阅读说明：本技术 一种新型的小体积晶体管封装框架 (Novel small-volume transistor packaging frame ) 是由 陈石元 于 2019-02-21 设计创作，主要内容包括：一种新型的小体积晶体管封装框架,本发明涉及晶体管封装技术领域；框架外壳的底壳的外围一体成型有连接框,连接框的上表面开设有插槽,插槽中开设有引脚通孔；设置于框架外壳内的引脚依次穿过框架外壳周壁的引脚穿孔、引脚通孔后,焊接固定在电路板上；相邻的连接框之间利用若干个连接柱连接固定；相邻的连接框中的插槽之间利用安装连接杆连接,安装连接杆的两个垂直端活动插设在插槽内。其方便调节小体积晶体管的安装位置,稳定性能高,且利于加工过程中数量的统计,实用性更强。(The invention relates to a novel small-volume transistor packaging frame, belonging to the technical field of transistor packaging; a connecting frame is integrally formed on the periphery of the bottom shell of the frame shell, the upper surface of the connecting frame is provided with a slot, and a pin through hole is formed in the slot; the pins arranged in the frame shell sequentially penetrate through the pin through holes and the pin through holes on the peripheral wall of the frame shell and are fixed on the circuit board in a welding way; adjacent connecting frames are connected and fixed by a plurality of connecting columns; the slots in the adjacent connecting frames are connected by the mounting connecting rods, and the two vertical ends of the mounting connecting rods are movably inserted in the slots. The mounting position of its convenient regulation small size transistor, stability can be high, and does benefit to the statistics of quantity in the course of working, and the practicality is stronger.)

1. A novel small-size transistor packaging frame is characterized in that: the frame comprises a frame shell (1), a connecting frame (2), a connecting column (3) and an installation connecting rod (4); a connecting frame (2) is integrally formed on the periphery of a bottom shell of the frame shell (1), a slot (2-1) is formed in the upper surface of the connecting frame (2), and a pin through hole (2-2) is formed in the slot (2-1); pins arranged in the frame shell (1) sequentially penetrate through pin through holes (1-1) and pin through holes (2-2) on the peripheral wall of the frame shell (1) and then are welded and fixed on a circuit board; the adjacent connecting frames (2) are connected and fixed by a plurality of connecting columns (3); the slots (2-1) in the adjacent connecting frames (2) are connected by the mounting connecting rods (4), and two vertical ends of the mounting connecting rods (4) are movably inserted in the slots (2-1).

2. A novel small-volume transistor package frame as defined in claim 1, wherein: the two vertical ends of the mounting connecting rod (4) are integrally formed with spheres (4-1), the vertical surfaces and the bottom surfaces of the slots (2-1) are integrally formed with arc-shaped concave surfaces (2-1-1), and the outer walls of the spheres (4-1) are arranged between the arc-shaped concave surfaces (2-1-1) and the outer wall of the frame shell (1) in an abutting mode.

3. A novel small-volume transistor package frame as defined in claim 1, wherein: the heat dissipation silicon sheet (5) is inserted into the connecting frame (2), and the inner end of the heat dissipation silicon sheet (5) penetrates through the side wall of the frame shell (1) and then is arranged in the inner space of the frame shell (1).

4. A novel small-volume transistor package frame as defined in claim 1, wherein: the top wall of the upper shell of the frame shell (1) is provided with a plurality of heat dissipation holes (1-2), a heat dissipation silica gel column (6) is inserted into each heat dissipation hole (1-2), and the lower end of the heat dissipation silica gel column (6) is arranged in the inner space of the frame shell (1).

5. A novel small-size transistor packaging frame is characterized in that: the working principle is as follows: the method comprises the steps that a template is prefabricated, a bottom shell, a connecting frame (2) and connecting columns (3) of a plurality of frame shells (1) are integrally formed through injection molding by the template, and small transistors are packaged in the frame shells (1) and then are integrally packaged and transported, so that the problems that quantity counting is not facilitated and dropping is caused by scattered individuals are avoided; when the transistor installing device needs to be installed, the transistor needing to be installed is located at the connecting column (3) and is broken off, the transistor is integrally broken off, the installing connecting rod (4) with the appropriate length is selected, the frame shells (1) of the transistors which are close to each other are clamped through the installing connecting rod (4), and the stability of the frame shells (1) of the transistors which are close to each other in installing on a circuit board is stabilized.

Technical Field

The invention relates to the technical field of transistor packaging, in particular to a novel small-volume transistor packaging frame.

Background

A transistor is a solid state semiconductor device that can be used for detection, rectification, amplification, switching, regulation, signal modulation, and many other functions. The transistor is used as a variable switch to control the current based on the input voltage, so the transistor can be used as a current switch and a common mechanical switch, and the transistor is controlled by an electric signal, and the switching speed can be very fast, and the switching speed in a laboratory can reach more than 100 GHz. In the analog circuit, the transistor is used for an amplifier, an audio amplifier, a radio frequency amplifier and a voltage stabilizing circuit; among computer power supplies, switching power supplies are mainly used. Transistors are also used in digital circuits, the main function of which is to act as electronic switches. The digital circuits include logic gates, Random Access Memory (RAM), and a microprocessor. Transistors have many maximum ratings to be noted in their use, e.g., maximum voltage, maximum current, maximum power. In the excess state, the structure inside the transistor may be damaged. Each type of transistor has unique characteristics, such as direct current amplification factor hfe, NF noise to noise ratio, etc., and can be known by means of a transistor specification table or Data Sheet. The most common use of transistors in circuits is signal amplification, followed by impedance matching, signal conversion, etc., where transistors are important components and many delicate components are mainly made of transistors.

The existing small-size transistor packaging frame is formed independently, is small in size, inconvenient to assemble and install, not beneficial to quantity statistics in the processing process and urgent to improve.

Disclosure of Invention

The invention aims to provide a novel small-volume transistor packaging frame which is simple in structure, reasonable in design and convenient to use, is convenient to adjust the mounting position of a small-volume transistor, is high in stability, facilitates the statistics of the number in the processing process and is higher in practicability, and the defects of the prior art are overcome.

In order to achieve the purpose, the invention adopts the technical scheme that: it comprises a frame shell, a connecting frame, a connecting column and an installation connecting rod; a connecting frame is integrally formed on the periphery of the bottom shell of the frame shell, the upper surface of the connecting frame is provided with a slot, and a pin through hole is formed in the slot; the pins arranged in the frame shell sequentially penetrate through the pin through holes and the pin through holes on the peripheral wall of the frame shell and are fixed on the circuit board in a welding way; adjacent connecting frames are connected and fixed by a plurality of connecting columns; the slots in the adjacent connecting frames are connected by the mounting connecting rods, and the two vertical ends of the mounting connecting rods are movably inserted in the slots.

Further, two perpendicular end of installation connecting rod on integrated into one piece have the spheroid, on the perpendicular of slot and the bottom surface homogeneous body shaping have the arc concave surface, spheroidal outer wall is contradicted and is set up between arc concave surface and frame shell outer wall.

Furthermore, a heat dissipation silica gel sheet is inserted into the connecting frame, and the inner end of the heat dissipation silica gel sheet penetrates through the side wall of the frame shell and then is arranged in the inner space of the frame shell.

Furthermore, the top wall of the upper shell of the frame shell is provided with a plurality of heat dissipation holes, a heat dissipation silica gel column is inserted into each heat dissipation hole, and the lower end of the heat dissipation silica gel column is arranged in the inner space of the frame shell.

The working principle of the invention is as follows: the method comprises the following steps of prefabricating a template, wherein the bottom shells, connecting frames and connecting columns of a plurality of frame shells are integrally formed into a whole by injection molding through the template, and the small transistors are packaged in the frame shells and then are integrally packaged and transported, so that the problems of quantity counting inconvenience and falling inconvenience caused by scattered individuals are avoided; when the transistor is required to be installed, the transistor to be installed is located at the connecting column and broken off, the transistor is integrally broken off, the installation connecting rod with the appropriate length is selected, the frame shells of the transistors which are close to each other are clamped through the installation connecting rod, and the stability of the frame shells of the transistors which are close to each other in installing on the circuit board is stabilized.

After adopting the structure, the invention has the beneficial effects that: the novel small-volume transistor packaging frame is convenient for adjusting the mounting position of a small-volume transistor, high in stability, beneficial to counting of the number in the processing process and high in practicability, and has the advantages of simple structure, reasonable arrangement, low manufacturing cost and the like.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural view of the present invention.

Fig. 2 is a top view of the present invention.

Fig. 3 is a schematic view of the present invention in use.

Fig. 4 is an enlarged view of the structure of the portion a in fig. 3.

FIG. 5 is a schematic structural diagram of a connecting column according to an embodiment.

FIG. 6 is a schematic structural diagram of a connecting column in the second embodiment.

Description of reference numerals:

the heat dissipation silica gel column comprises a frame shell 1, pin through holes 1-1, a connecting frame 2, slots 2-1, arc-shaped concave surfaces 2-1-1, pin through holes 2-2, a connecting column 3, an installation connecting rod 4, a sphere 4-1, a heat dissipation silica gel sheet 5, heat dissipation holes 1-2 and a heat dissipation silica gel column 6.

Detailed Description

The invention will be further described with reference to the accompanying drawings.

Referring to fig. 1 to 5, the technical solution adopted in the present embodiment (example one) is as follows: the frame comprises a frame shell 1, a connecting frame 2, a connecting column 3 and a mounting connecting rod 4; a connecting frame 2 is integrally formed on the periphery of a bottom shell of the frame shell 1, a slot 2-1 is formed in the upper surface of the connecting frame 2, and a pin through hole 2-2 is formed in the slot 2-1; the pins arranged in the frame shell 1 sequentially pass through the pin through holes 1-1 and the pin through holes 2-2 on the peripheral wall of the frame shell 1 and then are welded and fixed on the circuit board; adjacent connecting frames 2 are fixedly connected through a plurality of connecting columns 3, each connecting column 3 is of a cylindrical structure, the diameter of each connecting column is 5mm, a plurality of grooves are annularly formed in the surface of each connecting column (the diameter of each connecting column 3 at each groove is 2 mm), and the connecting columns 3 are convenient to break (breakpoints are located at the grooves); the slots 2-1 in the adjacent connecting frames 2 are connected by the mounting connecting rods 4, and two vertical ends of the mounting connecting rods 4 are movably inserted in the slots 2-1.

Furthermore, the two vertical ends of the installation connecting rod 4 are integrally formed with a sphere 4-1 (the cross rod and the vertical section of the installation connecting rod 4 are both in a cylinder structure, the diameter of the installation connecting rod 4 is 5mm, the diameter of the sphere 4-1 is 7mm, and the installation connecting rod 4-1 is made of plastic materials), the vertical surface and the bottom surface of the slot 2-1 are integrally formed with an arc-shaped concave surface 2-1-1, and the outer wall of the sphere 4-1 is arranged between the arc-shaped concave surface 2-1-1 and the outer wall of the frame shell 1 in a butting mode.

Furthermore, a heat dissipation silicone sheet 5 is inserted into the connecting frame 2 (the ratio of the thickness of the heat dissipation silicone sheet 5 to the thickness of the connecting frame 2 is 1: 1.5), and the inner end of the heat dissipation silicone sheet 5 penetrates through the side wall of the frame shell 1 and is arranged in the inner space of the frame shell 1; the heat dissipation silica gel sheet 5 is divided into a plurality of sheets, is inserted in the connecting frame 2, and the inner end of the heat dissipation silica gel sheet can be contacted with the small transistor in the inner space of the frame shell 1 to conduct the heat generated during the work, thereby playing a role of heat dissipation.

Furthermore, the top wall of the upper shell of the frame shell 1 is provided with a plurality of heat dissipation holes 1-2 (the aperture of each heat dissipation hole 1-2 is 2 mm), a heat dissipation silica gel column 6 is inserted into each heat dissipation hole 1-2, the lower end of the heat dissipation silica gel column 6 is arranged in the inner space of the frame shell 1, the inner end of the heat dissipation silica gel column 6 can conduct heat generated by the small transistors in the frame shell 1 during working, the heat dissipation effect is achieved, the heat dissipation silica gel column 6 can move up and down in the heat dissipation holes 1-2, and the inner end of the heat dissipation silica gel column can be conveniently controlled to be located in the position of the frame.

The working principle of the specific embodiment is as follows:

the method comprises the steps that a template is prefabricated, a bottom shell, a connecting frame 2 and connecting columns 3 of a plurality of frame shells 1 are integrally formed through injection molding by utilizing the template, and after small transistors are packaged in the frame shells 1, the small transistors are integrally packaged and transported, so that the problems that quantity counting is not facilitated and the small transistors fall off due to scattered individuals are avoided; when the small transistors are required to be installed, the transistors required to be installed are located at the connecting columns 3 and broken off, the transistors are integrally broken off, the installation connecting rods 4 with proper lengths are selected, the frame shells 1 of the transistors close to each other are clamped and connected through the installation connecting rods 4, the stability of the frame shells 1 of the transistors close to each other in installation on a circuit board is stabilized, meanwhile, before the small transistors are not welded and fixed, the small transistors to be installed rotate around the installed small transistors by taking the installation connecting rods 4 as the radius, and the proper installation positions are selected for welding and fixing, so that the arrangement of the installation positions of the small transistors is facilitated;

the contact area between the heat dissipation silica gel column 6 and the inner space of the frame shell 1 is adjusted by adjusting the height of the heat dissipation silica gel column 6 in the heat dissipation hole 1-2, so as to control the heat dissipation efficiency;

the heat dissipation efficiency of the inner space of the frame shell 1 is adjusted by inserting different numbers of heat dissipation silicon sheets 5.

After adopting above-mentioned structure, this embodiment beneficial effect does:

1. the adjacent frame shells 1 are connected into a whole by the connecting column 3, so that the statistics of the number of small transistors in the processing process is facilitated, meanwhile, the storage and transportation are facilitated, and the loss caused by scattered falling is prevented;

2. adopt erection joint pole 4 to connect the location between the small-size transistor that is close to each other, when conveniently adjusting the mounted position of little volume transistor, still improved the stability can.