阅读说明：本技术 具有安装在两个基体之间的构件的电子组件及其制造方法 (electronic assembly with a component mounted between two substrates and method for producing the same ) 是由 R.诺夫 B.米勒 J.斯特罗吉斯 K.威尔克 R.布兰克 M.弗兰克 P.弗吕霍夫 于 2018-04-20 设计创作，主要内容包括：本发明涉及一种具有构件(11)的电子组件,所述构件固持在第一基体(12)和第二基体(13)之间。按照本发明规定,第一基体(12)和构件(11)之间的缝隙(18)与通孔(21)相连,从而例如能够在充分利用作用在所述通孔(21)和缝隙(18)中的毛细力的情况下通过所述通孔计量加入焊料(24)。所述计量加入在此自动地实现,因为毛细力只在缝隙中起作用。通过自动地计量加入焊料能够有利地实现公差补偿,所述公差补偿由于不同的缝隙尺寸可能是必要的。本发明还涉及一种用于制造所述组件的方法,其中,接合辅助材料(24)尤其可以作为焊料通过选择性波峰焊进行使用。(The invention relates to an electronic component having a component (11) which is held between a first base body (12) and a second base body (13). According to the invention, the gap (18) between the first substrate (12) and the component (11) is connected to the through-opening (21), so that, for example, solder (24) can be metered through the through-opening while taking full advantage of the capillary forces acting in the through-opening (21) and the gap (18). The metering is effected automatically here, since the capillary forces act only in the gap. The automatic metering of solder advantageously enables tolerance compensation, which may be necessary due to different gap sizes. The invention also relates to a method for producing said assembly, wherein the bonding auxiliary material (24) can be used, in particular, as a solder material by selective wave soldering.)