Connection terminal unit
阅读说明:本技术 连接端子单元 (Connection terminal unit ) 是由 堀田丰 大须贺慎也 粂康弘 于 2019-01-16 设计创作,主要内容包括:本发明实现一种能够适当地与包含半导体元件的半导体模块的端子连接部连接,并能够更减小与沿着芯片面的方向正交的方向观察时的投影面积的连接端子单元。连接端子单元(1)具备:多个连接端子(25),它们与半导体模块(5)的多个端子连接部(55)对置并连接;和端子模制部(20),其保持这些连接端子(25)。端子模制部(20)具有抵接部(T),抵接部(T)与半导体模块(5)或者支承半导体模块(5)的基材(B)抵接。抵接部(T)具有:纵向抵接部(1a),其从连接端子(25)与端子连接部(55)对置的方向亦即纵向(V)抵接;和侧方抵接部(1b、1c),其从与纵向(V)交叉、并且分别不同的至少两个方向抵接。(The invention provides a connection terminal unit which can be appropriately connected to a terminal connection portion of a semiconductor module including a semiconductor element and can further reduce a projected area when viewed in a direction orthogonal to a direction along a chip surface. A connection terminal unit (1) is provided with: a plurality of connection terminals (25) that face and are connected to a plurality of terminal connection sections (55) of the semiconductor module (5); and a terminal molding part (20) which holds the connection terminals (25). The terminal mold section (20) has an abutting section (T) that abuts against the semiconductor module (5) or a base material (B) that supports the semiconductor module (5). The contact part (T) has: a longitudinal contact portion (1a) that contacts the longitudinal direction (V), which is the direction in which the connection terminal (25) and the terminal connection portion (55) face each other; and lateral contact portions (1b, 1c) that contact from at least two different directions that intersect the longitudinal direction (V).)
1. A connection terminal unit is provided with:
a plurality of connection terminals which are opposed to a plurality of terminal connection portions provided in a semiconductor module including at least one switching element and are connected to the plurality of terminal connection portions, respectively; and
a terminal molding portion that holds a plurality of the connection terminals,
the terminal mold portion has an abutting portion that abuts against the semiconductor module or a base material supporting the semiconductor module,
the abutting portion has:
a longitudinal abutting portion that abuts longitudinally from a direction in which the connection terminal and the terminal connection portion face each other; and
and side contact portions that contact the first and second substrates from at least two different directions intersecting the longitudinal direction.
2. A connection terminal unit according to claim 1,
the terminal mold portion is disposed in a state where at least a part of the semiconductor modules to be connected to the plurality of connection terminals held by the terminal mold portion is overlapped with each other when viewed in a longitudinal direction along the longitudinal direction.
3. A connection terminal unit according to claim 1 or 2,
the connection terminal has a movement restricting portion that restricts movement of the connection terminal in the longitudinal direction inside the terminal molding portion.
4. A connection terminal unit according to claim 3,
the movement restricting portion is an in-mold bent portion bent in a direction intersecting the longitudinal direction.
5. A connection terminal unit according to any one of claims 1 to 4,
the connection terminal has a low rigidity portion having a rigidity lower than other portions of the connection terminal outside the terminal molding portion.
6. A connection terminal unit according to claim 5,
the low rigidity portion is a molded outer curved portion curved in a direction intersecting the longitudinal direction, or a spring-like portion that is curved at least in the longitudinal direction.
7. A connection terminal unit according to claim 5 or 6,
the low rigidity portion is provided between an end portion of the plurality of connection terminals opposite to an end portion of the plurality of connection terminals on a side connected to the terminal connection portion and the terminal mold portion.
8. A connection terminal unit according to claim 5 or 6,
the low rigidity portion is provided between an end portion of one side of the plurality of connection terminals connected to the terminal connection portion and the terminal molding portion.
9. A connection terminal unit according to claim 8,
the semiconductor module and the terminal mold are integrally molded by an element mold,
the low rigidity portion is provided at a position corresponding to an inside of the element molding portion.
10. A connection terminal unit according to any one of claims 1 to 9,
the semiconductor module and the terminal mold are integrally molded by an element mold,
the terminal mold has a concave portion or a convex portion that is concave or convex in a direction intersecting the longitudinal direction at a position corresponding to the inside of the element mold.
11. A connection terminal unit according to any one of claims 1 to 10,
wherein an end portion of the plurality of connection terminals on a side opposite to a side connected to the terminal connection portion penetrates a plurality of terminal connection holes formed in a control board on which a control circuit of the semiconductor module is formed and is connected to the control board,
the terminal mold portion has a positioning portion that engages with the control substrate to perform positioning in a direction along a substrate surface of the control substrate.
12. A connection terminal unit according to claim 11,
the positioning portion is formed in a columnar shape protruding to one side of the control substrate than the plurality of connection terminals in the longitudinal direction, and is engaged with a hole portion formed in the control substrate.
13. A connection terminal unit according to claim 12,
the positioning portion has two columnar portions having different protruding lengths toward one side of the control substrate.
Technical Field
The present invention relates to a connection terminal unit including a plurality of connection terminals connected to a plurality of terminal connection portions provided in a semiconductor module.
Background
For example, a plurality of terminal connection portions of a Semiconductor module including a power Semiconductor element, such as an IGBT (Insulated Gate Bipolar Transistor) or a power MOSFET (Metal Oxide Semiconductor Field Effect Transistor), are connected to a control circuit or the like via a connection terminal unit having a plurality of connection terminals. Japanese patent application laid-open publication No. 2011-253942 discloses, as an example of such a connection terminal unit, a configuration including a plurality of signal terminals (5) and a terminal block (4) in which the signal terminals (5) are integrally resin-molded (fig. 1, [0014] - [0016], and the like). In the description of the background art, the reference numerals in parentheses are those of the reference documents to be referred to. One end sides of the signal terminals (5) are electrically connected to electrodes of the semiconductor element (3) or a bus bar (8) connected to the semiconductor element (3) through bonding wires (6). The other end side of the signal terminal (5) is electrically connected to an external motor device or the like. Specifically, the semiconductor element (3) is electrically connected to an external motor device or the like via a terminal block (4) provided with a signal terminal (5).
In this way, when the signal terminal (5) and the semiconductor element (3) are connected by using the bonding wire (6), the tolerance of the relative position of the signal terminal (5) and the semiconductor element (3) can be increased, and the signal terminal (5) and the semiconductor element (3) can be appropriately connected. However, since a space for wiring the bonding wire (6) is required, the area (projected area) of the terminal block (4), the connection terminal (5), and the semiconductor element (3) as viewed in a direction orthogonal to the direction along the chip surface of the semiconductor element (3) tends to be large. This hinders the miniaturization of a semiconductor module provided with the semiconductor element (3), and improvement is demanded.
Patent document 1: japanese patent laid-open publication No. 2011-253942.
Disclosure of Invention
In view of the above background, it is desirable to realize a connection terminal unit that can be appropriately connected to a terminal connection portion of a semiconductor module including a semiconductor element and can further reduce a projected area when viewed in a direction orthogonal to a direction along a chip surface.
In view of the above, the connection terminal unit includes:
a plurality of connection terminals which are opposed to a plurality of terminal connection portions provided in a semiconductor module including at least one switching element and are connected to the plurality of terminal connection portions, respectively; and
a terminal molding part for holding a plurality of the connection terminals,
the terminal mold portion has an abutting portion which abuts against the semiconductor module or a base material supporting the semiconductor module,
the contact portion includes:
a vertical contact portion that contacts the connection terminal in a vertical direction, which is a direction in which the connection terminal and the terminal connection portion face each other; and
and side contact portions which contact the respective portions from at least two different directions intersecting the longitudinal direction.
According to this configuration, since the plurality of connection terminals are opposed to the respective terminal connection portions, and the connection terminals are connected to the terminal connection portions, a space for wiring a bonding wire or the like is not required. Here, in order to appropriately face each connection terminal and each terminal connection portion, it is preferable that the relative positions of the connection terminal unit and the semiconductor module be accurately aligned. According to this configuration, the relative position in the vertical direction is defined by the vertical contact portion, and the relative positions in the two directions intersecting the vertical direction are defined by the lateral contact portions. That is, since the relative positions of the connection terminal unit and the semiconductor module are defined from three directions, the positions of the connection terminals and the terminal connection portions can be accurately aligned, and the connection terminals and the terminal connection portions can be appropriately opposed to each other. That is, according to the connection terminal unit of the present configuration, it is possible to appropriately connect to the terminal connection portion of the semiconductor module including the semiconductor element, and it is possible to further reduce the projected area when viewed in the direction orthogonal to the direction along the chip surface.
Further features and advantages of the connection terminal unit will become clear from the following description with respect to the embodiments explained with reference to the drawings.
Drawings
Fig. 1 is a schematic circuit block diagram of a rotary electric machine driving device.
Fig. 2 is an exploded perspective view of the inverter unit including the connection terminal unit.
Fig. 3 is a perspective view of the inverter unit before molding.
Fig. 4 is a perspective view of the inverter unit after molding.
Fig. 5 is a sectional view of the inverter unit and the control board before molding.
Fig. 6 is a sectional view of the inverter unit and the control board after molding.
Fig. 7 is a plan view of the inverter unit before molding.
Fig. 8 is an enlarged cross-sectional view of another configuration example of the inverter unit and the control board after molding.
Fig. 9 is an enlarged cross-sectional view of still another configuration example of the inverter unit and the control board after molding.
Fig. 10 is an enlarged cross-sectional view of another configuration example of the inverter unit and the control board after molding.
Fig. 11 is an enlarged view showing another example (molded-in outer bend portion) of the low rigidity portion on the first end portion side.
Fig. 12 is an enlarged view showing still another example (coil spring portion) of the low rigidity portion on the first end portion side.
Detailed Description
Hereinafter, an embodiment of the connection terminal unit will be described with reference to the drawings, taking as an example a mode of connection to a semiconductor module constituting an inverter for drive-controlling a rotating electrical machine. Fig. 1 shows a schematic circuit block diagram of a rotary electric machine drive device 100 including an
The
In the present embodiment, the switching element 13 and the flywheel diode 15 are integrated into one semiconductor chip, and are configured as one
In the present embodiment, the
As described above, each switching element 13 is configured as the
The inverter control device 8 performs current feedback control by a vector control method, for example, based on a target torque of the rotating electric machine 6 supplied from a higher-level vehicle control device (VHL-CTRL) 9. The actual current flowing through the stator coil of each phase of the rotating electric machine 6 is detected by an ac current sensor 61, and the magnetic pole position of the rotor of the rotating electric machine 6 at each time point is detected by a rotation sensor 62 such as a resolver. The inverter control device 8 performs current feedback control using the detection results of the alternating current sensor 61 and the rotation sensor 62, and generates a control signal for individually performing switching control of each switching element 13. The generated control signal is supplied to each switching element 13 as a switching control signal SW via a drive circuit 7 that amplifies a voltage or a current to improve the driving capability.
As shown in fig. 2 to 4, the
The
As shown in fig. 4, the
As shown in fig. 2, the upper-layer side semiconductor modules 11 and the lower-layer side semiconductor modules 12 of the respective phases are arranged in the first lateral direction H1 for each U, V, W phase. For example, the U-phase upper layer side semiconductor module 11U and the U-phase lower layer side semiconductor module 12U are arranged in the first lateral direction H1 (the same applies to the V-phase and W-phase). The three upper-layer side semiconductor modules 11 and the three lower-layer side semiconductor modules 12 are arranged in a second lateral direction H2 that intersects the first lateral direction H1. The three upper-layer-side semiconductor modules 11 are arranged on the same plane, and the three lower-layer-side semiconductor modules 12 are also arranged on the same plane.
That is, the three upper-layer-side semiconductor modules 11 corresponding to the three phases are arranged in the second lateral direction H2 on the same plane, and the three lower-layer-side semiconductor modules 12 corresponding to the three phases are arranged in the second lateral direction H2 on the same plane in parallel with the arrangement direction. Further, in the present embodiment, the upper layer side semiconductor module 11 and the lower layer side semiconductor module 12 of each phase are arranged on the same plane.
In this manner, all (six in this example) of the
The positive
The plurality of output bus bars (51, 52, 53) are in contact with the upper surface (emitter terminal 5E) of the upper-layer-side semiconductor module 11 of the corresponding phase, and are arranged along the first lateral direction H1 in an electrically connected state with them. The output bus bars (51, 52, 53) are arranged parallel to each other along the first lateral direction H1. In the present embodiment, the output bus bars (51, 52, 53) are arranged so as to be orthogonal to the positive
The lower-stage semiconductor modules 12(12u, 12v, 12w) corresponding to the three phases are arranged on the upper surfaces of the bent and extended output bus bars (51, 52, 53). Each of the output bus bars (51, 52, 53) is in contact with and electrically connected to the lower surface (collector terminal 5C) of the lower semiconductor module 12 of the corresponding phase. That is, the emitter terminal 5E of the upper semiconductor module 11 and the collector terminal 5C of the lower semiconductor module 12 are electrically connected via the output bus bars (51, 52, 53). Each of the output bus bars (51, 52, 53) functions as a base material B that supports the lower-layer-side semiconductor module 12 (semiconductor module 5). Further, when the upper and lower sides are reversed in the vertical direction V, the upper-layer-side semiconductor module 11 is disposed on the output bus bars (51, 52, 53), and therefore the output bus bars (51, 52, 53) can also function as the base material B that supports the upper-layer-side semiconductor module 11 (semiconductor module 5).
The upper surfaces of the output bus bars (51, 52, 53) at the positions where the lower-layer-side semiconductor module 12 is arranged are on the same plane as the upper surface of the positive-
The negative
As described above, the positive
The plurality of
As shown in fig. 2 and 5 to 7, the
When the
When the
As such, by the
As shown in fig. 2 to 7, the
By connecting the six
As described above, fig. 6 shows a cross-sectional view of the
In the present embodiment, as shown in fig. 5, 6, and the like, the
In the
In the present embodiment, the positioning
However, the
Fig. 8 illustrates a mode in which the
In the above description, the
However, in the embodiment described above with reference to fig. 8 and 9, the
Fig. 10 illustrates a mode in which the
In fig. 10, a spring-shaped portion (annular spring portion 78) is exemplified as the
As described above, by using the
[ other embodiments ]
Other embodiments will be described below. Note that the configurations of the embodiments described below are not limited to being applied individually, and may be applied in combination with the configurations of other embodiments as long as no contradiction occurs.
(1) In the above description, the
(2) In the above description, the first lateral abutment portion 1B and the second lateral abutment portion 1c are exemplified as the lateral abutment portions that abut on the base material B from at least two different directions that intersect with the longitudinal direction V. Further, the first side abutting portion 1B and the second side abutting portion 1c are illustrated as abutting against the base material B from a direction orthogonal to each other and also orthogonal to the longitudinal direction V. However, the first side abutting portion 1B and the second side abutting portion 1c may abut on the base material B from directions not orthogonal to each other if they are directions intersecting each other. Further, if the first side abutting portion 1B and the second side abutting portion 1c are in a direction intersecting the longitudinal direction V, they may abut on the base material B from a direction not orthogonal to the longitudinal direction V. In addition, the number of the side contact portions may be one. For example, the side contact portion may be configured using a positioning pin or the like that contacts two different surfaces at the same time. When the side contact portion is formed by a positioning pin or the like, the direction of contact may not be uniquely determined, but the side contact portion may be formed so as to intersect the longitudinal direction V and come into contact with at least two directions.
(3) In the above description, the case where five
(4) In the above, the mode in which two
(5) In the above, the
[ brief description of the embodiments ]
The outline of the
In one aspect, a connection terminal unit (1) includes: a plurality of connection terminals (25) that face a plurality of terminal connection sections (55) provided on a semiconductor module (5) that includes at least one switching element (13) and are connected to the plurality of terminal connection sections (55), respectively; and a terminal mold part (20) that holds the plurality of connection terminals (25), wherein the terminal mold part (20) has an abutting part (T) that abuts against the semiconductor module (5) or a base material (B) that supports the semiconductor module (5), and wherein the abutting part (T) has: a vertical contact portion (1a) that contacts the connection terminal (25) in a vertical direction (V) that is a direction in which the connection terminal faces the terminal connection portion (55); and lateral contact portions (1b, 1c) that contact the longitudinal direction (V) from at least two different directions intersecting the longitudinal direction (V).
According to this configuration, since the plurality of connection terminals (25) face the respective terminal connection portions (55), the connection terminals (25) are connected to the terminal connection portions (55), and therefore, a space for wiring a bonding wire or the like is not required. In order to appropriately face the connection terminals (25) and the terminal connection sections (55), it is preferable that the relative positions of the connection terminal unit (1) and the semiconductor module (5) be accurately aligned. According to the structure, the relative position in the vertical direction (V) is defined by the vertical contact part (1a), and the relative positions in two directions intersecting the vertical direction (V) are defined by the lateral contact parts (1b, 1 c). That is, since the relative positions of the connection terminal unit (1) and the semiconductor module (5) are defined from three directions, the positions of the connection terminals (25) and the terminal connection sections (55) can be accurately aligned, and the connection terminals (25) and the terminal connection sections (55) can be appropriately opposed to each other. That is, according to the connection terminal unit (1) of the present configuration, it is possible to appropriately connect to the terminal connection portion (55) of the semiconductor module (5) including the semiconductor element (13), and it is possible to further reduce the projected area when viewed in the direction orthogonal to the direction along the chip surface.
Here, the terminal mold part (20) is preferably arranged in a state in which at least a part of the semiconductor modules (5) to be connected to the plurality of connection terminals (25) held by the terminal mold part (20) overlaps with each other when viewed in a longitudinal direction along the longitudinal direction (V).
According to this configuration, since the terminal mold portion (20) overlaps the semiconductor module (5) when viewed in the longitudinal direction (V), the projected area when viewed in a direction orthogonal to the direction along the chip surface of the semiconductor module (5) can be further reduced.
Here, the connection terminal (25) preferably has a movement restricting portion (60) for restricting movement of the connection terminal (25) in the longitudinal direction (V) inside the terminal molding portion (20).
The movement restricting section (60) is provided inside the terminal mold section (20), so that the connection terminal (25) is not easily detached from the terminal mold section (20). As a result, the reliability of the connection terminal unit (1) is improved.
Preferably, the movement restricting portion (60) is an in-mold bent portion (27) bent in a direction intersecting the longitudinal direction (V) inside the terminal mold portion (20).
The terminal mold part (20) is provided with an in-mold bent part (27) inside, so that the connecting terminal (25) is not easy to fall off from the terminal mold part (20). Therefore, the in-mold bent portion (27) is a preferable mode as the movement restricting portion (60).
The connecting terminal (25) preferably has a low rigidity portion (70) outside the terminal molding portion (20) and having a rigidity lower than that of the other portions of the connecting terminal (25).
The connection terminal (25) is connected to a terminal connection section (55) of the semiconductor module (5) at one end section (25a), and is connected to another component at the other end section (25 b). Among other members connected to the other end portion (25b), there are some cases where the shape of the member is changed or varied due to the influence of warpage, flexure, or the like, such as a circuit board. In addition, there are cases where the semiconductor module (5) is warped, and where the variation in the coating thickness of the conductive bonding material is large (there are cases where the state of the connection destination varies). If the connecting terminal (25) has the low-rigidity portion (70) outside the terminal molding portion (20), even when variations or changes occur in the shapes and states of the components to be connected to the connecting terminal (25), the variations or changes in the shapes and states can be absorbed by the low-rigidity portion (70). As a result, the influence of external force generated by the shape and state of the members to be connected on the terminal molding part (20) and the terminal connecting part (55) of the semiconductor module (5) can be reduced.
Preferably, the low rigidity portion (70) is an outer mold curved portion (28) curved in a direction intersecting the longitudinal direction (V), or a spring-like portion (78, 79) that is bent at least in the longitudinal direction (V).
The molded outer curved portion (28) is a shape capable of absorbing a change or variation in shape even when the shape of a member to be connected is varied or changed. Therefore, the molded-in outer curved portion (28) is preferably of a configuration of a low rigidity portion (70). In addition, when the shape of the member to be connected varies or changes, the spring-shaped portions (78, 79) are also shaped so as to be able to absorb the variation or variation in shape by the elastic force. Therefore, the spring-like portions (78, 79) are also preferably configured as low-rigidity portions (70).
Here, the low rigidity portion (70) is preferably provided between an end portion (25b) of the plurality of connection terminals (25) opposite to an end portion (25a) on the side connected to the terminal connection portion (55) and the terminal mold portion (20).
As described above, the end portion (25b) opposite to the end portion (25a) connected to the terminal connection portion (55) may be connected to a component, such as a circuit board, whose shape is changed or varied by the influence of warpage or deflection. If the low rigidity portion (70) is provided at the above-mentioned portion, even if the shape of the circuit board or the like changes or varies, the change or variation can be absorbed in the low rigidity portion (70).
Alternatively, the low rigidity portion (70) is preferably provided between an end portion (25a) of the plurality of connection terminals (25) on the side connected to the terminal connection portion (55) and the terminal mold portion (20).
If the low-rigidity portion (70) is provided at this location, even when the semiconductor module (5) is warped or when the variation in the coating thickness of the conductive bonding material is large, such changes and variations in shape and state can be absorbed by the low-rigidity portion (70). Therefore, the connection of the connection terminal (25) to the semiconductor module (5) is improved, and the reliability is improved.
When the semiconductor module (5) and the terminal mold (20) are integrally molded by an element mold (40), and the low rigidity portion (70) is provided between an end (25a) of the plurality of connection terminals (25) on the side connected to the terminal connection portion (55) and the terminal mold (20), the low rigidity portion (70) is preferably provided at a position corresponding to the inside of the element mold (40).
According to the structure, when the connection terminal (25) is connected with the semiconductor module (5), the elastic force of the low rigidity part (70) can be used for properly absorbing the change and the deviation of the shape and the state of one side of the semiconductor module (5). After the connection terminal (25) is connected to the semiconductor module (5), the low-rigidity portion (70) is molded inside the element molding portion (40) so that the elastic force thereof is eliminated. Therefore, stress applied to a connection portion (terminal connection portion (55)) between the semiconductor module (5) and the connection terminal (25) due to vibration or the like in a use environment is also reduced. Therefore, the service life of the device provided with the semiconductor module (5) and the connection terminal (25) can be expected to be prolonged.
Preferably, the semiconductor module (5) and the terminal mold part (20) are integrally molded by an element mold part (40), and the terminal mold part (20) has a concave part (29) or a convex part (30) that is concave in a direction intersecting the longitudinal direction (V) at a position corresponding to the inside of the element mold part (40).
By providing the terminal molding part (20) with such a recessed part (29) or a raised part (30), the possibility of the connection terminal unit (1) falling off from the element molding part (40) in the longitudinal direction (V) can be reduced.
Preferably, an end portion (25b) of the plurality of connection terminals (25) opposite to the side connected to the terminal connection portion (55) penetrates a plurality of terminal connection holes (85) formed in a control board (80) on which a control circuit (8) of the semiconductor module (5) is formed and is connected to the control board (80), and the terminal mold portion (20) has a positioning portion (23) that engages with the control board (80) to perform positioning in a direction along a board surface of the control board (80).
In order to appropriately pass the plurality of connection terminals (25) through the plurality of terminal connection holes (85) formed in the control board (80), it is preferable that the relative positions of the control board (80) and the connection terminal unit (1) be accurately aligned. According to the structure, the positioning part (23) formed on the terminal molding part (20) is engaged with the control substrate (80), so that the control substrate (80) and the connection terminal unit (1) can be aligned with high precision. As a result, the plurality of connection terminals (25) can be easily and appropriately inserted into the plurality of terminal connection holes (85).
As described above, when the terminal mold portion (20) has the positioning portion (23) that engages with the control board (80) to perform positioning in the direction along the board surface of the control board (80), the positioning portion (23) is preferably formed in a columnar shape that protrudes toward one side of the control board (80) along the longitudinal direction (V) than the plurality of connection terminals (25), and engages with the hole portions (81, 82) formed in the control board (80).
According to the structure, the columnar positioning part (23) protruding to one side of the control substrate (80) is engaged with the control substrate (80) before the connection terminal (25), so when the connection terminal (25) penetrates through the terminal connection hole (85) of the control substrate (80), the control substrate (80) and the connection terminal unit (1) are properly aligned. Therefore, the plurality of connection terminals (25) can easily and appropriately penetrate through the plurality of terminal connection holes (85) formed in the control board (80).
When the positioning part (23) is formed in a columnar shape, the positioning part (23) preferably has two columnar parts (21, 22) having different protruding lengths to one side of the control board (80).
When the two columnar positioning portions (23) are simultaneously engaged with the control board, the control board (80) and the connection terminal unit (1) are required to be accurately aligned. However, when two columnar portions having different projection lengths to one side of the control board (80) are provided, one columnar portion (21) having a longer projection length can be engaged with the control board (80) first. Therefore, the control board (80) and the connection terminal unit (1) can be easily aligned, as compared with a case where two columnar positioning portions (23) are simultaneously engaged with the control board (80). In addition, in a state where one columnar positioning portion (21) is engaged with the control substrate (80), the other columnar positioning portion (22) may be engaged with the control substrate (80), and therefore, the positioning at this time is also facilitated.
Thus, according to the structure, the control substrate (80) and the connection terminal unit (1) can be simply and accurately aligned, and the plurality of connection terminals (25) can easily and properly penetrate through the plurality of terminal connection holes (85) formed in the control substrate (80).
Description of the reference numerals
1 … connecting a terminal unit; 1a … longitudinal abutment; 1b … first side contact portion (side contact portion); 1c … second side contact portion (side contact portion); 2N … negative bus bar (substrate); 2P … positive bus bar (substrate); 5 … a semiconductor module; 7 … drive circuit; 8 … inverter control device (control circuit of semiconductor module); 11 … upper layer side semiconductor module (semiconductor module); 12 … a lower layer side semiconductor module (semiconductor module); 13 … switching element; 20 … terminal molding; 21 … a first columnar positioning portion (two columnar portions having different projection lengths); 22 … second columnar positioning portion (two columnar portions different in projection length); 23 … a locating portion; 25 … connection terminal; 25a … first end (end on the side connected to the terminal connecting portion); 25b … second end portion (end portion on the opposite side to the side connected to the terminal connecting portion); 27 … molding an inner bend (movement restricting portion); 28 … molding the outer bend (low stiffness portion); 29 … recess; 30 … protrusions; 40 … element molding; 51 … first output bus bar (substrate); 52 … second output bus bar (substrate); 53 … third output bus bar (substrate); a 55 … terminal connection; 60 … a movement restricting portion; 67 … bulge (movement restriction); 70 … low stiffness portion; 78 … annular spring portion (spring-like portion); 79 … helical spring portion (spring-like portion); 80 … control substrate; 81 … first engaging hole (hole formed in control board); 82 … second engaging hole (hole formed in the control board); 85 … terminal connection hole; a B … substrate; h1 … first transverse direction (direction crossing the longitudinal direction); h2 … second cross direction (direction crossing the machine direction); a T … abutment; v … longitudinal.
- 上一篇:一种医用注射器针头装配设备
- 下一篇:利用电网/接地网结构上的管芯上槽线的隔离增强