阅读说明：本技术 包含具有几何属性的过孔的制品及其制造方法 (Article comprising via having geometric properties and method of making the same ) 是由 黄甜 金宇辉 M·E·威廉 于 2018-05-22 设计创作，主要内容包括：公开了包括基于玻璃的基板的制品和半导体封装件及其形成方法。制品包括基于玻璃的基板,该基板包括彼此隔开一段距离并彼此平行的第一和第二主表面,以及通过基板延伸的锥形过孔。锥形过孔包括内壁和关于平面对称的横截面,所述平面在基于玻璃的基板的第一主表面和第二主表面之间并且与这两个主表面等距,所述内壁具有位于第一主表面与所述平面之间的第一锥形区域和第二锥形区域。第一锥形区域和第二锥形区域各自的斜度是恒定的,并且第一锥形区域的斜度不等于第二锥形区域的斜度。(Articles and semiconductor packages including glass-based substrates and methods of forming the same are disclosed. The article includes a glass-based substrate including first and second major surfaces spaced apart from and parallel to each other, and a tapered via extending through the substrate. The tapered via includes an inner wall and a cross-section that is symmetrical about a plane that is between and equidistant from the first and second major surfaces of the glass-based substrate, the inner wall having a first tapered region and a second tapered region that are between the first major surface and the plane. The respective slopes of the first tapered region and the second tapered region are constant, and the slope of the first tapered region is not equal to the slope of the second tapered region.)