阅读说明：本技术 一种含微通道的陶瓷基板及其制备方法 (Ceramic substrate containing micro-channel and preparation method thereof ) 是由 陈明祥 王卿 程浩 于 2020-03-27 设计创作，主要内容包括：本发明属于电子封装相关技术领域,其公开了一种含微通道的陶瓷基板及其制备方法,所述制备方法包括以下步骤：(1)采用电镀工艺在陶瓷基片相背的两个表面分别制备金属线路层及微通道立柱,所述微通道立柱的数量为多个,多个所述微通道立柱间隔设置；(2)在多个所述微通道立柱之间填充牺牲层材料后,在所述微通道立柱及所述牺牲层材料所形成的、远离所述金属线路层的表面上电镀制备金属底板；(3)去除所述牺牲层材料,所述金属底板及所述陶瓷基片分别覆盖所述微通道立柱相背的两端,以形成多个微通道,至此完成含微通道的陶瓷基板的制备。本发明在保证加工精度和微型化的同时,提高了陶瓷基板散热性能与器件可靠性,大幅度降低了生产成本。(The invention belongs to the technical field related to electronic packaging, and discloses a ceramic substrate containing a microchannel and a preparation method thereof, wherein the preparation method comprises the following steps: (1) respectively preparing a metal circuit layer and a plurality of microchannel stand columns on two opposite surfaces of a ceramic substrate by adopting an electroplating process, wherein the number of the microchannel stand columns is multiple, and the microchannel stand columns are arranged at intervals; (2) after filling a sacrificial layer material among the microchannel upright columns, electroplating on the surfaces, far away from the metal circuit layer, formed by the microchannel upright columns and the sacrificial layer material to prepare a metal bottom plate; (3) and removing the sacrificial layer material, wherein the metal base plate and the ceramic substrate respectively cover two opposite ends of the microchannel stand column to form a plurality of microchannels, so that the preparation of the ceramic substrate containing the microchannels is completed. The invention ensures the processing precision and the miniaturization, improves the heat dispersion performance and the device reliability of the ceramic substrate and greatly reduces the production cost.)

1. A method for preparing a ceramic substrate containing microchannels, comprising the steps of:

(1) respectively preparing a metal circuit layer and a plurality of microchannel stand columns on two opposite surfaces of a ceramic substrate by adopting an electroplating process, wherein the number of the microchannel stand columns is multiple, and the microchannel stand columns are arranged at intervals;

(2) after filling a sacrificial layer material among the microchannel upright columns, electroplating on the surfaces, far away from the metal circuit layer, formed by the microchannel upright columns and the sacrificial layer material to prepare a metal bottom plate;

(3) and removing the sacrificial layer material, wherein the metal base plate and the ceramic substrate respectively cover two opposite ends of the microchannel stand column to form a plurality of microchannels, so that the preparation of the ceramic substrate containing the microchannels is completed.

2. The method of preparing a ceramic substrate comprising microchannels according to claim 1, wherein: the ceramic substrate is made of metal copper, nickel or copper-nickel alloy.

3. The method of preparing a ceramic substrate comprising microchannels according to claim 1, wherein: in the step (1), a ceramic substrate is provided, and after metal seed layers are sputtered on two surfaces of the ceramic substrate opposite to each other, metal circuit layers are prepared on the ceramic substrate by adopting photoetching, developing and pattern electroplating processes.

4. The method of preparing a ceramic substrate comprising microchannels according to claim 1, wherein: the sacrificial layer material is metal, organic glue or inorganic gelled material.

5. The method of preparing a ceramic substrate comprising microchannels according to claim 1, wherein: the metal bottom plate is made of metal copper, nickel or copper-nickel alloy.

6. The method of preparing a ceramic substrate comprising microchannels according to claim 1, wherein: and etching away the sacrificial layer material to obtain the ceramic substrate containing the micro-channels.

7. A ceramic substrate comprising microchannels, wherein: the ceramic substrate is prepared by the method for preparing a ceramic substrate containing micro-channels according to any one of claims 1 to 6.

8. The microchannel-containing ceramic substrate of claim 7, wherein: the cross section of the microchannel upright post is rectangular, the height of the microchannel upright post is 0.3-3.0 mm, the width of the microchannel upright post is 0.1-3 mm, and the distance between the microchannel upright posts is 0.1-3 mm.

9. The microchannel-containing ceramic substrate of claim 7, wherein: the thickness of the ceramic substrate is 0.3-1 mm.

10. The microchannel-containing ceramic substrate of claim 7, wherein: the thickness of the metal bottom plate is 0.5-1 mm.

Technical Field

The invention belongs to the technical field related to electronic packaging, and particularly relates to a ceramic substrate containing a microchannel and a preparation method thereof.

Background

With the continuous progress of electronic design and manufacturing process, the multi-functionalization and miniaturization of electronic products, power devices (including L ED, L D, IGBT, CPV, etc.) are continuously developed, so that the power consumption of a unit chip is rapidly increased, the heat flow of a unit volume is increased, and the temperature of the chip is rapidly increased.

For power device packages, besides the basic wiring (electrical interconnection) function, the package substrate is also required to have high thermal conductivity, heat resistance, insulation, strength and thermal matching performance. The ceramic material has the performances of high thermal conductivity, good heat resistance, high insulation, high strength, thermal matching with a chip material and the like, so that the ceramic material is very suitable for serving as a power device packaging substrate and is widely applied to the fields of semiconductor illumination, laser and optical communication, aerospace, automotive electronics, deep sea drilling and the like at present. The traditional ceramic substrate is mostly prepared by adopting thick film sintering (such as thick film ceramic substrate TPC), high temperature bonding (such as direct bonding ceramic substrate DBC) and other processes, and has the defects of low precision of a metal circuit layer, high process cost and the like. The front end of the preparation of the electroplated ceramic substrate (DPC) adopts the semiconductor micro-processing technology (sputtering coating, photoetching, developing and the like), the rear end adopts the preparation technology of a Printed Circuit Board (PCB) (pattern electroplating, hole filling, surface grinding, etching, surface treatment and the like), and the metal circuit is finer; the vertical interconnection of the upper surface and the lower surface of the ceramic substrate is realized by adopting the laser drilling and electroplating hole filling technology, and the three-dimensional packaging and integration of electronic devices can be realized; the surface roughness of the circuit layer is reduced through grinding, and the packaging requirements of high-temperature and large-current devices are met; the low-temperature preparation process (below 300 ℃) avoids the adverse effect of high temperature on the substrate material and the metal circuit layer, simultaneously reduces the production cost and has obvious technical advantages.

On the other hand, with the improvement of the integration level of device packaging and the continuous increase of power, the existing planar ceramic substrate is difficult to meet the heat dissipation requirement, and an active heat dissipation technology containing a micro-channel structure is required to be adopted. In recent years, a micro-channel heat dissipation technology based on a Micro Electro Mechanical System (MEMS) technology is beginning to be applied to heat dissipation of power devices, and a structure with a size of tens to hundreds of micrometers is processed on a bottom surface of a package substrate (such as a silicon substrate, a metal substrate, and the like) by using processes of photolithography, development, corrosion, and the like in a semiconductor technology, and then a micro-channel is prepared by sealing a bottom plate and a micro-structure through a welding or bonding process, where fig. 1 is a traditional micro-channel heat sink structure. When the device works, liquid flows in the micro-channel, the temperature is reduced by utilizing the high-efficiency heat dissipation characteristic of the micro-structure, but the micro-channel prepared by a welding or bonding process has poor integration level, and the reliability of a packaged device is influenced.

Disclosure of Invention

Aiming at the defects or improvement requirements in the prior art, the invention provides a ceramic substrate containing a micro-channel and a preparation method thereof.

To achieve the above object, according to one aspect of the present invention, there is provided a method for preparing a ceramic substrate including microchannels, the method comprising the steps of:

(1) respectively preparing a metal circuit layer and a plurality of microchannel stand columns on two opposite surfaces of a ceramic substrate by adopting an electroplating process, wherein the number of the microchannel stand columns is multiple, and the microchannel stand columns are arranged at intervals;

(2) after filling a sacrificial layer material among the microchannel upright columns, electroplating on the surfaces, far away from the metal circuit layer, formed by the microchannel upright columns and the sacrificial layer material to prepare a metal bottom plate;

(3) and removing the sacrificial layer material, wherein the metal base plate and the ceramic substrate respectively cover two opposite ends of the microchannel stand column to form a plurality of microchannels, so that the preparation of the ceramic substrate containing the microchannels is completed.

Further, the ceramic substrate is made of metal copper, nickel or copper-nickel alloy.

Further, in the step (1), a ceramic substrate is provided, and after metal seed layers are sputtered on two surfaces of the ceramic substrate opposite to each other, a metal circuit layer is prepared on the ceramic substrate by adopting photoetching, developing and pattern electroplating processes.

Further, the sacrificial layer material is metal, organic glue or inorganic gel material.

Further, the metal bottom plate is made of metal copper, nickel or copper-nickel alloy.

Further, the sacrificial layer material is etched away to obtain a ceramic substrate containing microchannels.

According to another aspect of the present invention, there is provided a ceramic substrate containing microchannels, which is prepared by the method for preparing a ceramic substrate containing microchannels as described above.

Furthermore, the cross section of the microchannel upright post is rectangular, the height of the microchannel upright post is 0.3-3.0 mm, the width of the microchannel upright post is 0.1-3 mm, and the distance between the microchannel upright posts is 0.1-3 mm.

Further, the thickness of the ceramic substrate is 0.3-1 mm.

Furthermore, the thickness of the metal bottom plate is 0.5-1 mm.

Generally, compared with the prior art, the ceramic substrate containing the micro-channel and the preparation method thereof provided by the invention have the following beneficial effects:

1. the micro-channel provided by the invention is prepared by adopting a full electroplating process, a welding process is avoided, and the integration level and the reliability of the substrate are improved.

2. The micro-channel provided by the invention is prepared by adopting a pattern electroplating process, the structural precision is high, and the heat dissipation capability of the ceramic circuit board is improved.

3. The adoption of the electroplating process can improve the integration level of the ceramic substrate and reduce the cost.

4. The preparation method has the advantages of simple process, easy implementation and strong applicability.

Drawings

FIG. 1 is a schematic structural diagram of a conventional packaging substrate including micro-channels;

FIG. 2 is a schematic structural view of a ceramic substrate containing microchannels provided by the present invention;

FIGS. 3 (a) to (f) are schematic flow charts of a method for producing a ceramic substrate containing microchannels according to example 1 of the present invention;

fig. 4 (a) to (f) are schematic flow charts of the method for producing a ceramic substrate containing microchannels according to example 2 of the present invention.

The same reference numbers will be used throughout the drawings to refer to the same or like elements or structures, wherein: 1-metal circuit layer, 2-ceramic substrate, 3-microchannel upright post, 4-microchannel and 5-microchannel baseplate.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

The invention provides a preparation method of a ceramic substrate containing a micro-channel, which mainly comprises the following steps:

firstly, respectively preparing a metal circuit layer and a plurality of micro-channel stand columns on two opposite surfaces of a ceramic substrate by adopting an electroplating process, wherein the number of the micro-channel stand columns is multiple, and the micro-channel stand columns are arranged at intervals.

Specifically, a ceramic substrate is provided, and after metal seed layers are sputtered on two surfaces of the ceramic substrate opposite to each other, metal circuit layers are prepared on the ceramic substrate by adopting photoetching, developing and pattern electroplating processes. In the embodiment, the metal circuit layer is made of metal copper, and the thickness of the metal copper is 10-100 μm; the ceramic substrate is made of metal copper, nickel or copper-nickel alloy and the like.

And then, preparing a plurality of microchannel stand columns on the other surface of the ceramic substrate by adopting the processes of film pasting, exposure, development and pattern electroplating for many times. The cross section of the microchannel upright post is rectangular, the height of the microchannel upright post is 0.3-3.0 mm, the preferred size is 0.5-1.0 mm, the width is 0.1-3 mm, and the distance is 0.1-3 mm; the metal circuit layer is made of electroplated copper; the thickness of the ceramic substrate is 0.3-1 mm.

And step two, after filling a sacrificial layer material among the microchannel upright columns, electroplating the surfaces, which are formed by the microchannel upright columns and the sacrificial layer material and are far away from the metal circuit layer, to prepare a metal bottom plate.

Specifically, a sacrificial layer material is filled between the microchannel columns, the lower surface (including the microchannel columns and the sacrificial layer material) of the ceramic substrate is ground, a metal seed layer is deposited on the lower surface of the ceramic substrate by a sputtering process and is electroplated and thickened to obtain a metal bottom plate, and then the surface of the metal bottom plate is ground. In this embodiment, the material of the sacrificial layer is a metal, an organic glue or an inorganic gelled material. The metal bottom plate is made of metal copper, nickel or copper-nickel alloy and is formed by electroplating growth, and the thickness of the metal bottom plate is 0.5-1 mm.

And step three, removing the sacrificial layer material, wherein the metal base plate and the ceramic substrate respectively cover two opposite ends of the microchannel upright post to form a plurality of microchannels, so as to finish the preparation of the ceramic substrate containing the microchannels.

Specifically, the sacrificial layer material is etched away to obtain the ceramic substrate containing the micro-channel, and the material of the micro-channel is metal copper, nickel or copper-nickel alloy and the like.

Referring to fig. 2, the invention further provides a ceramic substrate with a microchannel, which is prepared by the preparation method described above, and includes a metal circuit layer 1, a ceramic substrate 2, a plurality of microchannel posts 3 and a microchannel bottom plate 5, wherein the metal circuit layer 1 and the microchannel posts 3 are respectively formed on two opposite surfaces of the ceramic substrate 2, and the microchannel posts 3 are arranged at intervals. The microchannel bottom plate 5 is formed on one end of the microchannel pillar 3 away from the metal wiring layer 1, thereby forming a plurality of microchannels 4.

The present invention is further illustrated in detail below with reference to several examples.