting substrate a, the cover can be separated from the convex portion 10 by joining the cover to the upper surface 15a of the bank portion 15.

As shown in fig. 8, in the light-emitting element mounting substrate a, the base 1 may have a base 16 on the first surface 1 a. In this case, the base 16 is provided on the mounting surface 1aa of the first surface 1a, and the light emitting element is mounted on the upper surface 16a of the base 16. That is, the light emitting element is indirectly mounted on the mounting surface 1aa via the base 16. As shown in fig. 9, upper surface 16a of base 16 is lower in height than upper surface 10b of projection 10. With this configuration, the light emitted from the light emitting element mounted on the base 16 is reflected by the inclined surface 10a of the projection 10. Fig. 9 is a sectional view of fig. 8, the sectional position being indicated by the section line i-i in fig. 2. At this time, as shown in fig. 10, light emitting element 100 may be mounted such that light emitting surface 100a of light emitting element 100 coincides with enlarged surface 16aa of upper surface 16a of base 16. With this configuration, the rate of reflection at the first surface 1a of the base 1 of the radiated light from the light emitting element 100 can be reduced, and thus the energy loss of the radiated light can be reduced. Fig. 10 is an enlarged view of an area surrounded by a broken line 222 in fig. 9. Further, the base 16 on the base 1 can be a target of a mounting position when mounting the light emitting element. That is, by mounting the light emitting element on the base 16 formed in advance, the positional shift at the time of mounting the light emitting element can be reduced. As a result, the optical axis deviation of the reflected light can be reduced.

As shown in fig. 9 and the like, the upper surface 16a of the base 16 is preferably parallel to the mounting surface 1aa of the base 1. With such a configuration, as shown in fig. 9, a dihedral angle 160 formed by the enlarged surface 16aa of the pedestal 16 including the upper surface 16a and the inclined surface 10a of the projection 10 is equal to a dihedral angle 110 formed by the mounting surface 1aa and the inclined surface 10 a. The enlarged surface 16aa is a surface obtained by enlarging the upper surface 16a of the base 16 in the direction of the projection 10 as shown in fig. 9. The dihedral angle 160 is an angle formed by the enlarged surface 16aa of the base 16 including the upper surface 16a and the inclined surface 10a that reflects the radiated light from the light emitting element mounted on the base 16.

In the case where the base 1 has a plurality of bases 16, the dihedral angle 160 is set for each base 16. In this case, the difference between the largest dihedral angle 160 and the smallest dihedral angle 160 among all the dihedral angles 160 may be 3 degrees or less, preferably 2 degrees or less, and more preferably 1 degree or less. With this configuration, the uniformity of the reflected light group is improved regardless of the dihedral angle 110 formed by the mounting surface 1aa of the base 1 and the inclined surface 10a of the convex portion 10, and the interference between the reflected lights can be further reduced.

In the case where the light-emitting element mounting substrate a has the bank 15, the base 16 may be connected to the bank 15 as shown in fig. 9 and the like. That is, at least one end of the pedestal 16 may be in contact with the bank 15. With such a configuration, as shown in fig. 10, not only the heat generated by the light-emitting element 100 mounted on the base 16 can be conducted toward the base 16, but also the heat can be conducted toward the bank 15. As a result, since the heat diffusion from the light-emitting element 100 is improved, the light-emitting element mounting substrate a with high reliability can be realized.

The bank 15 and the pedestal 16 may be mainly made of a ceramic material, but may be mainly made of a metal material, an organic material, or a glass material. The base 1, the convex portion 10, the bank 15, and the base 16 may be formed integrally of the same material.

In the light-emitting element mounting substrate a, a via conductor (not shown) and a conductor pattern 17 are provided inside and on the surface of the base 1 and the bank 15 as necessary. Various metal materials, alloys, and composite materials are used for the via hole conductor and the conductor pattern 17. When the base 1 contains aluminum nitride (AlN), a composite material of tungsten (W) and aluminum nitride (AlN), molybdenum (Mo) and aluminum nitride (AlN) may be used from the viewpoint of enabling simultaneous firing. A plating film of Ni or the like may be formed on the surface of the conductive pattern 17. Further, a solder or Au-Sn plating film may be provided on the surface of the plating film.

The light emitting element is bonded to the mounting surface 1aa and the base 16 using a conductive bonding material such as solder. At this time, the electrode provided on the upper surface of the light emitting element and the conductor pattern 17 may be electrically connected by wire bonding or the like. The electrode provided on the lower surface of the light emitting element and the conductor pattern 17 may be electrically connected via the conductive bonding material.

However, in general, a light-emitting element generates heat as light is emitted. Further, since the light emitting efficiency of the light emitting element decreases with an increase in temperature, for example, when a plurality of light emitting elements are mounted on the mounting surface 1aa, the light emitting elements that generate heat affect each other, and the light emitting efficiency tends to decrease. Therefore, when a plurality of light emitting elements are mounted, the light emitting elements are preferably arranged with a predetermined interval therebetween. Specifically, the following arrangement is preferable.

First, as shown in fig. 11, the first surface 1a is divided into four parts by a straight line 18a parallel to the first surface 1a passing through the center of the first surface 1a and a straight line 18b parallel to the first surface 1a passing through the center of the first surface 1a and being orthogonal to the straight line 18 a. In this case, the number of light emitting elements to be mounted in the four divided regions 20 is preferably the same. For example, one light emitting element may be mounted on each of the four divided regions 20. According to this configuration, since the light emitting elements to be mounted have a predetermined interval therebetween, an excessive temperature rise of the light emitting elements can be reduced. As a result, the light-emitting element mounting substrate a, which is less likely to decrease in light emission efficiency, can be realized. The "center of the first surface 1 a" means the area center of gravity of the first surface 1 a. In fig. 11, the case where the straight lines 18a and 18b are diagonal lines of the first surface 1a is illustrated, but the straight lines 18a and 18b can be set as appropriate.

In the case where the first surface 1a of the base 1 has a rectangular shape and the convex portion 10 has four inclined surfaces 10a, as shown in fig. 12, a diagonal line 19 of the first surface 1a may be perpendicular to an end edge 10d of each inclined surface 10a on the first surface 1a side. With this configuration, the distance from each inclined surface 10a to the end of the first surface 1a in the direction perpendicular to the end edge 10d of each inclined surface 10a can be increased. As a result, the distance between the light emitting element and each inclined surface 10a is easily changed according to the performance of the light emitting element.

Next, a method for manufacturing the light-emitting element mounting substrate a according to each embodiment will be described. Fig. 13 is a sectional view showing one manufacturing process of the light-emitting element mounting substrate a according to the embodiment.

First, silicon dioxide (SiO) is added to a powder of aluminum nitride (AlN) or the like₂) Powders of magnesium oxide (MgO), calcium oxide (CaO), and the like are used as a sintering aid, and an appropriate binder, for example, an acrylic binder, toluene, and the like are added as an organic binder, and the mixture is kneaded to form a slurry. Then, green sheets 210 processed into a rectangular parallelepiped shape are prepared by a molding method such as a doctor blade method.

Next, as shown in fig. 12, a press mold 220 is used to perform a press process from above to below the green sheet 210, thereby forming a molded body 230 to be a light emitting element mounting substrate a. The press mold 220 shown in the figure is processed into a predetermined shape so that the molded body 230 obtained after the press has the base 1, the convex portion 10, and the bank portion 15. For example, in the case where the base 16 is formed on the base 1, the press die 220 processed into a predetermined shape may be used so that the molded body 230 obtained after the pressing has the base 16.

In the case of manufacturing the light-emitting element mounting substrate a having the via hole conductor and the conductor pattern 17 in at least one of the inside and the surface, the green sheet 210 in which the via hole conductor and the conductor pattern 17 are formed in advance in at least one of the inside and the surface of the green sheet 210 may be used.

Next, the molded body 230 thus produced was fired (maximum temperature: 1500-.

While the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above embodiments, and various modifications can be made without departing from the spirit thereof.

Description of the reference numerals

Substrate for mounting A light emitting element

1 base station

1a first side

1aa mounting surface

10 convex part

10a inclined plane

11 mirror for reflection

12 concave-convex area

13 groove part

14 connecting part

15 dike part

16 stage

17 conductor pattern.