阅读说明：本技术 一种微通道相变散热装置及其散热方法 (Micro-channel phase change heat dissipation device and heat dissipation method thereof ) 是由 张衍俊 刘珠明 李全同 陈志涛 于 2020-12-11 设计创作，主要内容包括：本发明公开了一种微通道相变散热装置及其散热方法,包括由上而下依次叠放连接的盖板、分流板、导流板及微通道板；在微通道板上设置特殊的分流板和导流板,使得流体以均匀分流的形式进入和流出微通道板。通过微通道板上几个相互独立的换热单元集成在一起,来实现较好的冷却和均温效果,有效的解决了现有微通道散热器内由于气泡过大所导致的气泡堵塞流道和压降损失过大的问题。该型散热器具有冷却和均温效果好,流动压降损失小的特点。(The invention discloses a microchannel phase change heat dissipation device and a heat dissipation method thereof, wherein the microchannel phase change heat dissipation device comprises a cover plate, a flow distribution plate, a flow guide plate and a microchannel plate which are sequentially stacked and connected from top to bottom; special flow distribution plates and flow guide plates are arranged on the microchannel plate, so that the fluid enters and flows out of the microchannel plate in a uniform flow distribution mode. The micro-channel plate is integrated with a plurality of mutually independent heat exchange units to realize better cooling and temperature equalizing effects, and the problems that the flow channel is blocked by bubbles and the pressure drop loss is overlarge due to overlarge bubbles in the existing micro-channel radiator are effectively solved. The radiator has the characteristics of good cooling and temperature equalizing effects and small flow pressure drop loss.)

1. A microchannel phase change heat dissipation device is characterized by comprising a cover plate, a splitter plate, a guide plate and a microchannel plate which are sequentially stacked and connected from top to bottom;

the flow distribution plate is provided with a plurality of fluid inlet grooves and fluid outlet grooves in parallel, and the fluid inlet grooves and the fluid outlet grooves are alternately arranged; a fluid inlet is formed in one side of the fluid inlet groove, a fluid outlet is formed in one side of the fluid outlet groove, and the fluid inlet and the fluid outlet are respectively formed in different sides of the flow distribution plate;

a plurality of first shunting openings are arranged in the fluid inlet groove in a sequence from left to right according to a preset first distance;

a plurality of second shunting openings are arranged in the fluid outflow groove in a sequence from left to right according to a preset second distance;

the guide plate is provided with a plurality of first guide grooves and second guide grooves in parallel, and the first guide grooves and the second guide grooves are alternately arranged;

a first flow guide opening and a baffle are arranged in the first flow guide groove, and a second flow guide opening is arranged in the second flow guide groove; the first diversion grooves correspond to the first diversion openings in position; the positions of the second diversion grooves correspond to the second diversion openings; convex grooves for separating and dividing each area of the microchannel plate are correspondingly arranged between each first flow guide opening and the second flow guide opening closest to the first flow guide opening on one side surface facing the microchannel plate;

the microchannel plate is divided into a plurality of heat dissipation areas by a plurality of convex grooves, and a plurality of mutually independent flow areas are arranged in each heat dissipation area; the inlet of each flow field corresponds to one of the first flow directing openings and the outlet of each flow field corresponds to one of the second flow directing openings.

2. The micro-channel phase change heat sink of claim 1,

the central position of the baffle corresponds to the position vertically below the first split opening.

3. The microchannel phase change heat sink of claim 1, wherein the distance between the upper surface of the baffle and the upper surface of the baffle is in a range of 3 mm to 10 mm.

4. The micro-channel phase change heat sink of claim 1,

the cover plates, the splitter plate, the guide plate and the microchannel plate are connected through sealing rings.

5. The micro-channel phase change heat sink of claim 1,

the width of the convex groove is smaller than that of the heat dissipation area;

the thickness of the convex groove ranges from 0.5 mm to 1 mm.

6. The micro-channel phase change heat sink of claim 1,

the lengths of the first flow guide opening and the second flow guide opening are greater than or equal to the length of the whole heat dissipation area below;

the width of the first and second flow openings ranges from 2 mm to 6 mm.

7. The micro-channel phase change heat sink of claim 1,

one side surface of the microchannel plate is a smooth plane.

8. A microchannel phase change heat dissipation method, adapted to the microchannel phase change heat dissipation device of any one of claims 1 to 7, the heat dissipation method comprising:

the diverter plate receives a first fluid through the fluid inlet;

the diverter plate directs the first fluid to the baffle through the fluid inlet groove and the first diverter opening;

the baffle plate is used for guiding the first fluid guided to the baffle plate to the heat dissipation area through the first guide opening;

the microchannel plate, through the flow region, converts the first fluid channeled to the heat dissipation region into a second fluid;

the flow guide plate guides the second fluid to the fluid outflow groove through the second flow guide opening and the second flow dividing opening;

the flow distribution plate guides the second fluid, which is guided to the fluid outflow groove, to the fluid outlet through the fluid outflow groove.

9. The method for phase-change heat dissipation of micro-channel according to claim 8, wherein the flow dividing plate guides the first fluid to the baffle plate through the fluid inlet groove and the first flow dividing opening, and specifically comprises:

the flow distribution plate guides the first fluid to each first flow distribution opening in the groove through the fluid inlet groove;

the first fluid is divided into the fluids which are not interfered with each other and have the same quantity with the first diversion openings through the first diversion openings, and the fluids are respectively guided to the first diversion grooves corresponding to the first diversion openings.

10. The method for phase-change heat dissipation of micro-channels according to claim 8, wherein the step of converting the first fluid introduced to the heat dissipation area into a second fluid comprises:

and by a plurality of mutually independent flow areas of the heat dissipation area, the first fluid which is guided to the heat dissipation area is guided to the outlet direction of the flow area to generate phase change reaction, and heat is absorbed, so that the first fluid is converted into the second fluid.

Technical Field

The invention relates to the field of heat dissipation of electronic devices, in particular to a micro-channel phase change heat dissipation device and a heat dissipation method thereof.

Background

With the development of microelectronics and large-scale integrated circuits, the interior of a tiny electronic component is highly concentrated, the volume design of the component is smaller and smaller, and the heating power of the tiny electronic component is higher and higher, so that a high-efficiency heat dissipation device is urgently needed for the electronic component which operates in a severe thermal environment at present, and the service life of the electronic component is guaranteed.

At present, for an electronic component with high heat flow density, because a large amount of heat inside the electronic component is accumulated in a narrow space, an efficient heat dissipation device is often needed, so that the temperature inside the component is controlled within a certain range, and the normal and stable operation of the component is guaranteed. In the prior art, a microchannel heat sink heat dissipation technology is often adopted for heat dissipation of high heat flux density electronic components, and heat is absorbed by heat exchange of fluid in a microchannel, so that the microchannel heat sink method has a cooling effect and stable control of the whole temperature inside a device is realized. When the fluid keeps single-phase flow, on one hand, the fluid can only rely on the sensible heat absorbed by the self-temperature rise to exchange heat with the outside, and the heat exchange capacity is very limited at the moment, so that the integral cooling effect of the heat sink is limited; on the other hand, the fluid can absorb external heat at slender passageway flow in-process and make self temperature constantly rise to make the difference in temperature between fluid and the external world constantly shrink, make local heat transfer effect constantly worsen, finally lead to holistic samming effect to worsen.

When the fluid in the microchannel is subjected to phase change heat exchange, on one hand, because the latent heat absorbed by phase change is large, the microchannel heat sink has a good cooling effect in principle; on the other hand, the temperature of the fluid in the phase-change heat exchange process is kept stable, and in principle, the micro-channel heat sink has a good temperature equalizing effect. However, in the practical application process, for the existing micro-channel phase-change heat sink, the fluid absorbs external heat to undergo phase change in the flowing process of the slender channel, and the generated bubbles are increased continuously, so that the effective flow cross-sectional area of the channel is reduced, and thus, the great pressure drop loss is caused. More seriously, when the bubbles grow to a certain extent, the bubbles are gathered in the slender channel and do not flow any more, so that the channel is blocked, and a serious air lock phenomenon is generated. And the local heat exchange area of the heat sink cannot be supplemented by fresh cold fluid, so that the cooling effect is rapidly deteriorated. In addition, the above phenomenon also causes uneven flow distribution of the fluid in each parallel microchannel, and the temperature equalizing effect is also poor.

Disclosure of Invention

The embodiment of the invention provides a micro-channel phase change heat dissipation device and a heat dissipation method thereof, which adopt the idea of shunting, integrating and cooling and can solve the problems of heat dissipation channel blockage, high-voltage drop loss and poor cooling and temperature equalizing effects of the existing heat dissipater of a high-power electronic element, thereby improving the temperature control capability of the heat dissipater.

The embodiment of the invention provides a micro-channel phase change heat dissipation device which comprises a cover plate, a flow distribution plate, a flow guide plate and a micro-channel plate which are sequentially stacked and connected from top to bottom;

the flow distribution plate is provided with a plurality of fluid inlet grooves and fluid outlet grooves in parallel, and the fluid inlet grooves and the fluid outlet grooves are alternately arranged; a fluid inlet is formed in one side of the fluid inlet groove, a fluid outlet is formed in one side of the fluid outlet groove, and the fluid inlet and the fluid outlet are respectively formed in different sides of the flow distribution plate;

a plurality of first shunting openings are arranged in the fluid inlet groove in a sequence from left to right according to a preset first distance;

a plurality of second shunting openings are arranged in the fluid outflow groove in a sequence from left to right according to a preset second distance;

the guide plate is provided with a plurality of first guide grooves and second guide grooves in parallel, and the first guide grooves and the second guide grooves are alternately arranged;

a first flow guide opening and a baffle are arranged in the first flow guide groove, and a second flow guide opening is arranged in the second flow guide groove; the first diversion grooves correspond to the first diversion openings in position; the positions of the second diversion grooves correspond to the second diversion openings; convex grooves for separating and dividing each area of the microchannel plate are correspondingly arranged between each first flow guide opening and the second flow guide opening closest to the first flow guide opening on one side surface facing the microchannel plate;

the microchannel plate is divided into a plurality of heat dissipation areas by a plurality of convex grooves, and a plurality of mutually independent flow areas are arranged in each heat dissipation area; the inlet of each flow field corresponds to one of the first flow directing openings and the outlet of each flow field corresponds to one of the second flow directing openings.

Further, a center position of the baffle plate corresponds to a position vertically below the first split opening.

Further, the distance between the upper surface of the baffle and the upper surface of the baffle ranges from 3 mm to 10 mm.

Furthermore, the cover plates, the splitter plate, the guide plate and the microchannel plate are connected through sealing rings.

Further, the width of the convex groove is smaller than that of the heat dissipation area; the thickness of the convex groove ranges from 0.5 mm to 1 mm.

Further, the length of the first flow guide opening and the length of the second flow guide opening are greater than or equal to the length of the whole heat dissipation area below the first flow guide opening and the second flow guide opening; the width of the first and second flow openings ranges from 2 mm to 6 mm.

Furthermore, one side surface of the microchannel plate is a smooth plane.

Correspondingly, the embodiment of the invention also provides a microchannel phase change heat dissipation method, which is suitable for the microchannel phase change heat dissipation device, and the heat dissipation method comprises the following steps:

the diverter plate receives a first fluid through the fluid inlet;

the diverter plate directs the first fluid to the baffle through the fluid inlet groove and the first diverter opening;

the baffle plate is used for guiding the first fluid guided to the baffle plate to the heat dissipation area through the first guide opening;

the microchannel plate, through the flow region, converts the first fluid channeled to the heat dissipation region into a second fluid;

the flow guide plate guides the second fluid to the fluid outflow groove through the second flow guide opening and the second flow dividing opening;

the flow distribution plate guides the second fluid, which is guided to the fluid outflow groove, to the fluid outlet through the fluid outflow groove.

Further, the flow distribution plate guides the first fluid to the baffle plate through the fluid inlet groove and the first flow distribution opening, and specifically includes:

the flow distribution plate guides the first fluid to each first flow distribution opening in the groove through the fluid inlet groove;

the first fluid is divided into the fluids which are not interfered with each other and have the same quantity with the first diversion openings through the first diversion openings, and the fluids are respectively guided to the first diversion grooves corresponding to the first diversion openings.

Further, the converting the first fluid guided to the heat dissipation area into a second fluid includes:

and by a plurality of mutually independent flow areas of the heat dissipation area, the first fluid which is guided to the heat dissipation area is guided to the outlet direction of the flow area to generate phase change reaction, and heat is absorbed, so that the first fluid is converted into the second fluid.

The embodiment of the invention has the following beneficial effects:

in the phase-change heat dissipation device for the micro-channel, provided by the embodiment of the invention, in the fluid receiving stage, a first fluid is received through a fluid inlet which is formed in a groove and is formed in a flow distribution plate; then the first fluid is guided to the baffle plate of the guide plate by the fluid entering groove and the first diversion opening; under the condition that the baffle blocks at one side, the first fluid which is guided to the baffle is guided to a heat dissipation area of the microchannel plate through the first guide opening; then, the first fluid which is guided to the heat dissipation area is converted into a second fluid through the flow area; in the fluid discharging stage, a second fluid is guided to flow out of the groove through the second flow guide opening and the second flow dividing opening; and finally, the second fluid which is drained to the fluid outflow groove is drained to the fluid outlet through the fluid outflow groove, so that the heat dissipation function is realized. The scheme of the invention can solve the problems of high pressure drop loss, uneven cooling and integral temperature equalization caused by that the air bubbles block the channel and the fluid enters the overlong heat dissipation area due to the overlong channel of the traditional microchannel heat sink of the high-power electronic element, thereby improving the temperature control capability of the microchannel heat sink.

Drawings

FIG. 1 is a schematic structural diagram of an embodiment of a micro-channel phase change heat dissipation device provided in the present invention;

FIG. 2 is a schematic view of a baffle structure of an embodiment of a micro-channel phase change heat dissipation device provided by the present invention;

fig. 3 is a schematic flow chart of an embodiment of a method for dissipating heat through phase change of a microchannel according to the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of a microchannel phase change heat dissipation device provided in the present invention. Further, referring to fig. 2, fig. 2 is a schematic view of a baffle structure of an embodiment of the microchannel phase change heat dissipation device provided in the present invention;

as shown in fig. 1 and fig. 2, the microchannel phase change heat dissipation device provided by the present invention includes: comprises a cover plate 1, a flow distribution plate 2, a flow guide plate 3 and a micro-channel plate 4 which are sequentially stacked and connected from top to bottom;

a plurality of fluid inlet grooves 7 and fluid outlet grooves 9 are arranged on the flow distribution plate 2 side by side, and the fluid inlet grooves 7 and the fluid outlet grooves 9 are alternately arranged; a fluid inlet 17 is arranged on one side of the fluid inlet groove 7, a fluid outlet 8 is arranged on one side of the fluid outlet groove 9, and the fluid inlet 17 and the fluid outlet 8 are respectively arranged on different sides of the flow distribution plate 2; a plurality of first shunting openings 6 are arranged in the fluid inlet groove 7 in a sequence from left to right according to a preset first distance; a plurality of second shunting openings 5 are arranged in the fluid outflow groove 9 in a sequence from left to right according to a preset second distance; a plurality of first flow guide grooves 18 and second flow guide grooves 19 are arranged on the flow guide plate 3 side by side, and the first flow guide grooves 18 and the second flow guide grooves 19 are alternately arranged;

a first diversion opening 12 and a baffle 11 are arranged in the first diversion groove 18, and a second diversion opening 10 is arranged in the second diversion groove 19; the positions of the first diversion grooves 18 correspond to the first diversion openings 6; the positions of the second diversion grooves 19 correspond to the second diversion openings 5; convex grooves 13 for separating and dividing each area of the microchannel plate 4 are correspondingly arranged between each first flow guide opening 12 and the second flow guide opening 10 closest to the first flow guide opening on one side surface facing the microchannel plate 4;

the microchannel plate 4 is divided into a plurality of heat dissipation areas 15 by a plurality of convex grooves 13, and a plurality of mutually independent flow areas 14 are arranged in each heat dissipation area 15; one first flow opening 12 for each inlet of the flow field 14 and one second flow opening 10 for each outlet of the flow field 14.

In this embodiment, as shown in fig. 1, the cover plate 1, the flow distribution plate 2, the flow guide plate 3, and the microchannel plate 4 of the microchannel phase change heat dissipation device are all rectangular. Each plate in the radiator can be made of metal materials with high heat conductivity coefficient, such as copper, aluminum and the like, and the four parts are sequentially overlapped and assembled in a sealing mode, so that the relatively closed stable radiator is formed.

As another example of this embodiment, the cover plates 1, the splitter plate 2, the flow guide plate 3, and the microchannel plate 4 are connected by a seal ring.

In this embodiment, through selecting for use anticorrosive, high temperature resistant rubber seal for the closed effect of the pile of this radiator is better, and the guarantee fluid can not leaked.

In the present embodiment, as shown in fig. 1, a fluid inlet 17 is opened at a left side portion of the fluid inlet groove 7 for introducing the fluid into the interior of the radiator device. The right part of the fluid outflow groove 9 is provided with a fluid outlet 8 for discharging the phase-change reacted fluid through the fluid outlet 8. At the same time, a number of first split openings 6 are dug out at an average or slightly left distance from the fluid inlet groove 7, which will determine how many streams the fluid is split into the microchannel plate. The fluid outflow grooves 9 also dig a number of second split openings 5 on average or slightly to the right, which will determine how many fluid streams are divided to flow out of the microchannel plate. The openings may be rectangular, oval or circular cutouts. In addition, due to the difference between the inlet and the outlet and the structure, after the fluid enters the first branch opening 6, the subsequent fluid channels all flow in one direction, and meanwhile, in the arrangement, the first branch opening 6 is entirely blocked because the other side of the inlet of the fluid entering the groove 7 needs to be present, so that all the first branch openings 6 are closer to the left side than the second branch openings 5 in the same sequence, a staggered arrangement mode is formed, the branch outlet inlets are respectively connected with different lower channels, and the channels for fluid entering and fluid discharging are separated from each other.

In this embodiment, the first guiding grooves 18 and the second guiding grooves 19 are also disposed on the guiding plate 3 in a staggered manner, so that the channels are not communicated. The baffle 11 of the first diversion groove 18 is used for receiving the fluid flowing through the flow distribution plate 2, so that the area of the first diversion opening 6 which must correspond to the area of the baffle 11 of the first diversion groove 18 enables the fluid to normally flow onto the baffle 11, the fluid is buffered, and the fluid is uniformly distributed. And due to the tightness and the blockage on the right side of the baffle plate 11, the fluid must flow through the first flow guiding opening 12 on the left side of the baffle plate 11 in the first flow guiding groove 18, so that the flow guiding effect of the first flow guiding opening 12 is realized. And the second diversion groove 19 internally comprises a second diversion opening 10 for guiding the phase-changed fluid to the flow distribution plate 2. The positions of the second flow guide openings 10 and the passages of the second flow dividing openings 5 are corresponding, and the number of the corresponding second flow dividing openings 5 is related to the number of the fluid outflow grooves 9, so that the discharged second fluid flows out of the second flow dividing openings 5 smoothly. Meanwhile, on the back of the guide plate 2, according to the vacant position between the first guide groove 18 and the second guide groove 19 and the corresponding position rule between each first guide opening 12 and the second guide opening 10 closest to the first guide opening, a convex groove 13 for separating and dividing each area of the microchannel plate 4 is arranged, so that the reduction of the length of the microchannel is realized, and the phenomenon of bubble blockage is avoided.

As another example of the present embodiment, the center position of the baffle plate 11 corresponds to the position vertically below the first split opening 6.

In this embodiment, the central position of the baffle 11 preferably corresponds to a position vertically below the first split opening 6, the area of the first split opening 6 needs to be smaller than the area of the baffle 11, and the normal direction of the plane of the baffle 11 is parallel to the flow direction of the fluid entering the baffle 3. Through the arrangement mode, when entering the first diversion groove 18, the fluid completely falls on the position of the baffle plate 11 and then flows to the first diversion opening 12, so that the fluid falls on the microchannel plate 4 in an evenly distributed mode, the phase change efficiency of the fluid is enhanced, and the poor temperature equalization effect is avoided.

As another example of the present embodiment, the distance between the upper surface of the baffle 11 and the upper surface of the baffle 3 ranges from 3 mm to 10 mm.

In this embodiment, the distance between the baffle 11 and the surface of the baffle 3 is set to reasonably set the depth position of the baffle 11 in the first diversion groove 18, so that the upper, lower and right sides of the baffle 11 form a barrier, and the fluid naturally flows to the first diversion opening 12.

As another example of this embodiment, the lengths of the first flow guiding opening 12 and the second flow guiding opening 10 are greater than or equal to the length of the entire heat dissipation area 15 below; the widths of the first and second guide openings 12 and 10 range from 2 mm to 6 mm.

In the present embodiment, the length and width of the first diversion opening 12 are set to correspond to the length and width of the heat dissipation area 15, so that the fluid is uniformly distributed on the heat dissipation area 15, and the phase change reaction of the fluid is more sufficient. Meanwhile, the change of the overall length and width of the first guide opening 12 also causes the change of the overall length and width of the first guide groove 18, the baffle 11, the second guide opening 10 and the second guide groove 19. In the present embodiment, it is preferable that they have the same length, but the widths of the second guide opening 10 and the second guide groove 19 are smaller than the first guide groove 18. The widths of the first diversion opening 12 and the second diversion opening 10 are consistent; the first and second flow openings 12, 10 are of uniform length.

As another example of this embodiment, the width of the convex groove 13 is smaller than the width of the heat dissipation area 15; the thickness of the tongue 13 ranges from 0.5 mm to 1 mm.

In the present embodiment, the width of the convex groove 13 is set so that the convex groove 13 partitioning the heat dissipation region 15 can be formed to shorten the flow length of the flow region 14. The thickness of the convex groove 13 is set so that the convex groove 13 reasonably occupies the position of the heat dissipation area 15.

As another example of this embodiment, one side of the microchannel plate 4 is a smooth plane.

In this embodiment, as shown in fig. 2, the bottom surface of the microchannel plate 4 is a smooth plane, which facilitates a larger area of contact with the surface of the heat source, thereby achieving a high-efficiency heat conduction effect and improving the heat dissipation capability of the heat sink.

Correspondingly, the invention also provides a micro-channel phase change heat dissipation method which is suitable for the micro-channel phase change heat dissipation device. Referring to fig. 2, fig. 2 is a schematic flow chart of an embodiment of a phase change heat dissipation method for a microchannel provided in the present invention. As shown in fig. 2, the specific steps of the heat dissipation method include steps 201 to 206:

step 201: the flow distribution plate receives a first fluid through the fluid inlet;

in this embodiment, the fluid enters the interior of the heat sink through the fluid inlet.

Step 202: the diverter plate directs the first fluid to the baffle through the fluid inlet recess and the first diverter opening.

In this embodiment, the fluid flowing into the radiator flows to the other side on the fluid inlet groove arranged on the flow distribution plate under a certain pressure, and flows into the lower part of each first flow distribution opening after flowing through each first flow distribution opening, thereby realizing the effect of distributing the fluid.

As another example of this embodiment, the diversion plate directs the first fluid to the baffle plate through the fluid inlet groove and the first diversion opening, specifically: the flow distribution plate enters the groove through the fluid and guides the first fluid to each first flow distribution opening in the groove; through each first diversion opening, divide into the fluid of mutual noninterference, with first diversion opening equals quantity to respectively lead to, the first water conservancy diversion recess that each first diversion opening corresponds.

In this embodiment, the first shunting openings are spaced apart from each other in the groove, and the groove automatically and uniformly distributes the fluid to each opening when the fluid flows through each opening, so that the fluid is changed into a plurality of thinner fluid strands, and the purpose of the groove is to fully perform the subsequent phase change reaction and prevent the excessive fluid from flowing through the heat dissipation area.

Step 203: the guide plate guides the first fluid which is guided to the baffle to the heat dissipation area through the first guide opening.

In this embodiment, the baffle acts to direct the direction of the fluid. When the fluid is blocked by the baffle, the fluid becomes gentle and uniform, flows in from the first flow guide opening on the left side and enters the heat dissipation area.

Step 204: the microchannel plate passes through the flow region, and converts the first fluid, which is directed to the heat dissipation region, into a second fluid.

In this embodiment, the fluid can take place the phase transition reaction after the heat dissipation region to absorb the heat, produce the bubble and discharge, thereby realize the cooling effect.

As another example of this embodiment, the first fluid guided to the heat dissipation area is converted into the second fluid, specifically: the first fluid which is guided to the heat dissipation area is guided to the outlet direction of the flow area through a plurality of mutually independent flow areas of the heat dissipation area so as to generate phase change reaction and absorb heat, thereby being converted into the second fluid.

In this embodiment, the fluid is uniformly distributed to the flow regions after entering the heat dissipation region. Wherein, the flow area refers to a heat dissipation micro-channel. The heat dissipation micro-channels distribute the distributed thinner fluid to one side of the right convex groove in the blocking direction, so that the fluid undergoes a phase change reaction to generate bubbles. Because of the length of the micro-channels, the bubbles have no time to form a blockage and flow upwards when meeting the obstruction of the convex groove.

Step 205: the guide plate guides the second fluid to the fluid outflow groove through the second guide opening and the second shunt opening.

In this embodiment, the positions of the second diversion opening and the second diversion opening are corresponding, but there may be a plurality of corresponding second diversion openings, so it is preferable in this embodiment that the discharged air bubbles uniformly flow to the two fluid outflow grooves on the diversion plate through the second diversion opening and then through the two second diversion openings.

Step 206: the flow distribution plate guides the second fluid which is guided to the fluid outflow groove to the fluid outlet through the fluid outflow groove.

In this embodiment, the bubbles flow to the fluid outflow groove through the above steps. Under the condition that the left side of the groove blocks, the bubbles flow towards the right side, so that the bubbles flow through the fluid outlet, the bubbles are discharged, and the heat dissipation process is completed.

In the fluid receiving stage, the fluid provided on the flow distribution plate enters the fluid inlet in the groove to receive the first fluid; then the first fluid is guided to the baffle plate of the guide plate by the fluid entering groove and the first diversion opening; under the condition that the baffle blocks at one side, the first fluid which is guided to the baffle is guided to a heat dissipation area of the microchannel plate through the first guide opening; then, the first fluid which is guided to the heat dissipation area is converted into a second fluid through the flow area; in the fluid discharging stage, a second fluid is guided to flow out of the groove through the second flow guide opening and the second flow dividing opening; and finally, the second fluid which is drained to the fluid outflow groove is drained to the fluid outlet through the fluid outflow groove, so that the heat dissipation function is realized. The scheme of the invention can solve the problems of high pressure drop loss, uneven cooling and integral temperature equalization caused by that the air bubbles block the channel and the fluid enters the overlong heat dissipation area due to the overlong channel of the traditional microchannel heat sink of the high-power electronic element, thereby improving the temperature control capability of the microchannel heat sink.

While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention.