阅读说明：本技术 一种电磁屏蔽封装结构和电磁屏蔽封装方法 (Electromagnetic shielding packaging structure and electromagnetic shielding packaging method ) 是由 张超 钟磊 李利 何正鸿 于 2021-02-24 设计创作，主要内容包括：本发明的实施例提供了一种电磁屏蔽封装结构和电磁屏蔽封装方法,涉及半导体技术领域。该电磁屏蔽封装结构包括基板、至少两个贴装在基板上的芯片、设置在基板上的屏蔽线弧、覆盖在芯片和屏蔽线弧外的塑封体以及覆盖在塑封体表面的金属屏蔽层,其中,相邻两个芯片之间设置有屏蔽线弧,塑封体的表面设置有使得屏蔽线弧外露的沟槽,金属屏蔽层还覆盖在沟槽的内表面并与屏蔽线弧电接触。相较于现有技术,本发明通过屏蔽线弧实现电磁屏蔽,结合金属屏蔽层,以达到更好的电磁屏蔽效果。并且,本实施例通过在塑封体上开设沟槽,无需贯穿塑封体,避免了损伤下方基板,降低了工艺难度,提高了制作效率。(The embodiment of the invention provides an electromagnetic shielding packaging structure and an electromagnetic shielding packaging method, and relates to the technical field of semiconductors. The electromagnetic shielding packaging structure comprises a substrate, at least two chips attached to the substrate, a shielding line arc arranged on the substrate, a plastic packaging body covering the chips and the shielding line arc and a metal shielding layer covering the surface of the plastic packaging body, wherein the shielding line arc is arranged between every two adjacent chips, a groove enabling the shielding line arc to be exposed is formed in the surface of the plastic packaging body, and the metal shielding layer also covers the inner surface of the groove and is in electrical contact with the shielding line arc. Compared with the prior art, the invention realizes electromagnetic shielding through the shielding wire arc and achieves better electromagnetic shielding effect by combining the metal shielding layer. In addition, the grooves are formed in the plastic package body, so that the plastic package body does not need to be penetrated, the lower substrate is prevented from being damaged, the process difficulty is reduced, and the manufacturing efficiency is improved.)

1. An electromagnetic shielding package, comprising:

a substrate;

at least two chips attached to the substrate;

a shielded wire arc disposed on the substrate;

the plastic package body covers the chip and the shielding wire arc;

and a metal shielding layer covering the surface of the plastic package;

the shielding line arcs are arranged between every two adjacent chips, the surface of the plastic package body is provided with a groove enabling the shielding line arcs to be exposed, the metal shielding layer further covers the inner surface of the groove and is in electrical contact with the shielding line arcs, and the metal shielding layer is sunken in the groove to form a direction mark.

2. The emi shielding package structure of claim 1, wherein the shielding wire loop includes a grounding wire loop and a partitioning wire loop, the upper surface of the substrate is provided with a grounding pad and a partitioning pad, the partitioning pad is disposed between two adjacent chips, the partitioning wire loop is connected to the partitioning pad, the grounding wire loop is connected to the grounding pad, the lower surface of the substrate is further provided with a grounding pin for grounding, the grounding pin is electrically connected to the grounding pad, and the trench is opened above the partitioning wire loop and/or above the grounding wire loop, so that the partitioning wire loop and/or the grounding wire loop are exposed.

3. The emi shielding package structure as claimed in claim 2, wherein the surface of the plastic-sealed body has a direction mark area at the edge and a lettering area at the middle, the lettering area is provided with lettering characters, and the groove is opened above the ground line arc and located at the direction mark area.

4. The emc package of claim 2, wherein the trench has a depth of between 15-90 μ ι η.

5. The EMI shielded package structure as claimed in claim 3, wherein the lower surface of the substrate is further provided with a grounding solder ball, and the grounding solder ball is connected to the grounding pin.

6. The emc package structure of claim 1, wherein the molding compound has thermally conductive particles uniformly added therein.

7. An electromagnetic shielding packaging method, comprising:

mounting at least two chips on a substrate;

routing on the substrate to form a shielding line arc;

forming a plastic package body covering the chip and the shielding wire arc in a plastic package mode on the substrate;

grooving on the plastic package body to form a groove;

forming a metal shielding layer on the surface of the plastic package body;

the shielding line arcs are arranged between every two adjacent chips, the grooves enable the shielding line arcs to be exposed, the metal shielding layers cover the inner surfaces of the grooves and are in electrical contact with the shielding line arcs, and the metal shielding layers are sunken in the grooves to form direction marks.

8. The method of claim 7, wherein the step of routing the shield wire arcs onto the substrate comprises:

routing on a grounding bonding pad of the substrate to form a grounding wire arc;

and routing on the partition bonding pad of the substrate to form a partition line arc.

9. The method of claim 8, wherein the step of forming the groove in the plastic package body comprises:

laser grooving is carried out on a direction mark area positioned on the edge of the plastic package body, and a groove enabling the grounding wire arc to be exposed is formed;

and laser lettering is carried out on the lettering area positioned in the middle of the plastic package body to form lettering characters.

10. The method of claim 8, wherein the step of forming the groove in the plastic package body comprises:

and carrying out laser grooving on the surface of the plastic package body to form a groove for exposing the subarea line arc.

Technical Field

The invention relates to the technical field of semiconductors, in particular to an electromagnetic shielding packaging structure and an electromagnetic shielding packaging method.

Background

With the rapid development of the semiconductor industry, the SIP module structure is widely applied to the semiconductor industry. The packaging structure has the advantages that chips with different functions are packaged and stacked, high-density integration is achieved, the size of a packaged product is small, the performance of the product is excellent, the signal transmission frequency is high, and the like. The electromagnetic interference phenomenon that various chips and components and parts produced each other is prevented from occurring, after a metal column is formed by routing on the same substrate generally, the metal column is subjected to metal routing again, glue is dispensed and wrapped, conductive glue which is easy to cause overflows to a pad effective area of the substrate chip (a grounding pad pin on the surface of the substrate is designed around the chip), and the chip welding is caused to be invalid.

Furthermore, a technical means of grooving the plastic package body and refilling shielding media is provided, the mode needs to penetrate through the plastic package body, and the grooving stopping time is difficult to control, so that the lower substrate can be damaged, and the process difficulty is high. And the mode of filling the shielding medium also increases the process complexity undoubtedly, and the shielding effect is difficult to guarantee.

Disclosure of Invention

The present invention provides an electromagnetic shielding package structure and an electromagnetic shielding package method, which can simplify the process complexity, reduce the manufacturing difficulty, improve the manufacturing efficiency, and have a good electromagnetic shielding effect.

Embodiments of the invention may be implemented as follows:

in a first aspect, the present invention provides an electromagnetic shielding package structure, including:

a substrate;

at least two chips attached to the substrate;

a shielded wire arc disposed on the substrate;

the plastic package body covers the chip and the shielding wire arc;

and a metal shielding layer covering the surface of the plastic package;

the shielding line arcs are arranged between every two adjacent chips, the surface of the plastic package body is provided with a groove enabling the shielding line arcs to be exposed, the metal shielding layer further covers the inner surface of the groove and is in electrical contact with the shielding line arcs, and the metal shielding layer is sunken in the groove to form a direction mark.

In optional embodiment, the shielding wire arc includes ground connection wire arc and subregion wire arc, the upper surface of base plate is provided with ground connection pad and subregion pad, the subregion pad sets up adjacent two between the chip, the subregion wire arc with the subregion pad is connected, the ground connection wire arc with the ground connection pad is connected, the lower surface of base plate still is provided with the ground connection pin that is used for ground connection, the ground connection pin with the ground connection pad electricity is connected, the slot is seted up subregion wire arc top and/or ground connection wire arc top, so that subregion wire arc and/or the ground connection wire arc exposes.

In an optional embodiment, the surface of the plastic package body has a direction mark area located at the edge and a lettering area located at the middle, the lettering area is provided with lettering characters, and the groove is opened above the ground wire arc and located in the direction mark area.

In an alternative embodiment, the depth of the trench is between 15-90 μm.

In an optional embodiment, the lower surface of the substrate is further provided with a grounding solder ball, and the grounding solder ball is connected with the grounding pin.

In an alternative embodiment, the plastic package body is uniformly added with heat conducting particles.

In a second aspect, the present invention provides an electromagnetic shielding packaging method, including:

mounting at least two chips on a substrate;

routing on the substrate to form a shielding line arc;

forming a plastic package body covering the chip and the shielding wire arc in a plastic package mode on the substrate;

grooving on the plastic package body to form a groove;

sputtering the surface of the plastic package body to form a metal shielding layer;

the shielding line arcs are arranged between every two adjacent chips, the grooves enable the shielding line arcs to be exposed, the metal shielding layers cover the inner surfaces of the grooves and are in electrical contact with the shielding line arcs, and the metal shielding layers are sunken in the grooves to form direction marks.

In an alternative embodiment, the step of routing a shield loop on the substrate includes:

routing on a grounding bonding pad of the substrate to form a grounding wire arc;

and routing on the partition bonding pad of the substrate to form a partition line arc.

In an alternative embodiment, the step of forming the groove in the plastic package body includes:

laser grooving is carried out on a direction mark area positioned on the edge of the plastic package body, and a groove enabling the grounding wire arc to be exposed is formed;

and laser lettering is carried out on the lettering area positioned in the middle of the plastic package body to form lettering characters.

In an alternative embodiment, the step of forming the groove in the plastic package body includes:

and carrying out laser grooving on the surface of the plastic package body to form a groove for exposing the subarea line arc.

The beneficial effects of the embodiment of the invention include, for example:

according to the electromagnetic shielding packaging structure provided by the embodiment of the invention, the shielding wire arc is formed by routing on the substrate, the plastic packaging body which covers the chip and the shielding wire arc is arranged on the substrate, the groove which exposes the shielding wire arc is arranged on the surface of the plastic packaging body, and the part of the metal shielding layer which covers the groove is in electrical contact with the shielding wire arc, so that the electrical connection between the metal shielding layer and the shielding wire arc is realized. Compared with the prior art, the invention realizes electromagnetic shielding through the shielding wire arc and achieves better electromagnetic shielding effect by combining the metal shielding layer. In addition, the grooves are formed in the plastic package body, so that the plastic package body does not need to be penetrated, the lower substrate is prevented from being damaged, the process difficulty is reduced, and the manufacturing efficiency is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of an electromagnetic shielding package structure according to a first embodiment of the present invention in a first view;

fig. 2 is a schematic structural diagram of an electromagnetic shielding package structure according to a first embodiment of the present invention under a second viewing angle;

fig. 3 is a schematic structural diagram of an electromagnetic shielding package structure according to a second embodiment of the present invention under a first viewing angle;

fig. 4 is a schematic structural diagram of an electromagnetic shielding package structure according to a second embodiment of the present invention under a second viewing angle;

fig. 5 is a block diagram illustrating steps of an electromagnetic shielding packaging method according to a third embodiment of the present invention;

fig. 6 to 11 are process flow diagrams of an electromagnetic shielding packaging method according to a third embodiment of the present invention.

Icon: 100-electromagnetic shielding packaging structure; 110-a substrate; 111-ground pad; 113-a zoning pad; 115-ground pin; 117-ground solder ball; 130-chip; 150-shielded wire arc; 151-ground arc; 153-section line arc; 170-plastic package body; 171-a trench; 173-lettering characters; 190-metal shielding layer.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. indicate an orientation or a positional relationship based on that shown in the drawings or that the product of the present invention is used as it is, this is only for convenience of description and simplification of the description, and it does not indicate or imply that the device or the element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.

Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

As disclosed in the background art, in the prior art, for the electromagnetic shielding structure, a dispensing manner is usually adopted for fixing, i.e., after a metal pillar is formed by routing on the same substrate, the metal pillar is dispensed and wrapped again, and this manner easily causes the conductive glue to overflow to the chip effective area of the substrate 110 (the grounding pad pin on the substrate surface is designed around the chip), resulting in the failure of chip soldering. Furthermore, a technical means of grooving the plastic package body and refilling shielding media is provided, the mode needs to penetrate through the plastic package body, and the grooving stopping time is difficult to control, so that the lower substrate can be damaged, and the process difficulty is high. In addition, in the prior art, there is a process of plastic packaging after wire bonding, that is, a plastic packaging body is used to wrap the wire loop inside after wire bonding, however, in order to enable the metal layer formed by subsequent sputtering to be in electrical contact with the wire loop, the process usually requires grinding the plastic packaging body, so that the wire loop is exposed, and the finally formed metal layer is deposited on the upper side of the wire loop, thereby achieving electromagnetic shielding. The process needs grinding, has low efficiency, is difficult to control the grinding depth, is easy to damage the wire arcs, and undoubtedly improves the manufacturing difficulty due to the increase of the grinding process.

In order to solve the above problems, the present invention provides an electromagnetic shielding structure, and it should be noted that features in embodiments of the present invention may be combined with each other without conflict.

First embodiment

Referring to fig. 1 and fig. 2, the present embodiment provides an electromagnetic shielding package structure 100, which can simplify the process complexity, reduce the manufacturing difficulty, improve the manufacturing efficiency, and achieve a good electromagnetic shielding effect.

The electromagnetic shielding package structure 100 provided in this embodiment includes: the chip package comprises a substrate 110, at least two chips 130, a shielding wire arc 150, a plastic package body 170 and a metal shielding layer 190, wherein the at least two chips 130 are attached to the substrate 110, the shielding wire arc 150 is arranged on the substrate 110, and is at least arranged between two chips 130, a shielding wire arc 150 is arranged between every two adjacent chips 130, a plastic package body 170 is arranged on the substrate 110, and covers the chip 130 and the shielding wire loop 150, the metal shielding layer 190 covers the surface of the plastic package body 170, wherein, the surface of the plastic package body 170 is further provided with a groove 171 exposing the shielding wire arc 150, i.e., the trench 171 is located above the shield wire arc 150, and extends down to the shield wire arc 150, so that the shield wire loop 150 is exposed from the groove 171, the metal shield layer 190 covers the inner surface of the groove 171, and is electrically connected to the shield wire loop 150 to realize electromagnetic shielding, and the metal shield layer 190 is recessed at the groove 171 to form a direction indication.

In this embodiment, at least two chips 130 are mounted on the surface of the substrate 110 at intervals, which may be a positive type, that is, the chips 130 and the substrate 110 are electrically connected through additional wire arcs, or a flip type, that is, the chips 130 and the substrate 110 are soldered together and are electrically connected through solder balls. Meanwhile, the mounting manner of the chip 130 may refer to the existing Surface Mount Technology (SMT), and is not particularly limited herein.

In this embodiment, the shield arcs 150 include ground arcs 151 and partition arcs 153, the upper surface of the substrate 110 is provided with ground pads 111 and partition pads 113, the partition pads 113 are disposed between two adjacent chips 130, the partition arcs 153 are connected to the partition pads 113, the ground arcs 151 are connected to the ground pads 111, the lower surface of the substrate 110 is further provided with ground pins 115 for grounding, the ground pins 115 are electrically connected to the ground pads 111, and trenches 171 are opened above the ground arcs 151 to expose the ground arcs 151.

It should be noted that in this embodiment, the grounding wire loop 151 and the partitioning wire loop 153 are both formed by wire bonding on the pads, the pads are in a double-row structure, two ends of the wire loop are respectively connected with the two pads, and the wire bonding manner is not specifically limited herein.

It should be noted that, in the present embodiment, the chips 130 are all the chips 130 that need electromagnetic shielding in the SIP package module, for example, the high-frequency chip 130 that is easy to generate electromagnetic radiation and the low-frequency chip 130 that is easy to be affected by electromagnetic radiation, and the type of the chip 130 is not specifically limited herein.

In the present embodiment, the ground wire loop 151 is disposed on the ground pad 111, the ground pad 111 is electrically connected to the ground pin 115 through a metal post inside the substrate 110, and the ground pin 115 is used for grounding, thereby achieving the grounding process of the ground wire loop 151.

In this embodiment, the surface of the plastic package body 170 has a direction mark area at the edge and a print area at the middle, the print area is provided with print characters 173, and the groove 171 is opened above the ground line arc 151 and is located at the direction mark area. Specifically, the printing area is located in the middle of the plastic package body 170, and laser-engraved on the surface of the plastic package body 170 by a laser-engraving process to form a printing character 173, and at the same time, a groove may be formed in the direction mark area of the plastic package body 170 by the laser-engraving process while engraving, wherein the direction mark area is located above at least one ground line arc 151, and a groove 171 is formed by grooving in the direction mark area to form a direction mark, and the depth of the groove 171 should be greater than the depth of the printing character 173, and after a metal shielding layer 190 is formed by sputtering, the printing character 173 and the groove 171 may be revealed on the surface of the metal shielding layer 190, wherein the metal shielding layer 190 covering the surface of the groove 171 may serve as a direction mark, thereby assisting in proving the front and back of the device.

It should be noted that when the plastic package body 170 is engraved and grooved, the laser energy used is different, so as to form characters and grooves 171 with different depths, specifically, 10W of laser energy can be used to form grooves in the direction marking area of the plastic package body 170, the ground line arc 151 at the bottom is exposed after the grooves 171 are formed, and the other print characters 173 can be formed in the middle position of the plastic package body 170 by 2W of laser energy. Wherein the grooves 171 of the direction indication area play a role of identification reversion prevention and enable the metal shielding layer 190 to be grounded through the grounding wire arc 151, and the lettered characters 173 play a role of identification, such as a device model and the like. The engraving of the printed characters 173 and the direction marks on the plastic package body 170 is achieved through one-time laser printing with different energy, the groove 171 formed at the same time can be used for grounding the metal shielding layer 190, the printed characters and the groove 171 are formed in one-time forming, the process is simplified, and the manufacturing efficiency is greatly improved. And the groove 171 is formed by using the laser lettering process, so that the damage to the lower substrate 110 in the grooving process is avoided, and the manufacturing difficulty is reduced.

It should be noted that in this embodiment, the surface of the substrate 110 is provided with a ground pad 111 and a partition pad 113, where the ground pad 111 is used for achieving grounding, the ground wire loop 151 is disposed on the ground pad 111, and the ground pad 111 is located at an edge position of the substrate 110 after cutting, so that the ground pad 111 corresponds to the groove 171 on the plastic package body 170, and the direction identification and grounding of the metal shielding layer 190 are achieved through the groove 171. In other preferred embodiments of the present invention, the grounding pad 111 can also be disposed at other positions of the substrate 110, and the upper end of the grounding wire loop 151 is located at the edge of the plastic package body 170 by changing the wire bonding direction, which can also achieve the functions of direction marking and grounding of the metal shielding layer 190 through the trench 171.

In the present embodiment, the grounding wire loop 151 and the partition wire loop 153 are formed by wire bonding, and they are metal wire loops, such as copper wire, gold wire or alloy wire.

In the present embodiment, the depth of the trench 171 is between 15-90 μm. Preferably, the depth of the grooves 171 is between 25-45 μm. Meanwhile, at least one grounding wire arc 151 is adopted, and multiple sets of wire arcs are preferably adopted. The grounding wire arcs 151 and the partition wire arcs 153 are of cage-shaped structures, so that the contact area between the surfaces of the conductive wires and the metal shielding layer 190 in different equipment and process environments is increased, gaps among the wire arcs are small, surface tension can enable the wire arcs to be connected into a plane, and the stability and the shielding effect of the structure are further guaranteed.

In the present embodiment, the bottom surface of the substrate 110 is further provided with a grounding solder ball 117, and the grounding solder ball 117 is connected to the grounding pin 115. Specifically, the grounding is achieved by the grounding solder ball 117 on the lower surface, and at the same time, the lower surface of the substrate 110 is provided with other solder balls for achieving electrical connection, which will not be described in detail herein.

In the embodiment, the molding compound 170 is uniformly added with the heat conductive particles. Specifically, the plastic package body 170 is formed by epoxy-based resin (epoxy-based resin) or silicon-based resin (silicone-based resin), and heat conducting particles are added in the plastic package material before molding, so that the heat conducting particles are embedded in the plastic package body 170, wherein the heat conducting particles may be one or more of aluminum oxide particles, copper oxide particles and iron oxide particles, preferably, aluminum oxide powder may be added in the plastic package material, and the heat transfer effect of the plastic package body 170 is improved by the fine aluminum oxide particles, so as to ensure the heat dissipation performance of the whole body. Meanwhile, the heat conducting particles are mostly metal conducting particles, so that the electromagnetic shielding effect of the device can be further improved.

In summary, in the present embodiment, a groove 171 and a print character 173 for a direction mark are formed by a laser engraving process and grooving the direction mark region of the plastic package body 170 and engraving the print region with different laser energies in the electromagnetic shielding package structure 100. The groove 171 corresponds to the ground line segment 151, the metal shielding layer 190 covers the groove 171, and the ground of the metal shielding layer 190 is achieved by the ground line segment 151 formed by wire bonding on the ground pad 111. Specifically, a groove 171 is formed by grooving the surface of the plastic package body 170 by using laser, the ground line arc 151 at the bottom is exposed, a metal shielding layer 190 is formed after metal sputtering to contact with the ground line arc 151, and a ground end point effect is achieved, namely the groove 171 in the direction identification area has an identification anti-reflection effect and an electromagnetic shielding grounding effect, and the partition line arc 153 has a partition shielding effect. Through the laser grooving process, the direction mark groove and the groove 171 are combined into a whole, so that the direction mark effect is achieved, the metal shielding layer 190 is in electrical contact with the grounding line arc 151, the grounding of the metal shielding layer 190 is achieved, the metal shielding layer and the lettering characters 173 are formed together, the process that the grooving of the plastic package body 170 and the engraving of the lettering characters 173 are achieved through one-time laser lettering is achieved, and the preparation efficiency is greatly improved. Meanwhile, various problems in the prior art are avoided, grinding is not needed, and the process difficulty is reduced.

Second embodiment

Referring to fig. 3 and 4, the present embodiment provides an electromagnetic shielding package structure 100, the basic structure and principle thereof and the technical effects thereof are the same as those of the first embodiment, and for the sake of brief description, reference may be made to the corresponding contents of the first embodiment for the parts that are not mentioned in the present embodiment.

The electromagnetic shielding package structure 100 provided in this embodiment includes: the chip package comprises a substrate 110, at least two chips 130, a shielding line arc 150, a plastic package body 170 and a metal shielding layer 190, wherein the at least two chips 130 are attached to the substrate 110, the shielding line arc 150 is arranged on the substrate 110 and at least between the two chips 130, the shielding line arc 150 is arranged between every two adjacent chips 130, the plastic package body 170 is arranged on the substrate 110 and covers the chips 130 and the shielding line arc 150, and the metal shielding layer 190 covers the surface of the plastic package body 170, wherein the surface of the plastic package body 170 is further provided with a groove 171 for exposing the shielding line arc 150, namely the groove 171 is positioned above the shielding line arc 150 and extends downwards to the shielding line arc 150, so that the shielding line arc 150 is exposed from the groove 171, and the metal shielding layer 190 covers the inner surface of the groove 171 and is electrically connected with the shielding line arc 150, thereby realizing electromagnetic shielding.

In this embodiment, the shield arcs 150 include ground arcs 151 and partition arcs 153, the upper surface of the substrate 110 is provided with ground pads 111 and partition pads 113, the partition pads 113 are disposed between two adjacent chips 130, the partition arcs 153 are connected to the partition pads 113, the ground arcs 151 are connected to the ground pads 111, the lower surface of the substrate 110 is further provided with ground pins 115 for grounding, the ground pins 115 are electrically connected to the ground pads 111, and trenches 171 are opened above the partition arcs 153 to expose the partition arcs 153. Specifically, the groove 171 is opened in the middle of the plastic package body 170 and corresponds to the partition line arc 153, so that the partition line arc 153 is electrically connected to the sputtering-formed metal shielding layer 190 to perform an electromagnetic shielding function.

In the present embodiment, the trench 171 is also formed through a laser grooving process, and particularly, the trench 171 is formed together when laser writing is used, thereby simplifying the process and improving the manufacturing efficiency. It should be noted that in this embodiment, the metal shielding layer 190 and the ground wire loop 151 may be electrically connected by an additional routing method, or the routing height of the ground wire loop 151 is higher than the partition wire loop 153, so that the ground wire loop 151 is exposed, thereby ensuring that the metal shielding layer 190 is grounded.

Of course, in this embodiment, the groove 171 is only opened above the partition line arc 153, and the groove for implementing the direction indication on the plastic package body 170 and the ground line arc 151 do not implement conduction. In other preferred embodiments of the present invention, the groove 171 is divided into a plurality of grooves, and exposes the ground wire arcs 151 and the segment wire arcs 153 at the same time, so that the metal shielding layer 190 is electrically connected to the ground wire arcs 151 and the segment wire arcs 153 at the same time, and the specific structure thereof is not limited in detail herein.

In the electromagnetic shielding packaging structure 100 provided by the embodiment, the groove 171 is formed above the partition line arc 153 by using laser, so that the metal shielding layer 190 is electrically contacted with the partition line arc 153, thereby improving the electromagnetic shielding effect of the device, and the groove 171 is formed at the same time when lettering, thereby simplifying the process and improving the preparation efficiency.

Third embodiment

Referring to fig. 5, the present embodiment provides an electromagnetic shielding packaging method, which is suitable for the electromagnetic shielding packaging structure 100 provided in the first embodiment or the second embodiment, and the method includes the following steps:

s1: at least two chips 130 are mounted on the substrate 110.

Specifically, a substrate 110 is provided, an upper surface of the substrate 110 is provided with a ground pad 111 and a partition pad 113, a lower surface is provided with a ground pin 115 electrically connected to the ground pad 111, the substrate 110 has a plurality of chip 130 mounting areas, and the partition pad 113 is located between two adjacent chip 130 mounting areas. The plurality of chips 130 are mounted in the chip 130 mounting region of the substrate 110 in a one-to-one correspondence manner through a surface mounting process, which may be a normal mounting manner or a flip mounting manner, and when the chip 130 is normal mounted, an additional wire bonding is required to achieve electrical connection between the chip 130 and the substrate 110.

S2: a shield loop 150 is formed by wire bonding on the substrate 110.

Specifically, a grounding wire arc 151 is formed by routing on the grounding pad 111 of the substrate 110, and a partitioning wire arc 153 is formed by routing on the partitioning pad 113 of the substrate 110, wherein the grounding wire arc 151 and the partitioning wire arc 153 are both multiple and adopt cage-shaped structures, so that the contact area between the surface of the conductive wire and the metal shielding layer 190 under different equipment and process environments is increased, the gap between the wire arcs is small, the surface tension can enable the multiple wire arcs to be connected into a plane, and the stability and the shielding effect of the structure are further ensured.

S3: a molding body 170 is molded on the substrate 110 to cover the chip 130 and the shield wire loop 150.

Specifically, the plastic package body 170 is formed on the substrate 110 by using a plastic package process, and the plastic package body 170 is wrapped outside the chip 130, the ground wire arc 151 and the partition wire arc 153, thereby playing a role in protecting the chip 130 and the wire arc. The plastic package body 170 is formed by using epoxy resin, and heat conducting particles are added in the plastic package material before molding, so that the heat conducting particles are embedded in the plastic package body 170, wherein the heat conducting particles can be one or more of aluminum oxide particles, copper oxide particles and iron oxide particles, preferably, aluminum oxide powder can be added in the plastic package material, the heat transfer effect of the plastic package body 170 is improved through the tiny aluminum oxide particles, and the heat dissipation performance of the whole body is ensured. Meanwhile, the heat conducting particles are mostly metal conducting particles, so that the electromagnetic shielding effect of the device can be further improved.

S4: the plastic package body 170 is grooved to form a groove 171.

Specifically, shield wire loop 150 is disposed between two adjacent chips 130, and shield wire loop 150 is exposed by groove 171. The upper surface of the plastic package body 170 has a direction mark area and a printing area, the direction mark area is located at the edge of the plastic package body 170, and the printing area is located in the middle of the plastic package body 170. When the electromagnetic shielding package structure 100 provided in the first embodiment is prepared, laser grooving is performed on the direction marking area located at the edge of the plastic-sealed body 170 to form the groove 171 exposing the ground line arc 151; laser engraving is performed on the printing region located in the middle of the plastic package body 170 to form a printing character 173. When preparing the electromagnetic shielding package structure 100 as provided in the second embodiment, a groove 171 is formed by laser grooving the surface of the molding compound 170 so as to expose the partition line arc 153. No matter the electromagnetic shielding package structure 100 provided in the first embodiment or the second embodiment is manufactured, the forming of the groove 171 and the printing are performed together, so that the process is simplified, and the manufacturing efficiency is improved.

In this embodiment, the depth of the groove 171 should be greater than the depth of the print character 173, specifically, the groove 171 and the print character 173 can be formed by slotting on the plastic package 170 with different laser energies, for example, 10W of laser energy can be used to slot in the direction marking area of the plastic package 170, the ground line arc 151 at the bottom is exposed after the groove 171 is formed, and the print character 173 can be formed at the middle position of the plastic package 170 by 2W of laser energy for other print characters 173. Wherein the grooves 171 of the direction indication area play a role of identification reversion prevention and enable the metal shielding layer 190 to be grounded through the grounding wire arc 151, and the lettered characters 173 play a role of identification, such as a device model and the like. The engraving of the printed characters 173 and the direction marks on the plastic package body 170 is achieved through one-time laser printing with different energy, the groove 171 formed at the same time can be used for grounding the metal shielding layer 190, the printed characters and the groove 171 are formed in one-time forming, the process is simplified, and the manufacturing efficiency is greatly improved. And the groove 171 is formed by using the laser lettering process, so that the damage to the lower substrate 110 in the grooving process is avoided, and the manufacturing difficulty is reduced. Of course, the laser energy is merely illustrative and not intended to be limiting.

S5: a metal shielding layer 190 is formed on the surface of the plastic package 170 by sputtering.

Specifically, the metal shielding layer 190 is formed by sputtering metal on the surface (side surface and upper side surface) of the plastic package body 170, and the metal shielding layer 190 covers the inner surface of the groove 171 and is in electrical contact with the shield wire loop 150. When the electromagnetically shielded package structure 100 as provided in the first embodiment is prepared, the metal shielding layer 190 is in electrical contact with the ground wire arcs 151, and when the electromagnetically shielded package structure 100 as provided in the second embodiment is prepared, the metal shielding layer 190 is in electrical contact with the segment wire arcs 153.

The preparation method of the electromagnetic shielding heat dissipation packaging structure provided by the embodiment of the invention comprises the following steps of mounting, routing, plastic packaging, printing, ball mounting, cutting, sputtering and the like during actual packaging operation when the electromagnetic shielding heat dissipation packaging structure provided by the first embodiment is prepared, and specifically comprises the following steps:

step 1, referring to fig. 6, a plurality of chips 130 are mounted on a substrate 110 prepared in advance by a substrate 110 factory, a ground pad 111 and a partition pad 113 are designed on the upper surface of the substrate 110, a ground pin 115 is designed on the lower surface of the substrate 110, and the ground pad 111 and the ground pin 115 are electrically connected through a metal column inside the substrate 110. The mounting process of the chip 130 is a conventional Surface Mount Technology (SMT), wherein the chip 130 may be a front-mounted chip or a flip-chip, and the number of the chips 130 is not limited herein.

Step 2, referring to fig. 7, a routing process is used to route the grounding wire arc 151 on the grounding pad 111, and a routing process is used to route the partitioning wire arc 153 on the partitioning pad 113, so that the grounding wire arc 151 and the partitioning wire arc 153 are both connected to the circuit of the substrate 110.

Step 3, referring to fig. 8, a plastic package process is performed, and the chip 130 and the shielding wire arc 150 are wrapped by a plastic package material added with heat conducting particles, so as to form a plastic package body 170. The molding compound is formed by epoxy-based resin (epoxy-based resin) or silicone-based resin (silicone-based resin), and is added with high thermal conductivity material, such as alumina thermal powder, to realize high thermal conductivity of the molding compound 170.

Step 4, referring to fig. 9, a printing process is performed on the surface of the plastic package body 170, characters are engraved on the surface of the plastic package body 170 by using a laser method, printed characters 173 are formed in a printing area by grooving with 2W of laser energy, grooves 171 are formed in a direction mark area by grooving with 10W of laser energy, and the grooves 171 can be used for direction marks. Through laser printing on the surface of the plastic package body 170, different printing areas are engraved by using different laser energy, one-time laser printing is realized to realize slotting of the direction identification direction area of the plastic package body 170 and engraving of the printing characters 173, and the efficiency is greatly improved.

Step 5, referring to fig. 10, a grounding solder ball 117 is formed by ball-mounting on the grounding pin 115 on the lower surface of the substrate 110, so as to realize the grounding function.

Step 6, referring to fig. 11, cutting is performed to obtain a single product.

Step 7, please continue to refer to fig. 1, a metal sputtering process is performed to form a metal shielding layer 190 on the surface of the plastic package body 170, and the metal shielding layer 190 in the groove 171 on the plastic package body 170 is connected to the grounding wire arc 151 to play a grounding role, thereby forming an electromagnetic shielding effect.

In summary, in the electromagnetic shielding packaging method provided in this embodiment, through the laser lettering process, and by using different laser energies, the grooves 171 and the print characters 173 for the direction marks are formed in the direction mark area of the plastic package body 170 and engraved in the print area. The groove 171 corresponds to the ground line segment 151, the metal shielding layer 190 covers the groove 171, and the ground of the metal shielding layer 190 is achieved by the ground line segment 151 formed by wire bonding on the ground pad 111. Specifically, a groove 171 is formed by grooving the surface of the plastic package body 170 by using laser, the ground line arc 151 at the bottom is exposed, a metal shielding layer 190 is formed after metal sputtering to contact with the ground line arc 151, and a ground end point effect is achieved, namely the groove 171 in the direction identification area has an identification anti-reflection effect and an electromagnetic shielding grounding effect, and the partition line arc 153 has a partition shielding effect. Through the laser grooving process, the direction mark groove and the groove 171 are combined into a whole, so that the direction mark effect is achieved, the metal shielding layer 190 is in electrical contact with the grounding line arc 151, the grounding of the metal shielding layer 190 is achieved, the metal shielding layer and the lettering characters 173 are formed together, the process that the grooving of the plastic package body 170 and the engraving of the lettering characters 173 are achieved through one-time laser lettering is achieved, and the preparation efficiency is greatly improved. Meanwhile, various problems in the prior art are avoided, grinding is not needed, and the process difficulty is reduced.

The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.