阅读说明：本技术 电子模块 (Electronic module ) 是由 池田康亮 于 2018-01-17 设计创作，主要内容包括：本发明的电子模块,包括：第一基板11；第二基板21,设置在所述第一基板11的一侧；以及芯片模块100,设置在所述第一基板11与所述第二基板21之间,其中,所述芯片模块100具有：电子元件13、23、以及与所述电子元件13、23电气连接的连接体60、70、80,所述电子元件13、23沿所述电子模块的厚度方向延伸。(The electronic module of the present invention comprises: a first substrate 11; a second substrate 21 disposed at one side of the first substrate 11; and a chip module 100 disposed between the first substrate 11 and the second substrate 21, wherein the chip module 100 includes: electronic components 13, 23, and connectors 60, 70, 80 electrically connected to the electronic components 13, 23, the electronic components 13, 23 extending in a thickness direction of the electronic module.)

1. An electronic module, comprising:

a first substrate;

a second substrate disposed at one side of the first substrate; and

a chip module disposed between the first substrate and the second substrate,

wherein the chip module has: an electronic component and a connector electrically connected to the electronic component,

the electronic component extends in a first direction that is a thickness direction of the electronic module.

2. The electronic module of claim 1, wherein:

wherein the chip module has: the electronic device comprises a first electronic element and a second electronic element connected with the first electronic element through a connecting body.

3. The electronic module of claim 1, wherein:

wherein the linker has: a first connecting body and a second connecting body,

the chip module has: the electronic device includes a first electronic element, a second electronic element, a first connector disposed between the first electronic element and the second electronic element, and a second connector disposed on an opposite side of the second electronic element from the first connector.

4. The electronic module of claim 1, wherein:

wherein the linker has: a head portion and a pillar portion extending from the head portion in a thickness direction of the head portion,

the head portion extends in a thickness direction of the electronic module.

5. The electronic module of claim 1, wherein:

wherein the chip module is provided in plurality,

and a chip connecting body electrically connected with the chip modules is arranged between the chip modules.

6. The electronic module of claim 5, wherein:

wherein the chip module has an engaging portion engaged with the chip connecting body.

7. The electronic module of claim 1, further comprising:

a first conductor layer disposed on one side of the first substrate; and

a second conductor layer disposed on the other side of the second substrate,

wherein the connecting body has connecting terminals each connecting the electronic component with the first conductor layer and the second conductor layer,

one of the first conductor layer and the second conductor layer connected to the connection terminal is not electrically connected to an external device.

8. The electronic module of claim 1, further comprising:

a first conductor layer disposed on one side of the first substrate; and

a second conductor layer disposed on the other side of the second substrate,

wherein the linker has: a head portion, a first base end portion extending from an end portion of the head portion in an in-plane direction of the first substrate and connected to the first conductor layer, and a second base end portion extending from an end portion of the head portion in the in-plane direction of the second substrate and connected to the second conductor layer,

the direction in which the first base end portion extends from the end portion of the head portion and the direction in which the second base end portion extends from the end portion of the terminal head portion do not overlap in an in-plane direction of the electronic module including the second direction and the third direction.

9. The electronic module of claim 8, wherein:

wherein a direction in which the first base end portion extends from an end of the head portion differs by 180 degrees from a direction in which the second base end portion extends from an end of the terminal head portion.

Technical Field

The present invention relates to an electronic module having a substrate and an electronic element.

Background

Conventionally, electronic modules in which a plurality of electronic components are arranged in a sealing resin have been widely known. Such electronic modules are required to be miniaturized.

As one of means for achieving miniaturization, a structure in which electronic components are stacked may be employed. Such a structure is disclosed in international publication No. 2016/067383. However, in the international publication 2016/067383, only the semiconductor elements included in the electronic elements are provided on two substrates facing each other, that is: only a stacked (Stack) structure in which semiconductor elements are stacked in the thickness direction is disclosed.

Further, international publication 2016/067383 discloses another semiconductor module including: a first member having: the power module comprises a first insulating substrate, a first conductor layer arranged on the configuration surface of the first insulating substrate, a first power component arranged on the first conductor layer, and a first connecting part connected with the first power component; a second member having: the second insulating substrate, a second conductor layer arranged on the configuration surface of the second insulating substrate, a second power component arranged on the second conductor layer, and a second connecting part connected with the second power component; and a conductor post extending in the vertical direction between the first member and the second member. In this embodiment, the first power component and the second power component are connected by the conductor post, as well as being disposed opposite to each other. That is, the above-described structure also discloses only a stacked structure in which power components are stacked in the thickness direction of the semiconductor module.

The invention provides an electronic module which mounts electronic components in a manner different from the conventional manner to improve the degree of freedom in design.

Disclosure of Invention

[ PROCEDURE 1 ]

The invention relates to an electronic module comprising:

a first substrate;

a second substrate disposed at one side of the first substrate; and

a chip module disposed between the first substrate and the second substrate,

wherein the chip module has: an electronic component and a connector electrically connected to the electronic component,

the electronic component extends in a first direction that is a thickness direction of the electronic module.

[ PROCEDURE 2 ]

In the electronic module described in the above [ concept 1 ],

the chip module has: the electronic device comprises a first electronic element and a second electronic element connected with the first electronic element through a connecting body.

[ PROCEDURE 3 ]

In the electronic module described in the above [ concept 1 ] or [ concept 2 ],

the connecting body is provided with a first connecting body and a second connecting body,

the chip module has: the electronic device includes a first electronic element, a second electronic element, a first connector disposed between the first electronic element and the second electronic element, and a second connector disposed on an opposite side of the second electronic element from the first connector.

[ concept 4 ]

In the electronic module according to any one of the above [ concept 1 ] to [ concept 3 ],

the connecting body has: a head portion and a pillar portion extending from the head portion in a thickness direction of the head portion,

the head portion extends in a thickness direction of the electronic module.

[ PROCEDURE 5 ]

In the electronic module according to any one of the above [ concept 1 ] to [ concept 4 ],

the chip module is provided in a plurality of numbers,

and a chip connecting body electrically connected with the chip modules is arranged between the chip modules.

[ concept 6 ]

In the electronic module as recited in any one of the above [ concept 5 ],

the chip module has an engaging portion that engages with the chip connecting body.

[ PROCEDURE 7 ]

In the electronic module according to any one of the above [ concept 1 ] to [ concept 6 ], further comprising:

a first conductor layer disposed on one side of the first substrate; and

a second conductor layer disposed on the other side of the second substrate,

wherein the connecting body has connecting terminals each connecting the electronic component with the first conductor layer and the second conductor layer,

one of the first conductor layer and the second conductor layer connected to the connection terminal is not electrically connected to an external device.

[ concept 8 ]

In the electronic module according to any one of the above [ concept 1 ] to [ concept 7 ], the electronic module further includes:

a first conductor layer disposed on one side of the first substrate; and

a second conductor layer disposed on the other side of the second substrate,

wherein the linker has: a head portion, a first base end portion extending from an end portion of the head portion in an in-plane direction of the first substrate and connected to the first conductor layer, and a second base end portion extending from an end portion of the head portion in the in-plane direction of the second substrate and connected to the second conductor layer,

the direction in which the first base end portion extends from the end portion of the head portion and the direction in which the second base end portion extends from the end portion of the terminal head portion do not overlap in an in-plane direction of the electronic module including the second direction and the third direction.

[ concept 9 ]

In the electronic module described in the above [ concept 8 ],

the direction in which the first base end portion extends from the end portion of the head portion differs from the direction in which the second base end portion extends from the end portion of the terminal head portion by 180 degrees.

Effects of the invention

In the present invention, when the electronic component provided on the connecting body is extended in the direction from the first substrate to the second substrate, the electronic component can be arranged in a direction different from the forward direction, which can improve the degree of freedom in design compared to the arrangement proposed in the related art.

Drawings

Fig. 1 is a side sectional view of an electronic module that may be used in a first embodiment of the invention.

Fig. 2 is a side view of the second connecting body as viewed from an arrow a in fig. 1.

FIG. 3 is a side view of a second connector constructed in a different manner from that shown in FIG. 2.

Fig. 4 is a side cross-sectional view of an electronic module that may be used in a second embodiment of the invention.

Fig. 5 is a plan view of an electronic module that may be used in a second embodiment of the invention.

Fig. 6 is a side sectional view of an electronic module that is configured in a manner different from that shown in fig. 4 and that can be used in a second embodiment of the present invention.

Fig. 7 is a side sectional view of an electronic module that can be used in a third embodiment of the invention, with some of the components such as the enclosure not shown.

Fig. 8 is a side sectional view of an electronic module that can be used in a fourth embodiment of the invention, with some of the components such as the enclosure not shown.

Fig. 9 is a side sectional view of an electronic module which is different from the electronic module shown in fig. 8 and which can be used in a fourth embodiment of the present invention, and some members such as a sealing portion are not shown.

Fig. 10 is a side sectional view of an electronic module that can be used in a fifth embodiment of the invention, with some of the components such as the enclosure not shown.

Fig. 11 is a side sectional view of an electronic module which is different from the electronic module shown in fig. 10 and which can be used in a fifth embodiment of the present invention, and some members such as a sealing portion are not shown.

Fig. 12 is a side sectional view of an electronic module which is different from the electronic module shown in fig. 10 and 11 and which can be used in a fifth embodiment of the present invention, and some members such as a sealing portion are not shown in the drawing.

Fig. 13 is a side cross-sectional view of an electronic module that may be used in a sixth embodiment of the invention.

Detailed Description

First embodiment

Composition (composition)

In the present embodiment, "one side" refers to the upper side in fig. 1, and "the other side" refers to the lower side in fig. 1. In fig. 1, the vertical direction is referred to as a "first direction", the horizontal direction is referred to as a "second direction", and the front-back direction of the sheet is referred to as a "third direction". The in-plane direction including the second direction and the third direction is referred to as an "in-plane direction", and the upward view in fig. 1 is referred to as a "planar view".

As shown in fig. 1, the electronic module has: a first substrate 11, a second substrate 21 disposed on one side of the first substrate 11, and a chip module 100 disposed between the first substrate 11 and the second substrate 21. The chip module 100 includes: electronic components 13 and 23, and connectors 60, 70, and 80 electrically connected to the electronic components 13 and 23. The electronic components 13, 23 may extend in the thickness direction of the electronic module, i.e. in the first direction. The term "extending in the thickness direction" (that is, the "first direction") of the electronic module means not only extending in the normal direction (the first direction) of the first substrate 11 but also extending obliquely to the normal direction of the first substrate 11. The electronic components 13 and 23 are, for example, substantially rectangular solids having a small thickness. The direction in which the electronic components 13, 23 extend is perpendicular to the thickness direction (the direction from the front surface to the back surface of the electronic components 13, 23 and the direction from the back surface to the front surface of the electronic components 13, 23).

The chip module 100 may have: a first electronic component 13, and a second electronic component 23 connected to the first electronic component 13 via connectors 60, 70, 80. The chip module 100 in this embodiment may be assembled in advance before the electronic module is manufactured. In the case of this embodiment, the chip module 100 can be appropriately mounted during assembly, and therefore, the manufacturing efficiency can be improved.

The connecting body 60, 70, 80 may have a first connecting body 60 and a second connecting body 70. In this case, the chip module 100 may have: the electronic component includes a first electronic component 13, a second electronic component 23, a first connector 60 disposed between the first electronic component 13 and the second electronic component 23, and a second connector 70 disposed on an opposite side of the second electronic component 23 from the first connector 60.

The connecting body 60, 70, 80 may further include: the head portions 61, 71, and the column portions 62, 72 extending from the head portions 61, 71 in the thickness direction of the head portions 61, 71. The heads 61, 71 may also extend in the thickness direction of the electronic module. In the embodiment shown in fig. 1, the thickness direction of the heads 61 and 71 is the second direction. In the embodiment in which the connectors 60, 70, 80 have the first connector 60 and the second connector 70, the first connector 60 may have: the head includes a first head 61 and a first pillar 62 extending from the first head 61 in a thickness direction of the first head 61. The second connecting body 70 may have: the second head portion 71, and a second column portion 72 extending from the second head portion 71 in the thickness direction of the second head portion 71.

One side of the first substrate 11 may be provided with a plurality of first conductor layers 12. The second substrate 21 may be provided with a plurality of second conductor layers 22 on the other side. Both or only one of the first electronic device 13 and the second electronic device 23 may be a switch device or a control device. As the switching element, MOSFET, IGBT, or the like can be used. The first electronic element 13 and the second electronic element 23 may each be formed of a semiconductor element, and the material of the semiconductor element may be silicon, silicon carbide, gallium nitride, or the like.

A conductive adhesive 95 is disposed between the first electronic component 13 and the first connector 60, and the first electronic component 13 and the first connector 60 can be connected by the conductive adhesive 95. Similarly, a conductive adhesive 95 is disposed between the first connector 60 and the second electronic component 23, and the first connector 60 and the second electronic component 23 can be connected by the conductive adhesive 95. Similarly, a conductive adhesive 95 is disposed between the second electronic component 23 and the second interconnector 70, and the second electronic component 23 and the second interconnector 70 can be connected by the conductive adhesive 95.

The other side of the first substrate 11 is provided with a first heat dissipation layer 19 made of metal such as copper. Similarly, a second heat dissipation layer 29 made of metal such as copper is provided on one side of the second substrate 21.

As the first substrate 11 and the second substrate 21, a ceramic substrate, an insulating resin layer, or the like can be used. As the conductive adhesive 95, a material containing Ag and Cu as main components may be used in addition to the solder. As a material of the first and second connectors 60 and 70, a metal material such as Cu can be used. As the substrates 11 and 21, for example, metal substrates subjected to circuit patterning may be used, and in this case, the substrates 11 and 21 may also serve as the conductor layers 12 and 22.

As described above, the electronic module may have the sealing portion 90 made of a sealing resin or the like for sealing the first electronic component 13, the second electronic component 23, the first connector 60, the second connector 70, the first conductor layer 22, and the like.

When the first electronic element 13 is a switching element such as a MOSFET, the first gate electrode 13g and the first source electrode 13s may be disposed on the surface on the first interconnector 60 side (the right surface in fig. 1). Similarly, when the second electronic element 23 is a switching element such as a MOSFET, the second gate electrode 23g and the second source electrode 23s may be disposed on the surface on the second connector 70 side (the right surface in fig. 1). In this case, the second connector 70 can be connected to the second source electrode 23s of the second electronic component 23 by the conductive adhesive 95. The first connector 60 can connect the first source electrode 13s of the first electronic element 13 to the second drain electrode 23d provided on the surface (left surface in fig. 1) of the second electronic element 23 opposite to the second connector 70, via the conductive adhesive 95. A first drain electrode 13d may be provided on a surface (left surface in fig. 1) of the first electronic element 13 opposite to the first connector 60. The first gate electrode 13g may be connected to the first connector 30 by a conductive adhesive 95, and the first connector 30 may be connected to the conductor layers 12 and 22 (to the second conductor layer 22 in fig. 1) by the conductive adhesive 95. The second gate electrode 23g can be connected to the first connecting member 40 by a conductive adhesive 95, and the second connecting member 40 can be connected to the conductor layers 12 and 22 (to the first conductor layer 12 in fig. 1) by the conductive adhesive 95.

The bonding between the terminals 110 and 120 and the conductor layers 12 and 22 can be achieved not only by the conductive bonding 95 such as soldering but also by laser welding or ultrasonic welding.

The connecting bodies 60, 70, 80 may have connection terminals 80 for connecting the electronic components 13, 23 to the first conductor layer 12 and the second conductor layer 22, respectively. Any one of the first conductor layer 12 and the second conductor layer 22 connected to the connection terminal 80 may not be electrically connected to an external device.

When the connection terminal 80 in the present embodiment is provided, heat can be dissipated through the connection terminal 80. In the embodiment shown in fig. 1, the connection terminal 80 is provided on the surface (left surface) of the first electronic component 13 opposite to the surface on which the first connecting body 60 is provided. Therefore, in this embodiment, heat from the first electronic component 13 can be dissipated through the connection terminal 80.

The connection terminal 80 may have: a terminal head portion 81 extending in a thickness direction (a first direction in fig. 1) of the electronic module, a first base end portion 82 extending from an end portion of the terminal head portion 81 in an in-plane direction (a second direction in fig. 1) of the first substrate 11 and connected to the first conductor layer 12, and a second base end portion 83 extending from an end portion of the terminal head portion 81 in an in-plane direction of the second substrate 21 and connected to the second conductor layer 22. By providing such first and second base ends 82 and 83, the first and second conductor layers 12 and 22 can be more reliably connected, and the heat dissipation effect can be improved.

The first connector 60 may have a first connector base end portion 63 provided on the first header portion 61 and connected to the first conductor layer 12 or the second conductor layer 22. The first connector base end portion 63 may have: a first base end portion 63a extending from an end portion of the first head portion 61 in the in-plane direction (second direction in fig. 1) of the first substrate 11 and connected to the first conductor layer 12, and a second base end portion 63b extending from an end portion of the second head portion 71 in the in-plane direction of the second substrate 21 and connected to the second conductor layer 22.

The second connector 70 may have a second connector base end portion 73 provided on the second head portion 71 and connected to the first conductor layer 12 or the second conductor layer 22. The second connecting body base end part 73 may have: a first base end portion 73a extending from an end portion of the second head portion 71 in the in-plane direction (second direction in fig. 1) of the first substrate 11 and connected to the first conductor layer 12, and a second base end portion 73b extending from an end portion of the second head portion 71 in the in-plane direction of the second substrate 21 and connected to the second conductor layer 22.

In the embodiment shown in fig. 1, the direction in the plane in which the first base end portion 82 extends from the end portion of the terminal head portion 81 is the same as the direction in the plane in which the second base end portion 83 extends from the end portion of the terminal head portion 81 (the left direction in fig. 1). However, the present invention is not limited to this embodiment, and may be: the in-plane direction in which the first base end portion 82 extends from the end portion of the terminal head portion 81 is different from (for example, different by 180 degrees from) the in-plane direction in which the second base end portion 83 extends from the end portion of the terminal head portion 81.

Action and Effect

Next, the operation and effect of the present embodiment configured by the above-described structure will be described. In addition, any form described in "action/effect" can be applied to the above-described structure.

In the present embodiment, when the electronic components 13 and 23 provided on the connecting bodies 60, 70, and 80 are extended in the direction from the first substrate 11 to the second substrate 21, the electronic components 13 and 23 can be arranged in a direction different from the forward direction, which can improve the degree of freedom in design compared to the arrangement proposed in the related art.

In this embodiment, the chip module 100 includes: in the case of the first electronic component 13 and the second electronic component 23 connected to the first electronic component 13 via the first connector 60, the chip module 100 in which the first electronic component 13 and the second electronic component 23 are connected to each other via the first connector 60 can be used. In this way, for example, the first source electrode 13s of the first electronic element 13 and the second drain electrode 23d of the second electronic element 23 are electrically connected by the first connector 60, or the first drain electrode 13d of the first electronic element 13 and the second source electrode 23s of the second electronic element 23 are electrically connected by the first connector 60, and these can be used as the single chip module 100.

When the chip module 100 is used, it has: in the case of the first electronic component 13, the second electronic component 23, the first connecting body 60 provided between the first electronic component 13 and the second electronic component 23, and the second connecting body 70 provided on the opposite side of the second electronic component 23 from the first connecting body 60, the first electronic component 13 and the second electronic component 23 can be connected by the first connecting body 60, and the chip module 100 having the second connecting body 70 connected to the second electronic component 23 can also be used. Thus, for example, the following can be adopted: the first source electrode 13s of the first electronic element 13 and the second drain electrode 23d of the second electronic element 23 are electrically connected to each other through the first connector 60, and the second source electrode 23s of the second electronic element 23 is connected to each other through the second connector 70, or the first drain electrode 13d of the first electronic element 13 and the second source electrode 23s of the second electronic element 23 are electrically connected to each other through the first connector 60, and the second drain electrode 23d of the second electronic element 23 is connected to each other through the second connector 70, so that they are used as a single chip module 100.

When the connecting bodies 60, 70, 80 are used, they have: in the case of the head portions 61 and 71 and the pillar portions 62 and 72 extending from the head portions 61 and 71 in the thickness direction of the head portions 61 and 71, heat from the electronic components 13 and 23 can be prevented from being accumulated. In the case where the first connector 60 has the first pillar portion 62, a predetermined distance or more can be provided between the first electronic component 13 and the second electronic component 23, thereby preventing heat from being accumulated in the electronic component 13 and the second electronic component 23. In addition, in the case where the second connecting body 70 has the form of the second column portion 72, since the heat from the second electronic component 23 is transferred to the first conductor layer 12 or the second conductor layer 22 after a certain distance, the heat from the second electronic component 23 can be prevented from being concentrated. In particular, when the first electronic components 13 and 23 are extended from the first substrate 11 in the direction along the second substrate 21 as in the present embodiment, a predetermined distance or more can be provided between the first electronic component 13 and the second electronic component 23, which is very advantageous from the viewpoint of heat dissipation.

When the direction in the plane in which the first base end portions 63a, 73a, 82 extend is different from the direction in the plane in which the second base end portions 63b, 73b, 83 extend, the flow direction of heat can be made different in the direction in the plane of the chip module, and the heat radiation effect can be improved. From this point of view, it is advantageous to adopt a form in which the direction in the plane in which the first base end portions 63a, 73a, 82 extend is different from the direction in the plane in which the second base end portions 63b, 73b, 83 extend by 180 degrees. In particular, when the electronic components 13 and 23 are extended in the direction from the first substrate to the second substrate 21 as in the present embodiment, it is very advantageous to be able to enhance the heat dissipation effect as described above because heat is easily accumulated.

As shown in fig. 2, the connecting bodies 60, 70 may be elongated and rectangular when viewed from the side (as viewed from the direction of arrow a in fig. 1, shown in fig. 2). However, the present invention is not limited to this embodiment, and the connecting bodies 60 and 70 may be provided with a protruding surface 71a when viewed from the side as shown in fig. 3. Although the second connecting body 70 is shown in fig. 2 and 3, the first connecting body 60 may have the same structure as the second connecting body 70 shown in fig. 2 and 3.

Second embodiment

Next, a second embodiment of the present invention will be explained.

In the embodiment, as shown in fig. 4 to 6, a plurality of chip modules 100 are provided. The present embodiment can adopt any of the aspects described in the first embodiment. The same members as those of the first embodiment are described with the same reference numerals in the present embodiment.

When a plurality of chip modules 100 are provided as in the present embodiment, the first electronic component 13 and the second electronic component 23 may extend in the thickness direction (first direction) of the electronic module in each chip module 100.

In addition, the arrangement direction of the chip modules 100 can be appropriately adjusted. If the direction from the first electronic component 13 to the second electronic component 23 (the left-right direction in fig. 4) is the thickness direction of the chip module 100, the thickness direction of one chip module 100 may be different from the thickness direction of the other chip modules 100. For example, as shown in fig. 5, the thickness direction of a certain chip module 100a (e.g., a second chip module 100a described later) may be perpendicular to the thickness direction of another chip module 100b (e.g., a second chip module 100b described later) in the in-plane direction of the electronic module (i.e., in-plane direction including the second direction and the third direction). As shown in fig. 6, the direction from the first electronic component 13 to the second electronic component 23 in one chip module 100a (see arrow a1 in fig. 6) may be different from the direction from the first electronic component 13 to the second electronic component 23 in the other chip module 100b (see arrow a2 in fig. 6) by 180 degrees.

For example, as shown in fig. 5, when the first chip module 100a, the second chip module 100b, the third chip module 100c, and the fourth chip module 100d are provided, two or more directions among the thickness direction of the first chip module 100a, the thickness direction of the second chip module 100b, the thickness direction of the third chip module 100c, and the thickness direction of the fourth chip module 100d may be different from each other. For example, as shown in fig. 5, the thickness direction of the first chip module 100a may be aligned with the thickness direction of the third chip module 100c, and the thickness direction of the second chip module 11b may be aligned with the thickness direction of the fourth chip module 100 d. As shown in fig. 5, the thickness direction of the first chip module 100a and the third chip module 100c, the thickness direction of the second chip module 100b, and the thickness direction of the fourth chip module 100d may be perpendicular to each other in the in-plane direction of the electronic module. The direction from the first electronic component 13 to the second electronic component 23 in the first chip module 100a (see arrow a1 in fig. 5) may be different from the direction from the first electronic component 13 to the second electronic component 23 in the third chip module 100c (see arrow a3 in fig. 5) by 180 degrees. Similarly, the direction from the first electronic component 13 to the second electronic component 23 in the second chip module 100b (see arrow a2 in fig. 5) may be different from the direction from the first electronic component 13 to the second electronic component 23 in the fourth chip module 100d (see arrow a4 in fig. 5) by 180 degrees.

Third embodiment

Next, a third embodiment of the present invention will be explained.

The present embodiment is provided with a plurality of chip modules 100 as in the second embodiment. As shown in fig. 7, a chip connection body 150 as a third connection body electrically connected to the chip module 100 is further provided between the chip modules 100 in the in-plane direction of the electronic module (in-plane direction including the second direction and the third direction). In addition, the present embodiment can adopt any of the aspects described in the above embodiments. The same members as those in the above embodiments are described with the same reference numerals in the present embodiment.

According to the present embodiment, since the chip connection body 150 electrically connected to the chip modules 100 is provided in the in-plane direction of the electronic module (between the chip modules 100), two or more chip modules 100 can be electrically connected by the chip connection body 150, and thus, the plurality of chip modules 100 can be used as a single block (module).

Three or more chip modules 100 may be disposed around the chip connection body 150 in the in-plane direction of the electronic module, and the chip modules 100 may be electrically connected to each other by the chip connection body 150. In this mode, the chip modules 100 can be used as a single block (module).

The chip connector 150 may have: a third head 151 extending in an in-plane direction of the electronic module, and a third column 152 extending from the third head 151 to the other side.

Fourth embodiment

Next, a fourth embodiment of the present invention will be explained.

As shown in fig. 8, the present embodiment is provided with a chip connection body 150 as in the third embodiment. The chip module 100 in the present embodiment further includes a fitting portion 79 to be fitted to the chip connecting body 150. In addition, the present embodiment can adopt any of the aspects described in the above embodiments. The same members as those in the above embodiments are described with the same reference numerals in the present embodiment.

When the fitting portion 79 as in the present embodiment is provided, not only the positioning between the chip module 100 and the chip connecting body 150 but also the positioning between the plurality of chip modules 100 can be reliably performed.

In the present embodiment, the chip module 100 may further include a recess 79a as the fitting portion 79. When the recess 79a is provided, the edge of the chip connecting body 150 can be fitted into the recess 79 a. In the example shown in fig. 8, the second head 71 of the second connecting body 70 has a recess 79a, for example.

In addition, the present invention is not limited to this embodiment, and the chip module 100 may have a convex portion 101 as a fitting portion as shown in fig. 9. When the convex portion 101 is provided, a concave portion 158 for fitting the convex portion 101 into the chip connecting body 150 may be provided.

Fifth embodiment

Next, a fifth embodiment of the present invention will be explained.

As shown in fig. 10, in the present embodiment, a chip connection body 150a is provided. The chip connecting body 150a in the present embodiment is further provided with a first electronic component 160. The first electronic component 160 can be mounted on the mounting surface of the chip connecting body 150a by the conductive adhesive 95. In addition, the present embodiment can adopt any of the aspects described in the above embodiments. The same members as those in the above embodiments are described with the same reference numerals in the present embodiment.

According to the present embodiment, the first electronic component 13 and the second electronic component 23 included in the chip module 100 can be electrically connected to the first electronic component 160 provided on the chip connection body 150 a. As the first electronic component 160, a component such as a relay circuit may be used, but the present invention is not limited thereto, and an electronic element such as a semiconductor element may be used.

As shown in fig. 10, a fourth connection body 260 for connecting the first electronic component 160 with the second conductor layer 22 may be provided at one side of the first electronic component 160. A conductive adhesive 95 is provided between the fourth connecting body 260 and the first electronic component 160, and a conductive adhesive 95 is also provided between the fourth connecting body 260 and the second conductor layer 22.

In the embodiment shown in fig. 10, the sub-electronic module including the chip module 100 and the first electronic component 160 can be used as a single module.

As shown in fig. 10, although the plate-shaped chip connector 150a is used in the present embodiment, the present invention is not limited thereto, and a chip connector 150 having a third pillar portion 152 as shown in fig. 7 to 9 may be used.

In addition, as shown in fig. 11, a second electronic component 170 may be provided in addition to the first electronic component 160. As the second electronic component 170, a component such as a relay circuit may be used, but not limited thereto, and an electronic element such as a semiconductor element may be used.

The second electronic part 170 may be positioned at the other side of the third column portion 152 of the chip connector 150, and the second electronic part 170 may also be positioned at one side of the third head portion 151. In the embodiment shown in fig. 11, the conductive adhesive 95 is provided between the chip connecting body 150 and the second electronic component 170, and the conductive adhesive 95 is also provided between the second electronic component 170 and the second conductor layer 22.

In the case of the embodiment shown in fig. 11, a sub-electronic module including the chip module 100, the first electronic component 160, and the second electronic component 170 can be used as a single module.

As shown in fig. 12, two or more chip connecting bodies 150 and 150a may be provided. Also, a first electronic component 160 may be provided on one of the chip connectors 150, 150a, while the other is electrically connected to a second electronic component 170. In the embodiment shown in fig. 12, the chip connection body 150a is provided with the first electronic component 160, and the chip connection body 150 is electrically connected to the second electronic component 170.

Although the fitting portion 79 is shown in the form of fig. 10 to 12, such a fitting portion 79 may not be provided. In the present embodiment, it is also conceivable to prepare a module including the first electronic component 160, the second electronic component 170, or both the first electronic component 160 and the second electronic component 170 as a sub-electronic module in addition to the first electronic component 13 and the second electronic component 23.

Sixth embodiment

Next, a sixth embodiment of the present invention will be explained.

In the above embodiments, the embodiment using the second connected body 70 has been described, but the present invention is not limited thereto. As shown in fig. 13, the second connecting body 70 may not be provided. In the present embodiment, a connecting member 45 is provided in place of the second connecting body 70. The present embodiment can also adopt any of the aspects described in the above embodiments. The same members as those in the above embodiments are described with the same reference numerals in the present embodiment. The present embodiment has the effects of the above-described embodiments in the case where the portion other than the second connected body 70 is not provided.

The description of the embodiments, the modifications, and the drawings disclosed in the drawings are only examples for explaining the invention described in the claims, and therefore the invention described in the claims is not limited to the contents disclosed in the embodiments or the drawings. The description of the claim at the beginning of the present application is merely an example, and the description of the claim may be appropriately modified from the description of the specification, the drawings, and the like.

Description of the symbols

11 first substrate

13 first electronic component (electronic component)

21 second substrate

23 second electronic component (electronic component)

60 first connector (connector)

61 first head (head)

62 first pillar part (pillar part)

70 second connector (connector)

71 second head (head)

72 second column part (column part)

79 fitting part

80 connecting terminal

100 chip module

150 chip connector