阅读说明：本技术 一种弹性子模组及模组化压接型半导体模块 (Elastic submodule group and modularized crimping type semiconductor module ) 是由 童颜 刘克明 陈紫默 潘政薇 王蕤 方赏华 张大华 于 2021-07-27 设计创作，主要内容包括：本发明公开了一种弹性子模组及模组化压接型半导体模块,弹性子模组包括：导电片、绝缘弹性件和导电板；导电片为折弯成具有若干凹槽的弯折状导电片,导电片通过其凹槽卡接在绝缘弹性件上端,绝缘弹性件的下端接导电板；模组化压接型半导体模块,包括模块集电极板、芯片子模组、模块发射极板和弹性子模组；芯片子模组包括芯片、集电极导体、发射极导体；模块集电极板、集电极导体、芯片、发射极导体、弹性子模组、模块发射极板从上至下依次连接。优点：通过将芯片模组化的形式,可进一步降低热阻,提高模块的功率密度及电流等级；将芯片子单元模组化还能够降低物料成本与减少加工工序。(The invention discloses an elastic submodule and a modularized crimping type semiconductor module, wherein the elastic submodule comprises: a conductive sheet, an insulating elastic member and a conductive sheet; the conducting plate is bent into a bent conducting plate with a plurality of grooves, the conducting plate is clamped at the upper end of the insulating elastic piece through the grooves, and the lower end of the insulating elastic piece is connected with the conducting plate; the modularized compression joint type semiconductor module comprises a module collecting electrode plate, a chip submodule, a module emitting electrode plate and an elastic submodule; the chip sub-module comprises a chip, a collector conductor and an emitter conductor; the module collecting electrode plate, the collecting electrode conductor, the chip, the emitting electrode conductor, the elastic sub-module and the module emitting electrode plate are sequentially connected from top to bottom. The advantages are that: by modularizing the chip, the thermal resistance can be further reduced, and the power density and the current level of the module can be improved; the modularity of the chip sub-units can also reduce material cost and reduce processing procedures.)

1. An elasticity submodule, comprising: a conductive sheet, an insulating elastic member and a conductive sheet;

the conducting plate is bent into a bent conducting plate with a plurality of grooves, the conducting plate is clamped at the upper end of the insulating elastic piece through the grooves, and the lower end of the insulating elastic piece is connected with the conducting plate;

when the elastic submodule is not pressed, the insulating elastic piece supports the conducting plate, a gap is formed between the conducting plate and the conducting plate, the conducting plate is not conducted with the conducting plate, when a certain pressure is applied to the elastic submodule, the gap is not formed between the conducting plate and the conducting plate, and the conducting plate is conducted with the conducting plate.

2. The spring sub-module of claim 1, wherein the bent conductive sheet is a corrugated conductive sheet, and the downwardly opening slots in the corrugated conductive sheet are the grooves.

3. The spring sub-module of claim 1 wherein the insulating spring is one of a spring, a hydraulic member, or a pneumatic member.

4. The elastic sub-module of claim 3, wherein the top of the groove is formed with a plurality of through holes with circular cross-section, the through holes are provided with insulated guide rods, the bottom ends of the insulated guide rods are fixed on the conductive plate, the insulated elastic member is a disc spring, the disc spring is sleeved on the guide rods, and the diameter of the disc spring is larger than that of the through holes.

5. The elastic sub-module according to claim 4, wherein the upper portion of the through hole is provided with a conductive sleeve having a circular cross section, and the diameter of the conductive sleeve is not smaller than that of the through hole.

6. A modular press-fit type semiconductor module comprising a module collector plate, a chip sub-module, a module emitter plate and the elastic sub-module of any one of claims 1 to 4;

the chip sub-module comprises a chip, a collector conductor and an emitter conductor;

the module collector plate, the collector conductor, the chip, the emitter conductor, the elastic sub-module and the module emitter plate are sequentially connected from top to bottom;

by applying a certain pressure to the modularized crimping type semiconductor module, the elastic sub-module is conducted to drive the whole modularized crimping type semiconductor module to be conducted.

7. The modular crimping type semiconductor module according to claim 6, further comprising a chip limiting frame, wherein a plurality of chips are arranged in the chip limiting frame.

8. The modular crimp-type semiconductor module of claim 6, wherein the module emitter plate and the conductive plate are of an integrally formed structure.

9. The module of claim 6, wherein the plurality of chip sub-modules and the plurality of elastic sub-modules are arranged, and one elastic sub-module is arranged right below each chip sub-module to form a pair.

10. The modular crimping type semiconductor module of claim 9, further comprising a pressure-bearing and limiting frame, wherein the pressure-bearing and limiting frame is provided with a plurality of cavities, and a pair of elastic sub-modules and chip sub-modules are arranged in the cavities.

11. The modular crimping type semiconductor module of claim 6, further comprising a ceramic package, wherein the module collector plate, the chip sub-module, the module emitter plate and the elastic sub-module are disposed in the ceramic package, and the skirt of the ceramic package is sealed by cold welding or laser welding, and vacuuming and filling with a shielding gas are required before sealing.

Technical Field

The invention relates to an elastic submodule and a modularized compression joint type semiconductor module, and belongs to the technical field of power modules.

Background

Since the beginning of 1986, Insulated Gate Bipolar Transistor (IGBT) was produced formally and is gradually serialized, its packaging quality and reliability always affect its use and popularization in the fields of industrial control, locomotive traction, power system and other high-power applications.

The development in the fields of the existing electric power system, locomotive traction and the like puts higher requirements on the device power of the IGBT. At present, the packaging of the high-power IGBT is generally in two forms, one is a bottom plate insulation module type packaging, the bottom plate insulation module type packaging is composed of a chip, a bottom plate, a copper-clad ceramic substrate, a bonding wire, a sealing material, an insulation shell, a power terminal and the like, the chip is isolated from the external environment (water, air and dust) through pouring insulation materials such as silica gel or epoxy resin into the module, and the service life of the device is shortened.

The elastic sub-module of the manufacturer C is a single chip corresponding to a single sub-module, and is large in quantity and difficult to install; in addition, the manufacturer A is an elastic sub-module, but the conducting paths of the chips are independent, and the current equalizing effect among the chips is limited.

Disclosure of Invention

The invention provides an elastic submodule and a modularized compression joint type semiconductor module, aiming at overcoming the defects of the prior art.

In order to solve the above technical problem, the present invention provides an elastic modulus module, including: a conductive sheet, an insulating elastic member and a conductive sheet;

the conducting plate is bent into a bent conducting plate with a plurality of grooves, the conducting plate is clamped at the upper end of the insulating elastic piece through the grooves, and the lower end of the insulating elastic piece is connected with the conducting plate;

when the elastic submodule is not pressed, the insulating elastic piece supports the conducting plate, a gap is formed between the conducting plate and the conducting plate, the conducting plate is not conducted with the conducting plate, when a certain pressure is applied to the elastic submodule, the gap is not formed between the conducting plate and the conducting plate, and the conducting plate is conducted with the conducting plate.

Furthermore, the bent conducting strips are corrugated conducting strips, and grooves with downward openings in the corrugated conducting strips are the grooves.

Further, the insulating elastic member is one of a spring, a hydraulic member or a pneumatic member.

Furthermore, a plurality of through holes with circular cross sections are formed in the top of the groove, an insulating guide rod is arranged in each through hole, the bottom end of each insulating guide rod is fixed on the corresponding conducting plate, each insulating elastic part is a disc spring, each disc spring is sleeved on each guide rod, and the diameter of each disc spring is larger than that of each through hole.

Furthermore, the upper part of the through hole is provided with a conductive sleeve with a circular cross section, and the diameter of the conductive sleeve is not less than that of the through hole.

A modular press-fit type semiconductor module comprising a module collector plate, a chip sub-module, a module emitter plate and the elastic sub-module of any one of claims 1 to 4;

the chip sub-module comprises a chip, a collector conductor and an emitter conductor;

the module collector plate, the collector conductor, the chip, the emitter conductor, the elastic sub-module and the module emitter plate are sequentially connected from top to bottom;

by applying a certain pressure to the modularized crimping type semiconductor module, the elastic sub-module is conducted to drive the whole modularized crimping type semiconductor module to be conducted.

Furthermore, the chip packaging structure further comprises a chip limiting frame, and a plurality of chips are arranged in the chip limiting frame.

Further, the module emission polar plate and the conductive plate are of an integrally formed structure.

Furthermore, the chip sub-modules and the elastic sub-modules are respectively provided with a plurality of elastic sub-modules, and one elastic sub-module is arranged under each chip sub-module to form a pair.

Furthermore, the device also comprises a pressure-bearing limiting frame, wherein a plurality of cavities are arranged in the pressure-bearing limiting frame, and a pair of elastic sub-modules and a chip sub-module are arranged in each cavity.

The module collector plate, the chip sub-module, the module emitter plate and the elastic sub-module are arranged in the ceramic tube shell, the skirt edge of the ceramic tube shell is sealed in a cold pressure welding or laser welding mode, and vacuumizing and protective gas filling treatment are needed before sealing.

The invention achieves the following beneficial effects:

the elastic submodule group adopts an elastic compression joint mode to solve the problem of uneven stress, and meanwhile, the single conducting strip can well solve the flow equalization problem of a single subunit.

By modularizing the chip sub-units, the thermal resistance can be further reduced, and the power density and the current level of the module can be improved; the modularity of the chip sub-units can also reduce material cost and reduce processing procedures.

Drawings

FIG. 1 is a schematic diagram of the structure of an elasticity module of the present invention;

FIG. 2 is a schematic view of a modular compression-type semiconductor module according to the present invention;

FIG. 3 is a schematic diagram of a chip sub-module structure according to the present invention;

fig. 4 is another embodiment of the insulating elastic member.

In the figure, 1 is a conducting strip, 2 is an insulating elastic piece, 3 is a conducting plate, 4 is a groove, 5 is an insulating guide rod, 6 is a conducting sleeve, 7 is a module collecting electrode plate, 8 is a module emitting electrode plate, 9 is a chip, 10 is a collecting electrode conductor, 11 is an emitting electrode conductor, 12 is an emitting electrode conductor, 13 is a pressure-bearing limiting frame, 14 is a pressure-bearing limiting frame, 141 is a top cover, 142 is a skirt edge, and 143 is a base.

Detailed Description

The invention is further described below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.

As shown in fig. 1, an elasticity submodule includes: a conductive sheet 1, an insulating elastic member 2 and a conductive sheet 3;

the conducting plate 1 is bent into a bent conducting plate with a plurality of grooves 4, the conducting plate 1 is clamped at the upper end of the insulating elastic piece 2 through the grooves, and the lower end of the insulating elastic piece 2 is connected with the conducting plate 3;

when the elastic submodule is not pressed, the insulating elastic piece 2 supports the conducting plate 1, a gap is formed between the conducting plate 1 and the conducting plate 3, the conducting plate 1 is not conducted with the conducting plate 3, when a certain pressure is applied to the elastic submodule, no gap is formed between the conducting plate 1 and the conducting plate 3, and the conducting plate 1 is conducted with the conducting plate 3.

The bent conducting strip is a corrugated conducting strip, and a groove with a downward opening in the corrugated conducting strip is the groove 4; in the embodiment, the right-angle corrugated conducting plate is adopted, and the conducting plate is regular in structure and convenient to design and manufacture.

The top of the groove 4 is provided with a plurality of through holes with circular cross sections, the through holes are internally provided with insulating guide rods 5, the bottom ends of the insulating guide rods 5 are fixed on the conductive plate 3, the insulating elastic part 2 is a disc spring, the disc spring is sleeved on the insulating guide rods 5, and the diameter of the disc spring is larger than that of the through holes; through setting up through-hole and insulating guide arm, say the dish spring cover on insulating guide arm again, can guarantee when exerting pressure that the direction that the dish spring pressurized is vertical, avoid the skew, the diameter of dish spring is greater than the diameter of through-hole and also can prevent that the dish spring from wearing out the through-hole.

The upper part of the through hole is provided with a conductive sleeve 6 with a circular cross section, and the diameter of the conductive sleeve 6 is not less than that of the through hole; the insulating guide rod can enter the conductive sleeve when passing through the through hole.

As another embodiment of the insulating elastic member 2, as shown in fig. 4, a hydraulic member or a pneumatic member is used in the embodiment, which includes a pressure rod 15, a housing 16 and a liquid or a gas 17, the pressure rod 15 corresponds to the insulating guide rod 5, and the liquid or the gas 17 is disposed in the housing 16, and the liquid or the gas 17 replaces the action of the spring.

As shown in fig. 2 and 3, a modularized press-contact type semiconductor module includes a module collector plate 7, a chip sub-module, a module emitter plate 8, and an elastic sub-module;

the chip sub-module comprises a chip 9, a collector conductor 10 and an emitter conductor 11;

the module collector plate 7, the collector conductor 10, the chip 9, the emitter conductor 11, the elastic sub-module and the module emitter plate 8 are sequentially connected from top to bottom;

by applying a certain pressure to the modularized crimping type semiconductor module, the elastic sub-module is conducted to drive the whole modularized crimping type semiconductor module to be conducted.

The chip packaging structure also comprises a chip limiting frame 12, wherein a plurality of chips 9 are arranged in the chip limiting frame 12; the chip is limited, and the chip is prevented from sliding.

The module emitter plate 8 and the conductive plate 3 may be an integrally formed unitary structure.

The chip sub-module and the elastic sub-module are respectively provided with a plurality of elastic sub-modules, and one elastic sub-module is arranged under each chip sub-module to form a pair. In this embodiment, one chip sub-module includes 6 chips 9, and the elastic sub-module is also correspondingly provided with 6 grooves 4 and 6 conductive sleeves 6, so that the modular matching design further reduces the thermal resistance, and improves the power density and current level of the module.

Still including pressure-bearing spacing frame 13, be equipped with a plurality of cavitys in the pressure-bearing spacing frame 13, set up a pair of elasticity submodule group and chip submodule group in the cavity.

The ceramic tube shell 14 is further provided with a module collecting electrode plate 7, a chip sub-module, a module emitting electrode plate 8 and an elastic sub-module, wherein the module collecting electrode plate 7 is arranged in the top cover 141 of the ceramic tube shell 14, the module emitting electrode plate 8 is arranged on the base 143 of the ceramic tube shell 14, the skirt 142 of the ceramic tube shell 14 is sealed in a cold welding or laser welding mode, and vacuumizing and protective gas filling processing are needed before sealing.

The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.