阅读说明：本技术 管座 (Tube holder ) 是由 海沼正夫 松末明洋 田中秀幸 于 2020-03-13 设计创作，主要内容包括：本发明的管座,包括：管座体,其形成有贯通孔；镍镀膜,其形成在管座体的包含贯通孔的内壁面在内的表面,具有凹凸或空隙；以及固定部件,其设置在管座体的贯通孔而用于固定引脚,在贯通孔内其一部分被收纳于镍镀膜的凹凸或空隙。(The stem of the present invention comprises: a tube base body formed with a through hole; a nickel plating film formed on the surface of the stem body including the inner wall surface of the through hole, the nickel plating film having irregularities or voids; and a fixing member provided in the through hole of the tube base body for fixing the lead, a part of the fixing member being accommodated in the irregularities or the gaps of the nickel plating film in the through hole.)

1. A header, comprising:

a tube base body formed with a through hole;

a nickel plating film formed on a surface of the tube base body including an inner wall surface of the through hole, the nickel plating film having a concave-convex shape or a gap; and

and a fixing member provided in the through hole of the tube base body and fixing the lead, wherein a part of the fixing member is accommodated in the unevenness or the gap of the nickel plating film in the through hole.

2. The header of claim 1,

the through hole is non-circular.

3. Header according to claim 1 or 2,

a plurality of the pins are fixed in the through holes.

4. The header of claim 1,

the fixing member is partially received in the through hole in a gap of the nickel plating film, and is in contact with a surface of the tube base exposed from the gap.

5. The header of claim 1,

the tube seat body is formed of a metal,

the fixing member is formed of an insulating material having a smaller thermal expansion coefficient than the metal forming the tube base body.

6. The header of claim 5,

the metal is iron, and the metal is iron,

the insulating material is glass.

7. Header according to claim 5 or 6,

the nickel plating film has a convex portion formed by diffusing the metal forming the tube base body into the nickel plating film,

the fixing member has a concave portion for receiving the convex portion of the nickel plating film at a position corresponding to the convex portion on the outer peripheral surface thereof.

Technical Field

The present invention relates to a socket.

Background

A stem for mounting a semiconductor element such as an optical element is manufactured as follows: a tube base body is formed with a through hole, and then the lead pin is fixed to the through hole of the tube base body via a fixing member made of an insulating material such as glass.

The fixing member is fitted in the through hole of the socket body to allow the lead pin to be inserted therethrough. Then, the fixing member is melted and then solidified, thereby fixing the lead to the through hole of the tube base via the fixing member. The through hole of the pipe base body is formed in a circular shape in principle, but may be formed in a non-circular shape such as a long hole shape.

Patent document 1, Japanese patent laid-open No. 2005-191088

Disclosure of Invention

However, in the case of the stem in which the stem body is formed with the non-circular through hole, the stress from the stem body is not uniformly applied to the fixing member fitted in the through hole. That is, in the solidification process after melting, stress is applied from the tube seat body to the fixing member due to expansion and contraction of the fixing member and the tube seat body having different thermal expansion coefficients, but the stress varies in the circumferential direction along the inner wall surface of the non-circular through hole.

As described above, in a state where the stress applied from the stem body to the fixing member is uneven, if the mounting of the semiconductor element or the provision of the lid member for protecting the semiconductor element is performed on the stem body, a gap may be generated between the stem body and the fixing member due to heat or impact. As a result, the following problems may occur: the problem of leakage (leak) occurs in the non-circular through hole into which the fixing member is fitted, and the leakage is a case where external air flows in from a gap between the stem body and the fixing member. The leakage occurring in the through hole is not preferable because it causes deterioration in quality of the semiconductor element mounted on the tube base body.

The disclosed technology has been made in view of the above problems, and an object thereof is to provide a stem capable of suppressing occurrence of leakage in a through hole.

The present application discloses a socket, in an aspect, includes: a tube base body formed with a through hole; a nickel plating film formed on a surface of the tube base body including an inner wall surface of the through hole, the nickel plating film having irregularities or voids; and a fixing member provided in the through hole of the tube base body and fixing the lead, a part of the fixing member being accommodated in the unevenness or the gap of the nickel plating film in the through hole.

According to one aspect of the stem disclosed in the present application, an effect of suppressing the occurrence of the leak in the through hole can be obtained.

Drawings

Fig. 1 is a sectional view showing an example of the structure of a stem according to an embodiment.

Fig. 2 is a plan view of the socket as viewed from above.

Fig. 3 is a diagram showing an example of the installation state of the fixing member.

Fig. 4 is a view showing an example of the surface state of the tube base body according to the thickness of the Ni plating film.

Description of the symbols

1, tube seat; 10 pipe seat bodies; 10a, 10b through-holes for pins; 20. 40 a fixing member; 30 pins for electrical signals; 50 power supply pins; plating a film on 70 Ni; 70a void; 70b, a convex part; r element mounting region.

Detailed Description

Hereinafter, embodiments of the stem disclosed in the present application will be described in detail with reference to the drawings. In addition, the disclosed technology is not limited to this embodiment.

Examples

Structure of socket

Fig. 1 is a sectional view showing an example of the structure of a stem 1 according to an embodiment. Hereinafter, for convenience of explanation, a surface facing upward in the drawing sheet of fig. 1 is referred to as an upper surface, and a surface facing downward in the drawing sheet is referred to as a lower surface. However, the socket 1 may be used upside down, and may be used in any posture. As shown in fig. 1, the socket 1 includes a socket body 10, a fixing member 20, an electrical signal lead 30, a fixing member 40, and a power supply lead 50.

The tube seat body 10 is formed of, for example, metal into a disc shape, and is a base material on which various components constituting the tube seat 1 are mounted. As the metal forming the pipe housing 10, for example, iron can be used. An element mounting region R on which a semiconductor element such as an optical element is mounted is formed on the upper surface of the stem body 10. A plurality of pin through holes 10a and 10b penetrating the tube body 10 in the thickness direction are formed in the upper surface of the tube body 10 at positions surrounding the component mounting region R.

Fig. 2 is a plan view of the socket 1 as viewed from above. In fig. 2, the upper surface of the tube base 10 is shown in a disk shape. The section along the line I-I in fig. 2 corresponds to the section of the stem 1 shown in fig. 1. As shown in fig. 2, the stem body 10 is formed with a lead through-hole 10a and a lead through-hole 10 b. The pin through-hole 10a is formed in a circular shape, and 1 electrical signal pin 30 is fixed via the fixing member 20. On the other hand, the pin through-hole 10b is formed in a non-circular shape. In the present embodiment, the pin through-hole 10b is formed in a long hole shape. 3 power supply pins 50 are fixed to the pin through-hole 10b via the fixing member 40. By fixing 3 power supply pins 50 in 1 pin through hole 10b, the pitch between the pins is reduced, and the mounting density of the pins is improved.

Further, a nickel (Ni) plating film for preventing corrosion of the surface of the tube base body 10 is formed on the surface of the tube base body 10 including the inner wall surfaces of the pin through holes 10a and 10 b. The Ni plating film will be described later in detail.

Returning to fig. 1, the fixing member 20 is made of an insulating material having a smaller thermal expansion coefficient than the metal forming the tube base 10, and is provided in the pin through-hole 10a of the tube base 10. As an insulating material forming the fixing member 20, for example, glass can be used. The fixing member 20 has a hole through which the power supply signal pin 30 is inserted, and fixes the electric signal pin 30 inserted through the hole to the pin through-hole 10 a. Specifically, the fixing member 20 is fitted in the lead through hole 10a of the stem body 10 and the electric signal lead 30 is inserted therethrough. Then, the fixing member 20 is melted and then solidified, so that the electric signal pin 30 is fixed to the pin through hole 10a of the tube base 10 via the fixing member 20.

The electrical signal pin 30 is formed in a cylindrical shape, for example, and transmits an electrical signal, which is a high-frequency signal supplied to the semiconductor device on the device mounting region R of the housing 10. The electric signal pin 30 is fixed to the pin through hole 10a of the tube base 10 via the fixing member 20.

The fixing member 40 is made of an insulating material having a smaller thermal expansion coefficient than the metal forming the tube base 10, and is provided in the pin through-hole 10b of the tube base 10. As an insulating material forming the fixing member 40, for example, glass can be used. The fixing member 40 has a hole through which the power feeding pin 50 is inserted, and fixes the power feeding pin 50 inserted through the hole to the pin through-hole 10 b. Specifically, the fixing member 40 is fitted in the pin through hole 10b of the tube base 10 and the power supply pin 50 is inserted therethrough. Then, the fixing member 40 is melted and then solidified, whereby the power feeding pin 50 is fixed to the pin through hole 10b of the tube base 10 via the fixing member 40. The installation state of the fixing member 40 will be described later in detail.

The power supply lead 50 is formed in a cylindrical shape, for example, and serves as a lead for supplying a current for driving a semiconductor element mounted on the element mounting region R of the stem body 10. The power feeding pin 50 is fixed to the pin through hole 10b of the tube base 10 via the fixing member 40.

Installation state of fixing member

Next, the installation state of the fixing member 40 will be described in detail with reference to fig. 3. Fig. 3 is a diagram showing an example of the installation state of the fixing member 40. The fixing member 40 is provided in the lead through hole 10b of the stem body 10 to fix the power supply lead 50 to the lead through hole 10 b. The lead through-hole 10b is formed in a long hole shape (see fig. 2).

An Ni plating film 70 is formed on the surface of the stem body 10 including the inner wall surface of the pin through hole 10 b. The Ni plating film 70 has a gap 70a that partially exposes the surface of the tube base 10. For example, the Ni plating film 70 has voids 70a at the positions of grain boundaries, which are boundaries between a plurality of crystal grains forming the Ni plating film 70. In the pin through-hole 10b, a part of the fixing member 40 is accommodated in the void 70a of the Ni plating film 70. Further, a part of the fixing member 40 is in contact with the surface of the stem body 10 exposed from the gap 70 a.

The Ni plating film 70 has a convex portion 70b formed by diffusing the metal forming the tube base 10 into the Ni plating film 70. For example, the Ni plating film 70 has a convex portion 70b in a region where the void 70a is not formed. The convex portion 70b gives a certain surface roughness to the stem body 10 together with the void 70 a. The surface roughness (for example, arithmetic average roughness Ra) of the tube base body 10 is, for example, in the range of 2.5 μm to 3.4 μm. The fixing member 40 has a concave portion for accommodating the convex portion 70b of the Ni plating film 70 at a position corresponding to the convex portion 70b on the outer peripheral surface thereof.

Further, when the stem body 10 is formed with a non-circular through hole for lead 10b such as a long hole, for example, stress from the stem body 10 is not uniformly applied to the fixing member 40 fitted in the through hole for lead 10 b. That is, in the solidification process after melting, stress is applied from the stem body 10 to the fixing member 40 by expansion and solidification of the fixing member 40 and the stem body 10 having different thermal expansion coefficients from each other, but this stress is not uniform in the circumferential direction along the inner wall surface of the pin through-hole 10 b.

As described above, in a state where the stress applied to the fixing member 40 by the stem body 10 is uneven, if the semiconductor element is mounted on the stem body 10 or a lid member for protecting the semiconductor element is provided, a gap may be generated between the stem body 10 and the fixing member 40 due to heat or impact. As a result, there is a possibility that leakage of outside air from the gap between the stem body 10 and the fixing member 40 may occur in the non-circular pin through hole 10b into which the fixing member 40 is fitted.

Thus, in the stem 1 of the present embodiment, as shown in fig. 3, the Ni plating film 70 is formed with the void 70a partially exposing the surface of the stem body 10, and the fixing member 40 is partially accommodated in the void 70a of the Ni plating film 70 in the lead through hole 10 b.

By forming the void 70a in the Ni plating film 70 and accommodating a part of the fixing member 40 in the void 70a of the Ni plating film 70 in the lead through-hole 10b, the anchor effect is exerted, whereby the adhesion between the fixing member 40 and the lead through-hole 10b can be improved. Therefore, even when stress from the tube base body 10 is not uniformly applied to the fixing member 40 fitted in the non-circular pin through hole 10b, the pin through hole 10b is stably sealed by the fixing member 40, and the occurrence of leakage in the pin through hole 10b can be suppressed.

In the stem 1 of the present embodiment, a part of the fixing member 40 is accommodated in the void 70a of the Ni plating film 70, and is brought into contact with the surface of the stem body 10 exposed from the void 70 a. This can further improve adhesion between the fixing member 40 and the pin through-hole 10b, and further can further suppress occurrence of leakage in the pin through-hole 10 b.

In the stem 1 of the present embodiment, the protruding portion 70b is formed on the Ni plating film 70, and the recessed portion for accommodating the protruding portion 70b is formed on the outer peripheral surface of the fixing member 40 at a position corresponding to the protruding portion 70b of the Ni plating film 70. This results in an anchor effect, whereby the adhesion between the fixing member 40 and the pin through-hole 10b can be further improved, and the occurrence of leakage in the pin through-hole 10b can be further suppressed.

Manufacturing method of socket

The stem 1 shown in fig. 1 can be manufactured by the following manufacturing method, for example. First, the tube base body 10 is formed with a circular pin through-hole 10a and a long-hole pin through-hole 10 b. The tube housing 10 is formed by pressing a metal such as iron, for example, by cold forging.

Next, a Ni plating film 70 is formed on the surface of the stem body 10. At this time, the Ni plating film 70 is formed on the entire surface of the stem body 10 including the inner wall surfaces of the pin through-holes 10a and the pin through-holes 10 b. The Ni plating film 70 is formed by, for example, Ni plating on the surface of the stem body 10.

Subsequently, the fixing member 20 is fitted into the lead through hole 10a, and the fixing member 40 is fitted into the lead through hole 10 b.

Next, the electric signal pin 30 is inserted into the hole of the fixing member 20, and the electric power supply pin 50 is inserted into the fixing member 40. This forms an intermediate structure having the tube base 10, the fixing member 20, the electrical signal pins 30, the fixing member 40, and the power supply pins 50.

Next, the intermediate structure is heated at a temperature (for example, 1000 ℃) at which the fixing members 20 and 40 are melted. The intermediate structure is heated to melt the fixing members 20 and 40. After that, the intermediate structure is cooled to solidify the fixing members 20 and 40.

By melting and then solidifying the fixing member 20 and the fixing member 40, the electric signal pin 30 is fixed to the pin through hole 10a via the fixing member 20, and the power supply pin 50 is fixed to the pin through hole 10b via the fixing member 40. Here, the Ni plating film 70 is recrystallized by heat applied when the fixing member 40 is melted, and a void 70a that partially exposes the surface of the tube base body 10 is formed at the position of the grain boundary of the recrystallized Ni plating film 70. In the lead through hole 10b, a part of the fixing member 40 is accommodated in the void 70a of the Ni plating film 70. Further, due to the heat applied when melting the fixing member 40, the metal forming the tube base 10 diffuses into the Ni plating film 70 to form the convex portion 70b in the Ni plating film 70. In the pin through-hole 10b, a concave portion for accommodating the convex portion 70b of the Ni plating film 70 is formed in a position corresponding to the convex portion 70b of the outer peripheral surface of the fixing member 40. As a result, the anchor effect is exerted on the pin through-hole 10b, whereby the adhesion between the fixing member 40 and the pin through-hole 10b can be improved, and the occurrence of leakage in the pin through-hole 10b can be suppressed.

Now, with reference to fig. 4, a thickness of the Ni plating film 70 suitable for forming the voids 70a and the protrusions 70b will be described. Fig. 4 is a view showing an example of the surface state of the stem body 10 according to the thickness of the Ni plating film 70. In fig. 4, there are shown traces 101, 102 showing the surface state of the stem body 10 when the Ni plating film 70 has a thickness of 4.5 μm. In addition, fig. 4 shows traces 103 and 104 showing the surface state of the stem body 10 when the thickness of the Ni plating film 70 is 5 μm. The traces 101 and 103 show the surface state of the stem body 10 after Ni plating is applied to the surface of the stem body 10. The traces 102 and 104 show the surface state of the stem body 10 after the fixing member 40 is melted and solidified. The surface roughness is also shown in each trace.

Referring to fig. 4, it can be seen that the surface of the stem body 10 after melting and solidifying the fixing member 40 is rougher when the thickness of the Ni plating film 70 is 4.5 μm than when the thickness of the Ni plating film 70 is 5 μm. That is, as can be understood from fig. 4, when the thickness of the Ni plating film 70 is 4.5 μm, voids 70a are formed at the positions of the grain boundaries of the Ni plating film 70 after recrystallization. Further, as can be understood from fig. 4, when the thickness of the Ni plating film 70 is 4.5 μm, the metal forming the tube base 10 diffuses into the Ni plating film 70 to form the convex portion 70b on the Ni plating film 70. From this, it is understood that the thickness of the Ni plating film 70 is preferably less than 5.0. mu.m, and more preferably 4.5 μm or less. This allows the Ni plating film 70 to stably form the voids 70a and the projections 70 b.

Alternatively, the surface of the Ni plating film 70 may be chemically roughened to form irregularities and voids before or after the formation of the Ni plating film 70.

After the intermediate structure is cooled and the fixing members 20 and 40 are solidified, a Ni/Au plating film is formed on the entire surface of the intermediate structure. The Ni/Au plating film is formed by, for example, Ni plating and then Au plating on the surface of the intermediate structure. This completes the socket 1 shown in fig. 1.

As described above, the socket 1 according to the embodiment includes the socket body 10, the Ni plating film 70, and the fixing member 40. The stem body 10 is formed with a lead through hole 10 b. The pin through hole 10b is formed in a non-circular shape, for example. The Ni plating film 70 is formed on the surface of the stem body 10 including the inner wall surface of the pin through hole 10b, and has a void 70 a. The fixing member 40 is provided in the lead through hole 10b of the stem body 10 to fix the power supply lead 50, and a part thereof is accommodated in the gap 70a of the Ni plating film 70 in the lead through hole 10 b. This can suppress the occurrence of the leakage in the pin through-hole 10 b.

In the case of the stem 1 according to the embodiment, a part of the fixing member 40 is accommodated in the void 70a of the Ni plating film 70 in the lead through hole 10b, and is in contact with the surface of the stem body 10 exposed from the void 70 a. This can further improve adhesion between the fixing member 40 and the pin through-hole 10b, and further can further suppress occurrence of leakage in the pin through-hole 10 b.

In the stem 1 according to the embodiment, the Ni plating film 70 has the convex portion 70b formed by diffusing the metal forming the stem body 10 into the Ni plating film 70. The fixing member 40 has a concave portion for accommodating the convex portion 70b of the Ni plating film 70 at a position corresponding to the convex portion 70b on the outer peripheral surface thereof. This can further improve adhesion between the fixing member 40 and the pin through-hole 10b, and further can further suppress occurrence of leakage in the pin through-hole 10 b.

The present invention can also be applied to the circular through hole for lead 10 a. That is, by forming the void 70a in the Ni plating film 70 and accommodating a part of the fixing member 20 in the void 70a of the Ni plating film 70 in the through-hole for lead 10a, the anchor effect is exerted, whereby the adhesion between the fixing member 20 and the through-hole for lead 10a can be improved. This can suppress the occurrence of the leakage in the pin through-hole 10 a.

In the above description, the example in which the void 70a is formed in the Ni plating film 70 and a part of the fixing member 40 is accommodated in the void 70a of the Ni plating film 70 in the lead through hole 10b has been described, but the disclosed technique is not limited to this. For example, the Ni plating film 70 may be formed with irregularities, and a part of the fixing member 40 may be accommodated in the irregularities of the Ni plating film 70 in the lead through-hole 10 b.